December 1996 Order Number: 272267-005
8XC196NT
CHMOS MICROCONTROLLER WITH
1 MBYTE LINEAR ADDRESS SPACE
Y20 MHz Operation
YHigh Performance CHMOS 16-Bit CPU
YUp to 32 Kbytes of On-Chip OTPROM
YUp to 1 Kbyte of On-Chip Register RAM
YUp to 512 Bytes of Internal RAM
YRegister-Register Architecture
Y4 Channel/10-Bit A/D with Sample/Hold
Y37 Prioritized Interrupt Sources
YUp to Seven 8-Bit (56) I/O Ports
YFull Duplex Serial I/O Port
YDedicated Baud Rate Generator
YInterprocessor Communication Slave
Port
YSelectable Bus Timing Modes for
Flexible External Memory Interfacing
YOscillator Fail Detection Circuitry
YHigh Speed Peripheral Transaction
Server (PTS)
YTwo Dedicated 16-Bit High-Speed
Compare Registers
Y10 High Speed Capture/Compare (EPA)
YFull Duplex Synchronous Serial I/O
Port (SSIO)
YTwo Flexible 16-Bit Timer/Counters
YQuadrature Counting Inputs
YFlexible 8-/16-Bit External Bus
(Programmable)
YProgrammable Bus (HOLD/HLDA)
Y1.4 ms 16 x 16 Multiply
Y2.4 ms 32/16 Divide
Y68-Pin Package
Device Pins/Package OTPROM Reg Code Address I/O EPA A/D
RAM RAM Space
8XC196NT 68P PLCC 32K 1K 512 1 Mbyte 56 10 4
Xe7 OTPROM Device
Xe0 ROMLESS
The 8XC196NT 16-bit microcontroller is a high performance member of the MCSÉ96 microcontroller family.
The 8XC196NT is an enhanced 8XC196KR device with 1 Mbyte of linear address space, 1000 bytes of
register RAM, 512 bytes of internal RAM, 20 MHz operation and an optional 32 Kbytes of OTPROM. Intel’s
CHMOS III-E process provides a high performance processor along with low power consumption.
Ten high-speed capture/compare modules are provided. As capture modules event times with 200 ns resolu-
tion can be recorded and generate interrupts. As compare modules events such as toggling of a port pin,
starting an A/D conversion, pulse width modulation, and software timers can be generated. Events can be
based on the timer or up/down counter.
8XC196NT
272267–1
Figure1.8XC196NTBlockDiagram
PROCESSINFORMATION
ThisdeviceismanufacturedonP629.5,aCHMOS
III-Eprocess.Additionalprocessandreliabilityinfor-
mationisavailablein the Intel®
Quality System
Handbook
.
Table 1. Thermal Characteristics
Package iJA iJC
Type
PLCC 36.5§C/W 13§C/W
All thermal impedance data is approximate for static
air conditions at 1W of power dissipation. Values will
change depending on operation conditions and ap-
plication. See the Intel
Packaging Handbook
(order
number 240800) for a description of Intel’s thermal
impedance test methodology.
2722672
EXAMPLE: N87C196NT is 68-Lead PLCC OTPROM.
For complete package dimensional data, refer to the Intel Packaging Handbook (Order Number 240800).
Figure 2. The 8XC186NT Familiy Nomenclature
2
8XC196NT
8XC196NT Memory Map
Address Description
(Note 7)
FFFFFFH External Memory
FFA000H
FF9FFFH Internal OTPROM or External Memory (Determined by EA Pin)
FF2080H RESET at FF2080H
FF207FH Reserved Memory (Internal OTPROM or External Memory)
FF2000H (Determined by EA Pin)
FF1FFFH External Memory
FF0600H
FF05FFH Internal RAM (Identically Mapped into 00400H 005FFH)
FF0400H
FF03FFH External Memory
FF0100H
FF00FFH Reserved for ICE
FF0000H
FEFFFFH External Memory for future devices
100000H
FFFFFH 984 Kbytes External Memory
00A000H
009FFFH Internal OTPROM or External Memory (Note 1)
002080H
00207FH Reserved Memory (Internal OTPROM or External Memory)
002000H (Notes 1, 3, and 6)
001FFFH Memory Mapped Special Function Registers (SFR’s)
001FE0H
001FDFH Internal Special Function Registers (SFR’s) (Note 5)
001F00H
001EFFH External Memory
000600H
0005FFH Internal RAM
000400H (Address with Indirect or Indexed Modes)
0003FFH Upper Register File (Address with Indirect or
Register RAM
Indexed Modes or through Windows.) (Note 2)
000100H *
0000FFH Register RAM Lower Register File
000018H (Address with Direct,
000017H CPU SFR’s
Indirect, or Indexed
000000H *Modes.) (Notes 2, 4)
NOTES:
1. These areas are mapped internal OTPROM if the REMAP bit (CCB2.2) is set and EA e5V. Otherwise they are external
memory.
2. Code executed in locations 00000H to 003FFH will be forced external.
3. Reserved memory locations must contain 0FFH unless noted.
4. Reserved SFR bit locations must be written with 0.
5. Refer to 8XC196NT User’s Guide and Quick Reference for SFR descriptions.
6. WARNING: The contents or functions of reserved memory locations may change with future revisions of the device.
Therefore, a program that relies on one or more of these locations may not function properly.
7. The 8XC196NT internally uses 24 bit address, but only 20 address lines are bonded out allowing 1 Mbyte external
address space.
3
8XC196NT
2722673
Figure 3. 68-Pin PLCC Package Diagram
4
8XC196NT
PIN DESCRIPTIONS
Symbol Name and Function
VCC Main supply voltage (a5V).
VSS,V
SS1,V
SS1 Digital circuit ground (0V). There are multiple VSS pins, all of which MUST be
connected.
VREF Reference for the A/D converter (a5V). VREF is also the supply voltage to the
analog portion of the A/D converter and the logic used to read Port 0. Must be
connected for A/D and Port 0 to function.
VPP Programming voltage for the OTPROM parts. It should be a12.5V for programming.
It is also the timing pin for the return from powerdown circuit. Connect to VCC if
powerdown not being used.
ANGND Reference ground for the A/D converter. Must be held at nominally the same
potential as VSS.
XTAL1 Input of the oscillator inverter and the internal clock generator.
XTAL2 Output of the oscillator inverter.
P2.7/CLKOUT Output of the internal clock generator. The frequency is (/2 the oscillator frequency.
It has a 50% duty cycle. Also LSIO pin.
RESET Reset input to and open-drain output from the chip. RESET has an internal pullup.
P5.7/BUSWIDTH Input for bus width selection. If CCR bit 1 is a one and CCR1 bit 2 is a one, this pin
dyamically controls the Buswidth of the bus cycle in progress. If BUSWIDTH is low,
an 8-bit cycle occurs, if BUSWIDTH is high, a 16-bit cycle occurs. If CCR bit 1 is ‘‘0’’
and CCR1 bit 2 is ‘‘1’’, all bus cycles are 8-bit, if CCR bit 1 is ‘‘1’’ and CCR1 bit 2 is
‘‘0’’, all bus cycles are 16-bit. CCR bit 1 e‘‘0’’ and CCR1 bit 2 e‘‘0’’ is illegal. Also
an LSIO pin when not used as BUSWIDTH.
NMI A positive transition causes a non maskable interrupt vector through memory
location 203EH.
P5.1/INST/SLPCS Output high during an external memory read indicates the read is an instruction
fetch. INST is valid throughout the bus cycle. INST is active only during external
memory fetches, during internal OTPROM fetches INST is held low. Also LSIO when
not INST. SLPCS is the Slave Port Chip Select.
EA Input for memory select (External Access). EA equal to a high causes memory
accesses to locations 0FF2000H through 0FF9FFFH to be directed to on-chip
OTPROM. EA equal to a low causes accesses to these locations to be directed to
off-chip memory. EA ea
12.5V causes execution to begin in the Programming
Mode. EA is latched at reset.
HOLD Bus Hold Input requesting control of the bus.
HLDA Bus Hold acknowledge output indicating release of the bus.
BREQ Bus Request output activated when the bus controller has a pending external
memory cycle.
P5.0/ALE/ADV/ Address Latch Enable or Address Valid output, as selected by CCR. Both pin
options provide a latch to demultiplex the address from the address/data bus. When
SLPADDR/
the pin is ADV, it goes inactive (high) at the end of the bus cycle. ADV can be used
SLPALE as a chip select for external memory. ALE/ADV is active only during external
memory accesses. Also LSIO when not used as ALE. SLPADDR is the Slave Port
Address Control Input and SLPALE is the Slave Port Address Latch Enable Input.
P5.3/RD/SLPRD Read signal output to external memory. RD is active only during external memory
reads or LSIO when not used as RD. SLPRD is the Slave Port Read Control Input.
5
8XC196NT
PIN DESCRIPTIONS (Continued)
Symbol Name and Function
P5.2/WR/WRL/SLPWR Write and Write Low output to external memory, as selected by the CCR, WR
will go low for every external write, while WRL will go low only for external
writes where an even byte is being written. WR/WRL is active during external
memory writes. Also an LSIO pin when not used as WR/WRL. SLPWR is the
Slave Port Write Control Input
P5.5/BHE/WRH Byte High Enable or Write High output, as selected by the CCR. BHEe0
selects the bank of memory that is connected to the high byte of the data bus.
A0e0 selects that bank of memory that is connected to the low byte. Thus
accesses to a 16-bit wide memory can be to the low byte only (A0e0,
BHEe1), to the high byte only (A0e1, BHEe0) or both bytes (A0e0,
BHEe0). If the WRH function is selected, the pin will go low if the bus cycle is
writing to an odd memory location. BHE/WRH is only valid during 16-bit
external memory read/write cycles. Also an LSIO pin when not BHE/WRH.
P5.6/READY Ready input to lengthen external memory cycles, for interfacing with slow or
dynamic memory, or for bus sharing. If the pin is high, CPU operation continues
in a normal manner. If the pin is low prior to the falling edge of CLKOUT, the
memory controller goes into a wait state mode until the next positive transition
in CLKOUT occurs with READY high. When external memory is not used,
READY has no effect. The max number of wait states inserted into the bus
cycle is controlled by the CCR/CCR1. Also an LSIO pin when READY is not
selected.
P5.4/SLPINT Dual function I/O pin. As a bidirectional port pin or as a system function. The
system function is a Slave Port Interrupt Output Pin.
P6.2/T1CLK Dual function I/O pin. Primary function is that of a bidirectional I/O pin,
however, it may also be used as a TIMER1 Clock input. The TIMER1 will
increment or decrement on both positive and negative edges of this pin.
P6.3/T1DIR Dual function I/O pin. Primary function is that of a bidirectional I/O pin,
however, it may also be used as a TIMER1 Direction input. The TIMER1 will
increment when this pin is high and decrements when this pin is low.
PORT1/EPA0 7 Dual function I/O port pins. Primary function is that of bidirectional I/O. System
function is that of High Speed capture and compare. EPA0 and EPA2 have yet
P6.0 6.1/EPA8 9
another function of T2CLK and T2DIR of the TIMER2 timer/counter.
PORT 0/ACH4 7 4-bit high impedance input-only port. These pins can be used as digital inputs
and/or as analog inputs to the on-chip A/D converter. These pins are also
used as inputs to OTPROM parts to select the Programming Mode.
P6.3 6.7/SSIO Dual function I/O ports that have a system function as Synchronous Serial I/O.
Two pins are clocks and two pins are data, providing full duplex capability.
PORT 2 8-bit multi-functional port. All of its pins are shared with other functions.
PORT 3 and 4 8-bit bidirectional I/O ports with open drain outputs. These pins are shared
with the multiplexed address/data bus which has strong internal pullups.
EPORT 8-bit bidirectional standard and I/O port. These bits are shared with the
extended address bus, A16 A19. Pin function is selected on a per pin basis.
INTOUT Interrupt Output. This active-low output indicates that a pending interrupt
requires use of the external bus.
SLP0 SLP7 Slave Port Address/Data Bus
6
8XC196NT
ABSOLUTE MAXIMUM RATINGS*
Storage Temperature ÀÀÀÀÀÀÀÀÀÀb60§Ctoa
150§C
Voltage from VPP or EA to
VSS or ANGND ÀÀÀÀÀÀÀÀÀÀÀÀÀÀb0.5V to a13.0V
Voltage from Any Other Pin
to VSS or ANGND ÀÀÀÀÀÀÀÀÀÀÀÀÀÀb0.5 to a7.0V
This includes V
PP
on ROM and CPU devices
.
Power DissipationÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ0.5W
NOTICE: This data sheet contains information on
products in the sampling and initial production phases
of development. The specifications are subject to
change without notice. Verify with your local Intel
Sales office that you have the latest data sheet be-
fore finalizing a design.
*
WARNING: Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage.
These are stress ratings only. Operation beyond the
‘‘Operating Conditions’’ is not recommended and ex-
tended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability.
OPERATING CONDITIONS
Symbol Parameter Min Max Units
TAAmbient Temperature Under Bias 0 a70 §C
VCC Digital Supply Voltage 4.50 5.50 V
VREF Analog Supply Voltage 4.50 5.50 V
FOSC Oscillator Frequency 4 20 MHz (Note 4)
NOTE:
ANGND and VSS should be nominally at the same potential.
DC CHARACTERISTICS (Under Listed Operating Conditions)
Symbol Parameter Min Typ Max Units Test Conditions
ICC VCC Supply Current 90 mA XTAL1 e20 MHz,
VCC eVPP eVREF e5.5V
IREF A/D Reference Supply Current 5 mA (While device in Reset)
IIDLE Idle Mode Current 40 mA XTAL1 e20 MHz,
VCC eVPP eVREF e5.5V
IPD Powerdown Mode Current(6) 50 75 mAV
CC eVPP eVREF e5.5V(11)
VIL Input Low Voltage (all pins) b0.5V 0.3 VCC V For PORT0(10)
VIH Input High Voltage 0.7 VCC VCC a0.5 V For PORT0(10)
VIH1 Input High Voltage XTAL1 0.7 VCC VCC a0.5 V XTAL1 Input Pin Only(1)
VIH2 Input High Voltage on RESET 0.7 VCC VCC a0.5 V RESET input pin only
VOL Output Low Voltage 0.3 V IOL e200 mA(3,5)
(Outputs Configured as 0.45 V IOL e3.2 mA
Complementary) 1.5 V IOL e7.0 mA
VOH Output High Voltage VCC b0.3 V IOH eb
200mA(3,5)
(Outputs Configured as VCC b0.7 V IOH eb
3.2 mA
Complementary) VCC b1.5 V IOH eb
7.0 mA
ILI Input Leakage Current (Std. Inputs) g10 mAV
SS kVIN kVCC
ILI1 Input Leakage Current (Port 0) g3mAV
CC kVIN kVREF
IIL Logical 0 Input Current b70 mAV
IN e0.45V(1)
7
8XC196NT
DC CHARACTERISTICS (Under Listed Operating Conditions) (Continued)
Symbol Parameter Min Typ Max Units Test Conditions
VOL1 Output Low Voltage in RESET 0.8 V (Note 7)
VOH1 SLPINT (P5.4) and HLDA (P2.6) 2.0 V IOH e0.8 mA(7)
Output High Voltage in RESET
VOH2 Output High Voltage in RESET VCCb1V V IOH eb
6mA
(1)
CSPin Capacitance (Any pin to VSS)10pFf
test e1.0 MHz
RWPU Weak Pullup Resistance 150K X(Note 6)
RRST Reset Pullup 65K 180K X
NOTES:
1. All BD (bidirectional) pins except INST and CLKOUT. INST and CLKOUT are excluded due to their not being weakly
pulled high in reset. BD pins include Port1, Port2, Port3, Port4, Port5, Port6 and EPORT except SPLINT (P5.4) and HLDA
(P2.6).
2. Standard input pins include XTAL1, EA, RESET, and Port 1/2/5/6 and EPORT when setup as inputs.
3. All bidirectional I/O pins when configured as Outputs (Push/Pull).
4. Device is static and should operate below 1 Hz, but only tested down to 4 MHz.
5. Maximum IDL/IDH currents per pin are as follows:
a.) Test Condition: VOH eVCC b0.7V VOL e0.45V
Part 1: IOL e0.65 mA IOH e7.5 mA
Part 2: IOL e8.0 mA IOH e12.0 mA
Part 3: IOL e7.5 mA IOH e7.5 mA
Part 4: IOL e7.5 mA IOH e7.5 mA
Part 5: IOL e9.0 mA IOH e9.0 mA
Part 6: IOL e8.0 mA IOH e9.0 mA
b.) Test Condition: VOH eVCC b1.5V VOL e1.5V
Part 1: IOL e21.0 mA IOH e26.0 mA
Part 2: IOL e26.0 mA IOH e29.0 mA
Part 3: IOL e17.0 mA IOH e25.0 mA
Part 4: IOL e16.0 mA IOH e25.0 mA
Part 5: IOL e21.0 mA IOH e28.0 mA
Part 6: IOL e19.0 mA IOH e26.0 mA
6. Typicals are based on limited number of samples and are not guaranteed. The values listed are at room temperature and
VREF eVCC e5.5V.
7. Violating these specifications in reset may cause the device to enter test modes (P5.4 and P2.6).
8. TBD eTo Be Determined.
9. Pullup present during return from powerdown condition.
10. When P0 is used as analog inputs, refer to A/D specifications.
11. For temperatures k100§C typical is 10 mA.
27226724
8
8XC196NT
8XC196NT ADDITIONAL BUS TIMING MODES
The 8XC196NT device has 3 additional bus timing
modes for external memory interfacing.
MODE 3:
Mode 3 is the standard timing mode. Use this mode
for systems that emulate the 8XC196KR bus tim-
ings.
MODE 0:
Mode 0 is the standard timing mode, but 1 (mini-
mum) wait state is always inserted in external bus
cycles.
MODE 1:
Mode 1 is the long R/W mode. This mode advances
RD and WR signals by 1 TOSC creatinga2T
OSC
RD/WR low time. ALE is also advanced by 0.5 TOSC
but ALE high time remains 1 TOSC.
MODE 2:
Mode 2 is the long R/W mode with Early Address.
Mode 2 is similar to Mode 1 with respect to RD,WR,
and ALE signals. Additionally, the address is output
on the bus 0.5 TOSC earlier in the bus cycle.
2722674
Figure 4. Detailed MODE 1, 2, 3, Comparison
9
8XC196NT
EXPLANATION OF AC SYMBOLS
Each symbol is two pairs of letters prefixed by ‘‘T’’
for time. The characters in a pair indicate a signal
and its condition, respectively. Symbols represent
the time between the two signal/condition points.
Conditions: Signals:
HÐHigh AÐAddress HAÐHLDA
LÐLow BÐBHE LÐALE/ADV
VÐValid BRÐBREQ QÐData Out
XÐNo Longer CÐCLKOUT RDÐRD
Valid DÐDATA WÐWR/WRH/WRI
ZÐFloating GÐBuswidth XÐXTAL1
HÐHOLD YÐREADY
BUS MODE 0 and 3ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The system must meet these specifications to work with the 8XC196NT.
Symbol Parameter Min Max Units
TAVYV Address Valid to Ready Setup 2 TOSC b75 ns(3)
TYLYH Non READY Time No Upper Limit ns
TCLYX READY Hold after CLKOUT Low 0 TOSC b30 ns(1)
TAVGV Address Valid to BUSWIDTH Setup 2 TOSC b75 ns(2, 3)
TLLGV ALE Low to BUSWIDTH Setup TOSC b60 ns(2, 3)
TCLGX BUSWIDTH Hold after CLKOUT Low 0 ns
TAVDV Address Valid to Input Data Valid 3 TOSC b55 ns(2)
TRLDV RD active to input Data Valid TOSC b30 ns(2)
TCLDV CLKOUT Low to Input Data Valid TOSC b60 ns
TRHDZ End of RD to Input Data Float TOSC ns
TRHDX Data Hold after RD High 0 ns
NOTES:
1. If Max is exceeded, additional wait states will occur.
2. If wait states are used, add 2 TOSC cn, where n enumber of wait states.
3. If mode 0 is selected, one wait state minimum is always added. If additional wait states are required, add 2 TOSC to the
specification.
10
8XC196NT
BUS MODE 0 and 3ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The 8XC196NT will meet these specifications
Symbol Parameter Min Max Units
FXTAL Frequency on XTAL1 4.0 20 MHz(1)
TOSC XTAL1 Period (1/FXTAL) 50 250 ns
TXHCH XTAL1 High to CLKOUT High or Low a20 110 ns
TOFD Clock Failure to Reset Pulled Low(6) 440ms
T
CLCL CLKOUT Period 2 TOSC ns
TCHCL CLKOUT High Period TOSC b10 TOSC a30 ns
TCLLH CLKOUT Low to ALE/ADV High b10 a15 ns
TLLCH ALE/ADV Low to CLKOUT High b25 a15 ns
TLHLH ALE/ADV Cycle Time 4 TOSC ns(5)
TLHLL ALE/ADV High Time TOSC b10 TOSC a10 ns
TAVLL Address Valid to ALE Low TOSC b15 ns
TLLAX Address Hold After ALE/ADV Low TOSC b40 ns
TLLRL ALE/ADV Low to RD Low TOSC b40 ns
TRLCL RD Low to CLKOUT Low b5a35 ns
TRLRH RD Low Period TOSC b5ns
(5)
TRHLH RD High to ALE/ADV High TOSC TOSC a25 ns(3)
TRLAZ RD Low to Address Float a5ns
T
LLWL ALE/ADV Low to WR Low TOSC b10 ns
TCLWL CLKOUT Low to WR Low b10 a25 ns
TQVWH Data Valid before WR High TOSC b23 ns
TCHWH CLKOUT High to WR High b10 a15 ns
TWLWH WR Low Period TOSC b30 ns(5)
TWHQX Data Hold after WR High TOSC b35 ns
TWHLH WR High to ALE/ADV High TOSC b10 TOSC a15 ns(3)
TWHBX BHE, INST Hold after WR High TOSC b10 ns
TWHAX AD8 15 Hold after WR High TOSC b30 ns(4)
TRHBX BHE, INST Hold after RD High TOSC b10 ns
TRHAX AD8 15 Hold after RD High TOSC b30 ns(4)
NOTES:
1. Testing performed at 8.0 MHz, however, the device is static by design and will typically operate below 1 Hz.
2. Typical specifications, not guaranteed.
3. Assuming back-to-back bus cycles.
4. 8-bit bus only.
5. If wait states are used, add 2 TOSC cn, where n enumber of wait states. If mode 0 (1 automatic wait state added)
operation is selected, add 2 TOSC to specification.
6. TOFD is the time for the oscillator fail detect circuit (OFD) to react to a clock failure. The OFD circuitry is enabled by
programming the UPROM location 0778H with the value 0004H. NT/NQ customer QROM codes need to equate location
2016H to the value 0CDEH if the oscillator fail detect (OFD) function is desired. Intel manufacturing uses location 2016H
as a flag to determine whether or not to program the Clock Detect Enable (CDE) bit. Programming the CDE bit
enables oscillator fail detection.
11
8XC196NT
BUS MODE 0 and 3Ð8XC196NT SYSTEM BUS TIMING
2722675
*If mode 0 operation is selected, add 2 TOSC to this time.
12
8XC196NT
8XC196NT MODE 0 and 3ÐREADY TIMINGS (ONE WAIT STATE)
2722676
*If mode 0 selected, one wait state is always added. If additional wait states are required, add 2 TOSC to these specifica-
tions.
MODE 0 and 3Ð8XC196NT BUSWIDTH TIMINGS
2722677
*If mode 0 selected, add 2 TOSC to these specifications.
13
8XC196NT
BUS MODE 1ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The system must meet these specifications to work with the 8XC196NT.
Symbol Parameter Min Max Units
TAVYV Address Valid to Ready Setup 2 TOSC b75 ns
TYLYH Non READY Time No Upper Limit ns
TCLYX READY Hold after CLKOUT Low 0 TOSC b30 ns(1)
TAVGV Address Valid to BUSWIDTH Setup 2 TOSC b75 ns
TLLGV ALE Low to BUSWIDTH Setup 1.5 TOSC b60 ns
TCLGX BUSWIDTH Hold after CLKOUT Low 0 ns
TAVDV Address Valid to Input Data Valid 3 TOSC b60 ns(2)
TRLDV RD active to input Data Valid 2 TOSC b44 ns(2)
TCLDV CLKOUT Low to Input Data Valid TOSC b60 ns
TRHDZ End of RD to Input Data Float TOSC ns
TRHDX Data Hold after RD High 0 ns
NOTES:
1. If Max is exceeded, additional wait states will occur.
2. If wait states are used, add 2 TOSC cn, where n enumber of wait states.
14
8XC196NT
BUS MODE 1ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The 8XC196NT will meet these specifications
Symbol Parameter Min Max Units
FXTAL Frequency on XTAL1 8.0 20 MHz(1)
TOSC XTAL1 Period (1/FXTAL) 50 125 ns
TXHCH XTAL1 High to CLKOUT High or Low a20 110 ns
TCLCL CLKOUT Period 2 TOSC ns
TCHCL CLKOUT High Period TOSC b10 TOSC a27 ns
TCHLH CLKOUT HIGH to ALE/ADV High 0.5 TOSC b15 0.5 TOSC a15 ns
TCLLL CLKOUT LOW to ALE/ADV Low 0.5 TOSC b25 0.5 TOSC a15 ns
TLHLH ALE/ADV Cycle Time 4 TOSC ns(5)
TLHLL ALE/ADV High Time TOSC b20 TOSC a10 ns
TAVLL Address Valid to ALE Low 0.5 TOSC b20 ns
TLLAX Address Hold After ALE/ADV Low 0.5 TOSC b25 ns
TLLRL ALE/ADV Low to RD Low 0.5 TOSC b15 ns
TRLCL RD Low to CLKOUT Low TOSC b10 TOSC a30 ns
TRLRH RD Low Period 2 TOSC b20 ns(5)
TRHLH RD High to ALE/ADV High 0.5 TOSC 0.5 TOSC a25 ns(3)
TRLAZ RD Low to Address Float a5ns
T
LLWL ALE/ADV Low to WR Low 0.5 TOSC b10 ns
TCLWL CLKOUT Low to WR Low TOSC b15 TOSC a25 ns
TQVWH Data Valid before WR High 2 TOSC b23 ns
TCHWH CLKOUT High to WR High b10 a15 ns
TWLWH WR Low Period 2 TOSC b15 ns(5)
TWHQX Data Hold after WR High 0.5 TOSC b12 ns
TWHLH WR High to ALE/ADV High 0.5 TOSC b10 0.5 TOSC a15 ns(3)
TWHBX BHE Hold after WR High TOSC b15 ns
TWHIX INST Hold after WR High 0.5 TOSC b15
TWHAX AD8 15 Hold after WR High 0.5 TOSC b30 ns(4)
TRHBX BHE Hold after RD High TOSC b32 ns
TRHIX INST Hold after RD High 0.5 TOSC b32
TRHAX AD8 15 Hold after RD High 0.5 TOSC b30 ns(4)
NOTES:
1. Testing performed at 8.0 MHz, however, the device is static by design and will typically operate below 1 Hz.
2. Typical specifications, not guaranteed.
3. Assuming back-to-back bus cycles.
4. 8-bit bus only.
5. If wait states are used, add 2 TOSC cn, where n enumber of wait states.
15
8XC196NT
MODE 1Ð8XC196NT SYSTEM BUS TIMING
2722678
16
8XC196NT
MODE 1Ð8XC196NT READY TIMINGS (ONE WAIT STATE)
2722679
MODE 1Ð8XC196NT BUSWIDTH TIMINGS
27226710
17
8XC196NT
BUS MODE 2ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The system must meet these specifications to work with the 8XC196NT.
Symbol Parameter Min Max Units
TAVYV Address Valid to Ready Setup 2.5 TOSC b75 ns
TYLYH Non READY Time No Upper Limit ns
TCLYX READY Hold after CLKOUT Low 0 TOSC b30 ns(1)
TAVGV Address Valid to BUSWIDTH Setup 2.5 TOSC b75 ns
TLLGV ALE Low to BUSWIDTH Setup 1.5 TOSC b60 ns
TCLGX BUSWIDTH Hold after CLKOUT Low 0 ns
TAVDV Address Valid to Input Data Valid 3.5 TOSC b55 ns(2)
TRLDV RD active to input Data Valid 2 TOSC b44 ns(2)
TCLDV CLKOUT Low to Input Data Valid TOSC b60 ns
TRHDZ End of RD to Input Data Float 0.5 TOSC ns
TRHDX Data Hold after RD High 0 ns
NOTES:
1. If Max is exceeded, additional wait states will occur.
2. If wait states are used, add 2 TOSC cn, where n enumber of wait states.
18
8XC196NT
BUS MODE 2ÐAC CHARACTERISTICS (Over Specified Operating Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
The 8XC196NT will meet these specifications
Symbol Parameter Min Max Units
FXTAL Frequency on XTAL1 8.0 20 MHz(1)
TOSC XTAL1 Period (1/FXTAL) 50 125 ns
TXHCH XTAL1 High to CLKOUT High or Low a20 a85 ns
TCLCL CLKOUT Period 2 TOSC ns
TCHCL CLKOUT High Period TOSC b10 TOSC a27 ns
TCHLH CLKOUT HIGH to ALE/ADV High 0.5 TOSC b15 0.5 TOSC a15 ns
TCLLL CLKOUT LOW to ALE/ADV Low 0.5 TOSC b25 0.5 TOSC a15 ns
TLHLH ALE/ADV Cycle Time 4 TOSC ns(5)
TLHLL ALE/ADV High Time TOSC b20 TOSC a10 ns
TAVLL Address Valid to ALE Low TOSC b15 ns
TLLAX Address Hold After ALE/ADV Low 0.5 TOSC b20 ns
TLLRL ALE/ADV Low to RD Low 0.5 TOSC b15 ns
TRLCL RD Low to CLKOUT Low TOSC b10 TOSC a30 ns
TRLRH RD Low Period 2 TOSC b20 ns(5)
TRHLH RD High to ALE/ADV High 0.5 TOSC b5 0.5 TOSC a25 ns(3)
TRLAZ RD Low to Address Float a5ns
T
LLWL ALE/ADV Low to WR Low 0.5 TOSC b10 ns
TCLWL CLKOUT Low to WR Low TOSC b22 TOSC a25 ns
TQVWH Data Valid before WR High 2 TOSC b25 ns
TCHWH CLKOUT High to WR High b10 a15 ns
TWLWH WR Low Period 2 TOSC b20 ns(5)
TWHQX Data Hold after WR High 0.5 TOSC b12 ns
TWHLH WR High to ALE/ADV High 0.5 TOSC b10 0.5 TOSC a10 ns(3)
TWHBX BHE Hold after WR High TOSC b15 ns
TWHIX INST Hold after WR High 0.5 TOSC b15
TWHAX AD8 15 Hold after WR High 0.5 TOSC b30 ns(4)
TRHBX BHE Hold after RD High TOSC b32 ns
TRHIX INST Hold after RD High 0.5 TOSC b32
TRHAX AD8 15 Hold after RD High 0.5 TOSC b30 ns(4)
NOTES:
1. Testing performed at 8.0 MHz, however, the device is static by design and will typically operate below 1 Hz.
2. Typical specifications, not guaranteed.
3. Assuming back-to-back bus cycles.
4. 8-bit bus only.
5. If wait states are used, add 2 TOSC cn, where n enumber of wait states.
19
8XC196NT
MODE 2Ð8XC196NT SYSTEM BUS TIMING
27226711
20
8XC196NT
MODE 2Ð8XC196NT READY TIMINGS (ONE WAIT STATE)
27226712
MODE 2Ð8XC196NT BUSWIDTH TIMINGS
27226713
21
8XC196NT
BUS MODE 0, 1, 2, and 3ÐHOLD/HLDA TIMINGS (Over Specified Operation Conditions)
Test Conditions: Capacitance Load on All Pins e100 pF, Rise and Fall Times e10 ns.
Symbol Parameter Min Max Units
THVCH HOLD Setup Time a65 ns(1)
TCLHAL CLKOUT Low to HLDA Low b15 a15 ns
TCLBRL CLKOUT Low to BREQ Low b15 a15 ns
THALAZ HLDA Low to Address Float a25 ns
THALBZ HLDA Low to BHE, INST, RD,WRWeakly Driven a25 ns
TCLHAH CLKOUT Low to HLDA High b25 a15 ns
TCLBRH CLKOUT Low to BREQ High b25 a25 ns
THAHAX HLDA High to Address No Longer Float b15 ns
THAHBV HLDA High to BHE, INST, RD,WRValid b10 ns
NOTE:
1. To guarantee recognition at next clock.
8XC196NT HOLD/HLDA TIMINGS
27226714
22
8XC196NT
AC CHARACTERISTICSÐSLAVE PORT
SLAVE PORT WAVEFORMÐ(SLPL e0)
27226715
SLAVE PORT TIMINGÐ(SLPL e0)
Symbol Parameter Min Max Units
TSAVWL Address Valid to WR Low 50 ns
TSRHAV RD High to Address Valid 60 ns
TSRLRH RD Low Period TOSC ns
TSWLWH WR Low Period TOSC ns
TSRLDV RD Low to Output Data Valid 60 ns
TSDVWH Input Data Setup to WR High 20 ns
TSWHQX WR High to Data Invalid 30 ns
TSRHDZ RD High to Data Float 15 ns
NOTES:
1. Test Conditions: FOSC e20 MHz, TOSC e50 ns. Rise/Fall Time e10 ns. Capacitive Pin Load e100 pF.
2. These values are not tested in production, and are based upon theoretical estimates and/or laboratory tests.
3. Specifications above are advanced information and are subject to change.
23
8XC196NT
AC CHARACTERISTICSÐSLAVE PORT (Continued)
SLAVE PORT WAVEFORMÐ(SLPL e1)
27226716
SLAVE PORT TIMINGÐ(SLPL e1)
Symbol Parameter Min Max Units
TSELLL CS Low to ALE Low 20 ns
TSRHEH RD or WR High to CS High 60 ns
TSLLRL ALE Low to RD Low TOSC ns
TSRLRH RD Low Period TOSC ns
TSWLWH WR Low Period TOSC ns
TSAVLL Address Valid to ALE Low 20 ns
TSLLAX ALE Low to Address Invalid 20 ns
TSRLDV RD Low to Output Data Valid 60 ns
TSDVWH Input Data Setup to WR High 20 ns
TSWHQX WR High to Data Invalid 30 ns
TSRHDZ RD High to Data Float 15 ns
NOTES:
1. Test Conditions: FOSC e20 MHz, TOSC e50 ns. Rise/Fall Time e10 ns. Capacitive Pin Load e100 pF.
2. These values are not tested in production, and are based upon theoretical estimates and/or laboratory tests.
3. Specifications above are advanced information and are subject to change.
24
8XC196NT
EXTERNAL CLOCK DRIVE
Symbol Parameter Min Max Units
1/TXLXL Oscillator Frequency 4 20 MHz
TXLXL Oscillator Period (TOSC) 50 250 ns
TXHXX High Time 0.35 cTOSC 0.65 TOSC ns
TXLXX Low Time 0.35 cTOSC 0.65 TOSC ns
TXLXH Rise Time 10 ns
TXHXL Fall Time 10 ns
EXTERNAL CLOCK DRIVE WAVEFORMS
27226717
AC TESTING INPUT, OUTPUT WAVEFORMS
27226718
AC Testing inputs are driven at 3.5V for a logic ‘‘1’’ and
0.45V for a logic ‘‘0’’. Timing measurements are made
at 2.0V for a logic ‘‘1’’ and 0.8V for logic ‘‘0’’.
FLOAT WAVEFORMS
27226719
For timing purposes a Port Pin is no longer floating
when a 150 mV change from load voltage occurs and
begins to float when a 150 mV change from the loading
VOH/VOL level occurs IOL/IOH s15 mA.
25
8XC196NT
WAVEFORMÐSERIAL PORTÐSHIFT REGISTER MODE
SERIAL PORT WAVEFORMÐSHIFT REGISTER MODE (MODE 0)
27226720
AC CHARACTERISTICSÐSERIAL PORT-SHIFT REGISTER MODE
SERIAL PORT TIMINGÐSHIFT REGISTER MODE (MODE 0)
Test Conditions: TAeb
40§Ctoa
125§C; VCC e5.0V g10%; VSS e0.0V; Load Capacitance epF
Symbol Parameter Min Max Units
TXLXL(2) Serial Port Clock Period (BRR t8002H) Receive Only 6 TOSC ns
TXLXH(2) Serial Port Clock Falling Edge to Rising Edge (BRR t8002H) 4 TOSC b50 4 TOSC a50 ns
TXLXL(2) Serial Port Clock Period (BRR e8001H) Transmit Only 4 TOSC ns
TXLXH(2) Serial Port Clock Falling Edge to Rising Edge (BRR e8001H) 2 TOSC b50 2 TOSC a50 ns
TQVXH Output Data Setup to Clock Rising Edge 3 TOSC ns
TXHQX Output Data Hold after Clock Rising Edge 2 TOSC b50 ns
TXHQV Next Output Data Valid after Clock Rising Edge 2 TOSC a50 ns
TDVXH Input Data Setup to Clock Rising Edge 2 TOSC a200 ns
TXHDX(1) Input Data Hold after Clock Rising Edge 0 ns
TXHQZ(1) Last Clock Rising to Output Float 5 TOSC ns
NOTES:
1. Parameters not tested.
2. The minimum baud rate register value for Receive is 8002H. The minimum baud rate register value for Transmit is 8001H.
26
8XC196NT
A to D CHARACTERISTICS
The A/D converter is ratiometric, so absolute accuracy is dependent on the accuracy and stability of VREF.
10-BIT MODE A/D OPERATING CONDITIONS
Symbol Description Min Max Units
TAAmbient Temperature 0 a70 §C
VCC Digital Supply Voltage 4.50 5.50 V
VREF Analog Supply Voltage 4.50 5.50 V(1)
TSAM Sample Time 1.0 ms(2)
TCONV Conversion Time 10 15 ms(2)
FOSC Oscillator Frequency 4.0 20 MHz
NOTES:
1. VREF must be within 0.5V of VCC.
2. The value of ADÐTIME is selected to meet these specifications.
10-BIT MODE A/D CHARACTERISTICS (Using Above Operating Conditions)(6)
Parameter Typ*(1) Min Max Units*
Resolution 1024 1024 Level
10 10 Bits
Absolute Error 0 g3.0 LSBs
Full Scale Error 0.25 g0.5 LSBs
Zero Offset Error 0.25 g0.5 LSBs
Non-Linearity 1.0 g2.0 g3.0 LSBs
Differential Non-Linearity b0.75 a0.75 LSBs
Channel-to-Channel Matching g0.1 0 g1.0 LSBs
Repeatability g0.25 0 LSBs(1)
Temperature Coefficients:
Offset 0.009 LSB/C(1)
Full Scale 0.009 LSB/C(1)
Differential Non-Linearity 0.009 LSB/C(1)
Off Isolation b60 dB(1,2,3)
Feedthrough b60 dB(1,2)
VCC Power Supply Rejection b60 dB(1,2)
Input Resistance 750 1.2K X(4)
DC Input Leakage g1.0 0 g3.0 mA
Voltage on Analog Input Pin ANGND b0.5 VREF a0.5 V(5)
Sampling Capacitor 3.0 pF
*An ‘‘LSB’’ as used here has a value of approximately 5 mV.
NOTES:
1. These values are expected for most parts at 25§C, but are not tested or guaranteed.
2. DC to 100 KHz.
3. Multiplexer break-before-make is guaranteed.
4. Resistance from device pin, through internal MUX, to sample capacitor.
5. Applying voltages beyond these specifications will degrade the accuracy of other channels being converted.
6. All conversions performed with processor in IDLE mode.
27
8XC196NT
8-BIT MODE A/D OPERATING CONDITIONS
Symbol Description Min Max Units
TAAmbient Temperature 0 a70 §C
VCC Digital Supply Voltage 4.50 5.50 V
VREF Analog Supply Voltage 4.50 5.50 V(1)
TSAM Sample Time 1.0 ms(2)
TCONV Conversion Time 7 20 ms(2)
FOSC Oscillator Frequency 4.0 20 MHz
NOTES:
1. VREF must be within 0.5V of VCC.
2. The value of ADÐTIME is selected to meet these specifications.
8-BIT MODE A/D CHARACTERISTICS (Using Above Operating Conditions)(6)
Parameter Typ*(1) Min Max Units*
Resolution 256 256 Level
8 8 Bits
Absolute Error 0 g1.0 LSBs
Full Scale Error g0.5 LSBs
Zero Offset Error g0.5 LSBs
Non-Linearity 0 g1.0 LSBs
Differential Non-Linearity b0.5 a0.5 LSBs
Channel-to-Channel Matching 0 g1.0 LSBs
Repeatability g0.25 0 LSBs(1)
Temperature Coefficients:
Offset 0.003 LSB/C(1)
Full Scale 0.003 LSB/C(1)
Differential Non-Linearity 0.003 LSB/C(1)
Off Isolation b60 dB(1,2,3)
Feedthrough b60 dB(1,2)
VCC Power Supply Rejection b60 dB(1,2)
Input Resistance 750 1.2K X(4)
DC Input Leakage g1.0 0 g3.0 mA
Voltage on Analog Input Pin ANGND b0.5 VREF a0.5 V(5)
Sampling Capacitor 3.0 pF
*An ‘‘LSB’’ as used here has a value of approximately 5 mV.
NOTES:
1. These values are expected for most parts at 25§C, but are not tested or guaranteed.
2. DC to 100 KHz.
3. Multiplexer break-before-make is guaranteed.
4. Resistance from device pin, through internal MUX, to sample capacitor.
5. Applying voltage beyond these specifications will degrade the accuracy of other channels being converted.
6. All conversions performed with processor in IDLE mode.
28
8XC196NT
OTPROM SPECIFICATIONS
OPERATING CONDITIONS
Symbol Description Min Max Units
TAAmbient Temperature During Programming 20 30 §C
VCC Supply Voltage During Programming 4.5 5.5 V(1)
VREF Reference Supply Voltage During Programming 4.5 5.5 V(1)
VPP Programming Voltage 12.25 12.75 V(2)
VEA EA Pin Voltage 12.25 12.75 V(2)
FOSC Oscillator Frequency during Auto 6.0 8.0 MHz
and Slave Mode Programming
FOSC Oscillator Frequency during 6.0 20.0 MHz
Run-Time Programming
NOTES:
1. VCC and VREF should nominally be at the same voltage during programming.
2. VPP and VEA must never exceed the maximum specification, or the device may be damaged.
3. VSS and ANGND should nominally be at the same potential (0V).
4. Load capacitance during Auto and Slave Mode programming e150 pF.
AC OTPROM PROGRAMMING CHARACTERISTICS (SLAVE MODE)
Symbol Parameter Min Max Units
TAVLL Address Setup Time 0 TOSC
TLLAX Address Hold Time 100 TOSC
TDVPL Data Setup Time 0 TOSC
TPLDX Data Hold Time 400 TOSC
TLLLH PALE Pulse Width 50 TOSC
TPLPH PROG Pulse Width(2) 50 TOSC
TLHPL PALE High to PROG Low 220 TOSC
TPHLL PROG High to next PALE Low 220 TOSC
TPHDX Word Dump Hold Time 50 TOSC
TPHPL PROG High to next PROG Low 220 TOSC
TLHPL PALE High to PROG Low 220 TOSC
TPLDV PROG Low to Word Dump Valid 50 TOSC
TSHLL RESET High to First PALE Low 1100 TOSC
TPHIL PROG High to AINC Low 0 TOSC
TILIH AINC Pulse Width 240 TOSC
TILVH PVER Hold after AINC Low 50 TOSC
TILPL AINC Low to PROG Low 170 TOSC
TPHVL PROG High to PVER Valid 220 TOSC
NOTES:
1. Run-time programming is done with FOSC e6.0 MHz to 10.0 MHz, VCC,V
PD,V
REF e5V g0.5V, TCe25§Cg5§C and
VPP e12.5V g0.25V. For run-time programming over a full operating range, contact factory.
2. This specification is for the word dump mode. For programming pulses use Modified Quick Pulse Algorithm.
29
8XC196NT
DC OTPROM PROGRAMMING CHARACTERISTICS
Symbol Parameter Min Max Units
IPP VPP Programming Supply Current 200 mA
NOTE:
Do not apply VPP unti VCC is stable and within specifications and the oscillator/clock has stabilized or the device may be
damaged.
OTPROM PROGRAMMING WAVEFORMS
SLAVE PROGRAMMING MODE DATA PROGRAM MODE WITH SINGLE PROGRAM PULSE
27226721
NOTE:
P3.0 must be high (‘‘1’’)
SLAVE PROGRAMMING MODE IN WORD DUMP MODE WITH AUTO INCREMENT
27226722
NOTE:
P3.0 must be low (‘‘0’’)
30
8XC196NT
SLAVE PROGRAMMING MODE TIMING IN DATA PROGRAM MODE WITH REPEATED PROG PULSE
AND AUTO INCREMENT
27226723
This data sheet (272267-004) applies to devices
marked with a ‘‘D’’ at the end of the top side tracking
number.
8XC196NT Design Considerations
1. When operating in bus timing modes 1 or 2, the
upper and lower address/data lines must be
latched. Even in 8-bit bus mode, the upper ad-
dress lines must be latched. In modes 0 and 3,
the upper address lines DO NOT NEED to be
latched in 8-bit bus width mode. But in 16-bit
buswidth mode the upper address lines need to
be latched.
8XC196NT ERRATA see Faxback
Ý2344
1. ILLEGAL Opcode interrupt vector.
2. Aborted Interrupt vectors to lowest priority.
3. PTS Request during Interrupt latency.
DATA SHEET REVISION HISTORY
This datasheet applies to devices marked with a ‘‘D’’
at the end of the topside tracking number. The top-
side tracking number consists of nine characters
and is the second line on the top side of the device.
Datasheets are changed as new device information
becomes available. Verify with your local Intel sales
office that you have the latest version before finaliz-
ing a design or ordering devices.
The following are differences between the 272267-
003 and 272267-004 datasheets:
1. Changed all references of ‘‘EPROM’’ to
‘‘OTPROM’’.
2. Added all the Slave Port pins to the package
diagram and pin descriptions.
3. Added INTOUT pin to pin descriptions.
4. Changed ILI1 (input leakage current for Port 0)
from g1mAtog
3mA.
5. Removed TLLYV from AC characterisics and
waveform diagrams.
6. TRLCL in Mode 0 and 3, changed from a4ns
min. to b5 ns min.
7. TWHQX in Mode 0 and 3, changed from TOSC
b30 min. to TOSC b35 min.
8. Clarified the Ready waveform timings for Mode
0 and 3, by adding ‘‘a2T
OSC*’’.
9. TLHLL in Mode 1, changed from TOSC b10 min.
to TOSC b20 min.
10. TAVLL in Mode 1, changed from 0.5 TOSC b15
min. to 0.5 TOSC b20 min.
11. TLLAX in Mode 1, changed from 0.5 TOSC b20
min. to 0.5 TOSC b25 min.
12. TLHLL in Mode 2, changed from TOSC b10 min.
to TOSC b20 min.
13. TXLXL and TXLXH for the Serial Port timings
were changed to reflect the minimum baudrate
for receive and transmit modes.
14. Added the 8XC196NT ERRATA section.
31