Data Sheet
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© 2014 ROHM Co., Ltd. All rights reserved.
Ultra Low Capacitance ESD Protection Diode
RSAC18CS
lApplication lDimensions (Unit : mm) lLand size figure (Unit : mm)
ESD Protection
lFeatures
1) Ultra small mold type (VMN2)
2)
Low Capacitance
3) High reliability
lStructure
4) By chip-mounter,
automatic mounting is possible.
lConstruction lTaping specifications (Unit : mm)
Silicon epitaxial planar
lAbsolute maximum ratings (Ta= 25°C)
Unit
Power dissipation mW
Junction temperature °C
Storage temperature °C
lElectrical characteristics (Ta = 25°C)
Symbol Min. Typ. Max. Unit
Zener voltage
VZ18.20 - 19.35 V IZ=2mA
Reverse current
IR- - 0.1 nA VR=13V
Capacitance between terminals
Ct- 0.3 - pF VR=0V, f=1MHz
* Zener voltage (VZ) shall be measured at 40ms after loading current.
* Electrical characteristic assurance is just only zener direction.
Conditions
Parameter
Symbol
P
Tj
Tstg
Limits
100
150
-55 to +150
Parameter
ROHM : VMN2
dot (year week factory)
VMN2
0.55
0.5
0.45
0.45
0.16±0.05
0.37±0.03
0.6±0.05
0.35±0.1
0.9±0.05
1.0±0.05
0.156
0.7±0.05
4.0±0.1
2±0.05
φ0.5
4±0.1
2±0.05
φ1.55
1.75±0.1
8.0±0.2
3.5±0.05
1.1±0.05
0.2±0.05
0.52
f1.55
f0.5
1/4
2014.11 - Rev.B
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© 2014 ROHM Co., Ltd. All rights reserved.
Data Sheet
RSAC18CS
lElectrical characteristic curves
ZENER CURRENT : IZ (mA)
ZENER VOLTAGE : VZ(V)
VZ-IZ CHARACTERISTICS
REVERSE CURRENT : IR(pA)
REVERSE VOLTAGE : VR(V)
VR-IR CHARACTERISTICS
CAPACITANCE BETWEEN
TERMINALS : Ct(pF)
REVERSE VOLTAGE : VR(V)
VR-Ct CHARACTERISTICS
ZENER VOLTAGE : VZ (Ｖ)
VZ DISPERSION MAP
0.01
0.1
1
10
10 15 20 25
Ta = 75°C
Ta = 25°C Ta = 150°C
Ta = 125°C
0.1
1
10
100
1000
10000
0 5 10 15
Ta = 75°C
Ta = 25°C
Ta = 125°C
Ta = 150°C
0.1
1
10
0 1 2 3 4 5 6
f = 1MHz
15
16
17
18
19
20
Ave. : 18.66V
Ta=25°C
IZ=2mA
n=30pcs
2/4
2014.11 - Rev.B
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
Data Sheet
RSAC18CS
lElectrical characteristic curves
10
100
1000
10000
0.1 1 10
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Rth(j-a)
Rth(j-c)
REVERSE CURRENT : IR(pA)
IR DISPERSION MAP
CAPACITANCE BETWEEN
TERMINALS : Ct (pF)
Ct DISPERSION MAP
DYNAMIC IMPEDANCE : ZZ (W)
ZENER CURRENT : IZ (mA)
ZZ-IZ CHARACTERISTICS
TRANSIENT
THERMAL IMPEDANCE : Rth (°C/W)
TIME : t(s)
Rth-t CHARACTERISTICS
on glass-epoxy substrate
10
100
Ave. : 16.29pA
Ta=25°C
VR=13V
n=30pcs
0
0.1
0.2
0.3
0.4
0.5
Ave. : 0.31pF
Ta=25°C
f=1MHz
VR=0V
n=10pcs
3/4
2014.11 - Rev.B
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
Data Sheet
RSAC18CS
lElectrical characteristic curves
0
5
10
15
20
25
30
No break at 30kV
AVE. : 0.96kV
ELECTROSTATIC
DISCHARGE TEST ESD(kV)
ESD DISPERSION MAP
C=100pF
R=1.5kW
C=200pF
R=0W C=150pF
R=330W
4/4
2014.11 - Rev.B
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
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Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
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H2S, NH3, SO2, and NO2
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[h] Use of the Products in places subject to dew condensation
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exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
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7. De-rate Po wer Dissipation (P d) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual
ambient temperature.
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Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
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characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the pl aces where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
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may occur due to excessive s t ress applied when dropping of a carton.
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
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ROHM’s Products against warning, caution or note contained in this document.
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