©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
HUF76407D3, HUF76407D3S
11A, 60V, 0.107 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFET
Packaging
Symbol
Features
Ultra Low On-Resistance
-r
DS(ON)
= 0.092
Ω,
V
GS
=
10V
-r
DS(ON)
= 0.107
Ω,
V
GS
=
5V
Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
Peak Current vs Pulse Width Curve
UIS Rating Curve
Switching Time vs R
GS
Curves
Ordering Information
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
For severe environments, see our Automotive HUFA series.
JEDEC TO-251AA JEDEC TO-252AA
DRAIN
(FLANGE) DRAIN
SOURCE
HUF76407D3
GATE
HUF76407D3S
GATE
SOURCE
DRAIN
(FLANGE)
D
G
S
PART NUMBER PACKAGE BRAND
HUF76407D3 TO-251AA 76407D
HUF76407D3S TO-252AA 76407D
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the TO-252AA variant in tape and reel, e.g., HUF76407D3ST.
HUF76407D3,
HUF76407D3S UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
60 V
Drain to Gate Voltage (R
GS
= 20k
) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
±
16 V
Drain Current
Continuous (T
C
= 25
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 25
o
C, V
GS
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 135
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 135
o
C, V
GS
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
11
12
6
6
Figure 4
A
A
A
A
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS Figures 6, 14, 15
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
38
0.25
W
W/
o
C
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
-55 to 175
o
C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
L
Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
300
260
o
C
o
C
NOTE:
1. T
J
= 25
o
C to 150
o
C.
CAUTION:
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Data Sheet December 2001
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
Electrical Specifications
T
C
= 25
o
C, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
DSS
I
D
= 250
µ
A, V
GS
= 0V (Figure 12) 60 - - V
I
D
= 250
µ
A, V
GS
= 0V , T
C
= -40
o
C (Figure 12) 55 - - V
Zero Gate Voltage Drain Current I
DSS
V
DS
= 55V, V
GS
= 0V - - 1
µ
A
V
DS
= 50V, V
GS
= 0V, T
C
= 150
o
C - - 250
µ
A
Gate to Source Leakage Current I
GSS
V
GS
=
±
16V - -
±
100 nA
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
GS(TH)
V
GS
= V
DS
, I
D
= 250
µ
A (Figure 11) 1 - 3 V
Drain to Source On Resistance r
DS(ON)
I
D
= 13A, V
GS
= 10V (Figures 9, 10) - 0.077 0.092
I
D
= 8A, V
GS
= 5V (Figure 9) - 0.095 0.107
I
D
= 8A, V
GS
= 4.5V (Figure 9) - 0.107 0.117
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case R
θ
JC
TO-251, TO-252 - - 3.94
o
C/W
Thermal Resistance Junction to
Ambient
R
θ
JA
- - 100
o
C/W
SWITCHING SPECIFICATIONS
(V
GS
= 4.5V)
Turn-On Time t
ON
V
DD
= 30V, I
D
= 8A
V
GS
=
4.5V, R
GS
= 32
(Figures 15, 21, 22)
- - 170 ns
Turn-On Delay Time t
d(ON)
-8-ns
Rise Time t
r
- 105 - ns
Turn-Off Delay Time t
d(OFF)
-22-ns
Fall Time t
f
-39-ns
Turn-Off Time t
OFF
- - 92 ns
SWITCHING SPECIFICATIONS
(V
GS
= 10V)
Turn-On Time t
ON
V
DD
= 30V, I
D
= 13A
V
GS
=
10V,
R
GS
= 32
(Figures 16, 21, 22)
- - 56 ns
Turn-On Delay Time t
d(ON)
-5-ns
Rise Time t
r
-32-ns
Turn-Off Delay Time t
d(OFF)
-43-ns
Fall Time t
f
- 45 - ns
Turn-Off Time t
OFF
- - 132 ns
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
g(TOT)
V
GS
= 0V to 10V V
DD
= 30V,
I
D
= 8A,
I
g(REF)
= 1.0mA
(Figures 14, 19, 20)
- 9.4 11.3 nC
Gate Charge at 5V Q
g(5)
V
GS
= 0V to 5V - 5.2 6.2 nC
Threshold Gate Charge Q
g(TH)
V
GS
= 0V to 1V - 0.36 0.43 nC
Gate to Source Gate Charge Q
gs
- 1.2 - nC
Reverse Transfer Capacitance Q
gd
- 2.5 - nC
CAPACITANCE SPECIFICATIONS
Input Capacitance CISS VDS = 25V, VGS = 0V,
f = 1MHz
(Figure 13)
- 350 - pF
Output Capacitance COSS - 105 - pF
Reverse Transfer Capacitance CRSS -23-pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage VSD ISD =8A - - 1.25 V
ISD = 3A - - 1.0 V
Reverse Recovery Time trr ISD = 8A, dISD/dt = 100A/µs--66ns
Reverse Recovered Charge QRR ISD = 8A, dISD/dt = 100A/µs - - 159 nC
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
Typical Performance Curves
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
FIGURE 4. PEAK CURRENT CAPABILITY
TC, CASE TEMPERATURE (oC)
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 175
0.2
0.4
0.6
0.8
1.0
1.2
125 150
5
10
15
25 50 75 100 125 150 175
0
ID, DRAIN CURRENT (A)
TC, CASE TEMPERATURE (oC)
VGS = 10V
VGS = 4.5V
0.1
1
10-5 10-4 10-3 10-2 10-1 100101
0.01
2
t, RECTANGULAR PULSE DURATION (s)
ZθJC, NORMALIZED
SINGLE PULSE
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
PDM
t1
t2
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.01
0.02
THERMAL IMPEDANCE
100
10-5 10-4 10-3 10-2 10-1 100101
200
10
IDM, PEAK CURRENT (A)
t, PULSE WIDTH (s)
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
TC = 25oC
I = I25 175 - TC
150
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
VGS = 5V
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
FIGURE 7. TRANSFER CHARACTERISTICS FIGURE 8. SATURATION CHARACTERISTICS
FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
FIGURE 10. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
Typical Performance Curves (Continued)
1
10
100
1 10 100
0.1
200
100µs
10ms
1ms
VDS, DRAIN TO SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
LIMITED BY rDS(ON)
AREA MAY BE
OPERATION IN THIS
TJ = MAX RATED TC = 25oC
SINGLE PULSE
10
100
0.001 0.01 0.1 1 10
1
IAS, AVALANCHE CURRENT (A)
tAV, TIME IN AVALANCHE (ms)
STARTING TJ = 25oC
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R = 0
If R 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
STARTING TJ = 150oC
3
6
9
12
15
2345
0
ID, DRAIN CURRENT (A)
VGS, GATE TO SOURCE VOLTAGE (V)
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VDD = 15V
TJ = 175oC
TJ = 25oC
TJ = -55oC
ID, DRAIN CURRENT (A)
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS = 3V
VGS = 5V
VGS = 10V
VGS = 4V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
3
6
9
12
15
01234
0
VGS = 3.5V
Tc = 25oC
90
120
150
246810
60
ID = 3A
VGS, GATE TO SOURCE VOLTAGE (V)
rDS(ON), DRAIN TO SOURCE
ON RESISTANCE (m)
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
TC = 25oC
ID = 12A
ID = 5A
1.0
1.5
2.0
2.5
-80 -40 0 40 80 120 160 200
0.5
NORMALIZED DRAIN TO SOURCE
TJ, JUNCTION TEMPERATURE (oC)
ON RESISTANCE
VGS = 10V, ID = 12A
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
NOTE: Refer to Fairchild Application Notes AN7254 and AN7260.
FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT
GATE CURRENT
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE FIGURE 16. SWITCHING TIME vs GATE RESISTANCE
Typical Performance Curves (Continued)
0.8
1.0
1.2
-80 -40 0 40 80 120 160 200
0.6
NORMALIZED GATE
TJ, JUNCTION TEMPERATURE (oC)
VGS = VDS, ID = 250µA
THRESHOLD VOLTAGE
1.0
1.1
1.2
-80 -40 0 40 80 120 160 200
0.9
TJ, JUNCTION TEMPERATURE (oC)
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
ID = 250µA
100
1000
0.1 1.0 10 60
10
C, CAPACITANCE (pF)
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS = 0V, f = 1MHz
CISS = CGS + CGD
COSS CDS + CGD
CRSS = CGD
2
4
6
8
10
0246810
0
V
GS
, GATE TO SOURCE VOLTAGE (V)
Q
g
, GATE CHARGE (nC)
V
DD
= 30V
I
D
= 12A
I
D
= 5A
WAVEFORMS IN
DESCENDING ORDER:
I
D
= 3A
50
100
150
0 1020304050
0
SWITCHING TIME (ns)
RGS, GATE TO SOURCE RESISTANCE ()
VGS = 4.5V, VDD = 30V, ID = 6A
tr
tf
td(ON)
td(OFF)
20
40
60
80
0 1020304050
0
SWITCHING TIME (ns)
RGS, GATE TO SOURCE RESISTANCE ()
VGS = 10V, VDD = 30V, ID = 12A
tr
td(ON)
tf
td(OFF)
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
Test Circuits and Waveforms
FIGURE 17. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 18. UNCLAMPED ENERGY WAVEFORMS
FIGURE 19. GATE CHARGE TEST CIRCUIT FIGURE 20. GATE CHARGE WAVEFORMS
FIGURE 21. SWITCHING TIME TEST CIRCUIT FIGURE 22. SWITCHING TIME WAVEFORM
tP
VGS
0.01
L
IAS
+
-
VDS
VDD
RG
DUT
VARY tP TO OBTAIN
REQUIRED PEAK IAS
0V
VDD
VDS
BVDSS
tP
IAS
tAV
0
RL
VGS +
-
VDS
VDD
DUT
Ig(REF)
VDD
Qg(TH)
VGS = 1V
Qg(5)
VGS = 5V
Qg(TOT)
VGS = 10V
VDS
VGS
Ig(REF)
0
0
Qgs Qgd
VGS
RL
RGS
DUT
+
-
VDD
VDS
VGS
tON
td(ON)
tr
90%
10%
VDS 90%
10%
tf
td(OFF)
tOFF
90%
50%
50%
10% PULSE WIDTH
VGS
0
0
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
PSPICE Electrical Model
.SUBCKT HUF76407 2 1 3 ; rev 28June 1999
CA 12 8 3.9e-9
CB 15 14 4.9e-9
CIN 6 8 3.25e-10
DBODY 7 5 DBODYMOD
DBREAK 5 11 DBREAKMOD
DPLCAP 10 5 DPLCAPMOD
EBREAK 11 7 17 18 67.8
EDS 14 8 5 8 1
EGS 13 8 6 8 1
ESG 6 10 6 8 1
EVTHRES 6 21 19 8 1
EVTEMP 20 6 18 22 1
IT 8 17 1
LDRAIN 2 5 1.0e-9
LGATE 1 9 5.42e-9
LSOURCE 3 7 2.57e-9
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD
MWEAK 16 21 8 8 MWEAKMOD
RBREAK 17 18 RBREAKMOD 1
RDRAIN 50 16 RDRAINMOD 3.7e-2
RGATE 9 20 3.37
RLDRAIN 2 5 10
RLGATE 1 9 54.2
RLSOURCE 3 7 25.7
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
RSOURCE 8 7 RSOURCEMOD 2.50e-2
RVTHRES 22 8 RVTHRESMOD 1
RVTEMP 18 19 RVTEMPMOD 1
S1A 6 12 13 8 S1AMOD
S1B 13 12 13 8 S1BMOD
S2A 6 15 14 13 S2AMOD
S2B 13 15 14 13 S2BMOD
VBAT 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*30),3))}
.MODEL DBODYMOD D (IS = 1.75e-13 RS = 1.75e-2 TRS1 = 1e-4 TRS2 = 5e-6 CJO = 5.9e-10 TT = 5.45e-8 N = 1.03 M = 0.6)
.MODEL DBREAKMOD D (RS = 6.50e-1 TRS1 = 1.25e-4 TRS2 = 1.34e-6)
.MODEL DPLCAPMOD D (CJO = 3.21e-10 IS = 1e-30 N = 10 M = 0.81)
.MODEL MMEDMOD NMOS (VTO = 2.02 KP = .83 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 3.37)
.MODEL MSTROMOD NMOS (VTO = 2.39 KP = 14 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u)
.MODEL MWEAKMOD NMOS (VTO = 1.78 KP = 0.02 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 33.7 RS = 0.1)
.MODEL RBREAKMOD RES (TC1 = 1.06e-3 TC2 = 0)
.MODEL RDRAINMOD RES (TC1 = 1.23e-2 TC2 = 2.58e-5)
.MODEL RSLCMOD RES (TC1 = 0 TC2 = 0)
.MODEL RSOURCEMOD RES (TC1 = 1e-3 TC2 = 0)
.MODEL RVTHRESMOD RES (TC1 = -2.19e-3 TC2 = -4.97e-6)
.MODEL RVTEMPMOD RES (TC1 = -1.6e-3 TC2 = 1e-7)
.MODEL S1AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -4 VOFF= -2.5)
.MODEL S1BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -2.5 VOFF= -4)
.MODEL S2AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -0.5 VOFF= 0)
.MODEL S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0 VOFF= -0.5)
.ENDS
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
18
22
+-
6
8
+
-
5
51
+
-
19
8
+-
17
18
6
8
+
-
5
8+
-
RBREAK
RVTEMP
VBAT
RVTHRES
IT
17 18
19
22
12
13
15
S1A
S1B
S2A
S2B
CA CB
EGS EDS
14
8
13
8
14
13
MWEAK
EBREAK DBODY
RSOURCE
SOURCE
11
73
LSOURCE
RLSOURCE
CIN
RDRAIN
EVTHRES 16
21
8
MMED
MSTRO
DRAIN
2
LDRAIN
RLDRAIN
DBREAK
DPLCAP
ESLC
RSLC1
10
5
51
50
RSLC2
1
GATE RGATE
EVTEMP
9
ESG
LGATE
RLGATE
20
+
-
+
-
+
-
6
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
SABER Electrical Model
REV 28 June 1999
template huf76407 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
d..model dbodymod = (is = 1.75e-13, cjo = 5.9e-10, tt = 5.45e-8, n=1.03, m = 0.6)
d..model dbreakmod = ()
d..model dplcapmod = (cjo = 3.21e-10, is = 1e-30, m = 0.81 )
m..model mmedmod = (type=_n, vto = 2.02, kp = .83, is = 1e-30, tox = 1)
m..model mstrongmod = (type=_n, vto = 2.39, kp = 14, is = 1e-30, tox = 1)
m..model mweakmod = (type=_n, vto = 1.78, kp = 0.02, is = 1e-30, tox = 1)
sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -4, voff = -2.5)
sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -2.5, voff = -4)
sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -0.5, voff = 0)
sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0, voff = -0.5)
c.ca n12 n8 = 3.9e-10
c.cb n15 n14 = 4.9e-10
c.cin n6 n8 = 3.25e-10
d.dbody n7 n71 = model=dbodymod
d.dbreak n72 n11 = model=dbreakmod
d.dplcap n10 n5 = model=dplcapmod
i.it n8 n17 = 1
l.ldrain n2 n5 = 1.0e-9
l.lgate n1 n9 = 5.42e-9
l.lsource n3 n7 = 2.57e-9
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u
res.rbreak n17 n18 = 1, tc1 = 1.06e-3, tc2 = 0
res.rdbody n71 n5 = 1.75e-2, tc1 = 1e-4, tc2 = 5e-6
res.rdbreak n72 n5 = 6.50e-1, tc1 = 1.25e-4, tc2 = 1.34e-6
res.rdrain n50 n16 = 3.7e-2, tc1 = 1.23e-2, tc2 = 2.58e-5
res.rgate n9 n20 = 3.37
res.rldrain n2 n5 = 10
res.rlgate n1 n9 = 54.2
res.rlsource n3 n7 = 25.7
res.rslc1 n5 n51 = 1e-6, tc1 = 0, tc2 =0
res.rslc2 n5 n50 = 1e3
res.rsource n8 n7 = 2.50e-2, tc1 = 1e-3, tc2 =0
res.rvtemp n18 n19 = 1, tc1 = -1.6e-3, tc2 = 1.0e-7
res.rvthres n22 n8 = 1, tc1 = -2.19e-3, tc2 = -4.97e-6
spe.ebreak n11 n7 n17 n18 = 67.8
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
spe.evthres n6 n21 n19 n8 = 1
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/30))** 3))
}
}
18
22
+-
6
8
+
-
19
8
+-
17
18
6
8
+
-
5
8+
-
RBREAK
RVTEMP
VBAT
RVTHRES
IT
17 18
19
22
12
13
15
S1A
S1B
S2A
S2B
CA CB
EGS EDS
14
8
13
8
14
13
MWEAK
EBREAK
DBODY
RSOURCE
SOURCE
11
73
LSOURCE
RLSOURCE
CIN
RDRAIN
EVTHRES 16
21
8
MMED
MSTRO
DRAIN
2
LDRAIN
RLDRAIN
DBREAK
DPLCAP
ISCL
RSLC1
10
5
51
50
RSLC2
1
GATE RGATE
EVTEMP
9
ESG
LGATE
RLGATE
20
+
-
+
-
+
-
6
RDBODY
RDBREAK
72
71
HUF76407D3, HUF76407D3S
©2001 Fairchild Semiconductor Corporation HUF76407D3, HUF76407D3S Rev. B
SPICE Thermal Model
REV 28June 1999
HUF76407T
CTHERM1 th 6 4.5e-4
CTHERM2 6 5 2.5e-3
CTHERM3 5 4 1.9e-3
CTHERM4 4 3 2.6e-3
CTHERM5 3 2 5.5e-3
CTHERM6 2 tl 1.8e-2
RTHERM1 th 6 3.1e-2
RTHERM2 6 5 15.1e-2
RTHERM3 5 4 4.2e-1
RTHERM4 4 3 8.4e-1
RTHERM5 3 2 8.7e-1
RTHERM6 2 tl 1.5
SABER Thermal Model
SABER thermal model HUF76407T
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 = 4.5e-4
ctherm.ctherm2 6 5 = 2.5e-3
ctherm.ctherm3 5 4 = 1.9e-3
ctherm.ctherm4 4 3 = 2.6e-3
ctherm.ctherm5 3 2 = 5.5e-3
ctherm.ctherm6 2 tl = 1.8e-2
rtherm.rtherm1 th 6 = 3.1e-2
rtherm.rtherm2 6 5 = 15.1e-2
rtherm.rtherm3 5 4 = 4.2e-1
rtherm.rtherm4 4 3 = 8.4e-1
rtherm.rtherm5 3 2 = 8.7e-1
rtherm.rtherm6 2 tl = 1.5
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th JUNCTION
CASE
HUF76407D3, HUF76407D3S
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
Rev. H4
ACEx™
Bottomless™
CoolFET™
CROSSVOLT
DenseTrench™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
FACT Quiet Series™
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
STAR*POWER is used under license
VCX™