NL37WZ04 Triple Inverter The NL37WZ04 is a high performance triple inverter operating from a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. www.onsemi.com Features * * * * * * * * * * Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72 NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable These Devices are Pb-Free and are RoHS Compliant MARKING DIAGRAM 8 L5 M G G US8 US SUFFIX CASE 493 L5 M G 1 = Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin IN A1 1 OUT Y3 8 2 IN A2 OUT Y1 7 3 GND VCC IN A3 6 4 OUT Y2 5 1 OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC FUNCTION TABLE Figure 1. Pinout (Top View) IN A1 Function A Input Y Output L H H L ORDERING INFORMATION Figure 2. Logic Symbol Device Package Shipping NL37WZ04USG US8 (Pb-Free) 3000/Tape & Reel NLV37WZ04USG US8 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2015 March, 2015 - Rev. 7 1 Publication Order Number: NL37WZ04/D NL37WZ04 MAXIMUM RATINGS Symbol Value Units DC Supply Voltage -0.5 to +7.0 V VI DC Input Voltage -0.5 to +7.0 V VO DC Output Voltage -0.5 to +7.0 V IIK DC Input Diode Current VI < GND -50 DC Output Diode Current VO < GND -50 IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range VCC IOK Parameter mA mA -65 to +150 C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction Temperature under Bias +150 C qJA Thermal Resistance (Note 1) 250 C/W PD Power Dissipation in Still Air at 85C 250 mW MSL FR VESD Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V > 2000 > 200 N/A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. RECOMMENDED OPERATING CONDITIONS Symbol Min Max Supply Voltage Operating Data Retention Only 1.65 1.5 5.5 5.5 VI Input Voltage (Note 5) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free-Air Temperature -40 +85 C Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V 0 0 0 20 10 5 VCC Parameter Units V ns/V 5. Unused inputs may not be left open. All inputs must be tied to a high- or low-logic input voltage level. www.onsemi.com 2 NL37WZ04 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH VOL IIN Parameter Low-Level Input Voltage High-Level Output Voltage VIN = VIL Low-Level Output Voltage VIN = VIH Min 1.65 0.75 VCC 0.75 VCC 2.3 to 5.5 0.7 VCC 0.7 VCC Condition High-Level Input Voltage IOH = -100 mA -405C 3 TA 3 855C TA = 255C VCC (V) Typ Max Min Max V 1.65 0.25 VCC 0.25 VCC 2.3 to 5.5 0.3 VCC 0.3 VCC 1.65 to 5.5 VCC -0.1 VCC VCC -0.1 IOH = -3 mA 1.65 1.29 1.52 1.29 IOH = -8 mA 2.3 1.9 2.1 1.9 IOH = -12 mA 2.7 2.2 2.4 2.2 IOH = -16 mA 3.0 2.4 2.7 2.4 IOH = -24 mA 3.0 2.3 2.5 2.3 IOH = -32 mA 4.5 3.8 4.0 3.8 IOL = 100 mA 1.65 to 5.5 Units V V 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 0.1 1.0 mA 0 1 10 mA 5.5 1 10 mA Input Leakage Current VIN = 5.5 V or GND IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current VIN = 5.5 V or GND AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W -405C 3 TA 3 855C TA = 255C VCC (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.8 0.15 1.8 4.4 9.5 2.0 10 ns RL = 1 MW, CL = 15 pF 2.5 0.2 1.2 5.0 5.7 1.2 6.1 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 0.3 0.8 1.2 2.2 3.9 3.4 4.5 0.8 1.2 3.8 5.0 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 0.5 0.5 0.8 1.8 2.3 2.8 3.6 0.5 0.8 3.1 4.0 IIII IIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Symbol tPLH tPHL Parameter Condition Propagation Delay (Figure 3 and 4) CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. www.onsemi.com 3 NL37WZ04 tr = 3 ns tf = 3 ns 90% INPUT 50% VCC 90% 50% 10% 10% tPHL INPUT GND OUTPUT RL tPLH CL* VOH OUTPUT Y 50% 50% *CL includes all probe and jig capacitances. VOL A 1-MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit www.onsemi.com 4 NL37WZ04 PACKAGE DIMENSIONS US8 CASE 493-02 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.14MM (0.0055") PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL NOT EXCEED 0.14MM (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0.0203MM (0.003-0.008"). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED 0.0508MM (0.0002"). X Y A 8 J 5 DETAIL E B L 1 4 R S G P U C SEATING PLANE T D H 0.10 (0.004) T K 0.10 (0.004) M N R 0.10 TYP T X Y V M F DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.80 2.10 2.20 2.40 0.60 0.80 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 0_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.128 0_ 6_ 0_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC DETAIL E RECOMMENDED SOLDERING FOOTPRINT* 8X 0.30 8X 0.68 3.40 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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