CC8520, CC8521, CC8530 CC8531
www.ti.com
SWRS091F – JUNE 2012
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath™ is a trademark for Texas Instruments
All other trademarks are the property of their respective owners.
Copyright © 2010, Texas Instruments Incorporated
2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING
CC8520, CC8521, CC8530 & CC8531 - PurePath™ Wireless
APPLICATIONS
- Wireless high-quality digital audio
- Wireless point-to-point audio link
- Wireless (USB) headphones / headsets
- Wireless (USB) loudspeakers
- Wireless (USB) microphones
- Wireless 2.1 speaker systems
- CC852x supports up to 2 channels
- CC853x supports up to 4 channels
- CC85x1 supports USB
FEATURES
Built-in audio protocol
- CD-quality uncompressed audio
- Excellent robustness and co-existence
through multiple techniques
- Adaptive Frequency Hopping
- Forward Error Correction
- Buffering and Retransmission
- Error Concealment
- Optional high quality audio
compression
- No software development needed when
used in autonomous mode
External system
- Can be used autonomously, or can be
controlled by an external host MCU for
greatest flexibility
- Seamless connection and control of
external audio codecs, DACs/ADCs and
digital audio amplifiers using I2S and I2C
- HID functions like power control, pairing,
volume control, audio channel selection
etc. can be mapped to I/Os
- RoHS compliant 6mm x 6mm QFN-40
package
RF section
- 5 or 2 Mbps over-the-air data rate
- Bandwidth-efficient modulation format
- Excellent link budget with programmable
output power up to +3.5 dBm and -83/-86
dBm sensitivity
- Seamless support for CC2590 range
extender (+11dBm output power, -87dBm
sensitivity)
- Suited for systems targeting compliance
with worldwide radio frequency
regulations: ETSI EN 300 328 and EN
300 440 class 2 (Europe), FCC CFR47 Part
15 (US) and ARIB STD-T66 (Japan)
Digital audio support
- Digital I2S audio interface supports 1 or 2
audio channels for the CC8520 and 1 to 4
audio channels for the CC8530 at sample
rates of 32, 40.275, 44.1 and 48 kHz, and
supports 16 and 24 bit word-widths
- USB audio support for 32, 44.1 and 48 kHz,
and supports 16 and 24 bit word-widths
- Audio latency down to 10.7 ms
- Data side-channel allows data to be sent
alongside the audio between external host
processors
USB
- Full-speed USB Audio device
- USB Basic Audio Device Class: HT1, HS1
and MT topologies (headphone, headset
and microphone)
- USB Audio Device Class.
- Basic USB HID device class support for
remote control, mouse and keyboard
functionality
- Autonomous operation only.
Development tools
- PC-based PurePath™ Wireless
Configurator for CC85xx configuration
- CC85xx Family User Guide
- CC85XXDK audio development kit
- CC85XXDK-HEADSET development kit
QFN-40 PIN CONFIGURATION (TOP VIEW)
1
9
7
10
8
6
5
4
3
2
31
39
37
40
38
36
35
34
33
32
30
22
24
21
23
25
26
27
28
29
11
19
17
20
18
16
15
14
13
12
CC85xx
xANTN
/USBP
DVDD
DCPL
xLNAEN
/GIO15
IOVDD
xPAEN/
GIO14
GIOI3
GIOI2
SDA/
GIO11
SCL/
GIO10
AVDD
xANTP
/USBN
CSN
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
IOVDD
RSTN
IOVDD
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
AD2/
GIO9
AVDD
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
X0
X1
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
2
Copyright © 2010, Texas Instruments Incorporated
DESCRIPTION
The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless
transmission of high-quality digital audio.
The CC85xx includes a robust built-in wireless audio transmission protocol and can control
selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to
avoid interfering with, or being interfered by other 2.4 GHz radio systems.
The CC85xx operates autonomously, and can be used with or without an external MCU. An external
host processor can be connected through SPI and control some aspects of its operation. The
CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces).
More details can be found in the CC85xx Family User Guide [2].
ABBREVIATIONS
ADC
Analog to Digital Converter
LED
Light Emitting Diode
ARIB
Association of Radio Industries and Businesses
LNA
Low Noise Amplifier
BER
Bit Error Rate
MISO
Master In Slave Out
CODEC
Coder/Decoder
MOSI
Master Out Slave In
DAC
Digital to Analog Converter
MCU
Microcontroller
DSP
Digital Signal Processor
PA
Power Amplifier
EHIF
External Host Interface
PCM
Pulse Code Modulation
ESD
Electro Static Discharge
PER
Packet Error Rate
ETSI
European Telecommunications Standard Institute
PLL
Phase Lock Loop
FCC
Federal Communications Commission
PM
Protocol Master
FEC
Forward Error Correction
PPW
PurePath™ Wireless
FSK
Frequency Shift Keying
PS
Protocol Slave
FW
Firmware
RoHS
Restriction of Hazardous Substances
HID
Human Interface Device
RF
Radio Frequency
I2C
Inter-Integrated Circuit (serial communications bus)
SLAC
Slightly Lossy Compression Algorithm
I2S
Inter-IC Sound (serial bus for digital audio signals)
SPI
Serial Peripheral Interface
IEEE
Institute of Electrical and Electronics Engineers
SoC
System-on-Chip
ISM
Industrial, Scientific, Medical
STD
Standard
JEDEC
Joint Electron Device Engineering Council
TDM
Time-Division Multiplexing
LDO
Low-Dropout Regulator
CC8520, CC8521, CC8530C8531
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SWRS091F – JUNE 2012
3
Copyright © 2010, Texas Instruments Incorporated
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS(1)
PARAMETER
TEST CONDITIONS
Min
Max
Unit
Supply voltage (2)
All supply pins must have the same voltage
–0.3
3.9
V
Voltage on any digital pin
–0.3
min(VDD +
0.3, 3.9)
V
Input RF level
10
dBm
Storage temperature range
-40
125
°C
ESD (3)
All pads, according to human-body model
(HBM), JEDEC STD 22, method A114
2000
V
According to charged-device model (CDM),
JEDEC STD 22, method C101E
400
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings.
(3) CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS, CC8520/CC8530
PARAMETER
TEST CONDITIONS
Min
Max
Unit
Operating ambient temperature range, TA
-40
+85
°C
Operating supply voltage
2.0
3.6
V
RECOMMENDED OPERATING CONDITIONS, CC8521/CC8531
PARAMETER
TEST CONDITIONS
Min
Max
Unit
Operating ambient temperature range, TA
-40
+85
°C
Operating supply voltage (1)
3.0
3.6
V
(1) For CC8521 and CC8531 running on USB power, an LDO is needed to comply with these ratings.
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
RF frequency range
2400
2483.5
MHz
Data rate
Shaped 8FSK
Shaped 2FSK
5
2
Mbps
Audio latency
Latency between I2S interface on audio source
and I2S interface on audio sink. Uncompressed
16 or 24 bit. Audio latency is programmable
using the PurePath Wireless Configurator [1].
512(1)
2048
Samples
Audio sample rate
Audio sample rate is programmable using the
PurePath Wireless Configurator [1] (2)
48
44.1
40.275(3)
32
kHz
(1) Latencies below 768 samples only supported for some configurations
(2) ±2000ppm tolerance
(3) Not supported in USB mode. For USB Headset, dynamic sample rate change is not allowed.
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Current consumption,
power down state
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
1
A
Current consumption, headphone
master(1)
Average current for a PurePath Wireless master
with I2S interface active, sourcing two PCM16
channels with maximum output power.
29
mA
Current consumption, headphone
slave(1)
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels with maximum output power
25
mA
(1) Measured on Texas Instruments CC85xx EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled. 5 Mbit mode
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xx EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Output power
Maximum output power setting
3.5
dBm
Receiver sensitivity(1)
5 Mbps
2 Mbps(2)
-83
-86
dBm
Saturation (maximum input level) (1)
5 Mbps
2 Mbps(2)
-2
6
dBm
Selectivity
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity. 5 Mbps
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity. 2 Mbps(2)
8
20
dB
Alternate channel, ±8MHz, wanted 3dB above
sensitivity. 5 Mbps
Alternate channel, ±8MHz, wanted 3dB above
sensitivity. 2 Mbps(2)
35
43
dB
Occupied bandwidth
99% energy bandwidth. 5 Mbps
99% energy bandwidth. 2 Mbps(2)
3.8
3.2
MHz
Optimum load impedance
Differential impedance seen from the RF port
(RF_P and RF_N) towards the antenna
70 + j30
Ω
Spurious emission
Suitable for systems targeting compliance with EN 300 328, EN 300 440(3), FCC CFR47 Part
15 and ARIB STD-T-66
(1) Measured using data packets with 40 byte payload, 0.1% BER for 5 Mbit and 125 byte payload, 0.001% BED for 2 Mbit
(2) Typical data measured across 6 devices at room temperature.
(3) Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by
using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be
connected to a good RF ground.
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531+CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Current consumption,
power down state(1)
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
1
A
Current consumption, headphone
master(2)
Average current for a PurePath Wireless
master with I2S interface active, sourcing two
PCM16 channels.
38
mA
Current consumption, headphone
slave(2)
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels
28
mA
(1) CC2590 power down current is 100 nA[4]
(2) Measured on Texas Instruments CC85xx+CC2590 EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled. 5
Mbit mode
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531+CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Output power
Maximum output power setting
11
dBm
Receiver sensitivity(1)
5 Mbps
2 Mbps(2)
-87
-90
dBm
Saturation (maximum input level)(1)
5 Mbps
-12
dBm
Selectivity
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity. 5 Mbps
9
dB
Alternate channel, ±8MHz, wanted 3dB above
sensitivity. 5 Mbps
34
Spurious emission
Suitable for systems targeting compliance with EN 300 328, EN 300 440(3), FCC CFR47 Part 15
and ARIB STD-T-66
(1) Measured using data packets with 40 byte payload, 0.1% BER for 5 Mbit and 125 byte payload, 0.001% BER for 2 Mbit
(2) Typical data measured across 6 devices at room temperature.
(3) Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by
using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be
connected to a good RF ground.
48-MHz CRYSTAL REQUIREMENTS
General parameters with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Crystal frequency
48
MHz
Crystal frequency accuracy requirement(1)
-50
50
ppm
ESR Equivalent series resistance
-
60
ohm
C0 Crystal shunt capacitance
-
3
pF
CL Crystal load capacitance
15
16
17
pF
(1) Including aging and temperature dependency
AUDIO CLOCK CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
MCLK Frequency range
Programmable using the PurePath Wireless
Configurator [1]
32·FWCLK
512·FWCLK
BCLK Frequency range
Programmable using the PurePath Wireless
Configurator [1]
32·FWCLK
256·FWCLK
WCLK Frequency range
31.936
48.096
kHz
RMS jitter (Output clocks)
RMS period jitter for 1000 periods
80
200
ps
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
SPI INTERFACE CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
SCLK frequency
0
20
MHz
SCLK low
25
ns
SCLK high
25
ns
CSN high
Minimum time CSN must be high, if brought
high, between commands (it is not necessary to
bring CSN high between commands).
50
ns
CSN falling edge to
SCLK rising edge
Distance from CSN asserted until first rising
edge on SCLK.
25
ns
SCLK falling edge to
CSN rising edge
Distance from last negative edge of SCLK in
last word until CSN can be de-asserted.
100
ns
Inter-word spacing
Minimum distance in time from rising edge of
SCLK for last bit in word n and the rising edge
of SCLK for the first bit in word n+1.
Properly handles abutting words.
50
ns
Hysteresis on SCLK
Hysteresis around trigger point of input buffer
using a Schmitt trigger
100
mV
Slew rate on SCLK
Slew rate from 0.1·IOVDD to 0.9·IOVDD
10
V/ s
VBAT CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Min
Max
Unit
Input voltage
0
4.5
V
FLASH CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Min
TYP
Max
Unit
Program/erase endurance
1000
Cycles
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
1 PIN DESCRIPTION
1
9
7
10
8
6
5
4
3
2
31
39
37
40
38
36
35
34
33
32
30
22
24
21
23
25
26
27
28
29
11
19
17
20
18
16
15
14
13
12
CC85xx
xANTN
/USBN
DVDD
DCPL
xLNAEN
/GIO15
IOVDD
xPAEN/
GIO14
GIOI3
GIOI2
SDA/
GIO11
SCL/
GIO10
AVDD
xANTP
/USBP
CSN
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
IOVDD
RSTN
IOVDD
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
AD2/
GIO9
AVDD
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
X0
X1
Figure 1 - CC85xx QFN-40 PIN CONFIGURATION
PIN
PIN NAME
PIN TYPE
DESCRIPTION
-
GND
Ground
The exposed die attach pad must be connected to a solid ground plane underneath the
chip
1
xANTN
USBN
Digital I/O1
CC85x0 Slaves: External antenna switch control
CC85x1: USB D- data line
2
xANTP
USBP
Digital I/O1
CC85x0 Slaves: External antenna switch control
CC85x1: USB D+ data line
3
CS_N
Digital Input
(pull-up)
Serial SPI configuration interface, active low chip select
4
SCLK
Digital I/O1
Serial SPI configuration interface, clock input/output
5
MOSI
Digital I/O1
Serial SPI configuration interface, master data output, slave data input
6
MISO
Digital I/O1
Serial SPI configuration interface, master data input, slave data output.
7
GIO1
Digital I/O1
General-purpose digital I/O pin 1
Configurable with PurePath™ Wireless Configurator
8
GIO2
Digital I/O1
General-purpose digital I/O pin 2
9
GIO3
Digital I/O2
General-purpose digital I/O pin 3
Configurable with PurePath™ Wireless Configurator
10
IOVDD
Power
(I/O pads)
Digital power supply for the digital I/Os in the SPI interface and GIO1-GIO3.
11
RSTN
Digital Input
(pull-up)
Active-low device reset
12
IOVDD
Power
(I/O pins)
Digital power supply for the RSTN and MCLK digital I/O pins.
13
MCLK
GIO4
Digital I/O1
Master clock output for external audio devices
General-purpose digital I/O pin 4
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
PIN
PIN NAME
PIN TYPE
DESCRIPTION
14
BCLK
GIO5
Digital I/O1
I2S/DSP audio interface bit clock (in/out)
General-purpose digital I/O pin 5
15
WCLK
GIO6
Digital I/O1
I2S/DSP audio interface word clock (in/out)
General-purpose digital I/O pin 6
16
AD0
GIO7
Digital I/O1
I2S/DSP audio interface data line 0 (in/out)
General-purpose digital I/O pin 7
17
AD1
GIO8
Digital I/O1
I2S/DSP audio interface data line 1 (in/out)
General-purpose digital I/O pin 8
18
IOVDD
Power
(I/O pins)
Digital power supply for the digital I/Os in audio interface (BCLK-AD2).
19
AD2
GIO9
Digital I/O2
I2S/DSP audio interface data line 2 (in/out)
Configurable with PurePath™ Wireless Configurator
20
AVDD
Power (Analog)
2.0-3.6V analog power supply connection
21
X1
Analog I/O
Crystal oscillator pin input, or external clock input (48 MHz)
22
X0
Analog I/O
Crystal oscillator pin output (48 MHz)
23
AVDD
Power (Analog)
Analog power supply connection
24
RF_P
RF I/O
Positive differential RF input signal to LNA in receive mode
Positive differential RF output signal from PA in transmit mode
25
RF_N
RF I/O
Negative differential RF input signal to LNA in receive mode
Negative differential RF output signal from PA in transmit mode
26
AVDD
Power (Analog)
Analog power supply connection
27
AVDD
Power (Analog)
Analog power supply connection
28
AVDD
Power (Analog)
Analog power supply connection
29
VBAT
Analog input
Battery voltage supervisor (threshold level programmable by external resistor to positive
battery terminal)
30
RBIAS
Analog output
External precision bias resistor for reference current. 56 k , 1%
31
AVDD
Power (Analog)
Analog power supply connection (Guard ring AVDD connection for digital noise isolation)
32
SCL
GIO10
Digital I/O1
I2C master clock line. Must be connected to external pull-up
General-purpose digital I/O pin 10
33
SDA
GIO11
Digital I/O1
I2C master data line. Must be connected to external pull-up
General-purpose digital I/O pin 11
34
GIO12
Digital I/O1
General-purpose digital I/O pin 12
35
GIO13
Digital I/O1
General-purpose digital I/O pin 13
36
xPAEN
GIO14
Digital I/O2
Control external PA
General-purpose digital I/O pin 14
37
IOVDD
Power (I/O pads)
Digital power supply for SCL-GIO15 pins.
38
xLNAEN
GIO15
Digital I/O2
Control external LNA
General-purpose digital I/O pin 15
39
DCPL
Power (Digital)
1.7V-1.85 V linear voltage regulator output to which a 1 uF decoupling capacitor should be
attached. For test-purposes an external digital supply voltage (1.62-1.98 V) can be applied
here, bypassing the voltage regulator.
NOTE: The voltage regulator is intended for use with the CC85xx chip only. It cannot be
used to provide supply voltage to other devices.
40
DVDD
Power (Digital)
Digital power supply for the linear voltage regulator.
1 Digital I/O pad with 4 mA source/sink capability.
2 Digital I/O pad with 20 mA source/sink capability.
CC8520, CC8521, CC8530 CC8531
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SWRS091F – JUNE 2012
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Copyright © 2010, Texas Instruments Incorporated
2 APPLICATION CIRCUIT
1
9
7
10
8
6
5
4
3
2
31
39
37
40
38
36
35
34
33
32
30
22
24
21
23
25
26
27
28
29
11
19
17
20
18
16
15
14
13
12
CC8520/30
xANTM
DVDD
DCPL
xLNAEN
/GIO15
IOVDD
xPAEN/
GIO14
GIOI3
GIOI2
SDA/
GIO11
SCL/
GIO10
AVDD
xANTP
CSN
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
IOVDD
RSTN
IOVDD
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
AD2/
GIO9
AVDD
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
X0
X1
Audio Device
2.0V-3.6V
Power Supply
R101
Antenna
(50 Ohm)
C301
C302
L301
L302 L303
C303
C306
C305
Alternative:
CC2590 External LNA/PA
Antenna
(50 Ohm)
CC2590 +
Matching/
Filtering
C402
XTAL
C401
C391
L304
Figure 2 - CC8520/CC8530 Application Circuit
1
9
7
10
8
6
5
4
3
2
31
39
37
40
38
36
35
34
33
32
30
22
24
21
23
25
26
27
28
29
11
19
17
20
18
16
15
14
13
12
CC8521/31
USBN
DVDD
DCPL
xLNAEN
/GIO15
IOVDD
xPAEN/
GIO14
GIOI3
GIOI2
SDA/
GIO11
SCL/
GIO10
AVDD
USBP
CSN
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
IOVDD
RSTN
IOVDD
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
GIO9/
AD2
AVDD
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
X0
X1
2.0V-3.6V
Power Supply
R101
Antenna
(50 Ohm)
C301
C302
L301
L302 L303
C303
C306
C305
Alternative:
CC2590 External LNA/PA
Antenna
(50 Ohm)
CC2590 +
Matching/
Filtering
C402
XTAL
C401
C391
L304
33 ohm
33 ohm
47 pF
47 pF
1.5k ohm
USB D-
USB D+
Figure 3 - CC8521/CC8531 Application Circuit
CC8520, CC8521, CC8530 CC8531
WWW.TI.COM
SWRS091F – JUNE 2012
10
Copyright © 2010, Texas Instruments Incorporated
3 SYSTEM DESCRIPTION
By employing proprietary technology, referred to as PurePath Wireless, the CC85xx device family provides
robust, high-quality, short-range 2.4 GHz wireless digital audio streaming in low-cost single chip solutions.
Two or more devices form a PurePath Wireless audio network. Great care has been taken to ensure that this
audio network provides gap-less and robust audio streaming in varied environments and that it can coexist
amicably with existing wireless technologies in the crowded 2.4 GHz ISM band.
Most applications can be implemented without any software development and only require the CC85xx to be
connected to an external audio source or sink (such as an audio codec, S/PDIF interface or class-D amplifier)
and a few push buttons, switches or LED for human interaction. Advanced applications can interface a host
processor or DSP directly to the CC85xx and directly stream audio and control most aspects of device and
audio network operation. The complete list of supported audio devices can be found in the PurePath Wireless
Configurator [1].
The PurePath Wireless Configurator [1], a PC-based configuration tool, is used to set up the desired
functionality and parameters of the target system and then produces firmware images that subsequently must
be programmed into the embedded flash memory of each CC85xx.
All devices in the CC85xx family interface seamlessly with the CC2590 RF range extender device to allow for
even wider RF coverage and improved robustness in difficult environments.
4 DOCUMENT HISTORY
Revision
Date
Description/Changes
SWRS091F
June 2012
Added 2 Mbit mode (throughout document) and flash endurance
numbers. Lowered minimum latency. Added support for 24 bit data
width . Updated pin description.
SWRS091E
Dec 2011
Added VBAT voltage info
SWRS091D
July 2011
Added info on CC8521 and CC8531
SWRS091C
March 2011
Added info on CC8530. Updated current consumption numbers
and how they are measured. Storage temperature updated. Info on
supported codecs now in PurePath Wireless Configurator.
SWRS091B
Sept 2010
Add RF Characteristics for CC8520+CC2590EM. Moved the
sections; Network topology, Coexistence, Audio Interface, Human
Interaction drivers and external host interface to the CC85xx
Family User’s Guide [2]. Updated pin-out table and fig 1.
SWRS091A
March 2010
First release
5 REFERENCES
[1] PurePath™ Wireless Configurator
[2] CC85xx Family User Guide
[3] CC-Debugger
[4] CC2590 Product folder
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jun-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CC8520RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8520RHAT ACTIVE VQFN RHA 40 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8521RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8521RHAT ACTIVE VQFN RHA 40 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8530RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8530RHAT ACTIVE VQFN RHA 40 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8531RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
CC8531RHAT ACTIVE VQFN RHA 40 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jun-2012
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CC8520RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8520RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8521RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8521RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8530RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8530RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8531RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
CC8531RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC8520RHAR VQFN RHA 40 2500 336.6 336.6 28.6
CC8520RHAT VQFN RHA 40 250 336.6 336.6 28.6
CC8521RHAR VQFN RHA 40 2500 336.6 336.6 28.6
CC8521RHAT VQFN RHA 40 250 336.6 336.6 28.6
CC8530RHAR VQFN RHA 40 2500 336.6 336.6 28.6
CC8530RHAT VQFN RHA 40 250 336.6 336.6 28.6
CC8531RHAR VQFN RHA 40 2500 336.6 336.6 28.6
CC8531RHAT VQFN RHA 40 250 336.6 336.6 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2012
Pack Materials-Page 2
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