DS30817 Rev. 6 - 2 1 of 4
www.diodes.com BC847CDLP
© Diodes Incorporated
NEW PRODUCT
BC847CDLP
NPN DUAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideally Suited for Automated Assembly Processes
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Ultra Low Profile Package
Mechanical Data
• Case: DFN1310H4-6
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Finish ⎯ NiPdAu annealed over Copper
leadframe (Lead Free Plating). Solderable per MIL-
STD-202, Method 208
• Marking Code Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.0015g (approximate)
* Dimensions D, K, L, N Repeat 4X
** Dimensions E, M, Z Repeat 2X
DFN1310H4-6
Dim Min Max Typ
A 1.25 1.38 1.30
B 0.95 1.08 1.00
C 0.20 0.30 0.25
D* - - 0.10
E** - - 0.20
G - 0.40 -
H 0 0.05 0.02
K* 0.10 0.20 0.15
L* 0.30 0.50 0.40
M** - - 0.35
N* - - 0.25
Z** - - 0.05
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 50 V
Collector-Emitter Voltage VCEO 45 V
Emitter-Base Voltage VEBO 6.0 V
Collector Current IC 100 mA
Power Dissipation (Note 3) Pd 350 mW
Thermal Resistance, Junction to Ambient (Note 3) RθJA 357 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB pad layout as shown on page 4.
4. Radiused pad feature is intended for device manufacturing control and should not be considered as a polarity indicator, or to suggest orientation of
the devices in the carrier tape.
C
B
BE
EC
In ternal Sc h ema ti c
(TO P VIEW)
Bottom View
Side View
GH
B
K
E
C
D
Top View
A
L
L
N
M
N
C
EBC
E
B
D
Z
Z
R0.150
Note 4