PT Fel contact i PLCC SERIES TERS Se ae High Density Configuration Avaliable ORDERING INFORMATION TIL 1. DESCRIPTION PLCC = Plastic Leaded Chip Cariar 2. POSITION 20), 28, 32, 44, 52, 6B, 84, 100 3. MOUNTING ANGLE TB = Through Board SM Surface Mount 4. PLATING 6 = Gold over Nickel T=Tin 5. SPECIAL OPTIONS N= Thin wail for high density (available in 32, 44, 68, 84) DIMENSIONAL DATA FEATURES: fe Perdew tons ee Converts 050" chi Eee a arnete e ee J ip centers tp Pa eRe LAME Siem 100 board hole spacing ne ahaa fhe ree ee cae ee : re t tre sieges Sa ena iene: cates sual polartzatontor proper assembly OG gees * Closed bottom eliminates bridging and solder wicking * Superior conlact design alews proper sealing and retention of JEDEC A, B and 0 chaps PLCC SERIES SPECIFICATIONS: MATERIALS: ELECTRICAL: Contacts Phosphor Bronze Currant Rating 1 Amp DC Plating Tin or gold over nickel Dielectric Insuletior PPS high temp. withstanding voltage: 1000 VAC UL S4y-0 Insulation Resistance 1000 nmegohines: min. Contact Resisiance 5 millichms typ. 20 max. Operating Temperature = -65t0 4+ 110C Al Gimoecesicres bn [leech aed rook rember Suir Lie i ye__ - fA 0 o i ee c 1 21, BG 0 Ot 1 1 2870 1 1