ADV7630 Data Sheet
Rev. 0 | Page 8 of 16
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
CVDD to GND 2.2 V
DVDD to GND 2.2 V
TVDD to GND 3.9 V
TX_AVDD to GND 2.2 V
TXA_PVDD to GND 2.2 V
TXB_PVDD to GND 2.2 V
SYS_3P3V to GND 3.9 V
DVDDIO to GND 3.9 V
Digital Inputs Voltage to GND GND – 0.3 V to DVDDIO + 0.3 V
Analog Inputs Voltage to GND GND – 0.3 V to TXA_PVDD + 0.3 V
HDMI Digital Inputs Voltage to GND GND – 0.3 V to TVDD + 0.3 V
5 V Tolerant Digital Inputs to
GND1, 3, 6
GND – 0.3 V to 5.5 V
5 V Digital Inputs2
5 V Tolerant Digital Outputs to GND3, 6 GND – 0.3 V to 5.5 V
Digital Outputs Voltage to GND4, 5 GND – 0.3 V to DVDDIO + 0.3 V
Analog Outputs Voltage to GND GND – 0.3 V to CVDD + 0.3 V
HDMI Digital Outputs to GND GND – 0.3 V to TVDD + 0.3 V
Maximum Junction Temperature
(TJ MAX)
125°C
Storage Temperature Range −60°C to +150°C
Infrared Reflow Soldering (20 sec) 260°C
1 The following pins are 3.3 V inputs, 5 V tolerant: TXB_HPD, TXB_DDC_SDA, ,
TXA_HPD, TXA_DDC_SDA, DDCA_SCL, DDCB_SCL, DDCC_SCL, DDCD_SCL.
2 The following pins are 5 V inputs: RXA_5V, RXB_5V, RXC_5V, RXD_5V.
3 The following pins are 3.3 V outputs, 5 V tolerant: TXB_DDC_SCL,
TXA_DDC_SCL, HPA_D, HPA_C, HPA_B, HPA_A.
4 Except the DDCA_SDA, DDCB_SDA, DDCC_SDA, DDCD_SDA, EP_MOSI,
EP_SCK, and EP_CS pins, which are kept to GND – 0.3 V to REG_3P3V.
5 Except the REG_3P3V output, which is kept to GND – 0.3 V to SYS_3P3 +
0.3 V and REG_1P8V output, which is kept to GND – 0.3 V to DVDD + 0.3 V.
6 The following pins are 3.3 V bidirectional input/outputs, 5 V tolerant:
TXA_DDC_SDA, TXB_DDC_SDA, DDCA_SDA, DDCB_SDA, DDCC_SDA, and
DDCD_SDA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7630, the
user is advised to turn off the unused sections of the part.
Due to PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using
the package surface temperature to estimate the die tempera-
ture because this eliminates the variance associated with the
θJA value.
The maximum junction temperature (TJ MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured package surface temperature
and applies only when no heat sink is used on the device under
test (DUT):
TOTALJT
S
JWΨTT
where:
TS is the package surface temperature (°C).
ΨJT is 0.22°C/W for the 128-lead TQFP_EP.
WTOTAL = ((CVDD × ICVDD) + (0.2 × TVDD × ITVDD) + (DVDD ×
IDVDD) + (TX_AVDD × ITX_AVDD) + (TXA_PVDD × ITXA_PVDD) +
(TXB_PVDD × ITXA_PVDD) + (DVDDIO × IDVDDIO)) + NTX × PTX
where:
0.2 is 20% of the TVDD power that is dissipated on the part
itself.
NTX is the number of connected and active TX ports.
PTX = 28 mW minus average power dissipated on-chip of each
HDMI transmitters.
ESD CAUTION