TVS Diode Arrays (SPATM Family of Products) Low Capacitance ESD Protection - SP3012 Series RoHS SP3012 Series 0.5pF Diode Array Pb GREEN The SP3012 integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 6 5 7 4 8 3 9 2 10 t &4% *&$ 12kV contact, 25kV air t -PXMFBLBHFDVSSFOUPG 1.5A (MAX) at 5V t &'5 *&$ " (tP=5/50ns) t 4NBMMGPSNGBDUPS DFN (JEDEC MO-229) package saves board space t -JHIUOJOH *&$ 4A (tP=8/20s) 1 t -PXDBQBDJUBODFPGQ' (TYP) per I/O *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Applications Pin 1 Pin 2 Pin 4 Pin 5 t-$%1%157T t4FU5PQ#PYFT t&YUFSOBM4UPSBHFT t.PCJMF1IPOFT t%7%#MVF3BZ1MBZFST t/PUFCPPLT t%FTLUPQT t%JHJUBM$BNFSBT t.11.1 Application Example for USB3.0 USB Port GND (Pins 3,8) USB Controller VBUS D+ D- SP3003 Optional NC IC SSTX+ SSTXGND SP3012 SSRX+ SSRX*Package is shown as transparent Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 123 Revision: March 20, 2012 Case GND Signal GND SP3012 Series SP3012 Description TVS Diode Arrays (SPATM Family of Products) Low Capacitance ESD Protection - SP3012 Series Absolute Maximum Ratings Parameter Value Peak Current (tp=8/20s) TOP TSTOR Units 4.0 A Operating Temperature -55 to 125 C Storage Temperature -60 to 150 C SP3012 Symbol IPP CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25C) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR 1A 5.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.5 A Clamp Voltage1 IPP=1A, tp=8/20s, Fwd VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD 1 6.6 V IPP=2A, tp=8/20s, Fwd 7.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.4 IEC61000-4-2 (Contact) 12 kV IEC61000-4-2 (Air) 25 kV Diode Capacitance CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 pF Diode Capacitance1 CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 pF 1 Note: Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1.0 0 -3 -6 Attenuation (dB) Capacitance (pF) 0.8 0.6 0.4 -9 -12 -15 -18 -21 -24 0.2 -27 -30 0.0 0.0 1.0 2.0 3.0 4.0 100 5.0 Frequency (MHz) 1000 Bias Voltage (V) Clamping Voltage vs. IPP Pulse Waveform 10.0 110% 100% 90% 8.0 Percent of IPP 80% Clamp Voltage (V) 6.0 4.0 70% 60% 50% 40% 30% 20% 2.0 10% 0.0 SP3012 Series 0% 1 2 Current (A) 3 4 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (s) 124 Revision: March 20, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPATM Family of Products) Low Capacitance ESD Protection - SP3012 Series Soldering Parameters Pb - Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds Temperature TP TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C Time Product Characteristics Part Numbering System SP 3012 - 04 U T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays G= Green T= Tape & Reel Series Number of Channels Critical Zone TL to TP Ramp-up Package DFN-10 (2.5x1.0mm) Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. V* 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Number of Product Series Channels V = SP3012 Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP3012-04UTG DFN-10 V*4 3000 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 125 Revision: March 20, 2012 SP3012 Series SP3012 Reflow Condition TVS Diode Arrays (SPATM Family of Products) Low Capacitance ESD Protection - SP3012 Series Embossed Carrier Tape & Reel Specification -- DFN-10 Package P0 Symbol Millimeters A0 1.30 +/- 0.10 W B0 F D1 5 Max DFN-10 (2.5x1.0x0.5mm) User Feeding Direction E D T Pin 1 Location B0 2.83 +/- 0.10 D0 O 1.50 + 0.10 D1 O 1.00 + 0.25 A0 K0 5 Max E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 SP3012 0 P1 P2 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 Package Dimensions -- DFN-10 (2.5x1.0x0.5mm) Package DFN-10 (2.5x1.0x0.5mm) JEDEC Top View Inches Symbol A D Min Nom Max Min Nom Max A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 A3 E B 0.005 Ref b 0.15 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 L A1 A3 0.022 0.125 Ref e Side View 0.05 C MO-229 Millimeters 0.50 BSC 0.30 0.365 0.020 BSC 0.014 0.016 A Seating Plane b1 C 0.05 C Soldering Pad Layout Dimensions b 0.10 M C A B 0.05 M C Bottom View R0.125 Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 L Recomended Soldering Pad Layout P1 P Y (Y1) Z (C) G X X1 Alternative Soldering Pad Layout P1 2xR0.075mm (7x) P e Y (Y1) Z (C) G X X1 SP3012 Series 126 Revision: March 20, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.