XAA117 Dual Single-Pole, Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Ratings 60 150 16 1 Units VP mArms / mADC mA Description The XAA117 is a dual, single-pole, normally open (1-Form-A) Solid State Relay with two independently controlled, optically coupled MOSFET switches that feature 3750Vrms of input to output isolation. The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Features * Low Input Control Current: 1mA * 3750Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * Arc-Free With No Snubbing Circuits * FCC Compatible * VDE Compatible * No EMI/RFI Generation * Machine Insertable, Wave Solderable * Surface Mount Tape & Reel Version Available This dual single-pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Compliant Applications * Security * Passive Infrared Detectors (PIR) * Data Signaling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Ordering Information Part # XAA117 XAA117S XAA117STR XAA117P XAA117PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-XAA117-R03 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION XAA117 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 60 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units t =10ms IL=150mA VL=60VP IL ILPK RON ILEAK - 7 - 150 400 16 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 0.1 0.5 25 5 5 - IL=150mA IF=5mA VR=5V IF VF IR 0.05 0.9 - 1.2 - 1 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION XAA117 PERFORMANCE DATA @25C (Unless Otherwise Noted)* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 25 20 15 10 15 10 5 5 1.21 75 1.22 1.23 1.24 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mA) 25 20 15 10 5 0 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 20 Device Count (N) Device Count (N) 30 Device Count (N) 35 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 80 85 90 95 Turn-On Time (Ps) 100 0.35 105 0.45 0.50 0.55 0.60 Turn-Off Time (ms) 0.65 Typical Blocking Voltage Distribution (N=50) Typical On-Resistance Distribution (N=50, IL=100mA) 20 0.40 35 15 10 5 10 5 25 20 15 10 0 0 0.05 0.06 0.07 0.08 0.09 0.10 LED Current (mA) 0.11 1200 1.5 7.0 7.1 7.2 On-Resistance (:) 84 7.4 7.3 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 1.6 6.9 6.8 IF=20mA 1.3 IF=10mA IF=5mA IF=2mA IF=1mA 1.2 1.1 1.0 -40 Turn-Off Time (Ps) 1.4 800 600 400 200 0 20 40 60 Temperature (C) 80 100 0 Typical IF to Operate vs. Temperature (IL=100mA) 86 87 88 89 Blocking Voltage (VP) 90 480 475 470 465 460 0 -20 85 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 485 1000 IF=50mA Turn-On Time (Ps) LED Forward Voltage Drop (V) 15 5 0 0.18 Device Count (N) Device Count (N) Device Count (N) 30 20 5 10 15 LED Forward Current (mA) 0 20 Typical Turn-On Time vs. Temperature (IL=50mA) 600 5 10 15 LED Forward Current (mA) 20 Typical Turn-Off Time vs. Temperature (IL=50mA) 800 IF=1mA 0.14 0.12 0.10 0.08 -40 700 Turn-Off Time (Ps) Turn-On Time (Ps) IF (mA) 0.16 500 400 300 200 IF=5mA 0 20 40 60 Temperature (C) 80 100 0 -40 IF=1mA & IF=5mA 500 400 300 100 -20 600 -20 0 20 40 60 Temperature (C) 80 100 200 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XAA117 PERFORMANCE DATA @25C (Unless Otherwise Noted)* Typical Load Current vs. Load Voltage (IF=1mA) Typical On-Resistance vs. Temperature (IF=5mA, IL=50mA) 12 150 9 8 7 Load Current (mA) 10 Current (mA) 0.1 0.0 -0.1 6 -0.2 5 -40 -0.3 -1.5 -20 0 20 40 60 Temperature (C) 80 100 -1.0 -0.5 0.0 0.5 1.0 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 Leakage (nA) 88 86 8 6 4 2 -20 0 20 40 60 Temperature (C) 80 100 110 Both Poles 100 90 0 -40 -20 0 20 40 60 Temperature (C) 80 100 -20 0 20 40 60 Temperature (C) 80 100 Energy Rating Curve 10 90 120 -40 12 92 130 70 1.5 Voltage (V) 94 Single Pole 140 80 Load Current (A) On-Resistence (:) 0.2 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 160 0.3 11 84 -40 Maximum Load Current vs. Temperature (IF=2mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION XAA117 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating XAA117 / XAA117S / XAA117P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time XAA117 / XAA117S 250C for 30 seconds XAA117P 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XAA117 Mechanical Dimensions XAA117 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XAA117S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XAA117P 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION XAA117 XAA117STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 XAA117PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-XAA117-R03 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: XAA117STR XAA117 XAA117P XAA117S XAA117PTR