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DATA SHEET
SE2577L: Dual-Band 802.11n Wireless LAN Front-End Module
Applications
802.11n, MIMO solutions
IEEE 802.11g OFDM WLAN
IEEE 802.11a OFDM WLAN
Access points, PCMCIA, PC cards
Features
Passive front end, including two SPDT switches and diplexer
Integrated 2 GHz low pass filter
Able to accept 20 dBm of linear input power in both bands with
no EVM contribution
Lead free, Halogen Free and RoHS compliant
Thin lead-free plated QFN package (20-pin, 3 x 3 x 0.9 mm,
(MSL1, 260 °C per JEDEC J-STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
TXA
12
9
11
10
1
4
2
3
16
13
15
14
5
8
6
7
GND
GND
GND
VRX
GND
VTX
GND
GND
RXG
RXA
GND GND
GND
ANT
TXG
Y0148
17 20
18 19
Figure 2. SE2577L Pinout – 20-Pin QFN (Top View)
ANT
T
XG
RXG
RXA
TXA
Y0147
Figure 1. SE2577L Block Diagram
(RF Ports are DC Blocked)
Description
The SE2577L is a dual-band passive 802.11n WLAN RF front-end
module providing the functionality of spurious filters, switches
and diplexer. All RF ports are matched to 50 to simplify PCB
layout and the interface to the transceiver RFIC.
The Front End is packaged in a very compact RoHS compliant,
Halogen Free, and Lead Free 3mm x 3mm x 0.9mm QFN style
package.
A functional block diagram of the SE2577L is provided in Figure 1.
Figure 2 shows the pinout for the SE2577L. Table 1 lists the
signal pin assignments and functional pin descriptions.
DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
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Table 1. SE2577L Signal Descriptions
Pin Name Description Pin Name Description
1 GND Ground 11 GND Ground
2 RXG 2 GHz Receive Output 12 GND Ground
3 RXA 5 GHz Receive Output 13 VRX Receive Switch Control
4 GND Ground 14 GND Ground
5 TXA 5 GHz Transmit Input 15 GND Ground
6 GND Ground 16 TXG 2 GHz Transmit Input
7 GND Ground 17 GND Ground
8 VTX Transmit Switch Control 18 GND Ground
9 GND Ground 19 GND Ground
10 ANT Antenna 20 GND Ground
Electrical and Mechanical Specifications
The absolute maximum ratings of the SE2577L are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Tables 4
through 7.
Table 2. SE2577L Absolute Maximum Ratings (Note 1)
Parameter Symbol Minimum Maximum Units
High-level logic control voltage VCTL_ON 3.6 V
CW power on port 2TX, 5TX, ANT terminated into 50 Ω match TXRF +33 dBm
Operating temperature TA –40 +85 °C
Storage temperature TS2TX –40 +150 °C
Electrostatic discharge:
All pins
Antenna pin with external 4 pF blocking capacitor
ESD
200
1500
V
V
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2577L Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Ambient temperature TA –40 +25 +85 °C
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
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Table 4. SE2577L Electrical Specifications: RF Switch Characteristics (Note 1)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to the Device], All Unused Ports are Terminated with 50 Ω,
Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Control voltage:
ON state
OFF state
VCTL_ON
VCTL_OFF
3.0
0
3.3
3.6
0.3
V
V
Switch control bias circuit:
RF applied
No RF
ICTL_ON
On pin (VTX, VRX) driven high
On pin (VTX, VRX) driven high
0.5
0.5
1.5
1.5
mA
mA
10% to 90 % rise fall time Switch speed 250 ns
Control input capacitance CCTL 10 pF
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2577L Electrical Specifications: RF Switch Logic and Function Characteristics
RF Switch Logic RF Switch Function
VTX VRX TXG, TXA <-> ANT RXG, RXA <-> ANT
VCTL_OFF VCTL_OFF OFF OFF
VCTL_ON VCTL_OFF ON OFF
VCTL_OFF VCTL_ON OFF ON
VCTL_ON VCTL_ON Not a supported state
Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (1 of 2)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω,
Unless Otherwise Noted)
Parameter Symbol Condition Min Typ Max Unit
Frequency f 2400 2485 MHz
Reference input impedance ΩL All RF ports 50 Ω
RF input power PIN DSSS
OFDM +23
+22 dBm
Input return loss S11 RxG ↔ ANT; TxG ↔ ANT 15 dB
Transmit insertion loss S21 TX
TxG ↔ ANT:
Excluding external filter components
Includes losses from external filter components
1.5
1.8
1.8
2.1
dB
dB
Receive insertion loss S21 RX RxG ↔ ANT 1.1 1.4 dB
Output return loss S22 RxG ↔ ANT; TxG ↔ ANT 15 dB
0.1dB compression P0.1dB +29 +31 dBm
3rd order intercept IIP3 +50 dBm
2nd harmonics rejection 2fo
TxG ↔ ANT:
With external components on EK1 PCB
Without external components
50
35
55
40
dB
dB
3rd harmonics rejection 3fo
TXG ↔ ANT:
With external components on EK1 PCB
Without external components
50
25
55
28
dB
dB
DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
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Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (2 of 2)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω,
Unless Otherwise Noted)
Parameter Symbol Condition Min Typ Max Unit
Output 2nd harmonic power
generated at PIN = +22 dBm, CW PSD2 TXG ↔ ANT, no source contribution to harmonics –50 dBm
Output 3rd harmonic power
generated at PIN = +22 dBm, CW PSD3 TXG ↔ ANT, no source contribution to harmonics –50 dBm
5 to 2 GHz isolation Isol TXG ↔ ANT, Measure @RXA 40 50 dB
TXG ↔ ANT, Measure @TXA 20 40 dB
RXG to TXG TXG ↔ ANT, Measure @RXG 20 30 dB
RXG to ANT TXG ↔ ANT, Measure @RXG; TXG is not
terminated
20
27
33
dB
RF to non-RF Any RF pin to VRX, VTX, with 1.6pF cap on control
lines
40
dB
Table 7. Electrical Specifications: 5 GHz AC Electrical Characteristics (TA = 25 C, as Measured on the Evaluation Board [De-Embedded to
Device], All Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Unit
Frequency f 4900 5875 MHz
Reference input impedance L All RF ports 50
RF input power PIN OFDM +21 dBm
Input return loss S11 RxA ↔ ANT; TxA ↔ ANT 15 dB
Transmit insertion loss S21 TX TxA ↔ ANT 2.1 dB
Receive insertion loss S21 RX RxA ↔ ANT 2.1 dB
Output return loss S22 RxA ↔ ANT; TxA ↔ ANT 15 dB
0.1dB compression P0.1dB +29 +31 dBm
3rd order intercept IIP3 +50 dBm
2nd harmonics rejection 2fo TxA ↔ ANT 20 dB
3rd harmonics rejection 3fo TxA ↔ ANT 15 dB
Output 2nd harmonic power
generated at PIN = +22 dBm, OFDM
PSD2 TxA ↔ ANT
–50
dBm/MHz
Output 3rd harmonic power generated
at PIN = +22 dBm, OFDM
PSD3 TxA ↔ ANT
–50
dBm/MHz
Isolation: 2 to 5 GHz ISOL TxA ↔ ANT, Measure @ RXG
TxA ↔ ANT, Measure @ TXG
40
20 dB
dB
RXA to TXA ISOL TxA ↔ ANT, Measure @ RXA 20 dB
RXG to ANT ISOL TxA ↔ ANT, Measure @ RXA; TXA is not
terminated
20
33
dB
RF to non-RF ISOL Any RF pin to VRX, VTX
(with 1.6 pF cap on control lines)
40
dB
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
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Evaluation Board Description
The SE2577L Evaluation Board is used to test the performance of
the SE2577L FEM. A suggested application schematic diagram is
shown in Figure 3. An Evaluation Board assembly diagram is
shown in Figure 4. Component values for the SE2577L Evaluation
Board are listed in the Bill of Materials (BOM) in Table 8.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Paths to ground should be made as short as possible.
The ground pad of the SE2577L has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life
of the device.
Evaluation Board Setup Procedure
1. Connect system ground to pin 2 of connectors J6 and J20.
2. Test the Antenna to Receive Port by applying the switch
settings of RX – ANT as described in Table 5.
3. The RX to ANT performance can be monitored by applying an
RF signal to J4 (ANT), and measuring the response from either
J1 (5 GHz) or J5 (2 GHz) RX outputs.
4. Test the Transmit to Antenna Port by applying the switch
settings of TX – ANT as described in Table 5.
5. Amplifier performance at 2.5 GHz can be monitored by
applying an RF signal to connector J2 and monitoring the
output power on the antenna port connector J4 (ANT).
6. Amplifier performance at 5 GHz can be monitored by applying
an RF signal to connector J3 and monitoring the output power
on the antenna port connector J4 (ANT).
Caution: Care should be taken not to overdrive the amplifier by
applying too much RF on the input to the device. A
suitable starting input power for the device is
+20 dBm.
DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
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202486C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 11, 2014 6
1.2 pF
L1
2.7 nH
17
94
1
3
7
6
8
10
12
11
15
14
13
2
165
C3
4.0 pF
SMA
J1
J4
SM
A
2
1
J20
Header
2X1
2
1
J6
Header
2X1
SMA
J3
SMA
J2
SMA
J5
C7
1.2 pF
components that are not shown in this schematic.
The PCB contains footprints for non-populated
NOTE:
U1
PAD
GNDGND
GND
RX_A
GND
GND
VTX
ANT
GND
GND
GND
GND
VRX
RX_G
TX_G
TX_A
SE2577L
C6
Y1582
Figure 3. SE2577L Suggested Application Schematic
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
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Y1583
Figure 4. SE2577L Evaluation Board Assembly Diagram
Table 8. SE2577L Evaluation Board Bill of Materials
Component Value Manufacturer Mfr Part Number Package Description
C3 4.0 pF
Murata GRM1555C1H4R0CZ01 0402 Multilayer ceramic
C6, C7 1.2 pF Murata GRM1555C1H1R2CZ01 0402 Thick film chip resistor
J1, J2, J3, J4, J5 SMA Johnson Components 142-0701-851 End launch SMA end launch straight jack receptacle – tab
contact
J6, J20 2X1 Molex 22-28-4023 100 mil 100 mil header
L1 2.7 nH Murata LQG15HN2N7S02D 0402 Monolithic Inductor (Air-core)
U1 Skyworks SE2577L SE2577L Dual band switch diplex FEM
DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
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Package Dimensions
The recommended land and solder patterns for the SE2577L are
provided in Figure 5. Typical case markings are shown in Figure
6. Package dimensions for the are shown in Figure 7, and tape
and reel dimensions are provided in Figure 8.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE2577L is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
17
18
20
19
16
49
15 14 13
310
2 11
1 12
567 8
16
49
15 14 13
3 10
2 11
1 12
567 8
17
18
20
19
16
49
15 14 13
3 10
2 11
1 12
567 8
17
18
20
19
Board Metal and Via Pattern
(Note 4)
Solder Mask Pattern
(Note 6)
Stencil Pattern
(Note 5)
63% Solder Coverage on Center Pad
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations: 30-35 µm Cu via wall plating; via holes
should be tented with solder mask on the back side and filled with solder.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures,
trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations: Contact board fabricator for recommended
solder mask offset and tolerance.
Y0152
3.20
0.25 Typ
3.20
0.500
Typ
1.80
1.80
0.58 Typ
0.58
Typ
0.50 Typ
1.70
3.30
0.35 Typ
1.70
0.500
Typ
3.30
0.60 Typ
Package
Outline
0.500
Typ
0.50 Typ
3.20
0.25 Typ
3.20
0.10 0.675 Typ
0.675 Typ
0.10
9X
Ø
0.254
Package
Outline
Figure 5. SE2577L Recommended Land and Solder Patterns
(Top View)
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
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Y0141
SiGe
2577L
XXXXX
Pin 1
Indicator
Part Number
Lot Code
SKY
2577L
XXXXX
Pin 1
Indicator
Part Number
Lot Code
Figure 6. Typical Case Markings
(Top View)
0.500
C
0.15 C
0.15 C2X
2X
Top View Bottom View
3.000 ±0.050
Seating
Plane
0.300 X 45°
Y0150
1
2
3
4
12
11
10
9
87 65
13 14 15 16
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place) ± 0.1 mm ±1°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals.
5. Unless specified, dimensions are symmetrical about center lines.
0.850 ±0.050
1.700 ±0.050
16X 0.250 ±0.050
16X 0.350 ±0.050
0.000 – 0.050
12
11
10
9
1
2
3
4
1.700 ±0.050
13141516
8765
A
See Note 3
20
19
17
18
20
19
17
18
R0.075 Typ.
0.203 Ref.
0.05
M
C
0.10
M
C A B
0.10
M
C A B
0.10
M
C A B
3.000 ±0.050
B
Figure 7. SE2577L Package Dimensions
Pin 1 Corner
Figure 8. SE2577L Tape and Reel Dimensions
DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
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Ordering Information
Model Name Manufacturing Part Number Evaluation Board Part Number
SE2577L-S
SE2577L-R
SE2577L-EK1
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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