© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. 7 1Publication Order Number:
NL37WZ04/D
NL37WZ04
Triple Inverter
The NL37WZ04 is a high performance triple inverter ope r ati ng from
a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
Features
•Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V
•Designed for 1.65 V to 5.5 V VCC Operation
•Over Voltage Tolerant Inputs and Outputs
•LVTTL Compatible − Interface Capability With 5 V TTL Logic with
VCC = 3 V
•LVCMOS Compatible
•24 mA Balanced Output Sink and Source Capability
•Near Zero Static Supply Current Substantially Reduces System
Power Requirements
•Chip Complexity: FET = 72
•NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free and are RoHS Compliant
VCC
IN A1
OUT Y3
GND
IN A2 OUT Y2
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
IN A2
OUT Y2
OUT Y1IN A1
1
2
3
8
7
6
OUT Y3
IN A3
IN A3
OUT Y1
45
1
1
1
ORDERING INFORMATION
MARKING
DIAGRAM
PIN ASSIGNMENT
1
2
3IN A2
IN A1
GND
4
5
OUT Y3
OUT Y1
6
FUNCTION TABLE
L
A Input Y Output
H
7
8V
CC
IN A3
OUT Y2
US8
US SUFFIX
CASE 493
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1
8
L5 M G
G
L5 = Device Code
M = Date Code*
G= Pb−Free Package
*Date Code orientation may vary depending upo
n
manufacturing location.
(Note: Microdot may be in either location)
Pin Function
HL
Device
US8
(Pb−Free)
Shipping†
3000/Tape & Ree
l
NL37WZ04USG
Package
†For information on tape and reel specifications
,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
US8
(Pb−Free) 3000/Tape & Ree
l
NLV37WZ04USG
NL37WZ04
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2
MAXIMUM RATINGS
Symbol Parameter Value Units
VCC DC Supply Voltage −0.5 to +7.0 V
VIDC Input Voltage −0.5 to +7.0 V
VODC Output Voltage −0.5 to +7.0 V
IIK DC Input Diode Current
VI < GND −50 mA
IOK DC Output Diode Current
VO < GND −50 mA
IODC Output Sink Current ±50 mA
ICC DC Supply Current per Supply Pin ±100 mA
IGND DC Ground Current per Ground Pin ±100 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature under Bias +150 °C
qJA Thermal Resistance (Note 1) 250 °C/W
PDPower Dissipation in Still Air at 85°C 250 mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Units
VCC Supply Voltage
Operating
Data Retention Only 1.65
1.5 5.5
5.5
V
VIInput Voltage (Note 5) 0 5.5 V
VOOutput Voltage (HIGH or LOW State) 0 5.5 V
TAOperating Free−Air Temperature −40 +85 °C
Dt/DVInput Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
20
10
5
ns/V
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NL37WZ04
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3
DC ELECTRICAL CHARACTERISTICS
Symbo
l
Parameter Condition VCC
(V)
TA = 255C−405C 3 TA 3 855C
Units
Min Typ Max Min Max
VIH High−Level Input
Voltage 1.65 0.75 VCC 0.75 VCC V
2.3 to 5.5 0.7 VCC 0.7 VCC
VIL Low−Level Input Volt
-
age 1.65 0.25 VCC 0.25 VCC V
2.3 to 5.5 0.3 VCC 0.3 VCC
VOH High−Level Output
Voltage
VIN = VIL
IOH = −100 mA1.65 to 5.5 VCC −0.1 VCC VCC −0.1 V
IOH = − 3 mA 1.65 1.29 1.52 1.29
IOH = − 8 mA 2.3 1.9 2.1 1.9
IOH = − 12 mA 2.7 2.2 2.4 2.2
IOH = − 16 mA 3.0 2.4 2.7 2.4
IOH = − 24 mA 3.0 2.3 2.5 2.3
IOH = − 32 mA 4.5 3.8 4.0 3.8
VOL Low−Level Output
Voltage
VIN = VIH
IOL = 100 mA1.65 to 5.5 0.1 0.1 V
IOL = 3 mA 1.65 0.08 0.24 0.24
IOL = 8 mA 2.3 0.20 0.3 0.3
IOL = 12 mA 2.7 0.22 0.4 0.4
IOL = 16 mA 3.0 0.28 0.4 0.4
IOL = 24 mA 3.0 0.38 0.55 0.55
IOL = 32 mA 4.5 0.42 0.55 0.55
IIN Input Leakage Cur-
rent VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA
IOFF Power Off
Leakage Current VIN = 5.5 V or
VOUT = 5.5 V 0 1 10 mA
ICC Quiescent Supply
Current VIN = 5.5 V or GND 5.5 1 10 mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
Symbol Parameter Condition VCC
(V)
TA = 255C−405C 3 TA 3 855C
Units
Min Typ Max Min Max
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLH
tPHL
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Propagation Delay
(Figure 3 and 4) RL = 1 MW, CL = 15 pF 1.8 ± 0.15 1.8 4.4 9.5 2.0 10
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
RL = 1 MW, CL = 15 pF
ÎÎÎÎ
ÎÎÎÎ
2.5 ±0.2
ÎÎÎ
ÎÎÎ
1.2
ÎÎÎ
ÎÎÎ
5.0
ÎÎÎ
ÎÎÎ
5.7
ÎÎÎÎ
ÎÎÎÎ
1.2
ÎÎÎ
ÎÎÎ
6.1
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
3.3 ±0.3
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.8
1.2
ÎÎÎ
ÎÎÎ
ÎÎÎ
2.2
3.9
ÎÎÎ
ÎÎÎ
ÎÎÎ
3.4
4.5
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
0.8
1.2
ÎÎÎ
ÎÎÎ
ÎÎÎ
3.8
5.0
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
ÎÎÎÎ
ÎÎÎÎ
5.0 ±0.5
ÎÎÎ
ÎÎÎ
0.5
0.8
ÎÎÎ
ÎÎÎ
1.8
2.3
ÎÎÎ
ÎÎÎ
2.8
3.6
ÎÎÎÎ
ÎÎÎÎ
0.5
0.8
ÎÎÎ
ÎÎÎ
3.1
4.0
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF
CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9
11 pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
NL37WZ04
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5
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE C
DIM
AMIN MAX MIN MAX
INCHES
1.80 2.10 0.075 0.083
MILLIMETERS
B2.20 2.40 0.087 0.094
C0.60 0.80 0.024 0.035
D0.17 0.25 0.007 0.010
F0.20 0.35 0.008 0.014
G0.50 BSC 0.020 BSC
H0.40 REF 0.016 REF
J0.10 0.18 0.004 0.007
K0.00 0.10 0.000 0.004
L3.00 3.20 0.118 0.128
M0 6 0 6
N0 10 0 10
P0.23 0.34 0.010 0.013
R0.23 0.33 0.009 0.013
S0.37 0.47 0.015 0.019
U0.60 0.80 0.024 0.031
V0.12 BSC 0.005 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508MM (0.0002”).
LB
A
PG
41
58
C
K
D
SEATING
J
S
R
U
DETAIL E
V
F
H
NR 0.10 TYP
M
DETAIL E
T
M
0.10 (0.004) XY
T0.10 (0.004)
____
____
PLANE
X Y
T
0.30
8X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
RECOMMENDED
1
PITCH
3.40
0.68
8X
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NL37WZ04/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
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