LMC660 LMC660 CMOS Quad Operational Amplifier Literature Number: SNOSBZ3C LMC660 CMOS Quad Operational Amplifier General Description The LMC660 CMOS Quad operational amplifier is ideal for operation from a single supply. It operates from +5V to +15.5V and features rail-to-rail output swing in addition to an input common-mode range that includes ground. Performance limitations that have plagued CMOS amplifiers in the past are not a problem with this design. Input VOS, drift, and broadband noise as well as voltage gain into realistic loads (2 k and 600) are all equal to or better than widely accepted bipolar equivalents. This chip is built with National's advanced Double-Poly Silicon-Gate CMOS process. See the LMC662 datasheet for a dual CMOS operational amplifier with these same features. Features n Rail-to-rail output swing n Specified for 2 k and 600 loads n High voltage gain: 126 dB n n n n n n n n Low input offset voltage: 3 mV Low offset voltage drift: 1.3 V/C Ultra low input bias current: 2 fA Input common-mode range includes V- Operating range from +5V to +15.5V supply ISS = 375 A/amplifier; independent of V+ Low distortion: 0.01% at 10 kHz Slew rate: 1.1 V/s Applications n n n n n n n n High-impedance buffer or preamplifier Precision current-to-voltage converter Long-term integrator Sample-and-Hold circuit Peak detector Medical instrumentation Industrial controls Automotive sensors Connection Diagram 14-Pin SOIC/MDIP LMC660 Circuit Topology (Each Amplifier) 00876704 00876701 (c) 2006 National Semiconductor Corporation DS008767 www.national.com LMC660 CMOS Quad Operational Amplifier June 2006 LMC660 Absolute Maximum Ratings (Note 3) Power Dissipation If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Junction Temperature 150C ESD tolerance (Note 8) 1000V Supply Voltage Differential Input Voltage Supply Voltage Operating Ratings 16V Output Short Circuit to V+ (Note 11) Output Short Circuit to V- (Note 1) Temperature Range Lead Temperature (Soldering, 10 sec.) Voltage at Input/Output Pins (V ) + 0.3V, (V ) - 0.3V 18 mA 5 mA Current at Input Pin Current at Power Supply Pin 0C TJ +70C 4.75V to 15.5V (Note 9) Thermal Resistance (JA) (Note 10) - Current at Output Pin -40C TJ +85C Power Dissipation -65C to +150C + LMC660AI LMC660C Supply Voltage Range 260C Storage Temp. Range (Note 2) 14-Pin SOIC 115C/W 14-Pin MDIP 85C/W 35 mA DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C. Boldface limits apply at the temperature extremes. V+ = 5V, V- = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified. Parameter Conditions Typ (Note 4) Input Offset Voltage 1 Input Offset Voltage LMC660AI LMC660C Limit Limit (Note 4) (Note 4) Units 3 6 mV 3.3 6.3 max 1.3 V/C Average Drift Input Bias Current 0.002 Input Offset Current 2 max 2 1 max 83 70 63 dB 68 62 min 83 70 63 dB 68 62 min 0.001 0V VCM 12.0V + Rejection Ratio V = 15V Positive Power Supply 5V V+ 15V Rejection Ratio VO = 2.5V Negative Power Supply 0V V- -10V 94 Input Common-Mode V+ = 5V & 15V Voltage Range For CMRR 50 dB Voltage Gain RL = 2 k (Note 5) 84 74 dB 73 min -0.4 -0.1 -0.1 V 0 0 max V+ - 1.9 V+ - 2.3 V+ - 2.3 V V+ - 2.5 V+ - 2.4 min 2000 440 300 V/mV 400 200 min 500 180 90 V/mV 120 80 min 220 150 V/mV 200 100 min 100 50 V/mV 60 40 min Sourcing Sinking RL = 600 (Note 5) 1000 Sourcing Sinking www.national.com 250 2 Tera 83 Rejection Ratio Large Signal pA >1 Input Resistance Common Mode pA 4 (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25C. Boldface limits apply at the temperature extremes. V+ = 5V, V- = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified. Parameter Output Swing Conditions Typ (Note 4) V+ = 5V Limit (Note 4) 4.82 4.78 V 4.79 4.76 min 0.15 0.19 V 0.17 0.21 max 4.41 4.27 V 4.31 4.21 min 0.50 0.63 V 0.56 0.69 max 14.50 14.37 V 14.44 14.32 min 0.26 0.35 0.44 V 0.40 0.48 max 13.90 13.35 12.92 V 13.15 12.76 min 1.16 1.45 V 1.32 1.58 max 16 13 mA 14 11 min 16 13 mA 14 11 min 28 23 mA 25 21 min 28 23 mA 24 20 min 2.2 2.7 mA 2.6 2.9 max RL = 2 k to V /2 0.10 4.61 + RL = 600 to V /2 0.30 14.63 RL = 2 k to V+/2 V+ = 15V RL = 600 to V+/2 0.79 Output Current Sourcing, VO = 0V 22 V+ = 5V Sinking, VO = 5V Output Current 21 Sourcing, VO = 0V 40 V+ = 15V Sinking, VO = 13V 39 (Note 11) Supply Current Units Limit 4.87 V+ = 15V LMC660C (Note 4) + V+ = 5V LMC660AI All Four Amplifiers 1.5 VO = 1.5V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C. Boldface limits apply at the temperature extremes. V+ = 5V, V- = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified. Parameter Slew Rate Conditions (Note 6) Typ (Note 4) 1.1 LMC660AI LMC660C Limit Limit (Note 4) (Note 4) 0.8 0.8 0.6 0.7 Units V/s min Gain-Bandwidth Product 1.4 MHz Phase Margin 50 Deg Gain Margin 17 dB Amp-to-Amp Isolation (Note 7) 130 dB Input Referred Voltage Noise F = 1 kHz 22 Input Referred Current Noise f = 1 kHz 0.0002 3 www.national.com LMC660 DC Electrical Characteristics LMC660 AC Electrical Characteristics (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25C. Boldface limits apply at the temperature extremes. V+ = 5V, V- = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified. Parameter Conditions Total Harmonic Distortion Typ (Note 4) LMC660AI LMC660C Limit Limit (Note 4) (Note 4) Units 0.01 f = 10 kHz, AV = -10 RL = 2 k, VO = 8 VPP V+ = 15V % Note 1: Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature and/or multiple Op Amp shorts can result in exceeding the maximum allowed junction temperature of 150C. Output currents in excess of 30 mA over long term may adversely affect reliability. Note 2: The maximum power dissipation is a function of TJ(MAX), JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/JA. Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 4: Typical values represent the most likely parametric norm. Limits are guaranteed by testing or correlation. Note 5: V+ = 15V, VCM = 7.5V and RL connected to 7.5V. For Sourcing tests, 7.5V VO 11.5V. For Sinking tests, 2.5V VO 7.5V. Note 6: V+ = 15V. Connected as Voltage Follower with 10V step input. Number specified is the slower of the positive and negative slew rates. Note 7: Input referred. V+ = 15V and RL = 10 k connected to V+/2. Each amp excited in turn with 1 kHz to produce VO = 13 VPP. Note 8: Human Body Model is 1.5 k in series with 100 pF. Note 9: For operating at elevated temperatures the device must be derated based on the thermal resistance JA with PD = (TJ - TA)/JA. Note 10: All numbers apply for packages soldered directly into a PC board. Note 11: Do not connect output to V+ when V+ is greater than 13V or reliability may be adversely affected. Ordering Information Package Temperature Range Transport Media Industrial Commercial -40C to +85C 0C to +70C 14-Pin LMC660AIM LMC660CM Rail SOIC LMC660AIMX LMC660CMX Tape and Reel 14-Pin M DIP LMC660AIN LMC660CN Rail www.national.com 4 NSC Drawing M14A N14A LMC660 Typical Performance Characteristics VS = 7.5V, TA = 25C unless otherwise specified. Supply Current vs. Supply Voltage Offset Voltage 00876725 00876724 Input Bias Current Output Characteristics Current Sinking 00876726 00876727 Output Characteristics Current Sourcing Input Voltage Noise vs. Frequency 00876728 00876729 5 www.national.com LMC660 Typical Performance Characteristics VS = 7.5V, TA = 25C unless otherwise specified. CMRR vs. Frequency Open-Loop Frequency Response 00876730 00876731 Frequency Response vs. Capacitive Load Non-Inverting Large Signal Pulse Response 00876733 00876732 Stability vs. Capacitive Load Stability vs. Capacitive Load 00876734 www.national.com (Continued) 00876735 6 etc., and RP is the parallel combination of RF and RIN. This formula, as well as all formulae derived below, apply to inverting and non-inverting op amp configurations. AMPLIFIER TOPOLOGY The topology chosen for the LMC660, shown in Figure 1, is unconventional (compared to general-purpose op amps) in that the traditional unity-gain buffer output stage is not used; instead, the output is taken directly from the output of the integrator, to allow rail-to-rail output swing. Since the buffer traditionally delivers the power to the load, while maintaining high op amp gain and stability, and must withstand shorts to either rail, these tasks now fall to the integrator. As a result of these demands, the integrator is a compound affair with an embedded gain stage that is doubly fed forward (via Cf and Cff) by a dedicated unity-gain compensation driver. In addition, the output portion of the integrator is a push-pull configuration for delivering heavy loads. While sinking current the whole amplifier path consists of three gain stages with one stage fed forward, whereas while sourcing the path contains four gain stages with two fed forward. When the feedback resistors are smaller than a few k, the frequency of the feedback pole will be quite high, since CS is generally less than 10 pF. If the frequency of the feedback pole is much higher than the "ideal" closed-loop bandwidth (the nominal closed-loop bandwidth in the absence of CS), the pole will have a negligible effect on stability, as it will add only a small amount of phase shift. However, if the feedback pole is less than approximately 6 to 10 times the "ideal" -3 dB frequency, a feedback capacitor, CF, should be connected between the output and the inverting input of the op amp. This condition can also be stated in terms of the amplifier's low-frequency noise gain: To maintain stability a feedback capacitor will probably be needed if where is the amplifier's low-frequency noise gain and GBW is the amplifier's gain bandwidth product. An amplifier's lowfrequency noise gain is represented by the formula 00876704 FIGURE 1. LMC660 Circuit Topology (Each Amplifier) regardless of whether the amplifier is being used in inverting or non-inverting mode. Note that a feedback capacitor is more likely to be needed when the noise gain is low and/or the feedback resistor is large. The large signal voltage gain while sourcing is comparable to traditional bipolar op amps, even with a 600 load. The gain while sinking is higher than most CMOS op amps, due to the additional gain stage; however, under heavy load (600) the gain will be reduced as indicated in the Electrical Characteristics. Avoid resistive loads of less than 500, as they may cause instability. If the above condition is met (indicating a feedback capacitor will probably be needed), and the noise gain is large enough that: COMPENSATING INPUT CAPACITANCE The high input resistance of the LMC660 op amps allows the use of large feedback and source resistor values without losing gain accuracy due to loading. However, the circuit will be especially sensitive to its layout when these large-value resistors are used. Every amplifier has some capacitance between each input and AC ground, and also some differential capacitance between the inputs. When the feedback network around an amplifier is resistive, this input capacitance (along with any additional capacitance due to circuit board traces, the socket, etc.) and the feedback resistors create a pole in the feedback path. In the following General Operational Amplifier circuit,Figure 2 the frequency of this pole is the following value of feedback capacitor is recommended: If the feedback capacitor should be: where CS is the total capacitance at the inverting input, including amplifier input capacitance and any stray capacitance from the IC socket (if one is used), circuit board traces, 7 www.national.com LMC660 Application Hints LMC660 Application Hints (Continued) Note that these capacitor values are usually significant smaller than those given by the older, more conservative formula: 00876705 FIGURE 3. Rx, Cx Improve Capacitive Load Tolerance Capacitive load driving capability is enhanced by using a pull up resistor to V+ (Figure 4). Typically a pull up resistor conducting 500 A or more will significantly improve capacitive load responses. The value of the pull up resistor must be determined based on the current sinking capability of the amplifier with respect to the desired output swing. Open loop gain of the amplifier can also be affected by the pull up resistor (see Electrical Characteristics). 00876706 CS consists of the amplifier's input capacitance plus any stray capacitance from the circuit board and socket. CF compensates for the pole caused by CS and the feedback resistors. FIGURE 2. General Operational Amplifier Circuit Using the smaller capacitors will give much higher bandwidth with little degradation of transient response. It may be necessary in any of the above cases to use a somewhat larger feedback capacitor to allow for unexpected stray capacitance, or to tolerate additional phase shifts in the loop, or excessive capacitive load, or to decrease the noise or bandwidth, or simply because the particular circuit implementation needs more feedback capacitance to be sufficiently stable. For example, a printed circuit board's stray capacitance may be larger or smaller than the breadboard's, so the actual optimum value for CF may be different from the one estimated using the breadboard. In most cases, the values of CF should be checked on the actual circuit, starting with the computed value. 00876723 FIGURE 4. Compensating for Large Capacitive Loads with a Pull Up Resistor PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK It is generally recognized that any circuit which must operate with less than 1000 pA of leakage current requires special layout of the PC board. When one wishes to take advantage of the ultra-low bias current of the LMC662, typically less than 0.04 pA, it is essential to have an excellent layout. Fortunately, the techniques for obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board, even though it may sometimes appear acceptably low, because under conditions of high humidity or dust or contamination, the surface leakage will be appreciable. To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LMC660's inputs and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op amp's inputs. SeeFigure 5. To have a significant effect, guard rings should be placed on both the top and bottom of the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier inputs, since no leakage current can flow between two points at the same potential. For example, a PC board trace-to-pad resistance of 1012, which is normally considered a very large resistance, could leak 5 pA if the trace were a 5V bus adjacent to the pad of an input. This would cause a 100 times degradation from the LMC660's actual performance. However, if a guard ring is held within 5 mV of the inputs, then even a resistance of 1011 would CAPACITIVE LOAD TOLERANCE Like many other op amps, the LMC660 may oscillate when its applied load appears capacitive. The threshold of oscillation varies both with load and circuit gain. The configuration most sensitive to oscillation is a unity-gain follower. See Typical Performance Characteristics. The load capacitance interacts with the op amp's output resistance to create an additional pole. If this pole frequency is sufficiently low, it will degrade the op amp's phase margin so that the amplifier is no longer stable at low gains. As shown in Figure 3, the addition of a small resistor (50 to 100) in series with the op amp's output, and a capacitor (5 pF to 10 pF) from inverting input to output pins, returns the phase margin to a safe value without interfering with lowerfrequency circuit operation. Thus larger values of capacitance can be tolerated without oscillation. Note that in all cases, the output will ring heavily when the load capacitance is near the threshold for oscillation. www.national.com 8 LMC660 Application Hints (Continued) cause only 0.05 pA of leakage current, or perhaps a minor (2:1) degradation of the amplifier's performance. See Figure 6a,Figure 6b, Figure 6c for typical connections of guard rings for standard op amp configurations. If both inputs are active and at high impedance, the guard can be tied to ground and still provide some protection; see Figure 6d. 00876717 (a) Inverting Amplifier 00876718 (b) Non-Inverting Amplifier 00876716 FIGURE 5. Example, using the LMC660, of Guard Ring in P.C. Board Layout 00876719 (c) Follower 00876720 (d) Howland Current Pump FIGURE 6. Guard Ring Connections The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 7. 9 www.national.com LMC660 Application Hints (Continued) A suitable capacitor for C2 would be a 5 pF or 10 pF silver mica, NPO ceramic, or air-dielectric. When determining the magnitude of Ib-, the leakage of the capacitor and socket must be taken into account. Switch S2 should be left shorted most of the time, or else the dielectric absorption of the capacitor C2 could cause errors. Similarly, if S1 is shorted momentarily (while leaving S2 shorted) where Cx is the stray capacitance at the + input. 00876721 (Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.) FIGURE 7. Air Wiring BIAS CURRENT TESTING The test method of Figure 7 is appropriate for bench-testing bias current with reasonable accuracy. To understand its operation, first close switch S2 momentarily. When S2 is opened, then 00876722 FIGURE 8. Simple Input Bias Current Test Circuit www.national.com 10 LMC660 Typical Single-Supply Applications (V+ = 5.0 VDC) Sine-Wave Oscillator Additional single-supply applications ideas can be found in the LM324 datasheet. The LMC660 is pin-for-pin compatible with the LM324 and offers greater bandwidth and input resistance over the LM324. These features will improve the performance of many existing single-supply applications. Note, however, that the supply voltage range of the LMC660 is smaller than that of the LM324. Low-Leakage Sample-and-Hold 00876709 00876707 Oscillator frequency is determined by R1, R2, C1, and C2: fosc = 1/2RC, where R = R1 = R2 and C = C1 = C2. Instrumentation Amplifier This circuit, as shown, oscillates at 2.0 kHz with a peak-topeak output swing of 4.5V. 1 Hz Square-Wave Oscillator 00876708 If R1 = R5, R3 = R6, and R4 = R7; then 00876710 Power Amplifier AV 100 for circuit shown. For good CMRR over temperature, low drift resistors should be used. Matching of R3 to R6 and R4 to R7 affect CMRR. Gain may be adjusted through R2. CMRR may be adjusted through R7. 00876711 11 www.national.com LMC660 Typical Single-Supply Applications High Gain Amplifier with Offset Voltage Reduction (V+ = 5.0 VDC) (Continued) 10 Hz Bandpass Filter 00876712 fO = 10 Hz Q = 2.1 Gain = -8.8 00876715 10 Hz High-Pass Filter Gain = -46.8 Output offset voltage reduced to the level of the input offset voltage of the bottom amplifier (typically 1 mV). 00876713 fc = 10 Hz d = 0.895 Gain = 1 2 dB passband ripple 1 Hz Low-Pass Filter (Maximally Flat, Dual Supply Only) 00876714 fc = 1 Hz d = 1.414 Gain = 1.57 www.national.com 12 LMC660 Physical Dimensions inches (millimeters) unless otherwise noted 14-Pin SOIC NS Package Number M14A 14-Pin MDIP NS Package Number N14A 13 www.national.com LMC660 CMOS Quad Operational Amplifier Notes National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor follows the provisions of the Product Stewardship Guide for Customers (CSP-9-111C2) and Banned Substances and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at: www.national.com/quality/green. Lead free products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Francais Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated