DS-IXD_604 - R02 www.clare.com 1
RoHS
2002/95/EC e
3
Pb
Features
•4A Peak Source/Sink Driv e Current
•Wide Operating Voltage Range: 4.5V to 35V
•-40°C to +125°C Extended Operating Temperature
Range
•Logic Input Withstands Negative Swing of up to 5V
•Matched Rise and Fall Times
•Low Propaga tion Delay Time
•Low, 10μA Supply Current
•Low Output Impedance
Applications
•Efficient Pow er MOSFET and IGBT Switching
•Switch Mode Power Supplies
•Motor Controls
•DC to DC Converters
•Class-D Switching Amplifiers
•Pulse Transformer Driv er
Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate driv ers are especially w ell suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of peak
current while producing v oltage rise and fall times of
less than 10ns. The input of ea ch driv er is virtually
immune to latch up, and proprietary circuitry
eliminates cross conduction and current
“shoot-through.” Lo w pr opagation delay and fast,
matched rise and f all times make the IXD_604 f amily
ideal for high-freq uency and high-po wer applicat ions .
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual in verting driver , and the IXDF604
has one inverting driver and one non-in verting driver.
The IXD_604 family is available in a standard 8-pin
DIP (PI), 8-pin SOIC (SIA), 8-pin Po w er SOIC with an
e xpo sed met al back (SI), and an 8-pin DFN (D2)
package.
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD604D2TR 8-Pin DFN Tape & Reel 2000
IXDD604PI 8-Pin DIP Tube 50
IXDD604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD604SIA 8-Pin SOIC Tube 100
IXDD604SIATR 8-Pin SOIC Tape & Reel 2000
IXDF604PI 8-Pin DIP Tube 50
IXDF604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDF604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDF604SIA 8-Pin SOIC Tube 100
IXDF604SIATR 8-Pin SOIC Tape & Reel 2000
IXDI604PI 8-Pin DIP Tube 50
IXDI604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI604SIA 8-Pin SOIC Tube 100
IXDI604SIATR 8-Pin SOIC Tape & Reel 2000
IXDN604PI 8-Pin DIP Tube 50
IXDN604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN604SIA 8-Pin SOIC Tube 100
IXDN604SIATR 8-Pin SOIC Tape & Reel 2000
ENA
INA
ENB
INB
OUTA
OUTB
A
B
INA
INB
A
B
OUTA
OUTB
INA
INB
A
B
OUTA
OUTB
INA
INB
OUTA
OUTB
A
B
IXD_604
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
IXD_604
R02 www.clare.com 2
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: - 40°C ≤ TA ≤ +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
IXD_604
R02 www.clare.com 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolute Maximum Ratings
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress r a tings. Stresses in excess of these ratings can cause perman ent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
IXDD604PI/SI/SIA
ENA
INA
GND
INB
ENB
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDF604PI/SI/SIA
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDI604PI/SI/SIA
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDN604PI/SI/SIA
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDD604D2
ENA
INA
INB
ENB
OUTA
GND
VCC
OUTB
A
1
4
3
2
8
5
6
7
B
Pin Name Description
INA Channel A Logic Input
INB Channel B Logic Input
ENA
Channel A Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENB
Channel B Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VINx , VENx -5 VCC+0.3 V
Output Current IOUT -±4A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC 4.5 35 V
Operating Temperature Range T
A-40 +125 °C
IXD_604
4www.clare.com R02
1.5 Electrical Ch ara ct e ri st ic s: TA = 25°C
Test Condit ions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
1.6 Electrical Ch ara ct e ri st ic s: - 40°C ≤ TA ≤ +125°C
Test Condit ions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10μA
High EN Input Voltage IXDD604 only VENH 2/3VCC --
V
Low EN Input Voltage IXDD604 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -1.32.5
Ω
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -1.12
Output Current, Continuous Limited by package power
dissipation IDC --±1A
Rise Time VCC=18V, CLOAD=1000pF tr-916
ns
Fall Time VCC=18V, CLOAD=1000pF tf-814
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -2950
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -3550
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -3555
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -4055
Enable Pull-Up Resistor - REN -200-kΩ
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-13mA
VCC=18V, VIN=0V -<110
μA
VCC=18V, VIN=VCC -<110
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.1 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN -10 10 μA
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL -0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -3
Ω
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -2.5
Output Current, Continuous Limited by package power
dissipation IDC -±1A
Rise Time VCC=18V, CLOAD=1000pF tr-16
ns
Fall Time VCC=18V, CLOAD=1000pF tf-14
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -65
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -65
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -65
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -65
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-3.5mA
VCC=18V, VIN=0V -150
μA
VCC=18V, VIN=VCC -150
IXD_604
R02 www.clare.com 5
1.7 Thermal Characteristics
2 IXD_604 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
D2 (8-Pin DFN)
Thermal Resistance, Junction-to-Ambient θJA
35
°C/W
PI (8-Pin DIP) 125
SI (8-Pin Power SOIC) 85
SIA (8-Pin SOIC) 120
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Case θJC 10 °C/W
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
INx
OUTx
10%
90%
t
ondly
t
offdly
t
r
t
f
V
IH
V
IL
INx
OUTx
ENAENB
INA OUTA
GNDVCC
INB OUTB
VCC
+
-
VIN
0.1μF10μF
CLOAD
Tektronix
Current Probe
6302
Tektronix
Current Probe
6302
CLOAD
IXD_604
6www.clare.com R02
3 Block Diagrams & Truth Tables
3.1 IXDD604
3.2 IXDI604
3.3 IXDF604
3.4 IXDN604
INXENXOUTX
0 1 or open 0
1 1 or open 1
00
Z
10
Z
INXOUTX
01
10
200kΩ
ENA
INA
GND
INB
ENB
OUTA
V
CC
OUTB
V
CC
V
CC
IXDD604
200kΩ
V
CC
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDI604
INA OUTA
01
10
INB OUTB
00
11
INXOUTX
00
11
INA
GND
INB
OUTA
V
CC
OUTB
V
CC
IXDF604
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDN604
IXD_604
R02 www.clare.com 7
4 Typical Performance Characteristics
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Temperature (ºC)
-40-200 20406080 100 120 140
Rise & Fall Times (ns)
4
5
6
7
8
9
10
A&B Rise and Fall Times
vs. Temperature
(Input=0-5V, VCC=18V, CL=1nF)
t
r
t
f
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Time vs. Load Capacitance
at V arious VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Time vs. Load Capacitance
at V arious VCC Levels
V
CC
=4.5V
V
CC
=8V
V
CC
=12V
V
CC
=18V
V
CC
=24V
V
CC
=35V
Supply V oltage (V)
0 5 10 15 20 25 30 35
Propagation Delay (ns)
20
40
60
80
100
120
140
160
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
toffdly
tondly
Input V oltage (V)
246810 12
Propagation Delay (ns)
20
30
40
50
60
70
Propagation Delay vs. Input Voltage
(VCC=15V, CL=1nF)
tondly
toffdly
Temperature (ºC)
-40 -20 0 20 40 60 80100120140
Input Threshold V oltage (V)
1.7
1.9
2.1
2.3
2.5
2.7
2.9
Input Threshold V oltage
vs. Temperature
(VCC=18V, CL=1nF)
Min VIH
Max VIL
Supply V oltage (V)
0 5 10 15 20 25 30 35
Input Threshold (V)
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2 Input Threshold vs. Supply Voltage
V
IH
V
IL
Supply V oltage (V)
0 5 10 15 20 25 30 35
Enable Threshold (V)
0
2
4
6
8
10
12
14
16
18
20
22
Enable Threshold vs. Supply Voltage
V
ENH
V
ENL
IXD_604
8www.clare.com R02
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=2MHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(V
CC
=35V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(V
CC
=12V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Quiesent Supply Current
vs. Temperature
(VCC=18V)
V
IN
=3.5V
V
IN
=5V
V
IN
=10V
V
IN
=0V & 18V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Dynamic Supply Current
vs. Temperature
(V
CC
=18V, V
IN
=5V, f=1khz, C
L
=1nF)
Supply V oltage (V)
0 5 10 15 20 25 30 35
Output Source Current (A)
0
-2
-4
-6
-8
-10
Output Source Current
vs. Supply Voltage
(CL=10nF)
Supply V oltage (V)
0 5 10 15 20 25 30 35
Output Sink Current (A)
0
2
4
6
8
10
Output Sink Current
vs. Supply Voltage
(CL=10nF)
IXD_604
R02 www.clare.com 9
Temperature (ºC)
-40-200 20406080 100 120 140
Output Source Current (A)
2
3
4
5
6
Output Source Current
vs. Temperature
(VCC=18V, CL=10nF)
Temperature (ºC)
-40-200 20406080 100 120 140
Output Sink Current (A)
2.0
3.0
4.0
5.0
6.0
Output Sink Current
vs. Temperature
(VCC=18V, CL=10nF)
Supply V oltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
High State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
Supply V oltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
IXD_604
10 www.clare.com R02
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor pac kages are susceptib le to moisture ingression. Clare classif ied
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set f orth in the standard, and guar antee p roper op erat ion of our
de vices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the w a rnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of ov er all reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown belo w , and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivi ty
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maxim um body temperature and time rating as sho wn below. All other guidelines of J-STD-020
must be observed.
Device Moisture Sensitivity Level (MSL) Rating
IXD_604SI / IXD_604SIA / IXD_604PI MSL 1
IXD_604D2 MSL 3
Device Maximum Temperature x Time
IXD_604SI / IXD_604SIA / IXD_604D2 260°C for 30 seconds
IXD_604PI 250°C for 30 seconds
RoHS
2002/95/EC
e3
Pb
IXD_604
R02 www.clare.com 11
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.30 / 1.75
(0.051 / 0.069)
0.10 / 0.25
(0.004 / 0.010)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244) 3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
1.27
(0.050)
5.40
(0.213) 1.55
(0.061)
0.60
(0.024)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
Recommended PCB Land Pattern
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
2. The exposed metal pad on the back of the SI package may be
left floating or connected to GND. It is not suitable for carrying
current.
1.30 / 1.75
(0.051 / 0.069)
0.03 / 0.10
(0.001 / 0.004)
4.80 / 5.00
(0.190 / 0.197)
PIN 1
0.31 / 0.51
(0.012 / 0.020)
5.80 / 6.20
(0.228 / 0.244) 3.80 / 4.00
(0.150 / 0.157)
1.27 BSC
(0.05 BSC)
0.40 / 1.27
(0.016 / 0.050)
0.10 / 0.25
(0.004 / 0.010)
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0º / 8º
2.29 / 2.79
(0.090 / 0.110)
3.30 / 3.81
(0.130 / 0.150)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)
IXD_604
12 www.clare.com R02
5.4.3 Tape & Reel Information for SI and SIA Packages
5.4.4 PI (8-Pin DIP)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ± 0.2mm
3. ( ) Reference dimensions only.
4. Unless otherwise specified, all dimensions in millimeters.
K0=2.30 ± 0.10
B0=5.20 ± 0.10
R0.50 TYP
8.00 ± 0.10
2.00 ± 0.10
4.00 ± 0.10 See Note #2
12.00 ± 0.30
5.50 ± 0.10
1.75 ± 0.10
∅1.50 (MIN)
∅1.55 ± 0.05
1.80 ± 0.10
(3.40)
0.30 ± 0.05
(70º)
A0=6.40 ± 0.10
(4.70)
(1.20)
A A
B
B
SECTION A-A
SECTION B-B
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
PC Board Pattern
7.62 / 10.92
(0.300 / 0.430)
7.62 BSC
(0.300 BSC)
0.20 / 0.38
(0.008 / 0.015)
7.37 / 8.26
(0.290 / 0.325)
0.38 / 0.58
(0.015 / 0.023)
1.14 / 1.65
(0.045 / 0.065)
0.38 / 1.02
(0.015 / 0.040)
3.05 / 3.81
(0.120 / 0.150) 3.43 / 4.70
(0.135 / 0.185)
3.18 / 3.81
(0.125 / 0.150)
8-0.900 DIA.
(8-0.035 DIA.)
7.50
(0.295)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
6.10 / 6.86
(0.240 / 0.270)
2.540 BSC
(0.100 BSC)
1.40
(0.055)
IXD_604
R02 www.clare.com 13
5.4.5 D2 (8-Pin DFN)
5.4.6 Tape & Reel Information for D2 Package
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
5.00 BSC
(0.197 BSC)
4.00 BSC
(0.158 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.00 / 0.05
(0.000 / 0.002)
0.95 BSC
(0.037 BSC)
0.76 / 0.81
(0.030 / 0.032)
0.30 / 0.45
(0.012 / 0.018)
3.04 / 3.09
(0.120 / 0.122)
2.54 / 2.59
(0.100 / 0.102)
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
Pin 1
Pin 1 Pin 8
0.20 REF
(0.008 REF)
Recommended PCB Land Pattern
4.50
(0.177)
0.45
(0.018)
1.20
(0.047)
3.05
(0.120)
2.55
(0.100)
0.95
(0.037)
0.35 x 45º
(0.014 x 45º)
NOTE:
The exposed metal pad on the back of the D2 package may be
left floating or connected to ground. It is not suitable for carrying current.
K0=1.90 ± 0.10
B0=5.40 ± 0.10
5º MAX
A0=4.25 ± 0.10
5º MAX
0.30 ± 0.05
(0.05)
(0.05)
R0.75 TYP
8.00 ± 0.10
2.00 ± 0.05
4.00 ± 0.10 See Note #2
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
∅1.50 (MIN)
∅1.55 ± 0.05
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ± 0.2mm
3. ( ) Reference dimensions only.
4. Unless otherwise specified, all dimensions in millimeters.
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
For additional information please visit our website at: www.clare.com
Clare, Inc. m ake s no represen tations or w arr anties with r espect to the accura cy or compl eteness of the contents of this pub lica tion and reserves th e right to m ak e changes t o specificat ions a nd
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, I nc. assu mes n o liab ility what soever , an d discla ims an y express or implied w a rra nty, relating to its prod ucts incl uding, bu t not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604-R02
©Copyrigh t 2010, Clare, Inc.
All rights reserved. Printed in USA.
12/3/2010