Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
www.vishay.com For technical questions, contact: sfer@vishay.com Document Number: 50003
1Revision: 17-Oct-08
MSP
Vishay Sfernice
FEATURES
•Approved according CECC 40402-801
(wirewound)
•Wide range of ohmic values (0.04 Ω to 1 MΩ)
•Low temperature coefficient
(± 25 ppm/°C available)
•Good electrical insulation
•All welded construction and molded encapsulant
•High power ratings (up to 2.5 W)
•Stability class 0.5
•Pure matte tin termination
Specially designed for surface mounting, the MSP series
uses either wirewound or metal film technology.
The molded package ensures mechanical and climatic
protection as well as high dielectric insulation.
The MSP design is compatible with surface mounting
equipment and can withstand wave and reflow soldering
techniques.
DIMENSIONS in millimeters
General tolerance: ± 0.2 mm
MSP
C
D
A
B
F
F
E
DIMENSIONS
A BCD E FWX Z
Average
Mass
(g)
SERIES
MSP 1 6.9 3.8 3.8 2.5 6.5 1.4 2.7 2.9 6 0.2
MSP 2 11.4 5 7 5 11 2.4 5.2 4.1 9.4 0.8
MSP 3 14.8 6.6 7 5 14.4 2.4 5.2 4.1 12.7 1.5
RECOMMENDED SOLDERING AREAS
Z
W
XX
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY Wirewound Metal Film
Vishay Sfernice Series MSP 1 B MSP 2 B MSP 3 B MSP 1 C MSP 2 C
CECC 40402-801 RW1 RW2 RW3 - -
Metric Size 0704M 1107M 1607M 0704M 1107M
Rated Dissipation at + 25 °C, P25 1 W 2 W 2.5 W 0.5 W 1 W
Ohmic Range In
Relation to
Tolerance
(with Prefered
Ohmic
Value Series)
± 5 % E24 series 0.04
2.2K
0.04
4.7K
0.04
13K --
± 2 % E48 series 0.04
2.2K
0.04
4.7K
0.05
13K - -
± 1 % E96 series 0.04
2.2K
0.04
4.7K
0.05
13K
10
332K
10
1M
± 0.5 % E96 series 0.4
2.2K
0.4
4.7K
0.3
13K
10
332K
10
1M
± 0.1 % E192 series --- 10
332K
10
332K
Approved Range
CECC 40402-801
1 % or
Class 0.5
0.5
1K
0.5
2.2K
0.1
4.12K --
Limiting Element Voltage, Umax. AC/DC 50 V 120 V 200 V 300 V 350 V