123
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP3012 Series
SP3012
Low Capacitance ESD Protection - SP3012 Series
Description
Applications
The SP3012 integrates 4 channels of ultra low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). This robust
device can safely absorb repetitive ESD strikes above the
maximum level specified in the IEC61000-4-2 international
standard (±8kV contact discharge) without performance
degradation. The extremely low loading capacitance also
makes it ideal for protecting high speed signal pins such as
HDMI, USB3.0, USB2.0, and IEEE 1394.
Features
t &4%*&$
±12kV contact, ±25kV air
t &'5*&$"
(tP=5/50ns)
t -JHIUOJOH*&$
4A (tP=8/20s)
t -PXDBQBDJUBODFPGQ'
(TYP) per I/O
t -PXMFBLBHFDVSSFOUPG
1.5A (MAX) at 5V
t 4NBMMGPSNGBDUPS
DFN (JEDEC MO-229)
package saves board
space
t-$%1%157T
t&YUFSOBM4UPSBHFT
t%7%#MVF3BZ1MBZFST
t%FTLUPQT
t.11.1
t4FU5PQ#PYFT
t.PCJMF1IPOFT
t/PUFCPPLT
t%JHJUBM$BNFSBT
Pinout
5 4 3 2 1
6 7 8 9 10
Functional Block Diagram
GND (Pins 3,8)
Pin 5
Pin 2
Pin 1
Pin 4
GND (Pins 3,8)
Pin 5
Pin 2
Pin 1
Pin 4
*Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Application Example for USB3.0
SP3012 Series 0.5pF Diode Array RoHS Pb GREEN
Signal GND
Case GND
USB Controller USB Port
SP3003
Optional
SSTX+
SSTX
-
SSRX+
SSRX
-
GND
D+
D
-
SP3012
IC
NC
*Package is shown as transparent
V
BUS
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
124
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP3012 Series
Low Capacitance ESD Protection - SP3012 Series
SP3012
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20s) 4.0 A
TOP Operating Temperature -55 to 125 °C
TSTOR Storage Temperature -60 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR ≤ 1µA 5.0 V
Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 6.6 V
IPP=2A, tp=8/20µs, Fwd 7.0 V
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.4
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±12 kV
IEC61000-4-2 (Air) ±25 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 pF
Diode Capacitance1CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 pF
Note: 1 Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GNDCapacitance vs. Bias Voltage
Clamping Voltage vs. IPP
Bias Voltage (V)
Capacitance (pF)
0.0
0.2
0.4
0.0 1.0 2.0 3.0 4.0 5.0
0.6
0.8
1.0
0.0
2.0
4.0
6.0
8.0
10.0
1234
Clamp Voltage (V)
Current (A)
-30
-18
-15
-12
-9
-3
0
Attenuation (dB)
-6
-21
-24
-27
100 1000
Frequency (MHz)
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
125
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP3012 Series
SP3012
Low Capacitance ESD Protection - SP3012 Series
TVS Diode Arrays (SPA
™ Family of Products)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
amp-d
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Numbering System
Part Marking System
SP 3012 04 U T G
Series Package
μDFN-10 (2.5x1.0mm)
T= Tape & Reel
G= Green
Number of
Channels
–
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
V*4
Product Series
V = SP3012
Assembly Site
Number o
f
Channels
Part Number Package Marking Min. Order Qty.
SP3012-04UTG µDFN-10 V*4 3000
Ordering Information
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
126
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP3012 Series
Low Capacitance ESD Protection - SP3012 Series
SP3012
Embossed Carrier Tape & Reel Specification — μDFN-10
Package Dimensions — μDFN-10 (2.5x1.0x0.5mm)
Package μDFN-10 (2.5x1.0x0.5mm)
Symbol Millimeters
A0 1.30 +/- 0.10
B0 2.83 +/- 0.10
D0 Ø 1.50 + 0.10
D1 Ø 1.00 + 0.25
E1.75 +/- 0.10
F3.50 +/- 0.05
K0 0.65 +/- 0.10
P0 4.00 +/- 0.10
P1 4.00 +/- 0.10
P2 2.00 +/- 0.05
T0.254 +/- 0.02
W8.00 + 0.30 /- 0.10
K0
A0
B0
P2
P1 P0
T
FE
W
D0
D1
5º Max
5º Max
User Feeding Direction
Pin 1 Location
Package μDFN-10 (2.5x1.0x0.5mm)
JEDEC MO-229
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A0.48 0.515 0.55 0.019 0.020 0.021
A1 0.00 -- 0.05 0.000 0.022
A3 0.125 Ref 0.005 Ref
b0.15 0.20 0.25 0.006 0.008 0.012
b1 0.35 0.40 0.45 0.014 0.016 0.018
D2.40 2.50 2.60 0.094 0.098 0.102
E0.90 1.00 1.10 0.035 0.039 0.043
e0.50 BSC 0.020 BSC
L0.30 0.365 0.43 0.012 0.014 0.016
D
E
B
Top View
A
A
Bottom View
0.05C
b
A1
b1
A3
C
Seating
Plane
Side View
0.10 CA
MB
0.05C
M
L
e
2xR0.075mm (7x)
R0.125
0.05C
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Recomended
Soldering Pad Layout Dimensions
Inch Millimeter
C(0.034) (0.875)
G0.008 0.20
P0.020 0.50
P1 0.039 1.00
X0.008 0.20
X1 0.016 0.40
Y0.027 0.675
Y1 (0.061) (1.55)
Z0.061 1.55
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Alternative