INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-XAA117-R03 1
XAA117
Dual Single-Pole, Normally Open
OptoMOS® Relay
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Pb
Part # Description
XAA117 8-Pin DIP (50/Tube)
XAA117S 8-Pin Surface Mount (50/Tube)
XAA117STR 8-Pin Surface Mount (1,000/Reel)
XAA117P 8-Pin Flat Pack (50/Tube)
XAA117PTR 8-Pin Flat Pack (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 60 VP
Load Current 150 mArms / mADC
On-Resistance (max) 16
LED Current to Operate 1 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics of
Normally Open Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
• Low Input Control Current: 1mA
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
The XAA117 is a dual, single-pole, normally open
(1-Form-A) Solid State Relay with two independently
controlled, optically coupled MOSFET switches that
feature 3750Vrms of input to output isolation.
The optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R03
XAA117
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 150 mArms / mADC
Peak t =10ms ILPK - - ±400 mAP
On-Resistance IL=150mA RON -716
Off-State Leakage Current VL=60VPILEAK --1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.1 5 ms
Turn-Off toff - 0.5 5
Output Capacitance VL=50V, f=1MHz COUT -25- pF
Input Characteristics
Input Control Current to Activate IL=150mA IF--1mA
Input Control Current to Deactivate - - 0.05 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
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XAA117
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R03
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
25
20
15
10
5
0
1.21 1.22 1.23 1.24 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
75 85 95 10580 90 100
Turn-On Time (Ps)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
0.35 0.45 0.55 0.650.600.500.40
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
0.06 0.08 0.100.05 0.07 0.09 0.11
LED Current (mA)
Device Count (N)
25
15
10
5
0
20
Typical IF for Switch Operation
(N=50, IL=100mA)
20
15
10
5
0
On-Resistance (:)
Device Count (N)
6.8 6.9 7.17.0 7.47.2 7.3
Typical On-Resistance Distribution
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
84 86 88 9085 87 89
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=2mA
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=1mA
LED Forward Current (mA)
0 5 10 15 20
Turn-On Time (Ps)
0
200
400
600
800
1000
1200
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
0 5 10 15 20
Turn-Off Time (Ps)
460
465
470
475
480
485
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF (mA)
0.08
0.10
0.12
0.14
0.16
0.18
Typical IF to Operate vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
0
100
200
300
400
500
600
Typical Turn-On Time
vs. Temperature
(IL=50mA)
IF=5mA
IF=1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
300
400
500
600
700
800
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
IF=1mA & IF=5mA
INTEGRATED CIRCUITS DIVISION
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4R03
XAA117
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistence (:)
5
6
7
8
9
10
11
12
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=50mA)
Voltage (V)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Current (mA)
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
Typical Load Current
vs. Load Voltage
(IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
70
80
90
100
110
120
130
140
150
160
Maximum Load Current
vs. Temperature
(IF=2mA)
Single Pole
Both Poles
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
84
86
88
90
92
94
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
2
4
6
8
10
12
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
INTEGRATED CIRCUITS DIVISION
XAA117
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R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
XAA117 / XAA117S / XAA117P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
XAA117 / XAA117S 250ºC for 30 seconds
XAA117P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
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6R03
XAA117
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
XAA117
XAA117S
XAA117P
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-XAA117-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
7
XAA117
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
XAA117STR Tape & Reel
XAA117PTR Tape & Reel
Mouser Electronics
Authorized Distributor
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