Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - (c) NXP N.V. (year). All rights reserved or (c) Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - (c) Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia PMBD7000 Double high-speed switching diode Rev. 4 -- 16 September 2010 Product data sheet 1. Product profile 1.1 General description The PMBD7000 consists of two high-speed switching diodes connected in series, fabricated in planar technology, and encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits High switching speed: trr 4 ns Repetitive peak forward current: IFRM 450 mA Small SMD plastic package Reverse voltage: VR 100 V Repetitive peak reverse voltage: VRRM 100 V AEC-Q101 qualified 1.3 Applications High-speed switching General-purpose switching 1.4 Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit IR reverse current VR = 100 V - - 0.5 A VR reverse voltage - - 100 V - - 4 ns Per diode trr [1] reverse recovery time [1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. PMBD7000 NXP Semiconductors Double high-speed switching diode 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) Graphic symbol 3 1 3 2 1 2 006aaa763 3. Ordering information Table 3. Ordering information Type number PMBD7000 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 4. Marking Table 4. Marking codes Type number Marking code[1] PMBD7000 *5C [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 2 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit - 100 V Per diode VRRM repetitive peak reverse voltage VR reverse voltage forward current IF IFRM repetitive peak forward current IFSM non-repetitive peak forward current square wave - 100 V [1] - 215 mA [2] - 125 mA - 450 mA [3] tp = 1 s - 4 A tp = 1 ms - 1 A - 0.5 A - 250 mW tp = 1 s total power dissipation Ptot Tamb 25 C [1][4] Per device Tj junction temperature - 150 C Tamb ambient temperature -55 +150 C Tstg storage temperature -65 +150 C [1] Single diode loaded. [2] Double diode loaded. [3] Tj = 25 C prior to surge. [4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Symbol PMBD7000 Product data sheet Thermal characteristics Parameter Rth(j-a) thermal resistance from junction to ambient Rth(j-t) thermal resistance from junction to tie-point Conditions in free air [1][2] Min Typ Max Unit - - 500 K/W - - 360 K/W [1] Single diode loaded. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 3 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 7. Characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage IF = 1 mA - 550 700 mV IF = 10 mA - 670 820 mV IF = 50 mA - - 1 V IF = 100 mA - 0.75 1.1 V Per diode VF reverse current IR IF = 150 mA - - 1.25 V VR = 50 V - - 300 nA VR = 100 V - - 500 nA VR = 50 V; Tj = 150 C - - 100 A Cd diode capacitance - - 1.5 pF trr reverse recovery time [1] - - 4 ns forward recovery voltage [2] - - 1.75 V VFR f = 1 MHz; VR = 0 V [1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. [2] When switched from IF = 10 mA; tr = 20 ns. mbd033 300 mbg382 300 IF (mA) IF (mA) (1) 200 (2) (3) 200 single diode loaded double diode loaded 100 100 0 0 0 100 Tamb (C) 200 0 1 VF (V) 2 (1) Tj = 150 C; typical values FR4 PCB, standard footprint (2) Tj = 25 C; typical values (3) Tj = 25 C; maximum values Fig 1. Forward current as a function of ambient temperature; derating curve PMBD7000 Product data sheet Fig 2. Forward current as a function of forward voltage All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 4 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode mbg704 102 mbg378 105 IR (nA) IFSM (A) 104 10 (1) 103 (2) (3) 1 102 10-1 1 10 102 103 10 104 tp (s) 100 0 Based on square wave currents. (1) VR = 50 V; maximum values Tj = 25 C; prior to surge (2) VR = 30 V; typical values Tj (C) 200 (3) VR = 50 V; typical values Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values Fig 4. Reverse current as a function of junction temperature mbg446 0.8 Cd (pF) 0.6 0.4 0.2 0 0 4 8 12 VR (V) 16 f = 1 MHz; Tamb = 25 C Fig 5. Diode capacitance as a function of reverse voltage; typical values PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 5 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 8. Test information tr tp t D.U.T. 10 % + IF IF RS = 50 SAMPLING OSCILLOSCOPE trr t Ri = 50 V = VR + IF x RS (1) 90 % VR mga881 input signal output signal (1) IR = 1 mA Fig 6. Reverse recovery time test circuit and waveforms I 1 k RS = 50 D.U.T. 450 I V 90 % OSCILLOSCOPE VFR Ri = 50 10 % t tr t tp input signal output signal mga882 Fig 7. Forward recovery voltage test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 6 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig 8. 0.15 0.09 04-11-04 Package outline PMBD7000 (SOT23/TO-236AB) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMBD7000 [1] PMBD7000 Product data sheet Package SOT23 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -215 -235 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 7 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste occupied area 0.6 (3x) 0.7 (3x) Dimensions in mm 0.5 (3x) 0.6 (3x) 1 Fig 9. sot023_fr Reflow soldering footprint PMBD7000 (SOT23/TO-236AB) 2.2 1.2 (2x) 1.4 (2x) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 10. Wave soldering footprint PMBD7000 (SOT23/TO-236AB) PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 8 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBD7000 v.4 20100916 Product data sheet - PMBD7000_3 Modifications: PMBD7000_3 * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * * * * * * * Legal texts have been adapted to the new company name where appropriate. Table 4 "Marking codes": updated Table 7 "Characteristics": corrected VF unit for condition IF = 150 mA Figure 2: updated Section 8 "Test information": figure title of Figure 6 amended Section 8.1 "Quality information": added Section 13 "Legal information": updated 19990511 Product specification - PMBD7000_2 PMBD7000_2 19960918 Product specification - PMBD7000_1 PMBD7000_1 19960419 Product specification - - PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 9 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 10 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMBD7000 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 11 of 12 PMBD7000 NXP Semiconductors Double high-speed switching diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 September 2010 Document identifier: PMBD7000