Summary Atmel's SAM4L series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex-M4 RISC processor running at frequencies up to 48MHz. The SAM4L series embeds state-of-the-art picoPower technology for ultra-low power consumption. Combined power control techniques are used to bring active current consumption down to 90A/MHz. The device allows a wide range of options between functionality and power consumption, giving the user the ability to reach the lowest possible power consumption with the feature set required for the application. The WAIT and RETENTION modes provide full logic and RAM retention, associated with fast wake-up capability (<1.5s) and a very low consumption of, respectively, 3 A and 1.5 A. In addition, WAIT mode supports SleepWalking features. In BACKUP mode, CPU, peripherals and RAM are powered off and, while consuming less than 0.9A with external interrupt wakeup supported. The SAM4L series offers a wide range of peripherals such as segment LCD controller, embedded hardware capacitive touch (QTouch), USB device & embedded host, 128-bit AES and audio interfaces in addition to high speed serial peripherals such as USART, SPI and I2C. Additionally the Peripheral Event System and SleepWalking allows the peripherals to communicate directly with each other and make intelligent decisions and decide to wake-up the system on a qualified events on a peripheral level; such as I2C address match or and ADC threshold. Features * Core - ARM(R) CortexTM-M4 running at up to 48MHz - Memory Protection Unit (MPU) - Thumb(R)-2 instruction set * picoPower(R) Technology for Ultra-low Power Consumption - Active mode downto 90A/MHz with configurable voltage scaling - High performance and efficiency: 28 coremark/mA - Wait mode downto 3A with fast wake-up time (<1.5s) supporting SleepWalking - Full RAM and Logic Retention mode downto 1.5A with fast wake-up time (<1.5s) - Ultra low power Backup mode with/without RTC downto 1,5/0.9A * Memories - From 128 to 512Kbytes embedded Flash, 64-bit wide access, * 0 wait-state capability up to 24MHz - up to 64Kbytes embedded SRAM * System Functions - Embedded voltage linear and switching regulator for single supply operation - Two Power-on-Reset and Two Brown-out Detectors (BOD) - Quartz or ceramic resonator oscillators: 0.6 to 30MHz main power with Failure Detection and low power 32.768 kHz for RTC or device clock - High precision 4/8/12MHz factory trimmed internal RC oscillator - Slow Clock Internal RC oscillator as permanent low-power mode device clock - High speed 80MHz internal RC oscillator - Low power 32kHz internal RC oscillator ATSAM---e ARM-based Flash MCU SAM4L Series Summary 42023HS-11/2016 ATSAM4L8/L4/L2 * * * * - PLL up to 240MHz for device clock and for USB - Digital Frequency Locked Loop (DFLL) with wide input range - Up to 16 peripheral DMA (PDCA) channels Peripherals - USB 2.0 Device and Embedded Host: 12 Mbps, up to 8 bidirectional Endpoints and Multi-packet Ping-pong Mode. OnChip Transceiver - Liquid Crystal Display (LCD) Module with Capacity up to 40 Segments and up to 4 Common Terminals - One USART with ISO7816, IrDA(R), RS-485, SPI, Manchester and LIN Mode - Three USART with SPI Mode - One PicoUART for extended UART wake-up capabilities in all sleep modes - Windowed Watchdog Timer (WDT) - Asynchronous Timer (AST) with Real-time Clock Capability, Counter or Calendar Mode Supported - Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency - Six 16-bit Timer/Counter (TC) Channels with capture, waveform, compare and PWM mode - One Master/Slave Serial Peripheral Interface (SPI) with Chip Select Signals - Four Master and Two Slave Two-wire Interfaces (TWI), up to 3.4Mbit/s I2C-compatible - One Advanced Encryption System (AES) with 128-bit key length - One 16-channel ADC 300Ksps (ADC) with up to 12 Bits Resolution - One DAC 500Ksps (DACC) with up to 10 Bits Resolution - Four Analog Comparators (ACIFC) with Optional Window Detection - Capacitive Touch Module (CATB) supporting up to 32 buttons - Audio Bitstream DAC (ABDACB) Suitable for Stereo Audio - Inter-IC Sound (IISC) Controller, Compliant with Inter-IC Sound (I2S) Specification - Peripheral Event System for Direct Peripheral to Peripheral Communication - 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU) - Random generator (TRNG) - Parallel Capture Module (PARC) - Glue Logic Controller (GLOC) I/O - Up to 75 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and slew-rate control - Up to Six High-drive I/O Pins Single 1.68-3.6V Power Supply Packages - 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm/100-ball VFBGA, 7x7 mm, pitch 0.65 mm - 64-lead LQFP, 10 x 10 mm, pitch 0.5 mm/64-pad QFN 9x9 mm, pitch 0.5 mm - 64-ball WLCSP, 4,314x4,434 mm, pitch 0.5 mm for SAM4LC4/2 and SAM4LS4/2 series - 64-ball WLCSP, 5,270x5,194 mm, pitch 0.5 mm for SAM4LC8 and SAM4LS8 series - 48-lead LQFP, 7 x 7 mm, pitch 0.5 mm/48-pad QFN 7x7 mm, pitch 0.5 mm 2 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 1. Description Atmel's SAM4L series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex-M4 RISC processor running at frequencies up to 48MHz. The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern and real-time operating systems. The ATSAM4L8/L4/L2 embeds state-of-the-art picoPower technology for ultra-low power consumption. Combined power control techniques are used to bring active current consumption down to 90A/MHz. The device allows a wide range of options between functionality and power consumption, giving the user the ability to reach the lowest possible power consumption with the feature set required for the application. On-chip regulator improves power efficiency when used in swichting mode with an external inductor or can be used in linear mode if application is noise sensitive. The ATSAM4L8/L4/L2 supports 4 power saving strategies. The SLEEP mode put the CPU in idle mode and offers different sub-modes which automatically switch off/on bus clocks, PLL, oscillators. The WAIT and RETENTION modes provide full logic and RAM retention, associated with fast wake-up capability (<1.5s) and a very low consumption of, respectively, 3 A and 1.5 A. In addition, WAIT mode supports SleepWalking features. In BACKUP mode, CPU, peripherals and RAM are powered off and, while consuming less than 0.5A, the device is able to wakeup from external interrupts. The ATSAM4L8/L4/L2 incorporates on-chip Flash tightly coupled to a low power cache (LPCACHE) for active consumption optimization and SRAM memories for fast access. The LCD controller is intended for monochrome passive liquid crystal display (LCD) with up to 4 Common terminals and up to 40 Segments terminals. Dedicated Low Power Waveform, Contrast Control, Extended Interrupt Mode, Selectable Frame Frequency and Blink functionality are supported to offload the CPU, reduce interrupts and reduce power consumption. The controller includes integrated LCD buffers and integrated power supply voltage. The low-power and high performance capacitive touch module (CATB) is introduced to meet the demand for a low power capacitive touch solution that could be used to handle buttons, sliders and wheels. The CATB provides excellent signal performance, as well as autonomous touch and proximity detection for up to 32 sensors. This solution includes an advanced sequencer in addition to an hardware filtering unit. The Advanced Encryption Standard module (AESA) is compliant with the FIPS (Federal Information Processing Standard) Publication 197, Advanced Encryption Standard (AES), which specifies a symmetric block cipher that is used to encrypt and decrypt electronic data. Encryption is the transformation of a usable message, called the plaintext, into an unreadable form, called the ciphertext. On the other hand, decryption is the transformation that recovers the plaintext from the ciphertext. AESA supports 128 bits cryptographic key sizes. The Peripheral Direct Memory Access (DMA) controller enables data transfers between peripherals and memories without processor involvement. The Peripheral DMA controller drastically reduces processing overhead when transferring continuous and large data streams. The Peripheral Event System (PES) allows peripherals to receive, react to, and send peripheral events without CPU intervention. Asynchronous interrupts allow advanced peripheral operation in low power modes. The Power Manager (PM) improves design flexibility and security. The Power Manager supports SleepWalking functionality, by which a module can be selectively activated based on peripheral 3 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 events, even in sleep modes where the module clock is stopped. Power monitoring is supported by on-chip Power-on Reset (POR18, POR33), Brown-out Detectors (BOD18, BOD33). The device features several oscillators, such as Phase Locked Loop (PLL), Digital Frequency Locked Loop (DFLL), Oscillator 0 (OSC0), Internal RC 4,8,12MHz oscillator (RCFAST), system RC oscillator (RCSYS), Internal RC 80MHz, Internal 32kHz RC and 32kHz Crystal Oscillator. Either of these oscillators can be used as source for the system clock. The DFLL is a programmable internal oscillator from 40 to 150MHz. It can be tuned to a high accuracy if an accurate reference clock is running, e.g. the 32kHz crystal oscillator. The Watchdog Timer (WDT) will reset the device unless it is periodically serviced by the software. This allows the device to recover from a condition that has caused the system to be unstable. The Asynchronous Timer (AST) combined with the 32kHz crystal oscillator supports powerful real-time clock capabilities, with a maximum timeout of up to 136 years. The AST can operate in counter or calendar mode. The Frequency Meter (FREQM) allows accurate measuring of a clock frequency by comparing it to a known reference clock. The Full-speed USB 2.0 device and embedded host interface (USBC) supports several USB classes at the same time utilizing the rich end-point configuration. The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation. The ATSAM4L8/L4/L2 also features many communication interfaces, like USART, SPI, or TWI, for communication intensive applications. The USART supports different communication modes, like SPI Mode and LIN Mode. A general purpose 16-channel ADC is provided, as well as four analog comparators (ACIFC). The ADC can operate in 12-bit mode at full speed. The analog comparators can be paired to detect when the sensing voltage is within or outside the defined reference window. Atmel offers the QTouch Library for embedding capacitive touch buttons, sliders, and wheels functionality. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys as well as Adjacent Key Suppression(R) (AKS(R)) technology for unambiguous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications. The Audio Bitstream DAC (ABDACB) converts a 16-bit sample value to a digital bitstream with an average value proportional to the sample value. Two channels are supported, making the ABDAC particularly suitable for stereo audio. The Inter-IC Sound Controller (IISC) provides a 5-bit wide, bidirectional, synchronous, digital audio link with external audio devices. The controller is compliant with the Inter-IC Sound (I2S) bus specification. 4 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 2. Overview 2.1 Block Diagram Figure 2-1. Block Diagram System TAP System Management Access Port MEMORY PROTECTION UNIT Instruction/ Data M S HIGH SPEED BUS MATRIX M S M PERIPHERAL DMA CONTROLLER DMA USART0 USART1 USART2 USART3 DMA SPI DMA TWI MASTER 0 TWI MASTER 1 TWI MASTER 2 TWI MASTER 3 TWI SLAVE 0 TWI SLAVE 1 LCD CONTROLLER INTER-IC SOUND CONTROLLER AUDIO BITSTREAM DAC 16-CHANNEL 12-bit ADC INTERFACE 10-bit DAC INTERFACE CAPACITIVE TOUCH MODULE SENSE[69..0] PARALLEL CAPTURE CONTROLLER PCCK PCEN1,PCEN2 PCDATA[7..0] BACKUP POWER MANAGER BACKUP REGISTERS NMI EXTERNAL INTERRUPT CONTROLLER ASYNCHRONOUS TIMER WATCHDOG TIMER PICOUART RXD BACKUP DOMAIN POWER MANAGER RESETN CLOCK CONTROLLER RESET CONTROLLER SLEEP CONTROLLER GCLK_IN[1:0] GCLK[3:0] RCSYS XIN0 XOUT0 SYSTEM CONTROL INTERFACE OSC0 DFLL GLUE LOGIC CONTROLLER GENERIC CLOCK SCK MISO, MOSI NPCS[3..0] TWCK TWD TWCK TWD SEG[39..0] COM[3..0] BIASL,BIASH CAPH,CAPL ISCK IWS ISDI ISDO IMCK ABDAC[1..0] ABDACN[1..0] CLK RCFAST RC80M RXD TXD CLK RTS, CTS PLL GENERAL PURPOSE I/Os HSB-PB BRIDGE A DMA HSB-PB BRIDGE C DMA HSB-PB BRIDGE D OSC32 EXTINT[8..1] FLASH 512/256/128 KB CONTROLLER FLASH DMA GENERALPURPOSE I/Os PA PB PC S REGISTERS BUS BACKUP SYSTEM CONTROL INTERFACE RC32K XIN32 XOUT32 64/32 KB RAM DMA VDDCORE HSB-PB BRIDGE B LDO/ SWITCHING REGULATOR S PERIPHERAL EVENT CONTROLLER VDDIN HRAM CONTROLLER DMA S CONFIGURATION VDDOUT S LOW POWER CACHE S S USBC 8 EndPoints DM M DMA DP System DMA DMA 128-bit AES ARM Cortex-M4 Processor Fmax 48 MHz NVIC In-Circuit Emulator JTAG & Serial Wire DMA TCK TDO TDI TMS PA PB PC TRIGGER AD[14..0] ADVREFP DACOUT DIS IN[7..0] OUT[1..0] CLK[2..0] FREQUENCY METER TIMER/COUNTER 0 TIMER/COUNTER 1 B[2..0] A[2..0] AC INTERFACE ACAP[3..0] ACAN[3..0] ACREFN PAD_EVT[3..0] TRUE RANDOM GENERATOR 32-BIT CRC CALCULATION UNIT 5 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 2.2 Configuration Summary Table 2-1. Sub Series Summary Feature ATSAM4LC ATSAM4LS SEGMENT LCD Yes No AESA Yes No Device + Host Device Only USB Table 2-2. ATSAM4LC Configuration Summary Feature Number of Pins ATSAM4LC8/4/2C ATSAM4LC8/4/2B ATSAM4LC8/4/2A 100 64 48 Max Frequency 48MHz Flash 512/256/128KB SRAM 64/32/32KB SEGMENT LCD 4x40 4x23 4x13 GPIO 75 43 27 High-drive pins 6 3 1 External Interrupts 8 + 1 NMI 2 Masters + 2 Masters/Slaves 1 Master + 1 Master/Slave USART 4 3 in LC sub series 4 in LS sub series PICOUART 1 0 TWI Peripheral DMA Channels 16 AESA 1 Peripheral Event System 1 SPI 1 Asynchronous Timers 1 Timer/Counter Channels 6 3 Parallel Capture Inputs 8 Frequency Meter 1 Watchdog Timer 1 Power Manager 1 Glue Logic LUT 2 1 6 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 2-2. ATSAM4LC Configuration Summary Feature ATSAM4LC8/4/2C ATSAM4LC8/4/2B ATSAM4LC8/4/2A Digital Frequency Locked Loop 20-150MHz (DFLL) Phase Locked Loop 48-240MHz (PLL) Crystal Oscillator 0.6-30MHz (OSC0) Crystal Oscillator 32kHz (OSC32K) RC Oscillator 80MHz (RC80M) RC Oscillator 4,8,12MHz (RCFAST) RC Oscillator 115kHz (RCSYS) RC Oscillator 32kHz (RC32K) Oscillators ADC 15-channel 7-channel DAC 3-channel 1-channel Analog Comparators 4 2 1 CATB Sensors 32 32 26 USB 1 Audio Bitstream DAC 1 IIS Controller 1 TQFP/QFN/ WLCSP TQFP/QFN ATSAM4LS8/4/2C ATSAM4LS8/4/2B ATSAM4LS8/4/2A 100 64 48 Packages TQFP/VFBGA Table 2-3. ATSAM4LS Configuration Summary . Feature Number of Pins Max Frequency 48MHz Flash 512/256/128KB SRAM 64/32/32KB SEGMENT LCD NA GPIO 80 48 32 High-drive pins 6 3 1 External Interrupts 8 + 1 NMI 2 Masters + 2 Masters/Slaves 1 Master + 1 Master/Slave USART 4 3 in LC sub series 4 in LS sub series PICOUART 1 0 TWI Peripheral DMA Channels 16 AESA NA Peripheral Event System 1 SPI 1 Asynchronous Timers 1 7 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 2-3. ATSAM4LS Configuration Summary Feature Timer/Counter Channels ATSAM4LS8/4/2C ATSAM4LS8/4/2B 6 3 Parallel Capture Inputs 8 Frequency Meter 1 Watchdog Timer 1 Power Manager 1 Glue Logic LUT Oscillators ADC ATSAM4LS8/4/2A 2 1 Digital Frequency Locked Loop 20-150MHz (DFLL) Phase Locked Loop 48-240MHz (PLL) Crystal Oscillator 0.6-30MHz (OSC0) Crystal Oscillator 32kHz (OSC32K) RC Oscillator 80MHz (RC80M) RC Oscillator 4,8,12MHz (RCFAST) RC Oscillator 115kHz (RCSYS) RC Oscillator 32kHz (RC32K) 15-channel DAC 7-channel 3-channel 1-channel Analog Comparators 4 2 1 CATB Sensors 32 32 26 USB 1 Audio Bitstream DAC 1 IIS Controller 1 Packages TQFP/VFBGA TQFP/QFN/ WLCSP TQFP/QFN 8 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3. Package and Pinout 3.1 Package The device pins are multiplexed with peripheral functions as described in Section 3.2 "Peripheral Multiplexing on I/O lines" on page 19. 3.1.1 ATSAM4LCx Pinout ATSAM4LC TQFP100 Pinout 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PB11 PB10 PB09 PB08 PC23 PC22 PC21 PC20 PA17 PA16 PA15 PA14 PA13 PC19 PC18 PC17 PC16 PC15 VLCDIN GND BIASL BIASH VLCD CAPL CAPH Figure 3-1. PA18 PA19 PA20 PC24 PC25 PC26 PC27 PC28 PC29 PC30 PC31 VDDIO VDDIO PB12 PB13 PA21 PA22 PB14 PB15 PA23 PA24 VDDIO PA25 PA26 GND 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 PA12 PA11 PA10 PA09 PB07 PB06 PA08 PC14 PC13 PC12 PC11 PC10 PC09 PC08 PC07 VDDANA ADVREFP GNDANA ADVREFN PA07 PA06 PB05 PB04 XOUT32 XIN32 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PB03 PB02 PB01 PB00 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PC06 PC05 PC04 VDDIO GND PA01 PA00 PC03 PC02 PC01 PC00 9 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 3-2. ATSAM4LC VFBGA100 Pinout 1 2 3 4 5 6 7 8 9 10 A PA05 PA04 GND VDDIN VDDOUT VDD CORE PA02 VDDIO GND PC00 B PB05 XIN32 PA03 TCK RESET_N PC06 PC03 PA01 PA00 GND C PB04 XOUT32 PA06 PB03 PC04 PC05 PC02 PC01 PA26 VDDIO D AD VREFN GNDANA PA07 PC10 PB01 PA23 PB14 PB15 PA25 PA24 E VDDANA AD VREFP PC08 PC11 PB02 VDDIO PB12 PB13 PA21 PA22 F PC09 PC07 PC12 PC13 PA09 PC27 PC29 PC30 PC31 VDDIO G PC14 PA08 PB06 PC19 PA15 PB08 PB09 PB10 PC26 PC28 H PB07 PA10 PA11 PC17 PA13 PA17 PC20 PC23 PC25 PA20 J CAPL PA12 PB00 BIASL PC15 PC16 PA16 PC22 PC24 PA19 K CAPH VLCD BIASH GND VLCDIN PC18 PA14 PC21 PB11 PA18 10 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 3-3. ATSAM4LC WLCSP64 Pinout 1 2 3 4 5 6 7 8 A PB04 GNDANA AD VREFP VDDANA PA09 CAPL CAPH PA12 B PB03 XIN32 XOUT32 PA08 PB06 PA10 PA11 VLCD C VDDIN PB01 PA05 PA06 PA07 PB07 PA13 BIASH D VDDOUT PB00 PA04 PB05 PB12 PB08 PA14 BIASL E GND PA03 PB02 RESET_N PB13 PB09 PA15 GND F VDD CORE TCK PA02 PB14 PA22 PB10 PA16 VLCDIN G GND PA26 PA24 PA00 PA01 PA19 PA18 PA17 H VDDIO PA25 PA23 PB15 PA21 VDDIO PA20 PB11 11 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 ATSAM4LC TQFP64/QFN64 Pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PB11 PB10 PB09 PB08 PA17 PA16 PA15 PA14 PA13 VLCDIN GND BIASL BIASH VLCD CAPL CAPH Figure 3-4. PA18 PA19 PA20 VDDIO PB12 PB13 PA21 PA22 PB14 PB15 PA23 PA24 VDDIO PA25 PA26 GND 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 PA12 PA11 PA10 PA09 PB07 PB06 PA08 VDDANA ADVREFP GNDANA PA07 PA06 PB05 PB04 XOUT32 XIN32 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PB03 PB02 PB01 PB00 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PA01 PA00 12 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 ATSAM4LC TQFP48/QFN48 Pinout 36 35 34 33 32 31 30 29 28 27 26 25 PA17 PA16 PA15 PA14 PA13 VLCDIN GND BIASL BIASH VLCD CAPL CAPH Figure 3-5. PA18 PA19 PA20 VDDIO PA21 PA22 PA23 PA24 VDDIO PA25 PA26 GND 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 PA12 PA11 PA10 PA09 PA08 VDDANA ADVREFP GNDANA PA07 PA06 XOUT32 XIN32 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PA01 PA00 13 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3.1.2 ATSAM4LSx Pinout ATSAM4LS TQFP100 Pinout 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PB11 PB10 PB09 PB08 PC23 PC22 PC21 PC20 PA17 PA16 PA15 PA14 PA13 PC19 PC18 PC17 PC16 PC15 PA31 PA30 VDDIO GND PA29 PA28 PA27 Figure 3-6. PA18 PA19 PA20 PC24 PC25 PC26 PC27 PC28 PC29 PC30 PC31 VDDIO VDDIO PB12 PB13 PA21 PA22 PB14 PB15 PA23 PA24 VDDIO PA25 PA26 GND 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 PA12 PA11 PA10 PA09 PB07 PB06 PA08 PC14 PC13 PC12 PC11 PC10 PC09 PC08 PC07 VDDANA ADVREFP GNDANA ADVREFN PA07 PA06 PB05 PB04 XOUT32 XIN32 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PB03 PB02 PB01 PB00 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PC06 PC05 PC04 VDDIO GND PA01 PA00 PC03 PC02 PC01 PC00 14 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 3-7. ATSAM4LS VFBGA100 Pinout 1 2 3 4 5 6 7 8 9 10 A PA05 PA04 GND VDDIN VDDOUT VDD CORE PA02 VDDIO GND PC00 B PB05 XIN32 PA03 TCK RESET_N PC06 PC03 PA01 PA00 GND C PB04 XOUT32 PA06 PB03 PC04 PC05 PC02 PC01 PA26 VDDIO D AD VREFN GNDANA PA07 PC10 PB01 PA23 PB14 PB15 PA25 PA24 E VDDANA AD VREFP PC08 PC11 PB02 VDDIO PB12 PB13 PA21 PA22 F PC09 PC07 PC12 PC13 PA09 PC27 PC29 PC30 PC31 VDDIO G PC14 PA08 PB06 PC19 PA15 PB08 PB09 PB10 PC26 PC28 H PB07 PA10 PA11 PC17 PA13 PA17 PC20 PC23 PC25 PA20 J PA28 PA12 PB00 VDDIO PC15 PC16 PA16 PC22 PC24 PA19 K PA27 PA29 GND PA30 PA31 PC18 PA14 PC21 PB11 PA18 15 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 3-8. ATSAM4LS WLCSP64 Pinout 1 2 3 4 5 6 7 8 A PB04 GNDANA AD VREFP VDDANA PA09 PA28 PA27 PA12 B PB03 XIN32 XOUT32 PA08 PB06 PA10 PA11 PA29 C VDDIN PB01 PA05 PA06 PA07 PB07 PA13 GND D VDDOUT PB00 PA04 PB05 PB12 PB08 PA14 VDDIO E GND PA03 PB02 RESET_N PB13 PB09 PA15 PA30 F VDD CORE TCK PA02 PB14 PA22 PB10 PA16 PA31 G GND PA26 PA24 PA00 PA01 PA19 PA18 PA17 H VDDIO PA25 PA23 PB15 PA21 VDDIO PA20 PB11 16 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 ATSAM4LS TQFP64/QFN64 Pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PB11 PB10 PB09 PB08 PA17 PA16 PA15 PA14 PA13 PA31 PA30 VDDIO GND PA29 PA28 PA27 Figure 3-9. PA18 PA19 PA20 VDDIO PB12 PB13 PA21 PA22 PB14 PB15 PA23 PA24 VDDIO PA25 PA26 GND 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 PA12 PA11 PA10 PA09 PB07 PB06 PA08 VDDANA ADVREFP GNDANA PA07 PA06 PB05 PB04 XOUT32 XIN32 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PB03 PB02 PB01 PB00 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PA01 PA00 17 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 36 35 34 33 32 31 30 29 28 27 26 25 PA17 PA16 PA15 PA14 PA13 PA31 PA30 VDDIO GND PA29 PA28 PA27 Figure 3-10. ATSAM4LS TQFP48/QFN48 Pinout PA18 PA19 PA20 VDDIO PA21 PA22 PA23 PA24 VDDIO PA25 PA26 GND 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 PA12 PA11 PA10 PA09 PA08 VDDANA ADVREFP GNDANA PA07 PA06 XOUT32 XIN32 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA04 PA03 TCK VDDIN VDDOUT GND VDDCORE RESET_N PA02 PA01 PA00 See Section 3.3 "Signals Description" on page 31 for a description of the various peripheral signals. Refer to "Electrical Characteristics" on page 99 for a description of the electrical properties of the pin types used. 18 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3.2 Peripheral Multiplexing on I/O lines 3.2.1 Multiplexed Signals Each GPIO line can be assigned to one of the peripheral functions. The following tables (Section 3-1 "100-pin GPIO Controller Function Multiplexing" on page 19 to Section 3-4 "48-pin GPIO Controller Function Multiplexing" on page 28) describes the peripheral signals multiplexed to the GPIO lines. Peripheral functions that are not relevant in some parts of the family are grey-shaded. For description of differents Supply voltage source, refer to the Section 6. "Power and Startup Considerations" on page 46. 100-pin GPIO Controller Function Multiplexing (Sheet 1 of 4) Pin GPIO Supply ATSAM4LC ATSAM4LS Table 3-1. 5 B9 5 B9 PA00 0 VDDIO 6 B8 6 B8 PA01 1 VDDIO 12 A7 12 A7 PA02 2 VDDIN 19 B3 19 B3 PA03 3 VDDIN 24 A2 24 A2 PA04 4 VDDANA ADCIFE AD0 USART0 CLK EIC EXTINT2 GLOC IN1 25 A1 25 A1 PA05 5 VDDANA ADCIFE AD1 USART0 RXD EIC EXTINT3 GLOC IN2 ADCIFE TRIGGER CATB SENSE1 30 C3 30 C3 PA06 6 VDDANA DACC VOUT USART0 RTS EIC EXTINT1 GLOC IN0 ACIFC ACAN0 CATB SENSE2 31 D3 31 D3 PA07 7 VDDANA ADCIFE AD2 USART0 TXD EIC EXTINT4 GLOC IN3 ACIFC ACAP0 CATB SENSE3 44 G2 44 G2 PA08 8 LCDA USART0 RTS TC0 A0 PEVC PAD EVT0 GLOC OUT0 47 F5 47 F5 PA09 9 LCDA USART0 CTS TC0 B0 48 H2 48 H2 PA10 10 LCDA USART0 CLK 49 H3 49 H3 PA11 11 LCDA 50 J2 50 J2 PA12 12 63 H5 63 H5 PA13 64 K7 64 K7 65 G5 65 G5 QFN VFBGA QFN VFBGA GPIO Functions A B SCIF GCLK0 SPI NPCS0 C D E F G CATB DIS SPI MISO CATB SENSE0 LCDCA SEG23 CATB SENSE4 PEVC PARC PAD EVT1 PCDATA0 LCDCA COM3 CATB SENSE5 TC0 A1 PEVC PARC PAD EVT2 PCDATA1 LCDCA COM2 CATB SENSE6 USART0 RXD TC0 B1 PEVC PARC PAD EVT3 PCDATA2 LCDCA COM1 CATB SENSE7 LCDA USART0 TXD TC0 A2 PARC PCDATA3 LCDCA COM0 CATB DIS 13 LCDA USART1 RTS TC0 B2 SPI NPCS1 PARC PCDATA4 LCDCA SEG5 CATB SENSE8 PA14 14 LCDA USART1 CLK TC0 CLK0 SPI NPCS2 PARC PCDATA5 LCDCA SEG6 CATB SENSE9 PA15 15 LCDA USART1 RXD TC0 CLK1 SPI NPCS3 PARC PCDATA6 LCDCA SEG7 CATB SENSE10 19 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply Pin ATSAM4LC QFN GPIO 100-pin GPIO Controller Function Multiplexing (Sheet 2 of 4) ATSAM4LS Table 3-1. VFBGA QFN VFBGA GPIO Functions A B C D E F G 66 J7 66 J7 PA16 16 LCDA USART1 TXD TC0 CLK2 EIC EXTINT1 PARC PCDATA7 LCDCA SEG8 CATB SENSE11 67 H6 67 H6 PA17 17 LCDA USART2 RTS ABDACB DAC0 EIC EXTINT2 PARC PCCK LCDCA SEG9 CATB SENSE12 76 K10 76 K10 PA18 18 LCDA USART2 CLK ABDACB DACN0 EIC EXTINT3 PARC PCEN1 LCDCA SEG18 CATB SENSE13 77 J10 77 J10 PA19 19 LCDA USART2 RXD ABDACB DAC1 EIC EXTINT4 PARC PCEN2 SCIF GCLK0 LCDCA SEG19 CATB SENSE14 78 H10 78 H10 PA20 20 LCDA USART2 TXD ABDACB DACN1 EIC EXTINT5 GLOC IN0 SCIF GCLK1 LCDCA SEG20 CATB SENSE15 91 E9 91 E9 PA21 21 LCDC SPI MISO USART1 CTS EIC EXTINT6 GLOC IN1 TWIM2 TWD LCDCA SEG34 CATB SENSE16 92 E10 92 E10 PA22 22 LCDC SPI MOSI USART2 CTS EIC EXTINT7 GLOC IN2 TWIM2 TWCK LCDCA SEG35 CATB SENSE17 95 D6 95 D6 PA23 23 LCDC SPI SCK TWIMS0 TWD EIC EXTINT8 GLOC IN3 SCIF GCLK IN0 LCDCA SEG38 CATB DIS 96 D10 96 D10 PA24 24 LCDC SPI NPCS0 TWIMS0 TWCK GLOC OUT0 SCIF GCLK IN1 LCDCA SEG39 CATB SENSE18 98 D9 98 D9 PA25 25 VDDIO USBC DM USART2 RXD CATB SENSE19 99 C9 99 C9 PA26 26 VDDIO USBC DP USART2 TXD CATB SENSE20 51 K1 PA27 27 LCDA SPI MISO IISC ISCK ABDACB DAC0 GLOC IN4 USART3 RTS CATB SENSE0 52 J1 PA28 28 LCDA SPI MOSI IISC ISDI ABDACB DACN0 GLOC IN5 USART3 CTS CATB SENSE1 53 K2 PA29 29 LCDA SPI SCK IISC IWS ABDACB DAC1 GLOC IN6 USART3 CLK CATB SENSE2 56 K4 PA30 30 LCDA SPI NPCS0 IISC ISDO ABDACB DACN1 GLOC IN7 USART3 RXD CATB SENSE3 57 K5 PA31 31 LCDA SPI NPCS1 IISC IMCK ABDACB CLK GLOC OUT1 USART3 TXD CATB DIS 20 J3 20 J3 PB00 32 VDDIN TWIMS1 TWD USART0 RXD CATB SENSE21 21 D5 21 D5 PB01 33 VDDIN TWIMS1 TWCK USART0 TXD EIC EXTINT0 22 E5 22 E5 PB02 34 VDDANA ADCIFE AD3 USART1 RTS ABDACB DAC0 IISC ISCK ACIFC ACBN0 CATB SENSE23 23 C4 23 C4 PB03 35 VDDANA ADCIFE AD4 USART1 CLK ABDACB DACN0 IISC ISDI ACIFC ACBP0 CATB DIS 28 C1 28 C1 PB04 36 VDDANA ADCIFE AD5 USART1 RXD ABDACB DAC1 IISC ISDO DACC EXT TRIG0 CATB SENSE24 29 B1 29 B1 PB05 37 VDDANA ADCIFE AD6 USART1 TXD ABDACB DACN1 IISC IMCK 45 G3 45 G3 PB06 38 LCDA USART3 RTS GLOC IN4 IISC IWS LCDCA SEG22 CATB SENSE26 46 H1 46 H1 PB07 39 LCDA USART3 CTS GLOC IN5 TC0 A0 LCDCA SEG21 CATB SENSE27 CATB SENSE22 CATB SENSE25 20 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply Pin ATSAM4LC QFN GPIO 100-pin GPIO Controller Function Multiplexing (Sheet 3 of 4) ATSAM4LS Table 3-1. GPIO Functions A VFBGA QFN VFBGA B C D GLOC IN6 E F G TC0 B0 LCDCA SEG14 CATB SENSE28 LCDCA SEG15 CATB SENSE29 72 G6 72 G6 PB08 40 LCDA USART3 CLK 73 G7 73 G7 PB09 41 LCDA USART3 RXD PEVC PAD EVT2 GLOC IN7 TC0 A1 74 G8 74 G8 PB10 42 LCDA USART3 TXD PEVC PAD EVT3 GLOC OUT1 TC0 B1 SCIF GCLK0 LCDCA SEG16 CATB SENSE30 75 K9 75 K9 PB11 43 LCDA USART0 CTS SPI NPCS2 TC0 A2 SCIF GCLK1 LCDCA SEG17 CATB SENSE31 89 E7 89 E7 PB12 44 LCDC USART0 RTS SPI NPCS3 PEVC PAD EVT0 TC0 B2 SCIF GCLK2 LCDCA SEG32 CATB DIS 90 E8 90 E8 PB13 45 LCDC USART0 CLK SPI NPCS1 PEVC PAD EVT1 TC0 CLK0 SCIF GCLK3 LCDCA SEG33 CATB SENSE0 93 D7 93 D7 PB14 46 LCDC USART0 RXD SPI MISO TWIM3 TWD TC0 CLK1 SCIF GCLK IN0 LCDCA SEG36 CATB SENSE1 94 D8 94 D8 PB15 47 LCDC USART0 TXD SPI MOSI TWIM3 TWCK TC0 CLK2 SCIF GCLK IN1 LCDCA SEG37 CATB SENSE2 1 A10 1 A10 PC00 64 VDDIO SPI NPCS2 USART0 CLK TC1 A0 CATB SENSE3 2 C8 2 C8 PC01 65 VDDIO SPI NPCS3 USART0 RTS TC1 B0 CATB SENSE4 3 C7 3 C7 PC02 66 VDDIO SPI NPCS1 USART0 CTS USART0 RXD TC1 A1 CATB SENSE5 4 B7 4 B7 PC03 67 VDDIO SPI NPCS0 EIC EXTINT5 USART0 TXD TC1 B1 CATB SENSE6 9 C5 9 C5 PC04 68 VDDIO SPI MISO EIC EXTINT6 TC1 A2 CATB SENSE7 10 C6 10 C6 PC05 69 VDDIO SPI MOSI EIC EXTINT7 TC1 B2 CATB DIS 11 B6 11 B6 PC06 70 VDDIO SPI SCK EIC EXTINT8 TC1 CLK0 CATB SENSE8 36 F2 36 F2 PC07 71 VDDANA ADCIFE AD7 USART2 RTS PEVC PAD EVT0 TC1 CLK1 CATB SENSE9 37 E3 37 E3 PC08 72 VDDANA ADCIFE AD8 USART2 CLK PEVC PAD EVT1 TC1 CLK2 USART2 CTS CATB SENSE10 38 F1 38 F1 PC09 73 VDDANA ADCIFE AD9 USART3 RXD ABDACB DAC0 IISC ISCK ACIFC ACAN1 CATB SENSE11 39 D4 39 D4 PC10 74 VDDANA ADCIFE AD10 USART3 TXD ABDACB DACN0 IISC ISDI ACIFC ACAP1 CATB SENSE12 40 E4 40 E4 PC11 75 VDDANA ADCIFE AD11 USART2 RXD PEVC PAD EVT2 41 F3 41 F3 PC12 76 VDDANA ADCIFE AD12 USART2 TXD ABDACB CLK IISC IWS 42 F4 42 F4 PC13 77 VDDANA ADCIFE AD13 USART3 RTS ABDACB DAC1 IISC ISDO ACIFC ACBN1 CATB SENSE15 43 G1 43 G1 PC14 78 VDDANA ADCIFE AD14 USART3 CLK ABDACB DACN1 IISC IMCK ACIFC ACBP1 CATB DIS 58 J5 58 J5 PC15 79 LCDA TC1 A0 CATB SENSE13 GLOC IN4 CATB SENSE14 LCDCA SEG0 CATB SENSE16 21 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 GPIO Pin ATSAM4LC QFN Supply 100-pin GPIO Controller Function Multiplexing (Sheet 4 of 4) ATSAM4LS Table 3-1. GPIO Functions A VFBGA QFN VFBGA B C D E F G 59 J6 59 J6 PC16 80 LCDA TC1 B0 GLOC IN5 LCDCA SEG1 CATB SENSE17 60 H4 60 H4 PC17 81 LCDA TC1 A1 GLOC IN6 LCDCA SEG2 CATB SENSE18 61 K6 61 K6 PC18 82 LCDA TC1 B1 GLOC IN7 LCDCA SEG3 CATB SENSE19 62 G4 62 G4 PC19 83 LCDA TC1 A2 GLOC OUT1 LCDCA SEG4 CATB SENSE20 68 H7 68 H7 PC20 84 LCDA TC1 B2 LCDCA SEG10 CATB SENSE21 69 K8 69 K8 PC21 85 LCDA TC1 CLK0 PARC PCCK LCDCA SEG11 CATB SENSE22 70 J8 70 J8 PC22 86 LCDA TC1 CLK1 PARC PCEN1 LCDCA SEG12 CATB SENSE23 71 H8 71 H8 PC23 87 LCDA TC1 CLK2 PARC PCEN2 LCDCA SEG13 CATB DIS 79 J9 79 J9 PC24 88 LCDB USART1 RTS EIC EXTINT1 PEVC PARC PAD EVT0 PCDATA0 LCDCA SEG24 CATB SENSE24 80 H9 80 H9 PC25 89 LCDB USART1 CLK EIC EXTINT2 PEVC PARC PAD EVT1 PCDATA1 LCDCA SEG25 CATB SENSE25 81 G9 81 G9 PC26 90 LCDB USART1 RXD EIC EXTINT3 PEVC PARC PAD EVT2 PCDATA2 SCIF GCLK0 LCDCA SEG26 CATB SENSE26 82 F6 82 F6 PC27 91 LCDB USART1 TXD EIC EXTINT4 PEVC PARC PAD EVT3 PCDATA3 SCIF GCLK1 LCDCA SEG27 CATB SENSE27 83 G10 83 G10 PC28 92 LCDB USART3 RXD SPI MISO GLOC IN4 PARC PCDATA4 SCIF GCLK2 LCDCA SEG28 CATB SENSE28 84 F7 84 F7 PC29 93 LCDB USART3 TXD SPI MOSI GLOC IN5 PARC PCDATA5 SCIF GCLK3 LCDCA SEG29 CATB SENSE29 85 F8 85 F8 PC30 94 LCDB USART3 RTS SPI SCK GLOC IN6 PARC PCDATA6 SCIF GCLK IN0 LCDCA SEG30 CATB SENSE30 86 F9 86 F9 PC31 95 LCDB USART3 CLK SPI NPCS0 GLOC OUT1 PARC PCDATA7 SCIF GCLK IN1 LCDCA SEG31 CATB SENSE31 E F GPIO QFP QFP Supply 64-pin GPIO Controller Function Multiplexing (Sheet 1 of 3) Pin ATSAM4LS ATSAM4LC Table 3-2. QFN QFN 1 1 PA00 0 VDDIO 2 2 PA01 1 VDDIO 3 3 PA02 2 VDDIN 10 10 PA03 3 VDDIN GPIO Functions A B SCIF GCLK0 SPI NPCS0 C D G CATB DIS SPI MISO 22 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply GPIO 64-pin GPIO Controller Function Multiplexing (Sheet 2 of 3) Pin ATSAM4LS ATSAM4LC Table 3-2. GPIO Functions QFP QFP QFN QFN A B C D 15 15 PA04 4 VDDANA ADCIFE AD0 USART0 CLK EIC EXTINT2 GLOC IN1 16 16 PA05 5 VDDANA ADCIFE AD1 USART0 RXD EIC EXTINT3 GLOC IN2 ADCIFE TRIGGER CATB SENSE1 21 21 PA06 6 VDDANA DACC VOUT USART0 RTS EIC EXTINT1 GLOC IN0 ACIFC ACAN0 CATB SENSE2 22 22 PA07 7 VDDANA ADCIFE AD2 USART0 TXD EIC EXTINT4 GLOC IN3 ACIFC ACAP0 CATB SENSE3 26 26 PA08 8 LCDA USART0 RTS TC0 A0 PEVC PAD EVT0 GLOC OUT0 29 29 PA09 9 LCDA USART0 CTS TC0 B0 30 30 PA10 10 LCDA USART0 CLK 31 31 PA11 11 LCDA 32 32 PA12 12 40 40 PA13 41 41 42 E F G CATB SENSE0 LCDCA SEG23 CATB SENSE4 PEVC PARC PAD EVT1 PCDATA0 LCDCA COM3 CATB SENSE5 TC0 A1 PEVC PARC PAD EVT2 PCDATA1 LCDCA COM2 CATB SENSE6 USART0 RXD TC0 B1 PEVC PARC PAD EVT3 PCDATA2 LCDCA COM1 CATB SENSE7 LCDA USART0 TXD TC0 A2 PARC PCDATA3 LCDCA COM0 CATB DIS 13 LCDA USART1 RTS TC0 B2 SPI NPCS1 PARC PCDATA4 LCDCA SEG5 CATB SENSE8 PA14 14 LCDA USART1 CLK TC0 CLK0 SPI NPCS2 PARC PCDATA5 LCDCA SEG6 CATB SENSE9 42 PA15 15 LCDA USART1 RXD TC0 CLK1 SPI NPCS3 PARC PCDATA6 LCDCA SEG7 CATB SENSE10 43 43 PA16 16 LCDA USART1 TXD TC0 CLK2 EIC EXTINT1 PARC PCDATA7 LCDCA SEG8 CATB SENSE11 44 44 PA17 17 LCDA USART2 RTS ABDACB DAC0 EIC EXTINT2 PARC PCCK LCDCA SEG9 CATB SENSE12 49 49 PA18 18 LCDA USART2 CLK ABDACB DACN0 EIC EXTINT3 PARC PCEN1 LCDCA SEG18 CATB SENSE13 50 50 PA19 19 LCDA USART2 RXD ABDACB DAC1 EIC EXTINT4 PARC PCEN2 SCIF GCLK0 LCDCA SEG19 CATB SENSE14 51 51 PA20 20 LCDA USART2 TXD ABDACB DACN1 EIC EXTINT5 GLOC IN0 SCIF GCLK1 LCDCA SEG20 CATB SENSE15 55 55 PA21 21 LCDC SPI MISO USART1 CTS EIC EXTINT6 GLOC IN1 TWIM2 TWD LCDCA SEG34 CATB SENSE16 56 56 PA22 22 LCDC SPI MOSI USART2 CTS EIC EXTINT7 GLOC IN2 TWIM2 TWCK LCDCA SEG35 CATB SENSE17 59 59 PA23 23 LCDC SPI SCK TWIMS0 TWD EIC EXTINT8 GLOC IN3 SCIF GCLK IN0 LCDCA SEG38 CATB DIS 60 60 PA24 24 LCDC SPI NPCS0 TWIMS0 TWCK GLOC OUT0 SCIF GCLK IN1 LCDCA SEG39 CATB SENSE18 62 62 PA25 25 VDDIO USBC DM USART2 RXD CATB SENSE19 63 63 PA26 26 VDDIO USBC DP USART2 TXD CATB SENSE20 23 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply GPIO 64-pin GPIO Controller Function Multiplexing (Sheet 3 of 3) Pin ATSAM4LS ATSAM4LC Table 3-2. GPIO Functions QFP QFP QFN QFN A B C D E 33 PA27 27 LCDA SPI MISO IISC ISCK ABDACB DAC0 GLOC IN4 USART3 RTS CATB SENSE0 34 PA28 28 LCDA SPI MOSI IISC ISDI ABDACB DACN0 GLOC IN5 USART3 CTS CATB SENSE1 35 PA29 29 LCDA SPI SCK IISC IWS ABDACB DAC1 GLOC IN6 USART3 CLK CATB SENSE2 38 PA30 30 LCDA SPI NPCS0 IISC ISDO ABDACB DACN1 GLOC IN7 USART3 RXD CATB SENSE3 39 PA31 31 LCDA SPI NPCS1 IISC IMCK ABDACB CLK GLOC OUT1 USART3 TXD CATB DIS 11 11 PB00 32 VDDIN TWIMS1 TWD USART0 RXD 12 12 PB01 33 VDDIN TWIMS1 TWCK USART0 TXD EIC EXTINT0 13 13 PB02 34 VDDANA ADCIFE AD3 USART1 RTS ABDACB DAC0 IISC ISCK ACIFC ACBN0 CATB SENSE23 14 14 PB03 35 VDDANA ADCIFE AD4 USART1 CLK ABDACB DACN0 IISC ISDI ACIFC ACBP0 CATB DIS 19 19 PB04 36 VDDANA ADCIFE AD5 USART1 RXD ABDACB DAC1 IISC ISDO DACC EXT TRIG0 CATB SENSE24 20 20 PB05 37 VDDANA ADCIFE AD6 USART1 TXD ABDACB DACN1 IISC IMCK 27 27 PB06 38 LCDA USART3 RTS GLOC IN4 IISC IWS LCDCA SEG22 CATB SENSE26 28 28 PB07 39 LCDA USART3 CTS GLOC IN5 TC0 A0 LCDCA SEG21 CATB SENSE27 45 45 PB08 40 LCDA USART3 CLK GLOC IN6 TC0 B0 LCDCA SEG14 CATB SENSE28 46 46 PB09 41 LCDA USART3 RXD PEVC PAD EVT2 GLOC IN7 TC0 A1 LCDCA SEG15 CATB SENSE29 47 47 PB10 42 LCDA USART3 TXD PEVC PAD EVT3 GLOC OUT1 TC0 B1 SCIF GCLK0 LCDCA SEG16 CATB SENSE30 48 48 PB11 43 LCDA USART0 CTS SPI NPCS2 TC0 A2 SCIF GCLK1 LCDCA SEG17 CATB SENSE31 53 53 PB12 44 LCDC USART0 RTS SPI NPCS3 PEVC PAD EVT0 TC0 B2 SCIF GCLK2 LCDCA SEG32 CATB DIS 54 54 PB13 45 LCDC USART0 CLK SPI NPCS1 PEVC PAD EVT1 TC0 CLK0 SCIF GCLK3 LCDCA SEG33 CATB SENSE0 57 57 PB14 46 LCDC USART0 RXD SPI MISO TWIM3 TWD TC0 CLK1 SCIF GCLK IN0 LCDCA SEG36 CATB SENSE1 58 58 PB15 47 LCDC USART0 TXD SPI MOSI TWIM3 TWCK TC0 CLK2 SCIF GCLK IN1 LCDCA SEG37 CATB SENSE2 F G CATB SENSE21 CATB SENSE22 CATB SENSE25 24 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 64-pin GPIO Controller Function Multiplexing for WLCSP package (Sheet 1 of 3) Pin GPIO Supply ATSAM4LS ATSAM4LC Table 3-3. G4 G4 PA00 0 VDDIO G5 G5 PA01 1 VDDIO F3 F3 PA02 2 VDDIN E2 E2 PA03 3 VDDIN D3 D3 PA04 4 VDDANA ADCIFE AD0 USART0 CLK EIC EXTINT2 GLOC IN1 C3 C3 PA05 5 VDDANA ADCIFE AD1 USART0 RXD EIC EXTINT3 GLOC IN2 ADCIFE TRIGGER CATB SENSE1 C4 C4 PA06 6 VDDANA DACC VOUT USART0 RTS EIC EXTINT1 GLOC IN0 ACIFC ACAN0 CATB SENSE2 C5 C5 PA07 7 VDDANA ADCIFE AD2 USART0 TXD EIC EXTINT4 GLOC IN3 ACIFC ACAP0 CATB SENSE3 B4 B4 PA08 8 LCDA USART0 RTS TC0 A0 PEVC PAD EVT0 GLOC OUT0 A5 A5 PA09 9 LCDA USART0 CTS TC0 B0 B6 B6 PA10 10 LCDA USART0 CLK B7 B7 PA11 11 LCDA A8 A8 PA12 12 C7 C7 PA13 D7 D7 E7 WLCSP WLCSP GPIO Functions A B SCIF GCLK0 SPI NPCS0 C D E F G CATB DIS SPI MISO CATB SENSE0 LCDCA SEG23 CATB SENSE4 PEVC PARC PAD EVT1 PCDATA0 LCDCA COM3 CATB SENSE5 TC0 A1 PEVC PARC PAD EVT2 PCDATA1 LCDCA COM2 CATB SENSE6 USART0 RXD TC0 B1 PEVC PARC PAD EVT3 PCDATA2 LCDCA COM1 CATB SENSE7 LCDA USART0 TXD TC0 A2 PARC PCDATA3 LCDCA COM0 CATB DIS 13 LCDA USART1 RTS TC0 B2 SPI NPCS1 PARC PCDATA4 LCDCA SEG5 CATB SENSE8 PA14 14 LCDA USART1 CLK TC0 CLK0 SPI NPCS2 PARC PCDATA5 LCDCA SEG6 CATB SENSE9 E7 PA15 15 LCDA USART1 RXD TC0 CLK1 SPI NPCS3 PARC PCDATA6 LCDCA SEG7 CATB SENSE10 F7 F7 PA16 16 LCDA USART1 TXD TC0 CLK2 EIC EXTINT1 PARC PCDATA7 LCDCA SEG8 CATB SENSE11 G8 G8 PA17 17 LCDA USART2 RTS ABDACB DAC0 EIC EXTINT2 PARC PCCK LCDCA SEG9 CATB SENSE12 G7 G7 PA18 18 LCDA USART2 CLK ABDACB DACN0 EIC EXTINT3 PARC PCEN1 LCDCA SEG18 CATB SENSE13 G6 G6 PA19 19 LCDA USART2 RXD ABDACB DAC1 EIC EXTINT4 PARC PCEN2 SCIF GCLK0 LCDCA SEG19 CATB SENSE14 H7 H7 PA20 20 LCDA USART2 TXD ABDACB DACN1 EIC EXTINT5 GLOC IN0 SCIF GCLK1 LCDCA SEG20 CATB SENSE15 H5 H5 PA21 21 LCDC SPI MISO USART1 CTS EIC EXTINT6 GLOC IN1 TWIM2 TWD LCDCA SEG34 CATB SENSE16 F5 F5 PA22 22 LCDC SPI MOSI USART2 CTS EIC EXTINT7 GLOC IN2 TWIM2 TWCK LCDCA SEG35 CATB SENSE17 25 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply Pin GPIO 64-pin GPIO Controller Function Multiplexing for WLCSP package (Sheet 2 of 3) ATSAM4LS ATSAM4LC Table 3-3. WLCSP WLCSP GPIO Functions A B C D E F G TWIMS0 TWD EIC EXTINT8 GLOC IN3 SCIF GCLK IN0 LCDCA SEG38 CATB DIS GLOC OUT0 SCIF GCLK IN1 LCDCA SEG39 CATB SENSE18 H3 H3 PA23 23 LCDC SPI SCK G3 G3 PA24 24 LCDC SPI NPCS0 TWIMS0 TWCK H2 H2 PA25 25 VDDIO USBC DM USART2 RXD CATB SENSE19 G2 G2 PA26 26 VDDIO USBC DP USART2 TXD CATB SENSE20 A7 PA27 27 LCDA SPI MISO IISC ISCK ABDACB DAC0 GLOC IN4 USART3 RTS CATB SENSE0 A6 PA28 28 LCDA SPI MOSI IISC ISDI ABDACB DACN0 GLOC IN5 USART3 CTS CATB SENSE1 B8 PA29 29 LCDA SPI SCK IISC IWS ABDACB DAC1 GLOC IN6 USART3 CLK CATB SENSE2 E8 PA30 30 LCDA SPI NPCS0 IISC ISDO ABDACB DACN1 GLOC IN7 USART3 RXD CATB SENSE3 F8 PA31 31 LCDA SPI NPCS1 IISC IMCK ABDACB CLK GLOC OUT1 USART3 TXD CATB DIS D2 D2 PB00 32 VDDIN TWIMS1 TWD USART0 RXD C2 C2 PB01 33 VDDIN TWIMS1 TWCK USART0 TXD EIC EXTINT0 E3 E3 PB02 34 VDDANA ADCIFE AD3 USART1 RTS ABDACB DAC0 IISC ISCK ACIFC ACBN0 CATB SENSE23 B1 B1 PB03 35 VDDANA ADCIFE AD4 USART1 CLK ABDACB DACN0 IISC ISDI ACIFC ACBP0 CATB DIS A1 A1 PB04 36 VDDANA ADCIFE AD5 USART1 RXD ABDACB DAC1 IISC ISDO DACC EXT TRIG0 CATB SENSE24 D4 D4 PB05 37 VDDANA ADCIFE AD6 USART1 TXD ABDACB DACN1 IISC IMCK B5 B5 PB06 38 LCDA USART3 RTS GLOC IN4 IISC IWS LCDCA SEG22 CATB SENSE26 C6 C6 PB07 39 LCDA USART3 CTS GLOC IN5 TC0 A0 LCDCA SEG21 CATB SENSE27 D6 D6 PB08 40 LCDA USART3 CLK GLOC IN6 TC0 B0 LCDCA SEG14 CATB SENSE28 E6 E6 PB09 41 LCDA USART3 RXD PEVC PAD EVT2 GLOC IN7 TC0 A1 LCDCA SEG15 CATB SENSE29 F6 F6 PB10 42 LCDA USART3 TXD PEVC PAD EVT3 GLOC OUT1 TC0 B1 SCIF GCLK0 LCDCA SEG16 CATB SENSE30 H8 H8 PB11 43 LCDA USART0 CTS SPI NPCS2 TC0 A2 SCIF GCLK1 LCDCA SEG17 CATB SENSE31 D5 D5 PB12 44 LCDC USART0 RTS SPI NPCS3 TC0 B2 SCIF GCLK2 LCDCA SEG32 CATB DIS CATB SENSE21 PEVC PAD EVT0 CATB SENSE22 CATB SENSE25 26 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Supply Pin GPIO 64-pin GPIO Controller Function Multiplexing for WLCSP package (Sheet 3 of 3) ATSAM4LS ATSAM4LC Table 3-3. WLCSP WLCSP GPIO Functions A B C D E F G SPI NPCS1 PEVC PAD EVT1 TC0 CLK0 SCIF GCLK3 LCDCA SEG33 CATB SENSE0 E5 E5 PB13 45 LCDC USART0 CLK F4 F4 PB14 46 LCDC USART0 RXD SPI MISO TWIM3 TWD TC0 CLK1 SCIF GCLK IN0 LCDCA SEG36 CATB SENSE1 H4 H4 PB15 47 LCDC USART0 TXD SPI MOSI TWIM3 TWCK TC0 CLK2 SCIF GCLK IN1 LCDCA SEG37 CATB SENSE2 27 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 3-4. ATSAM4LC ATSAM4LS Pin GPIO Supply 48-pin GPIO Controller Function Multiplexing (Sheet 1 of 2) 1 1 PA00 0 VDDIO 2 2 PA01 1 VDDIO 3 3 PA02 2 VDDIN 10 10 PA03 3 VDDIN 11 11 PA04 4 VDDANA ADCIFE AD0 USART0 CLK EIC EXTINT2 GLOC IN1 12 12 PA05 5 VDDANA ADCIFE AD1 USART0 RXD EIC EXTINT3 GLOC IN2 ADCIFE TRIGGER CATB SENSE1 15 15 PA06 6 VDDANA DACC VOUT USART0 RTS EIC EXTINT1 GLOC IN0 ACIFC ACAN0 CATB SENSE2 16 16 PA07 7 VDDANA ADCIFE AD2 USART0 TXD EIC EXTINT4 GLOC IN3 ACIFC ACAP0 CATB SENSE3 20 20 PA08 8 LCDA USART0 RTS TC0 A0 PEVC PAD EVT0 GLOC OUT0 21 21 PA09 9 LCDA USART0 CTS TC0 B0 22 22 PA10 10 LCDA USART0 CLK 23 23 PA11 11 LCDA 24 24 PA12 12 32 32 PA13 33 33 34 GPIO Functions A B SCIF GCLK0 SPI NPCS0 C D E F G CATB DIS SPI MISO CATB SENSE0 LCDCA SEG23 CATB SENSE4 PEVC PARC PAD EVT1 PCDATA0 LCDCA COM3 CATB SENSE5 TC0 A1 PEVC PARC PAD EVT2 PCDATA1 LCDCA COM2 CATB SENSE6 USART0 RXD TC0 B1 PEVC PARC PAD EVT3 PCDATA2 LCDCA COM1 CATB SENSE7 LCDA USART0 TXD TC0 A2 PARC PCDATA3 LCDCA COM0 CATB DIS 13 LCDA USART1 RTS TC0 B2 SPI NPCS1 PARC PCDATA4 LCDCA SEG5 CATB SENSE8 PA14 14 LCDA USART1 CLK TC0 CLK0 SPI NPCS2 PARC PCDATA5 LCDCA SEG6 CATB SENSE9 34 PA15 15 LCDA USART1 RXD TC0 CLK1 SPI NPCS3 PARC PCDATA6 LCDCA SEG7 CATB SENSE10 35 35 PA16 16 LCDA USART1 TXD TC0 CLK2 EIC EXTINT1 PARC PCDATA7 LCDCA SEG8 CATB SENSE11 36 36 PA17 17 LCDA USART2 RTS ABDACB DAC0 EIC EXTINT2 PARC PCCK LCDCA SEG9 CATB SENSE12 37 37 PA18 18 LCDA USART2 CLK ABDACB DACN0 EIC EXTINT3 PARC PCEN1 LCDCA SEG18 CATB SENSE13 38 38 PA19 19 LCDA USART2 RXD ABDACB DAC1 EIC EXTINT4 PARC PCEN2 SCIF GCLK0 LCDCA SEG19 CATB SENSE14 39 39 PA20 20 LCDA USART2 TXD ABDACB DACN1 EIC EXTINT5 GLOC IN0 SCIF GCLK1 LCDCA SEG20 CATB SENSE15 41 41 PA21 21 LCDC SPI MISO USART1 CTS EIC EXTINT6 GLOC IN1 TWIM2 TWD LCDCA SEG34 CATB SENSE16 42 42 PA22 22 LCDC SPI MOSI USART2 CTS EIC EXTINT7 GLOC IN2 TWIM2 TWCK LCDCA SEG35 CATB SENSE17 43 43 PA23 23 LCDC SPI SCK TWIMS0 TWD EIC EXTINT8 GLOC IN3 SCIF GCLK IN0 LCDCA SEG38 CATB DIS 28 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 3-4. ATSAM4LC ATSAM4LS Pin GPIO Supply 48-pin GPIO Controller Function Multiplexing (Sheet 2 of 2) 44 44 PA24 24 LCDC SPI NPCS0 TWIMS0 TWCK 46 46 PA25 25 VDDIO USBC DM USART2 RXD CATB SENSE19 47 47 PA26 26 VDDIO USBC DP USART2 TXD CATB SENSE20 25 PA27 27 LCDA SPI MISO IISC ISCK ABDACB DAC0 GLOC IN4 USART3 RTS CATB SENSE0 26 PA28 28 LCDA SPI MOSI IISC ISDI ABDACB DACN0 GLOC IN5 USART3 CTS CATB SENSE1 27 PA29 29 LCDA SPI SCK IISC IWS ABDACB DAC1 GLOC IN6 USART3 CLK CATB SENSE2 30 PA30 30 LCDA SPI NPCS0 IISC ISDO ABDACB DACN1 GLOC IN7 USART3 RXD CATB SENSE3 31 PA31 31 LCDA SPI NPCS1 IISC IMCK ABDACB CLK GLOC OUT1 USART3 TXD CATB DIS 3.2.2 GPIO Functions A B C D E F G GLOC OUT0 SCIF GCLK IN1 LCDCA SEG39 CATB SENSE18 Peripheral Functions Each GPIO line can be assigned to one of several peripheral functions. The following table describes how the various peripheral functions are selected. The last listed function has priority in case multiple functions are enabled on the same pin. Table 3-5. 3.2.3 Peripheral Functions Function Description GPIO Controller Function multiplexing GPIO and GPIO peripheral selection A to H JTAG port connections JTAG debug port Oscillators OSC0 JTAG Port Connections If the JTAG is enabled, the JTAG will take control over a number of pins, irrespectively of the I/O Controller configuration. Table 3-6. JTAG Pinout 48-pin Packages 64-pin QFP/QFN 64-pin WLSCP 100-pin QFN 100-ball VFBGA Pin Name JTAG Pin 10 10 E2 19 B3 PA03 TMS 43 59 H3 95 D6 PA23 TDO 44 60 G3 96 D10 PA24 TDI 9 9 F2 18 B4 TCK TCK 29 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3.2.4 ITM Trace Connections If the ITM trace is enabled, the ITM will take control over the pin PA23, irrespectively of the I/O Controller configuration. The Serial Wire Trace signal is available on pin PA23 3.2.5 Oscillator Pinout The oscillators are not mapped to the normal GPIO functions and their muxings are controlled by registers in the System Control Interface (SCIF) or Backup System Control Interface (BSCIF). Refer to the Section 15. "System Control Interface (SCIF)" on page 308 and Section 15. "Backup System Control Interface (BSCIF)" on page 308 for more information about this. 64-pin QFN/QFP 64-pin WLCSP 100-pin Packages 100-ball VFBGA Oscillator Pinout 48-pin Packages Table 3-7. 1 1 G4 5 B9 PA00 XIN0 13 17 B2 26 B2 XIN32 XIN32 2 2 G5 6 B8 PA01 XOUT0 14 18 B3 27 C2 XOUT32 XOUT32 Pin Name Oscillator Pin 30 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3.3 Signals Description The following table gives details on signal names classified by peripheral. Table 3-8. Signal Descriptions List (Sheet 1 of 4) Signal Name Function Type Active Level Comments Audio Bitstream DAC - ABDACB CLK D/A clock output Output DAC1 - DAC0 D/A bitstream outputs Output DACN1 - DACN0 D/A inverted bitstream outputs Output Analog Comparator Interface - ACIFC ACAN1 - ACAN0 Analog Comparator A negative references Analog ACAP1 - ACAP0 Analog Comparator A positive references Analog ACBN1 - ACBN0 Analog Comparator B negative references Analog ACBP1 - ACBP0 Analog Comparator B positive references Analog ADC controller interface - ADCIFE AD14 - AD0 Analog inputs Analog ADVREFP Positive voltage reference Analog TRIGGER External trigger Input Backup System Control Interface - BSCIF XIN32 32 kHz Crystal Oscillator Input Analog/ Digital XOUT32 32 kHz Crystal Oscillator Output Analog Capacitive Touch Module B - CATB DIS Capacitive discharge line SENSE31 - SENSE0 Capacitive sense lines Output I/O DAC Controller - DACC DAC external trigger DAC external trigger Input DAC voltage output DAC voltage output Analog Enhanced Debug Port For ARM Products - EDP TCK/SWCLK JTAG / SW Debug Clock Input TDI JTAG Debug Data In Input TDO/TRACESWO JTAG Debug Data Out / SW Trace Out TMS/SWDIO JTAG Debug Mode Select / SW Data Output I/O External Interrupt Controller - EIC EXTINT8 - EXTINT0 External interrupts Input Glue Logic Controller - GLOC IN7 - IN0 Lookup Tables Inputs OUT1 - OUT0 Lookup Tables Outputs Input Output 31 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 3-8. Signal Descriptions List (Sheet 2 of 4) Signal Name Function Type Active Level Comments Inter-IC Sound (I2S) Controller - IISC IMCK I2S Master Clock Output ISCK I2S Serial Clock I/O ISDI I2S Serial Data In ISDO I2S Serial Data Out IWS I2S Word Select Input Output I/O LCD Controller - LCDCA BIASL Bias voltage (1/3 VLCD) Analog BIASH Bias voltage (2/3 VLCD) Analog CAPH High voltage end of flying capacitor Analog CAPL Low voltage end of flying capacitor Analog COM3 - COM0 Common terminals Analog SEG39 - SEG0 Segment terminals Analog VLCD Bias voltage Analog Parallel Capture - PARC PCCK Clock Input PCDATA7 - PCDATA0 Data lines Input PCEN1 Data enable 1 Input PCEN2 Data enable 2 Input Peripheral Event Controller - PEVC PAD_EVT3 PAD_EVT0 Event Inputs Input Power Manager - PM RESET_N Reset Input Low System Control Interface - SCIF GCLK3 - GCLK0 Generic Clock Outputs Output GCLK_IN1 - GCLK_IN0 Generic Clock Inputs XIN0 Crystal 0 Input Analog/ Digital XOUT0 Crystal 0 Output Analog Input Serial Peripheral Interface - SPI MISO Master In Slave Out I/O MOSI Master Out Slave In I/O NPCS3 - NPCS0 SPI Peripheral Chip Selects I/O SCK Clock I/O Low Timer/Counter - TC0, TC1 32 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 3-8. Signal Descriptions List (Sheet 3 of 4) Signal Name Function Type A0 Channel 0 Line A I/O A1 Channel 1 Line A I/O A2 Channel 2 Line A I/O B0 Channel 0 Line B I/O B1 Channel 1 Line B I/O B2 Channel 2 Line B I/O CLK0 Channel 0 External Clock Input Input CLK1 Channel 1 External Clock Input Input CLK2 Channel 2 External Clock Input Input Active Level Comments Two-wire Interface - TWIMS0, TWIMS1, TWIM2, TWIM3 TWCK Two-wire Serial Clock I/O TWD Two-wire Serial Data I/O Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3 CLK Clock I/O CTS Clear To Send RTS Request To Send RXD Receive Data Input TXD Transmit Data Output Input Low Output Low USB 2.0 Interface - USBC DM USB Full Speed Interface Data - I/O DP USB Full Speed Interface Data + I/O Power GND Ground Ground GNDANA Analog Ground Ground VDDANA Analog Power Supply Power Input 1.68V to 3.6V VDDCORE Core Power Supply Power Input 1.68V to 1.98V VDDIN Voltage Regulator Input Power Input 1.68V to 3.6V VDDIO I/O Pads Power Supply Power Input 1.68V to 3.6V. VDDIO must always be equal to or lower than VDDIN. VDDOUT Voltage Regulator Output Power Output 1.08V to 1.98V General Purpose I/O 33 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 3-8. Signal Descriptions List (Sheet 4 of 4) Signal Name Function PA31 - PA00 Parallel I/O Controller I/O Port A I/O PB15 - PB00 Parallel I/O Controller I/O Port B I/O PC31 - PC00 Parallel I/O Controller I/O Port C I/O Note: 1. See "Power and Startup Considerations" section. 3.4 I/O Line Considerations 3.4.1 Type Active Level Comments SW/JTAG Pins The JTAG pins switch to the JTAG functions if a rising edge is detected on TCK low after the RESET_N pin has been released. The TMS, and TDI pins have pull-up resistors when used as JTAG pins. The TCK pin always has pull-up enabled during reset. The JTAG pins can be used as GPIO pins and multiplexed with peripherals when the JTAG is disabled. Refer to Section 3.2.3 "JTAG Port Connections" on page 29 for the JTAG port connections. For more details, refer to Section 1.1 "Enhanced Debug Port (EDP)" on page 3. 3.4.2 RESET_N Pin The RESET_N pin is a schmitt input and integrates a permanent pull-up resistor to VDDIN. As the product integrates a power-on reset detector, the RESET_N pin can be left unconnected in case no reset from the system needs to be applied to the product. 3.4.3 TWI Pins When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation andinputs with inputs with spike-filtering. When used as GPIO-pins or used for other peripherals, the pins have the same characteristics as GPIO pins. 3.4.4 GPIO Pins All the I/O lines integrate a pull-up/pull-down resistor and slew rate controller. Programming these features is performed independently for each I/O line through the GPIO Controllers. After reset, I/O lines default as inputs with pull-up and pull-down resistors disabled and slew rate enabled. 3.4.5 High-drive Pins The six pins PA02, PB00, PB01, PC04, PC05 and PC06 have high-drive output capabilities. Refer to Section 9.6.2 "High-drive I/O Pin : PA02, PC04, PC05, PC06" on page 115 for electrical characteristics. 3.4.6 USB Pins When these pins are used for USB, the pins are behaving according to the USB specification. When used as GPIO pins or used for other peripherals, the pins have the same behavior as other normal I/O pins, but the characteristics are different. Refer to Section 9.6.3 "USB I/O Pin : PA25, PA26" on page 116 for electrical characteristics. These pins are compliant to USB standard only when VDDIO power supply is 3.3 V nominal. 34 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3.4.7 ADC Input Pins These pins are regular I/O pins powered from the VDDANA. 35 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 4. Cortex-M4 processor and core peripherals 4.1 Cortex-M4 The Cortex-M4 processor is a high performance 32-bit processor designed for the microcontroller market. It offers significant benefits to developers, including: * * * * * outstanding processing performance combined with fast interrupt handling enhanced system debug with extensive breakpoint and trace capabilities efficient processor core, system and memories ultra-low power consumption with integrated sleep modes platform security robustness, with integrated memory protection unit (MPU). Cortex-M4 processor NVIC Debug Access Port Processor core Memory protection unit Flash patch Serial Wire viewer Data watchpoints Bus matrix Code interface SRAM and peripheral interface The Cortex-M4 processor is built on a high-performance processor core, with a 3-stage pipeline Harvard architecture, making it ideal for demanding embedded applications. The processor delivers exceptional power efficiency through an efficient instruction set and extensively optimized design, providing high-end processing hardware including a range of single-cycle and SIMD multiplication and multiply-with-accumulate capabilities, saturating arithmetic and dedicated hardware division. To facilitate the design of cost-sensitive devices, the Cortex-M4 processor implements tightlycoupled system components that reduce processor area while significantly improving interrupt handling and system debug capabilities. The Cortex-M4 processor implements a version of the Thumb(R) instruction set based on Thumb-2 technology, ensuring high code density and reduced program memory requirements. The Cortex-M4 instruction set provides the exceptional performance expected of a modern 32-bit architecture, with the high code density of 8-bit and 16-bit microcontrollers. The Cortex-M4 processor closely integrates a configurable Nested Vectored Interrupt Controller (NVIC), to deliver industry-leading interrupt performance. The NVIC includes a non-maskable interrupt (NMI), and provides up to 80 interrupt priority levels. The tight integration of the proces36 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 sor core and NVIC provides fast execution of interrupt service routines (ISRs), dramatically reducing the interrupt latency. This is achieved through the hardware stacking of registers, and the ability to suspend load-multiple and store-multiple operations. Interrupt handlers do not require wrapping in assembler code, removing any code overhead from the ISRs. A tail-chain optimization also significantly reduces the overhead when switching from one ISR to another. To optimize low-power designs, the NVIC integrates with the sleep modes, that include a deep sleep function enabling the entire device to be rapidly powered down while still retaining program state. 4.2 System level interface The Cortex-M4 processor provides multiple interfaces using AMBA(R) technology to provide high speed, low latency memory accesses. It supports unaligned data accesses and implements atomic bit manipulation that enables faster peripheral controls, system spinlocks and thread-safe Boolean data handling. The Cortex-M4 processor has an memory protection unit (MPU) that provides fine grain memory control, enabling applications to utilize multiple privilege levels, separating and protecting code, data and stack on a task-by-task basis. Such requirements are becoming critical in many embedded applications such as automotive. 4.3 Integrated configurable debug The Cortex-M4 processor implements a complete hardware debug solution. This provides high system visibility of the processor and memory through either a traditional JTAG port or a 2-pin Serial Wire Debug (SWD) port that is ideal for microcontrollers and other small package devices. For system trace the processor integrates an Instrumentation Trace Macrocell (ITM) alongside data watchpoints and a profiling unit. To enable simple and cost-effective profiling of the system events these generate, a Serial Wire Viewer (SWV) can export a stream of software-generated messages, data trace, and profiling information through a single pin. The Flash Patch and Breakpoint Unit (FPB) provides 8 hardware breakpoint comparators that debuggers can use. The comparators in the FPB also provide remap functions of up to 8 words in the program code in the CODE memory region. This enables applications stored on a nonerasable, ROM-based microcontroller to be patched if a small programmable memory, for example flash, is available in the device. During initialization, the application in ROM detects, from the programmable memory, whether a patch is required. If a patch is required, the application programs the FPB to remap a number of addresses. When those addresses are accessed, the accesses are redirected to a remap table specified in the FPB configuration, which means the program in the non-modifiable ROM can be patched. A specific Peripheral Debug (PDBG) register is implemented in the Private Peripheral Bus address map. This register allows the user to configure the behavior of some modules in debug mode. 37 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 4.4 Cortex-M4 processor features and benefits summary * * * * * * * * * * * 4.5 tight integration of system peripherals reduces area and development costs Thumb instruction set combines high code density with 32-bit performance code-patch ability for ROM system updates power control optimization of system components integrated sleep modes for low power consumption fast code execution permits slower processor clock or increases sleep mode time hardware division and fast digital-signal-processing orientated multiply accumulate saturating arithmetic for signal processing deterministic, high-performance interrupt handling for time-critical applications memory protection unit (MPU) for safety-critical applications extensive debug and trace capabilities: - Serial Wire Debug and Serial Wire Trace reduce the number of pins required for debugging, tracing, and code profiling. Cortex-M4 core peripherals These are: Nested Vectored Interrupt Controller The NVIC is an embedded interrupt controller that supports low latency interrupt processing. System control block The System control block (SCB) is the programmers model interface to the processor. It provides system implementation information and system control, including configuration, control, and reporting of system exceptions. System timer The system timer, SysTick, is a 24-bit count-down timer. Use this as a Real Time Operating System (RTOS) tick timer or as a simple counter. Memory protection unit The Memory protection unit (MPU) improves system reliability by defining the memory attributes for different memory regions. It provides up to eight different regions, and an optional predefined background region. The complete Cortex-M4 User Guide can be found on the ARM web site: http://infocenter.arm.com/help/topic/com.arm.doc.dui0553a/DUI0553A_cortex_m4_dgug.pdf 38 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 4.6 Cortex-M4 implementations options This table provides the specific configuration options implemented in the SAM4L series Option Inclusion of MPU yes Inclusion of FPU No Number of interrupts 80 Number of priority bits 4 Inclusion of the WIC No Embedded Trace Macrocell No Sleep mode instruction Only WFI supported Endianness Little Endian Bit-banding No SysTick timer Yes Register reset values No Table 4-1. 4.7 Implementation Cortex-M4 implementation options Cortex-M4 Interrupts map The table below shows how the interrupt request signals are connected to the NVIC. Table 4-2. Line Interrupt Request Signal Map (Sheet 1 of 3) Module Signal 0 Flash Controller HFLASHC 1 Peripheral DMA Controller PDCA 0 2 Peripheral DMA Controller PDCA 1 3 Peripheral DMA Controller PDCA 2 4 Peripheral DMA Controller PDCA 3 5 Peripheral DMA Controller PDCA 4 6 Peripheral DMA Controller PDCA 5 7 Peripheral DMA Controller PDCA 6 8 Peripheral DMA Controller PDCA 7 9 Peripheral DMA Controller PDCA 8 10 Peripheral DMA Controller PDCA 9 11 Peripheral DMA Controller PDCA 10 39 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 4-2. Line Interrupt Request Signal Map (Sheet 2 of 3) Module Signal 12 Peripheral DMA Controller PDCA 11 13 Peripheral DMA Controller PDCA 12 14 Peripheral DMA Controller PDCA 13 15 Peripheral DMA Controller PDCA 14 16 Peripheral DMA Controller PDCA 15 17 CRC Calculation Unit CRCCU 18 USB 2.0 Interface 19 Peripheral Event Controller PEVC TR 20 Peripheral Event Controller PEVC OV 21 Advanced Encryption Standard 22 Power Manager 23 System Control Interface 24 Frequency Meter FREQM 25 General-Purpose Input/Output Controller GPIO 0 26 General-Purpose Input/Output Controller GPIO 1 27 General-Purpose Input/Output Controller GPIO 2 28 General-Purpose Input/Output Controller GPIO 3 29 General-Purpose Input/Output Controller GPIO 4 30 General-Purpose Input/Output Controller GPIO 5 31 General-Purpose Input/Output Controller GPIO 6 32 General-Purpose Input/Output Controller GPIO 7 33 General-Purpose Input/Output Controller GPIO 8 34 General-Purpose Input/Output Controller GPIO 9 35 General-Purpose Input/Output Controller GPIO 10 36 General-Purpose Input/Output Controller GPIO 11 37 Backup Power Manager 38 Backup System Control Interface 39 Asynchronous Timer AST ALARM 40 Asynchronous Timer AST PER 41 Asynchronous Timer AST OVF 42 Asynchronous Timer AST READY 43 Asynchronous Timer AST CLKREADY 44 Watchdog Timer WDT 45 External Interrupt Controller EIC 1 46 External Interrupt Controller EIC 2 47 External Interrupt Controller EIC 3 USBC AESA PM SCIF BPM BSCIF 40 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 4-2. Line Interrupt Request Signal Map (Sheet 3 of 3) Module Signal 48 External Interrupt Controller EIC 4 49 External Interrupt Controller EIC 5 50 External Interrupt Controller EIC 6 51 External Interrupt Controller EIC 7 52 External Interrupt Controller EIC 8 53 Inter-IC Sound (I2S) Controller IISC 54 Serial Peripheral Interface SPI 55 Timer/Counter TC00 56 Timer/Counter TC01 57 Timer/Counter TC02 58 Timer/Counter TC10 59 Timer/Counter TC11 60 Timer/Counter TC12 61 Two-wire Master Interface TWIM0 62 Two-wire Slave Interface TWIS0 63 Two-wire Master Interface TWIM1 64 Two-wire Slave Interface TWIS1 65 Universal Synchronous Asynchronous Receiver Transmitter USART0 66 Universal Synchronous Asynchronous Receiver Transmitter USART1 67 Universal Synchronous Asynchronous Receiver Transmitter USART2 68 Universal Synchronous Asynchronous Receiver Transmitter USART3 69 ADC controller interface ADCIFE 70 DAC Controller DACC 71 Analog Comparator Interface ACIFC 72 Audio Bitstream DAC 73 True Random Number Generator TRNG 74 Parallel Capture PARC 75 Capacitive Touch Module B CATB 77 Two-wire Master Interface TWIM2 78 Two-wire Master Interface TWIM3 79 LCD Controller A LCDCA ABDACB 41 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 4.8 Peripheral Debug The PDBG register controls the behavior of asynchronous peripherals when the device is in debug mode.When the corresponding bit is set, that peripheral will be in a frozenstate in debug mode. 4.8.1 Name: Peripheral Debug PDBG Access Type: Read/Write Address: 0xE0042000 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 - - - - - - - - 23 22 21 20 19 18 17 16 - - - - - - - - 15 14 13 12 11 10 9 8 - - - - - - - - 7 6 5 4 3 2 1 0 - - - - - PEVC AST WDT * WDT: Watchdog PDBG bit WDT = 0: The WDT counter is not frozen during debug operation. WDT = 1: The WDT counter is frozen during debug operation when Core is halted * AST: Asynchronous Timer PDBG bit AST = 0: The AST prescaler and counter is not frozen during debug operation. AST = 1: The AST prescaler and counter is frozen during debug operation when Core is halted. * PEVC: PEVC PDBG bit PEVC= 0: PEVC is not frozen during debug operation. PEVC= 1: PEVC is frozen during debug operation when Core is halted. 42 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 5. Memories 5.1 Product Mapping Figure 5-1. ATSAM4L8/L4/L2 Product Mapping Global Memory Space Code 0x00000000 0x00000000 Code 0x20000000 Internal Flash Peripheral Bridge A Peripheral Bridge B 0x00800000 0x400A0000 0x40000000 SRAM Reserved Reserved FLASHCALW 0x400A0400 0x40004000 0x1FFFFFFF 0x22000000 PICOCACHE I2SC 0x400A1000 0x40008000 HMATRIX SPI SRAM Undefined 0x20000000 0x40000000 0x400A3000 0x400A4000 Reserved 0x400A5000 USBC TWIMS0 0x400A6000 0x4001C000 0x21000000 PEVC TWIMS1 HRAMC1 0xE0000000 System CRCCU TC1 0x40018000 Reserved SMAP TC0 0x40014000 0x20010000 0x60000000 PDCA Reserved 0x40010000 HRAMC0 Peripherals 0x400A2000 0x4000C000 0x400A6400 0x40020000 0x400AFFFF 0x40024000 Reserved 0xFFFFFFFF Reserved Reserved 0x210007FF USART0 0x40028000 0x21FFFFFF USART1 0x4002C000 USART2 Peripherals System 0xE0000000 ITM Peripheral Bridge A DWT Peripheral Bridge B FPB 0xE0003000 AESA SCS 0x400B0100 Reserved 0x400E0000 TPIU 0xE0041000 0xE0042000 0x400E0800 DACC 0x400E0C00 ACIFC 0x400E1000 Reserved 0x400E1800 GLOC 0x400EFFFF SCIF FREQM GPIO 0x40044000 Reserved 0x40064000 ABDACB Peripheral Bridge C 0x40068000 Peripheral Bridge D 0x40070000 TRNG BPM PARC 0x400F0400 BSCIF CATB 0x400F0800 0x40074000 0x40100000 Peripheral Bridge D 0x400F0000 0x4006C000 0x400F0000 Reserved ADCIFE 0x40060000 Reserved 0xE0040000 PM CHIPID 0x40040000 0xE000E000 0xE000F000 0x400E0740 0x4003C000 0x400B0000 Reserved Reserved 0x40038000 0x400A0000 0xE0002000 USART3 0x400E0000 0x40034000 0x40000000 0xE0001000 Peripheral Bridge C 0x40030000 AST Reserved External PPB 0x400F0C00 0x40078000 WDT TWIM2 0xE00FF000 ROM Table 0x400F1000 0x4007C000 EIC TWIM3 Reserved 0xE0100000 0x400F1400 0x40080000 PICOUART LCDCA Reserved 0x400F1800 0x40084000 Reserved Reserved 0xFFFFFFFF 0x5FFFFFFF 0x4009FFFF 0x400FFFFF System Controller 43 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 5.2 Embedded Memories * Internal high-speed flash - 512Kbytes (ATSAM4Lx8) - 256Kbytes (ATSAM4Lx4) - 128Kbytes (ATSAM4Lx2) * Pipelined flash architecture, allowing burst reads from sequential flash locations, hiding penalty of 1 wait state access * Pipelined flash architecture typically reduces the cycle penalty of 1 wait state operation compared to 0 wait state operation * 100 000 write cycles, 15-year data retention capability * Sector lock capabilities, bootloader protection, security bit * 32 fuses, erased during chip erase * User page for data to be preserved during chip erase * Internal high-speed SRAM, single-cycle access at full speed - 64Kbytes (ATSAM4Lx8) - 32Kbytes (ATSAM4Lx4, ATSAM4Lx2) 5.3 Physical Memory Map The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they are never remapped in any way, not even during boot. The 32-bit physical address space is mapped as follows: Table 5-1. ATSAM4L8/L4/L2 Physical Memory Map Start Address Size Size ATSAM4Lx4 ATSAM4Lx2 Memory Embedded Flash 0x00000000 256Kbytes 128Kbytes Embedded SRAM 0x20000000 32Kbytes 32Kbytes Cache SRAM 0x21000000 4Kbytes 4Kbytes Peripheral Bridge A 0x40000000 64Kbytes 64Kbytes Peripheral Bridge B 0x400A0000 64Kbytes 64Kbytes AESA 0x400B0000 256 bytes 256 bytes Peripheral Bridge C 0x400E0000 64Kbytes 64Kbytes Peripheral Bridge D 0x400F0000 64Kbytes 64Kbytes Start Address Size Memory ATSAM4Lx8 Embedded Flash 0x00000000 512Kbytes Embedded SRAM 0x20000000 64Kbytes Cache SRAM 0x21000000 4Kbytes Peripheral Bridge A 0x40000000 64Kbytes Peripheral Bridge B 0x400A0000 64Kbytes 44 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Start Address Size Memory ATSAM4Lx8 Table 5-2. AESA 0x400B0000 256 bytes Peripheral Bridge C 0x400E0000 64Kbytes Peripheral Bridge D 0x400F0000 64Kbytes Flash Memory Parameters Device Flash Size (FLASH_PW) Number of Pages (FLASH_P) Page Size (FLASH_W) ATSAM4Lx8 512Kbytes 1024 512 bytes ATSAM4Lx4 256Kbytes 512 512 bytes ATSAM4Lx2 128Kbytes 256 512 bytes 45 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 6. Power and Startup Considerations Power Domain Overview Figure 6-1. VDDCORE VDDOUT GND BUCK/LDOn (PA02) ATSAM4LS Power Domain Diagram VDDIN 6.1 DUAL OUTPUT TRIMMABLE VOLTAGE REGULATOR CORE DOMAIN CORTEX M4 CPU PDCA USBC RAM FLASH BUS MATRIX VDDANA DOMAIN PERIPHERAL BRIDGE A PERIPHERAL BRIDGE B PERIPHERALS AHB PERIPHERALS AD0-AD14 ADC ADVREF AC0A-AC3A ANALOG COMPARATORS AC0B-AC3B PERIPHERAL BRIDGE C GPIO DAC DACOUT POWER MANAGER FREQUENCY METER STARTUP LOGIC PLL POR33 SYSTEM CONTROL INTERFACE BOD33 BOD18 DFLL VDDIO DOMAIN RCSYS USB PADS RCFAST MPOSC PERIPHERAL BRIDGE D RC80M BACKUP POWER MANAGER RC32K BACKUP SYSTEM CONTROL INTERFACE XIN32 OSC32K POR18 XOUT32 EXTINT0-EXTINT8 VDDANA GPIOs EXTERNAL INTERRUPT CONTROLLER WATCHDOG TIMER ASYNCHRONOUS TIMER BACKUP REGISTERS VDDIO GND GNDANA BACKUP DOMAIN 46 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 6-2. VDDCORE VDDOUT GND VDDIN BUCK/LDOn (PA02) ATSAM4LC Power Domain Diagram VLCDIN GND LCDA DOMAIN DUAL OUTPUT TRIMMABLE VOLTAGE REGULATOR CORE DOMAIN CORTEX M4 CPU PDCA USBC RAM FLASH CAPH CAPL BIASH BIASL LCD VPUMP VLCD BUS MATRIX GPIOs VDDANA DOMAIN PERIPHERAL BRIDGE A PERIPHERAL BRIDGE B PERIPHERALS AHB PERIPHERALS AD0-AD14 ADC LCDB DOMAIN ADVREF VDDIO AC0A-AC3A ANALOG COMPARATORS AC0B-AC3B GPIOs PERIPHERAL BRIDGE C GPIO LCDC DOMAIN DAC DACOUT POWER MANAGER FREQUENCY METER VDDIO STARTUP LOGIC GPIOs PLL POR33 SYSTEM CONTROL INTERFACE BOD33 BOD18 DFLL VDDIO DOMAIN RCSYS USB PADS RCFAST MPOSC PERIPHERAL BRIDGE D RC32K BACKUP SYSTEM CONTROL INTERFACE XIN32 OSC32K VDDANA BACKUP POWER MANAGER POR18 XOUT32 EXTINT0-EXTINT8 GPIOs RC80M EXTERNAL INTERRUPT CONTROLLER WATCHDOG TIMER ASYNCHRONOUS TIMER BACKUP REGISTERS VDDIO GND GNDANA BACKUP DOMAIN 47 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 6.2 Power Supplies The ATSAM4L8/L4/L2 has several types of power supply pins: * VDDIO: Powers I/O lines, the general purpose oscillator (OSC), the 80MHz integrated RC oscillator (RC80M) . Voltage is 1.68V to 3.6V. * VLCDIN: (ATSAM4LC only) Powers the LCD voltage pump. Voltage is 1.68V to 3.6V. * VDDIN: Powers the internal voltage regulator. Voltage is 1.68V to 3.6V. * VDDANA: Powers the ADC, the DAC, the Analog Comparators, the 32kHz oscillator (OSC32K), the 32kHz integrated RC oscillator (RC32K)and the Brown-out detectors (BOD18 and BOD33). Voltage is 1.68V to 3.6V nominal. * VDDCORE: Powers the core, memories, peripherals, the PLL, the DFLL, the 4MHz integrated RC oscillator (RCFAST) and the 115kHz integrated RC oscillator (RCSYS). - VDDOUT is the output voltage of the regulator and must be connected with or without an inductor to VDDCORE. The ground pins GND are common to VDDCORE, VDDIO, and VDDIN. The ground pin for VDDANA is GNDANA. For decoupling recommendations for the different power supplies, refer to the schematic document. 6.2.1 Voltage Regulator An embedded voltage regulator supplies all the digital logic in the Core and the Backup power domains. The regulator has two functionnal mode depending of BUCK/LDOn (PA02) pin value. When this pin is low, the regulator is in linear mode and VDDOUT must be connected to VDDCORE externally. When this pin is high, it behaves as a switching regulator and an inductor must be placed between VDDOUT and VDDCORE. The value of this pin is sampled during the power-up phase when the Power On Reset 33 reaches VPOT+ (Section 9.9 "Analog Characteristics" on page 129) Its output voltages in the Core domain (VCORE) and in the Backup domain (VBKUP) are always equal except in Backup mode where the Core domain is not powered (VCORE=0). The Backup domain is always powered. The voltage regulator features three different modes: * Normal mode: the regulator is configured as linear or switching regulator. It can support all different Run and Sleep modes. * Low Power (LP) mode: the regulator consumes little static current. It can be used in Wait modes. * Ultra Low Power (ULP) mode: the regulator consumes very little static current . It is dedicated to Retention and Backup modes. In Backup mode, the regulator only supplies the backup domain. 48 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 6.2.2 Typical Powering Schematics The ATSAM4L8/L4/L2 supports the Single supply mode from 1.68V to 3.6V. Depending on the input voltage range and on the final application frequency, it is recommended to use the following table in order to choose the most efficient power strategy Figure 6-3. Efficient power strategy: 1.68V 1.80V Switching Mode N/A (BUCK/LDOn (PA02) =1) 2.00V VDDIN Voltage 2.30V Possible but not efficient 3.60V Optimal power efficiency Linear Mode Optimal power efficiency (BUCK/LDOn (PA02) =0) Possible but not efficient FCPUMAX 12MHz Up to 36MHz In PS0 Up to 12MHz in PS1 Up to 48MHz in PS2 PowerScaling PS1(1) ALL Typical power consumption in RUN mode Typical power consumption in RET mode 212A/MHz @ FCPU=12MHz(PS1) 306A/MHz @ FCPU= 48MHz(PS2) 100A/MHz @ FCPU=12MHz(PS1) @ VVDDIN=3.3V 180A/MHz @ FCPU=48MHz(PS2) @ VVDDIN=3.3V 1.5A Note 1. The SAM4L boots in PS0 on RCSYS(115kHz), then the application must switch to PS1 before running on higher frequency (<12MHz) 49 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 The internal regulator is connected to the VDDIN pin and its output VDDOUT feeds VDDCORE in linear mode or through an inductor in switching mode. Figure 6-4 shows the power schematics to be used. All I/O lines will be powered by the same power (VVDDIN=VVDDIO=VVDDANA). Figure 6-4. Single Supply Mode VLCDIN LCD VPUMP VDDIO RC80M, OSC, Main Supply (1.68V-3.6V) VDDANA BUCK/LDOn (PA02) ADC, DAC, AC0/1, RC32K, OSC32K, BOD18, BOD33 VDDIN REGULATOR VDDOUT Core domain: CPU, Peripherals, RAM, Flash, RCSYS, PLL, DFLL, RCFAST VDDCORE Backup domain: AST, WDT, EIC, BPM, BSCIF 6.2.3 6.2.3.1 LCD Power Modes Principle LCD lines is powered using the device internal voltage sources provided by the LCDPWR block. When enabled, the LCDPWR blocks will generate the VLCD, BIASL, BIASH voltages. LCD pads are splitted into three clusters that can be powered independently namely clusters A, B and C. A cluster can either be in GPIO mode or in LCD mode. When a cluster is in GPIO mode, its VDDIO pin must be powered externally. None of its GPIO pin can be used as a LCD line When a cluster is in LCD mode, each clusters VDDIO pin can be either forced externally (1.83.6V) or unconnected (nc). GPIOs in a cluster are not available when it is in LCD mode. A cluster is set in LCD mode by the LCDCA controller when it is enabled depending on the number of segments configured. The LCDPWR block is powered by the VLCDIN pin inside cluster A When LCD feature is not used, VLCDIN must be always powered (1.8-3.6V). VLCD, CAPH, CAPL, BIASH, BIASL can be left unconnected in this case 50 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 GND BIASL BIASH VLCD CAPL CAPH 55 54 53 52 51 VLCDIN SEG0 56 CAPH 33 57 58 VLCD CAPL 34 SEG1 59 BIASH 36 37 35 SEG2 BIASL SEG3 60 GND 38 SEG4 61 VLCDIN 39 SEG6 SEG5 62 63 SEG0 40 SEG1 SEG9 67 SEG10 SEG4 SEG3 SEG2 SEG1 SEG0 VLCDIN GND BIASL BIASH VLCD CAPL CAPH 41 84 SEG7 SEG29 64 83 SEG2 SEG28 42 SEG10 SEG8 82 65 SEG27 SEG3 49 SEG4 SEG9 43 81 44 SEG26 66 80 SEG5 SEG25 45 79 SEG6 78 SEG24 46 SEG11 SEG12 70 SEG20 48 77 68 SEG13 71 76 SEG19 SEG7 SEG14 72 SEG18 47 SEG15 73 69 SEG16 74 SEG8 SEG17 75 LCD clusters in the device 50 COM0 49 COM1 48 COM2 47 COM3 46 SEG21 COM0 45 SEG22 50 31 COM1 44 SEG23 SEG11 51 30 COM2 VDDIO 52 SEG15 53 SEG16 54 SEG30 85 SEG31 86 SEG17 55 VDDIO 87 SEG18 56 VDDIO 88 SEG19 57 SEG20 58 SEG21 59 SEG22 60 VDDIO 61 36 35 34 33 32 31 30 29 28 27 26 25 32 SEG5 SEG6 SEG7 VDDIO SEG9 SEG10 SEG11 SEG12 VDDIO 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 TQFP48/QFN48 COM0 COM1 COM2 COM3 SEG8 VDDANA GNDANA 43 29 COM3 28 SEG12 27 SEG13 26 SEG14 40 25 VDDANA 39 24 42 41 38 23 GNDANA SEG32 89 SEG33 90 SEG34 91 SEG35 92 62 19 SEG36 93 63 18 33 SEG37 94 17 32 SEG38 95 SEG39 96 VDDIN VDDOUT GND VDDCORE GND GND 64 36 21 35 20 VDDANA 34 TQFP64/QFN64 GNDANA 31 30 16 15 14 13 12 11 10 9 8 7 6 4 5 3 2 1 97 29 98 28 VDDIN VDDOUT 100 GND VDDCORE 99 GND 37 22 12 11 10 9 8 7 6 5 4 3 2 1 LCDC CLUSTER LCDB CLUSTER LCDA CLUSTER Figure 6-5. 27 26 TQFP100 25 24 23 22 21 20 19 18 VDDIN VDDOUT GND 17 15 VDDCORE 16 14 13 12 VDDIO 11 GND 10 8 9 7 6 5 4 3 2 1 6.2.3.2 Internal LCD Voltage In this mode the LCD voltages are internally generated. Depending of the number of segments required by the application, LCDB and LDCC clusters VDDIO pin must be unconnected (nc) or 51 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 connected to an external voltage source (1.8-3.6V). LCDB cluster is not available in 64 and 48 pin packages Table 6-1. LCD powering when using the internal voltage pump Segments in use Package 100-pin packages VDDIO VDDIO LCDB LCDC [1,24] 1.8-3.6V 1.8-3.6V [1, 32] nc 1.8-3.6V [1, 40] nc nc [1,15] - 1.8-3.6V [1, 23] - nc [1,9] - 1.8-3.6V [1,13] - nc 64-pin packages 48-pin packages Up to 4x40 segments No GPIO in LCD clusters GND LCDA DOMAIN CAPH CAPL BIASH BIASL LCD VPUMP VLCD Switch on Switch on GPIOs LCDB DOMAIN VDDIO nc GPIOs LCDC DOMAIN VDDIO nc Switch off GPIOs LCDC DOMAIN LCDB DOMAIN 1.8-3.6V VDDIO GPIOs 1.8-3.6V VDDIO GPIOs CAPH CAPL BIASH BIASL VLCD GPIOs VDDIO nc GPIOs LCD VPUMP VLCD GPIOs LCDB DOMAIN GND LCDA DOMAIN CAPH CAPL BIASH BIASL Switch off LCD VPUMP GND Switch off LCDA DOMAIN 1.8-3.6V VLCDIN 1.8-3.6V VLCDIN VLCDIN 1.8-3.6V Switch on Up to 4x24 segments Up to 16 GPIOs in LCDB & LCDC clusters Up to 4x32 segments Up to 8 GPIOs in LCDC clusters LCDC DOMAIN VDDIO GPIOs 52 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 6.2.4 Power-up Sequence 6.2.4.1 Maximum Rise Rate To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values described in Table 9-3 on page 100. 6.2.4.2 Minimum Rise Rate The integrated Power-on Reset (POR33) circuitry monitoring the VDDIN powering supply requires a minimum rise rate for the VDDIN power supply. See Table 9-3 on page 100 for the minimum rise rate value. If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, the following configuration can be used: * A logic "0" value is applied during power-up on pin RESET_N until VDDIN rises above 1.6 V. 6.3 Startup Considerations This section summarizes the boot sequence of the ATSAM4L8/L4/L2. The behavior after powerup is controlled by the Power Manager. For specific details, refer to Section 9. "Power Manager (PM)" on page 677. 6.3.1 Starting of Clocks After power-up, the device will be held in a reset state by the power-up circuitry for a short time to allow the power to stabilize throughout the device. After reset, the device will use the System RC Oscillator (RCSYS) as clock source. Refer to Section 9. "Electrical Characteristics" on page 99 for the frequency for this oscillator. On system start-up, the DFLL and the PLLs are disabled. Only the necessary clocks are active allowing software execution. Refer to Section 3-6 "Maskable Module Clocks in AT32UC3B." on page 24 to know the list of peripheral clock running.. No clocks have a divided frequency; all parts of the system receive a clock with the same frequency as the System RC Oscillator. 6.3.2 Fetching of Initial Instructions After reset has been released, the Cortex M4 CPU starts fetching PC and SP values from the reset address, which is 0x00000000. Refer to the ARM Architecture Reference Manual for more information on CPU startup. This address points to the first address in the internal Flash. The code read from the internal flash is free to configure the clock system and clock sources. 6.4 Power-on-Reset, Brownout and Supply Monitor The SAM4L embeds four features to monitor, warm, and/or reset the device: * POR33: Power-on-Reset on VDDANA * BOD33: Brownout detector on VDDANA * POR18: Power-on-Reset on VDDCORE * BOD18: Brownout detector on VDDCORE 53 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 6-6. Supply Monitor Schematic DUAL OUTPUT TRIMMABLE VOLTAGE REGULATOR VDDCORE VDDANA POR33 BOD33 POR18 BOD18 VDDANA GNDANA 6.4.1 Power-on-Reset on VDDANA POR33 monitors VDDANA. It is always activated and monitors voltage at startup but also during all the Power Save Mode. If VDDANA goes below the threshold voltage, the entire chip is reset. 6.4.2 Brownout Detector on VDDANA BOD33 monitors VDDANA. Refer to Section 15. "Backup System Control Interface (BSCIF)" on page 308to get more details. 6.4.3 Power-on-Reset on VDDCORE POR18 monitors the internal VDDCORE. Refer to Section 15. "Backup System Control Interface (BSCIF)" on page 308 to get more details. 6.4.4 Brownout Detector on VDDCORE Once the device is startup, the BOD18 monitors the internal VDDCORE. Refer to Section 15. "Backup System Control Interface (BSCIF)" on page 308 to get more details. 54 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 7. Low Power Techniques The ATSAM4L8/L4/L2 supports multiple power configurations to allow the user to optimize its power consumption in different use cases. The Backup Power Manager (BPM) implements different solutions to reduce the power consumption: * The Power Save modes intended to reduce the logic activity and to adapt the power configuration. See "Power Save Modes" on page 55. * The Power Scaling intended to scale the power configuration (voltage scaling of the regulator). See "Power Scaling" on page 60. These two techniques can be combined together. Figure 7-1. Power Scaling and Power Save Mode Overview POWER SCALING Max frequency = 36Mhz Max frequency = 12Mhz Max frequency = 48Mhz Normal Speed Flash Normal Speed Flash High Speed Flash RESET Reduced Voltage Nominal Voltage Nominal Voltage BPM.PMCON.PS=1 BPM.PMCON.PS=0 BPM.PMCON.PS=2 RUN SLEEP POWER SAVE MODES CPU Clock OFF 4 sub-modes WAIT All Clocks OFF SleepWalking RETENTION All Clocks OFF Full chip retention BACKUP Core Domain OFF 7.1 RUN0 RUN1 RUN2 SLEEP0 SLEEP1 SLEEP2 WAIT0 WAIT1 WAIT2 RET0 RET1 RET2 BKUP0 BKUP1 BKUP2 Power Save Modes Refer to Section 6. "Power and Startup Considerations" on page 46 to get definition of the core and the backup domains. 55 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 At power-up or after a reset, the ATSAM4L8/L4/L2 is in the RUN0 mode. Only the necessary clocks are enabled allowing software execution. The Power Manager (PM) can be used to adjust the clock frequencies and to enable and disable the peripheral clocks. When the CPU is entering a Power Save Mode, the CPU stops executing code. The user can choose between four Power Save Modes to optimize power consumption: * SLEEP mode: the Cortex-M4 core is stopped, optionally some clocks are stopped, peripherals are kept running if enabled by the user. * WAIT mode: all clock sources are stopped, the core and all the peripherals are stopped except the modules running with the 32kHz clock if enabled. This is the lowest power configuration where SleepWalking is supported. * RETENTION mode: similar to the WAIT mode in terms of clock activity. This is the lowest power configuration where the logic is retained. * BACKUP mode: the Core domain is powered off, the Backup domain is kept powered. A wake up source exits the system to the RUN mode from which the Power Save Mode was entered. A reset source always exits the system from the Power Save Mode to the RUN0 mode. The configuration of the I/O lines are maintained in all Power Save Modes. Refer to Section 9. "Backup Power Manager (BPM)" on page 677. 7.1.1 SLEEP mode The SLEEP mode allows power optimization with the fastest wake up time. The CPU is stopped. To further reduce power consumption, the user can switch off modulesclocks and synchronous clock sources through the BPM.PMCON.SLEEP field (See Table 7-1). The required modules will be halted regardless of the bit settings of the mask registers in the Power Manager (PM.AHBMASK, PM.APBxMASK). Table 7-1. SLEEP mode Configuration BPM.PSAVE.SLEEP CPU clock AHB clocks APB clocks GCLK Clock sources: OSC, RCFAST, RC80M, PLL, DFLL 0 Stop Run Run Run Run Run Any interrupt 1 Stop Stop Run Run Run Run Any interrupt(1) 2 Stop Stop Stop Run Run Run Any interrupt(1) 3 Stop Stop Stop Stop Run Run Any interrupt(1) Notes: RCSYS OSC32K RC32K(2) Wake up Sources 1. from modules with clock running. 2. OSC32K and RC32K will only remain operational if pre-enabled. 7.1.1.1 Entering SLEEP mode The SLEEP mode is entered by executing the WFI instruction. Additionally, if the SLEEPONEXIT bit in the Cortex-M4 System Control Register (SCR) is set, the SLEEP mode will also be entered when the Cortex-M4 exits the lowest priority ISR. This 56 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 mechanism can be useful for applications that only require the processor to run when an interrupt occurs. Before entering the SLEEP mode, the user must configure: * the SLEEP mode configuration field (BPM.PMCON.SLEEP), Refer to Table 7-1. * the SCR.SLEEPDEEP bit to 0. (See the Power Management section in the ARM Cortex-M4 Processor chapter). * the BPM.PMCON.RET bit to 0. * the BPM.PMCON.BKUP bit to 0. 7.1.1.2 7.1.2 Exiting SLEEP mode The NVIC wakes the system up when it detects any non-masked interrupt with sufficient priority to cause exception entry. The system goes back to the RUN mode from which the SLEEP mode was entered. The CPU and affected modules are restarted. Note that even if an interrupt is enabled in SLEEP mode, it will not trigger if the source module is not clocked. WAIT Mode and RETENTION Mode The WAIT and RETENTION modes allow achieving very low power consumption while maintaining the Core domain powered-on. Internal SRAM and registers contents of the Core domain are preserved. In these modes, all clocks are stopped except the 32kHz clocks (OSC32K, RC32K) which are kept running if enabled. In RETENTION mode, the SleepWalking feature is not supported and must not be used. 7.1.2.1 Entering WAIT or RETENTION Mode The WAIT or RETENTION modes are entered by executing the WFI instruction with the following settings: * set the SCR.SLEEPDEEP bit to 1. (See the Power Management section in the ARM CortexM4 Processor chapter). * set the BPM.PSAVE.BKUP bit to 0. * set the BPM.PMCON.RET bit to RETENTION or WAIT mode. SLEEPONEXIT feature is also available. See "Entering SLEEP mode" on page 56. 7.1.2.2 Exiting WAIT or RETENTION Mode In WAIT or RETENTION modes, synchronous clocks are stopped preventing interrupt sources from triggering. To wakeup the system, asynchronous wake up sources (AST, EIC, USBC ...) should be enabled in the peripheral (refer to the documentation of the peripheral). The PM.AWEN (Asynchronous Wake Up Enable) register should also be enabled for all peripheral except for EIC and AST. When the enabled asynchronous wake up event occurs and the system is waken-up, it will generate either: * an interrupt on the PM WAKE interrupt line if enabled (Refer to Section 9. "Power Manager (PM)" on page 677). In that case, the PM.WCAUSE register indicates the wakeup source. * or an interrupt directly from the peripheral if enabled (Refer to the section of the peripheral). When waking up, the system goes back to the RUN mode mode from which the WAIT or RETENTION mode was entered. 57 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 7.1.3 BACKUP Mode The BACKUP mode allows achieving the lowest power consumption possible in a system which is performing periodic wake-ups to perform tasks but not requiring fast startup time. The Core domain is powered-off. The internal SRAM and register contents of the Core domain are lost. The Backup domain is kept powered-on. The 32kHz clock (RC32K or OSC32K) is kept running if enabled to feed modules that require clocking. In BACKUP mode, the configuration of the I/O lines is preserved. Refer to Section 9. "Backup Power Manager (BPM)" on page 677 to have more details. 7.1.3.1 Entering BACKUP Mode The Backup mode is entered by using the WFI instruction with the following settings: * set the SCR.SLEEPDEEP bit to 1. (See the Power Management section in the ARM CortexM4 Processor chapter). * set the BPM.PSAVE.BKUP bit to 1. 7.1.3.2 Exiting BACKUP Mode Exit from BACKUP mode happens if a reset occurs or if an enabled wake up event occurs. The reset sources are: * BOD33 reset * BOD18 reset * WDT reset * External reset in RESET_N pin The wake up sources are: * EIC lines (level transition only) * BOD33 interrupt * BOD18 interrupt * AST alarm, periodic, overflow * WDT interrupt The RC32K or OSC32K should be used as clock source for modules if required. The PMCON.CK32S is used to select one of these two 32kHz clock sources. Exiting the BACKUP mode is triggered by: * a reset source: an internal reset sequence is performed according to the reset source. Once VDDCORE is stable and has the correct value according to RUN0 mode, the internal reset is released and program execution starts. The corresponding reset source is flagged in the Reset Cause register (RCAUSE) of the PM. * a wake up source: the Backup domain is not reset. An internal reset is generated to the Core domain, and the system switches back to the previous RUN mode. Once VDDCORE is stable and has the correct value, the internal reset in the Core domain is released and program execution starts. The BKUP bit is set in the Reset Cause register (RCAUSE) of the PM. It allows the user to discriminate between the reset cause and a wake up cause from the BACKUP mode. The wake up cause can be found in the Backup Wake up Cause register (BPM.BKUPWCAUSE). 58 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 7.1.4 Wakeup Time 7.1.4.1 Wakeup Time From SLEEP Mode The latency depends on the clock sources wake up time. If the clock sources are not stopped, there is no latency to wake the clocks up. 7.1.4.2 Wakeup Time From WAIT or RETENTION Mode The wake up latency consists of: * the switching time from the low power configuration to the RUN mode power configuration. By default, the switching time is completed when all the voltage regulation system is ready. To speed-up the startup time, the user can set the Fast Wakeup bit in BPM.PMCON register. * the wake up time of the RC oscillator used to start the system up. By default, the RCSYS oscillator is used to startup the system. The user can use another clock source (RCFAST for example) to speed up the startup time by configuring the PM.FASTWKUP register. Refer to Section 9. "Power Manager (PM)" on page 677. * the Flash memory wake up time. To have the shortest wakeup time, the user should: - set the BPM.PMCON.FASTWKUP bit. - configure the PM.FASTSLEEP.FASTRCOSC field to use the RCFAST main clock. - enter the WAIT or RETENTION mode Upon a wakeup, this is required to keep the main clock connected to RCFAST until the voltage regulation system is fully ready (when BPM.ISR.PSOK bit is one). During this wakeup period, the FLASHCALW module is automatically configured to operate in "1 wait state mode". 7.1.4.3 Wake time from BACKUP mode It is equal to the Core domain logic reset latency (similar to the reset latency caused by an external reset in RESET_N pin) added to the time required for the voltage regulation system to be stabilized. 59 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 7.1.5 Power Save Mode Summary Table The following table shows a summary of the main Power Save modes: Table 7-2. Mode Power Save mode Configuration Summary Mode Entry Wake up sources Core domain CPU clock OFF WFI SLEEP SCR.SLEEPDEEP bit = 0 Any interrupt BPM.PMCON.BKUP bit = 0 Other clocks OFF depending on the BPM.PMCON.SLEEP field see "SLEEP mode" on page 56 Backup domain Clocks OFF depending on the BPM.PMCON.SLEEP field see "SLEEP mode" on page 56 WFI SCR.SLEEPDEEP bit = 1 WAIT BPM.PMCON.RET bit = 0 PM WAKE interrupt All clocks are OFF Core domain is retained All clocks are OFF except RC32K or OSC32K if running BPM.PMCON.BKUP bit = 0 WFI RETENTION SCR.SLEEPDEEP bit = 1 BPM.PMCON.RET bit = 1 PM WAKE interrupt All clocks are OFF Core domain is retained All clocks are OFF except RC32K or OSC32K if running BPM.PMCON.BKUP bit = 0 EIC interrupt BOD33, BOD18 interrupt and reset WFI BACKUP + SCR.SLEEPDEEP bit = 1 + BPM.PMCON.BKUP bit = 1 AST alarm, periodic, overflow OFF (not powered) WDT interrupt and reset All clocks are OFF except RC32K or OSC32K if running external reset on RESET_N pin 7.2 Power Scaling The Power Scaling technique consists of adjusting the internal regulator output voltage (voltage scaling) to reduce the power consumption. According to the requirements in terms of performance, operating modes, and current consumption, the user can select the Power Scaling configuration that fits the best with its application. The Power Scaling configuration field (PMCON.PS) is provided in the Backup Power Manager (BPM) module. In RUN mode, the user can adjust on the fly the Power Scaling configuration The Figure 7.1 summarizes the different combination of the Power Scaling configuration which can be applied according to the Power Save Mode. Power scaling from a current power configuration to a new power configuration is done by halting the CPU execution Power scaling occurs after a WFI instruction. The system is halted until the new power configuration is stabilized. After handling the PM interrupt, the system resumes from WFI. To scale the power, the following sequence is required: * Check the BPM.SR.PSOK bit to make sure the current power configuration is stabilized. 60 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 * Set the clock frequency to be supported in both power configurations. * Set the high speed read mode of the FLASH to be supported in both power scaling configurations - Only relevant when entering or exiting BPM.PMCON.PS=2 * Configure the BPM.PMCON.PS field to the new power configuration. * Set the BPM.PMCON.PSCREQ bit to one. * Disable all the interrupts except the PM WCAUSE interrupt and enable only the PSOK asynchronous event in the AWEN register of PM. * Execute the WFI instruction. * WAIT for PM interrupt. The new power configuration is reached when the system is waken up by the PM interrupt thanks to the PSOK event. By default, all features are available in all Power Scaling modes. However some specific features are not available in PS1 (BPM.PMCON.PS=1) mode : - USB - DFLL - PLL - Programming/Erasing in Flash 61 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8. Debug and Test 8.1 Features * * * * * * * * * * * * 8.2 IEEE1149.1 compliant JTAG Debug Port Serial Wire Debug Port Boundary-Scan chain on all digital pins for board-level testing Direct memory access and programming capabilities through debug ports Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling Instrumentation Trace Macrocell (ITM) for support of printf style debugging Chip Erase command and status Unlimited Flash User page read access Cortex-M4 core reset source CRC32 of any memory accessible through the bus matrix Debugger Hot Plugging Overview Debug and test features are made available to external tools by: * The Enhanced Debug Port (EDP) embedding: - a Serial Wire Debug Port (SW-DP) part of the ARM coresight architecture - an IEEE 1149.1 JTAG Debug Debug Port (JTAG-DP) part of the ARM coresight architecture - a supplementary IEEE 1149.1 JTAG TAP machine that implements the boundary scan feature * The System Manager Acces Port (SMAP) providing unlimited flash User page read access, CRC32 of any memory accessible through the bus matrix and Cortex-M4 core reset services * The AHB Access Port (AHB-AP) providing Direct memory access, programming capabilities and standard debugging functions * The Instrumentation Trace macrocell part of the ARM coresight architecture For more information on ARM debug components, please refer to: * ARMv7-M Architecture Reference Manual * ARM Debug Interface v5.1 Architecture Specification document * ARM CoreSight Architecture Specification * ARM ETM Architecture Specification v3.5 * ARM Cortex-M4 Technical Reference Manual 62 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.3 Block diagram Figure 8-1. Debug and Test Block Diagram ENHANCED DEBUG PORT TMS TDI CORTEX-M4 TPIU PORT MUXING TDO Core AHB-AP SWJ-DP TCK Boundary scan Instr DAP Bus Data FPB BSCAN-TAP DWT NVIC ITM Hot_plugging JTAG-FILTER RESET_N Private peripheral Bus (PPB) M EDP Core reset request APB SMAP Core reset request HTOP SMAP Chip Erase M AHB AHB POR AHB S System Bus Matrix RESET CONTROLLER Cortex-M4 Core reset note: Boxes with a plain corner are SAM4L specific. 8.4 I/O Lines Description Refer to Section 1.1.4 "I/O Lines Description" on page 4. 63 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.5 8.5.1 Product dependencies I/O Lines Refer to Section 1.1.5.1 "I/O Lines" on page 5. 8.5.2 Power management Refer to Section 1.1.5.2 "Power Management" on page 5. 8.5.3 Clocks Refer to Section 1.1.5.3 "Clocks" on page 5. 8.6 Core debug Figure 8-2 shows the Debug Architecture used in the SAM4L. The Cortex-M4 embeds four functional units for debug: * FPB (Flash Patch Breakpoint) * DWT (Data Watchpoint and Trace) * ITM (Instrumentation Trace Macrocell) * TPIU (Trace Port Interface Unit) The debug architecture information that follows is mainly dedicated to developers of SWJ-DP Emulators/Probes and debugging tool vendors for Cortex-M4 based microcontrollers. For further details on SWJ-DP see the Cortex-M4 technical reference manual. Figure 8-2. Debug Architecture DWT 4 watchpoints FPB SWJ-DP PC sampler 6 breakpoints data address sampler SWD/JTAG ITM data sampler software trace 32 channels interrupt trace SWO trace TPIU time stamping CPU statistics 8.6.1 FPB (Flash Patch Breakpoint) The FPB: * Implements hardware breakpoints * Patches (on the fly) code and data being fetched by the Cortex-M4 core from code space with data in the system space. Definition of code and system spaces can be found in the System Address Map section of the ARMv7-M Architecture Reference Manual. 64 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 The FPB unit contains: * Two literal comparators for matching against literal loads from Code space, and remapping to a corresponding area in System space. * Six instruction comparators for matching against instruction fetches from Code space and remapping to a corresponding area in System space. * Alternatively, comparators can also be configured to generate a Breakpoint instruction to the processor core on a match. 8.6.2 DWT (Data Watchpoint and Trace) The DWT contains four comparators which can be configured to generate the following: * PC sampling packets at set intervals * PC or Data watchpoint packets * Watchpoint event to halt core The DWT contains counters for the items that follow: * Clock cycle (CYCCNT) * Folded instructions * Load Store Unit (LSU) operations * Sleep Cycles * CPI (all instruction cycles except for the first cycle) * Interrupt overhead 8.6.3 ITM (Instrumentation Trace Macrocell) The ITM is an application driven trace source that supports printf style debugging to trace Operating System (OS) and application events, and emits diagnostic system information. The ITM emits trace information as packets which can be generated by three different sources with several priority levels: * Software trace: This can be done thanks to the printf style debugging. For more information, refer to Section "How to Configure the ITM:". * Hardware trace: The ITM emits packets generated by the DWT. * Time stamping: Timestamps are emitted relative to packets. The ITM contains a 21-bit counter to generate the timestamp. How to Configure the ITM: The following example describes how to output trace data in asynchronous trace mode. * Configure the TPIU for asynchronous trace mode (refer to Section "5.4.3. How to Configure the TPIU") * Enable the write accesses into the ITM registers by writing "0xC5ACCE55" into the Lock Access Register (Address: 0xE0000FB0) * Write 0x00010015 into the Trace Control Register: - Enable ITM - Enable Synchronization packets - Enable SWO behavior 65 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 - Fix the ATB ID to 1 * Write 0x1 into the Trace Enable Register: - Enable the Stimulus port 0 * Write 0x1 into the Trace Privilege Register: - Stimulus port 0 only accessed in privileged mode (Clearing a bit in this register will result in the corresponding stimulus port being accessible in user mode.) * Write into the Stimulus port 0 register: TPIU (Trace Port Interface Unit) The TPIU acts as a bridge between the on-chip trace data and the Instruction Trace Macrocell (ITM). The TPIU formats and transmits trace data off-chip at frequencies asynchronous to the core. Asynchronous Mode: The TPIU is configured in asynchronous mode, trace data are output using the single TRACESWO pin. The TRACESWO signal is multiplexed with the TDO signal of the JTAG Debug Port. As a consequence, asynchronous trace mode is only available when the Serial Wire Debug mode is selected since TDO signal is used in JTAG debug mode. Two encoding formats are available for the single pin output: * Manchester encoded stream. This is the reset value. * NRZ_based UART byte structure 5.4.3. How to Configure the TPIU This example only concerns the asynchronous trace mode. * Set the TRCENA bit to 1 into the Debug Exception and Monitor Register (0xE000EDFC) to enable the use of trace and debug blocks. * Write 0x2 into the Selected Pin Protocol Register - Select the Serial Wire Output - NRZ * Write 0x100 into the Formatter and Flush Control Register * Set the suitable clock prescaler value into the Async Clock Prescaler Register to scale the baud rate of the asynchronous output (this can be done automatically by the debugging tool). 66 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7 Enhanced Debug Port (EDP) Rev.: 1.0.0.0 8.7.1 Features * * * * * 8.7.2 IEEE1149.1 compliant JTAG debug port Serial Wire Debug Port Boundary-Scan chain on all digital pins for board-level testing Debugger Hot-Plugging SMAP core reset request source Overview The enhanced debug port embeds a standard ARM debug port plus some specific hardware intended for testability and activation of the debug port features. All the information related to the ARM Debug Interface implementation can be found in the ARM Debug Interface v5.1 Architecture Specification document. It features: * A single Debug Port (SWJ-DP), that provides the external physical connection to the interface and supports two DP implementations: - the JTAG Debug Port (JTAG-DP) - the Serial Wire Debug Port (SW-DP) * A supplementary JTAG TAP (BSCAN-TAP) connected in parallel with the JTAG-DP that implements the boundary scan instructions detailed in * A JTAG-FILTER module that monitors TCK and RESET_N pins to handle specific features like the detection of a debugger hot-plugging and the request of reset of the Cortex-M4 at startup. The JTAG-FILTER module detects the presence of a debugger. When present, JTAG pins are automatically assigned to the Enhanced Debug Port(EDP). If the SWJ-DP is switched to the SW mode, then TDI and TDO alternate functions are released. The JTAG-FILTER also implements a CPU halt mechanism. When triggered, the Cortex-M4 is maintained under reset after the external reset is released to prevent any system corruption during later programmation operations. 67 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.3 Block Diagram Figure 8-3. Enhanced Debug Port Block Diagram ENHANCED DEBUG PORT SWJ-DP TMS swdio TDI traceswo SW-DP TDO swclk TCK DAP Bus tms tdi JTAG-DP tdo tck tms test_tap_sel tdi BSCAN-TAP boundary_scan JTAG-FILTER EDP Core reset request tdo tck tck reset_n RESET_N 8.7.4 I/O Lines Description Table 8-1. I/O Lines Description Name JTAG Debug Port Type Description SWD Debug Port Type Description TCK/SWCLK I Debug Clock I Serial Wire Clock TDI I Debug Data in - NA TDO/TRACESWO O Debug Data Out O Trace asynchronous Data Out TMS/SWDIO I Debug Mode Select I/O Serial Wire Input/Output RESET_N I Reset I Reset 68 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.5 8.7.5.1 Product Dependencies I/O Lines The TCK pin is dedicated to the EDP. The other debug port pins default after reset to their GPIO functionality and are automatically reassigned to the JTAG functionalities on detection of a debugger. In serial wire mode, TDI and TDO can be used as GPIO functions. Note that in serial wire mode TDO can be used as a single pin trace output. 8.7.5.2 Power Management When a debugger is present, the connection is kept alive allowing debug operations. As a side effect, the power is never turned off. The hot plugging functionality is always available except when the system is in BACKUP Power Save Mode. 8.7.5.3 Clocks The SWJ-DP uses the external TCK pin as its clock source. This clock must be provided by the external JTAG master device. Some of the JTAG Instructions are used to access an Access Port (SMAP or AHB-AP). These instructions require the CPU clock to be running. If the CPU clock is not present because the CPU is in a Power Save Mode where this clock is not provided, the Power Manager(PM) will automatically restore the CPU clock on detection of a debug access. The RCSYS clock is used as CPU clock when the external reset is applied to ensure correct Access Port operations. 8.7.6 Module Initialization This module is enabled as soon as a TCK falling edge is detected when RESET_N is not asserted (refer to Section 8.7.7 below). Moreover, the module is synchronously reseted as long as the TAP machine is in the TEST_LOGIC_RESET (TLR) state. It is advised asserting TMS at least 5 TCK clock periods after the debugger has been detected to ensure the module is in the TLR state prior to any operation. This module also has the ability to maintain the Cortex-M4 under reset (refer to the Section 8.7.8 "SMAP Core Reset Request Source" on page 70). 8.7.7 Debugger Hot Plugging The TCK pin is dedicated to the EDP. After reset has been released, the EDP detects that a debugger has been attached when a TCK falling edge arises. Figure 8-4. TCK Debugger Hot Plugging Detection Timings Diagram TC K RESET_N RESET_N H ot Plugging Hot_plugging 69 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 The Debug Port pins assignation is then forced to the EDP function even if they were already assigned to another module. This allows to connect a debugger at any time without reseting the device. The connection is non-intrusive meaning that the chip will continue its execution without being disturbed. The CPU can of course be halted later on by issuing Cortex-M4 OCD features. 8.7.8 SMAP Core Reset Request Source The EDP has the ability to send a request to the SMAP for a Cortex-M4 Core reset. The procedure to do so is to hold TCK low until RESET_N is released. This mechanism aims at halting the CPU to prevent it from changing the system configuration while the SMAP is operating. Figure 8-5. SMAP Core Reset Request Timings Diagram TCK RESET_N EDP reset request C o re re s e t re q u e s t The SMAP can de-assert the core reset request for this operation, refer to Section 2.8.8 "CortexM4 Core Reset Source" on page 57. 8.7.9 SWJ-DP The Cortex-M4 embeds a SWJ-DP Debug port which is the standard CoreSightTM debug port. It combines Serial Wire Debug Port (SW-DP), from 2 to 3 pins and JTAG debug Port(JTAG-DP), 5 pins. By default, the JTAG Debug Port is active. If the host debugger wants to switch to the Serial Wire Debug Port, it must provide a dedicated JTAG sequence on TMS/SWDIO and TCK/SWCLK which disables JTAG-DP and enables SW-DP. When the EDP has been switched to Serial Wire mode, TDO/TRACESWO can be used for trace (for more information refer to the section below). The asynchronous TRACE output (TRACESWO) is multiplexed with TDO. So the asynchronous trace can only be used with SW-DP, not JTAG-DP. The SWJ-DP provides access to the AHB-AP and SMAP access ports which have the following APSEL value: Figure 8-6. Access Ports APSEL Acces Port (AP) APSEL AHB-AP 0 SMAP 1 Refer to the ARM Debug Interface v5.1 Architecture Specification for more details on SWJ-DP. 70 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.10 SW-DP and JTAG-DP Selection Mechanism After reset, the SWJ-DP is in JTAG mode but it can be switched to the Serial Wire mode. Debug port selection mechanism is done by sending specific SWDIOTMS sequence. The JTAG-DP is selected by default after reset. * Switch from JTAG-DP to SW-DP. The sequence is: - Send more than 50 SWCLKTCK cycles with SWDIOTMS = 1 - Send the 16-bit sequence on SWDIOTMS = 0111100111100111 (0x79E7 MSB first) - Send more than 50 SWCLKTCK cycles with SWDIOTMS = 1 * Switch from SWD to JTAG. The sequence is: - Send more than 50 SWCLKTCK cycles with SWDIOTMS = 1 - Send the 16-bit sequence on SWDIOTMS = 0011110011100111 (0x3CE7 MSB first) Send more than 50 SWCLKTCK cycles with SWDIOTMS = 1 Note that the BSCAN-TAP is not available when the debug port is switched to Serial Mode. Boundary scan instructions are not available. 8.7.11 JTAG-DP and BSCAN-TAP Selection Mechanism After the DP has been enabled, the BSCAN-TAP and the JTAG-DP run simultaneously has long as the SWJ-DP remains in JTAG mode. Each TAP captures simultaneously the JTAG instructions that are shifted. If an instruction is recognized by the BSCAN-TAP, then the BSCAN-TAP TDO is selected instead of the SWJ-DP TDO. TDO selection changes dynamically depending on the current instruction held in the BSCAN-TAP instruction register. 71 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.12 JTAG Instructions Summary The implemented JTAG instructions are shown in the table below. Table 8-2. IR instruction value Implemented JTAG instructions list Instruction Description availability when protected b0000 EXTEST Select boundary-scan chain as data register for testing circuitry external to the device. yes b0001 SAMPLE_PRELOAD Take a snapshot of external pin values without affecting system operation. yes b0100 INTEST Select boundary-scan chain for internal testing of the device. yes b0101 CLAMP Bypass device through Bypass register, while driving outputs from boundary-scan register. yes b1000 ABORT ARM JTAG-DP Instruction yes b1010 DPACC ARM JTAG-DP Instruction yes b1011 APACC ARM JTAG-DP Instruction yes b1100 - Reserved yes b1101 - Reserved yes b1110 IDCODE ARM JTAG-DP Instruction yes b1111 BYPASS Bypass this device through the bypass register. yes Component BSCAN-TAP SWJ-DP (in JTAG mode) 72 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.13 Security Restrictions The SAM4L provide a security restrictions mechanism to lock access to the device. The device in the protected state when the Flash Security Bit is set. Refer to section Flash Controller for more details. When the device is in the protected state the AHB-AP is locked. Full access to the AHB-AP is reenabled when the protected state is released by issuing a Chip Erase command. Note that the protected state will read as programmed only after the system has been reseted. 8.7.13.1 Notation Table 8-4 on page 73 shows bit patterns to be shifted in a format like "p01". Each character corresponds to one bit, and eight bits are grouped together for readability. The least significant bit is always shifted first, and the most significant bit shifted last. The symbols used are shown in Table 8-3. Table 8-3. Symbol Symbol Description Description 0 Constant low value - always reads as zero. 1 Constant high value - always reads as one. p The chip protected state. x A don't care bit. Any value can be shifted in, and output data should be ignored. e An error bit. Read as one if an error occurred, or zero if not. b A busy bit. Read as one if the SMAP was busy, or zero if it was not. s Startup done bit. Read as one if the system has started-up correctly. In many cases, it is not required to shift all bits through the data register. Bit patterns are shown using the full width of the shift register, but the suggested or required bits are emphasized using bold text. I.e. given the pattern "01010101 xxxxxxxx xxxxxxxx xxxxxxxx", the shift register is 32 bits, but the test or debug unit may choose to shift only 8 bits "01010101". The following describes how to interpret the fields in the instruction description tables: Table 8-4. Instruction Description Instruction Description IR input value Shows the bit pattern to shift into IR in the Shift-IR state in order to select this instruction. The pattern is show both in binary and in hexadecimal form for convenience. Example: 1000 (0x8) IR output value Shows the bit pattern shifted out of IR in the Shift-IR state when this instruction is active. Example: p00s 73 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 8-4. 8.7.14 8.7.14.1 Instruction Description (Continued) Instruction Description DR Size Shows the number of bits in the data register chain when this instruction is active. Example: 32 bits DR input value Shows which bit pattern to shift into the data register in the Shift-DR state when this instruction is active. DR output value Shows the bit pattern shifted out of the data register in the Shift-DR state when this instruction is active. JTAG Instructions Refer to the ARM Debug Interface v5.1 Architecture Specification for more details on ABORT, DPACC, APACC and IDCODE instructions. EXTEST This instruction selects the boundary-scan chain as Data Register for testing circuitry external to the chip package. The contents of the latched outputs of the boundary-scan chain is driven out as soon as the JTAG IR-register is loaded with the EXTEST instruction. Starting in Run-Test/Idle, the EXTEST instruction is accessed the following way: 1. Select the IR Scan path. 2. In Capture-IR: The IR output value is latched into the shift register. 3. In Shift-IR: The instruction register is shifted by the TCK input. 4. In Update-IR: The data from the boundary-scan chain is applied to the output pins. 5. Return to Run-Test/Idle. 6. Select the DR Scan path. 7. In Capture-DR: The data on the external pins is sampled into the boundary-scan chain. 8. In Shift-DR: The boundary-scan chain is shifted by the TCK input. 9. In Update-DR: The data from the scan chain is applied to the output pins. 10. Return to Run-Test/Idle. Table 8-5. 8.7.14.2 EXTEST Details Instructions Details IR input value 0000 (0x0) IR output value p00s DR Size Depending on boundary-scan chain, see BSDL-file. DR input value Depending on boundary-scan chain, see BSDL-file. DR output value Depending on boundary-scan chain, see BSDL-file. SAMPLE_PRELOAD This instruction takes a snap-shot of the input/output pins without affecting the system operation, and pre-loading the scan chain without updating the DR-latch. The boundary-scan chain is selected as Data Register. Starting in Run-Test/Idle, the Device Identification register is accessed in the following way: 74 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 1. Select the IR Scan path. 2. In Capture-IR: The IR output value is latched into the shift register. 3. In Shift-IR: The instruction register is shifted by the TCK input. 4. Return to Run-Test/Idle. 5. Select the DR Scan path. 6. In Capture-DR: The Data on the external pins are sampled into the boundary-scan chain. 7. In Shift-DR: The boundary-scan chain is shifted by the TCK input. 8. Return to Run-Test/Idle. Table 8-6. 8.7.14.3 SAMPLE_PRELOAD Details Instructions Details IR input value 0001 (0x1) IR output value p00s DR Size Depending on boundary-scan chain, see BSDL-file. DR input value Depending on boundary-scan chain, see BSDL-file. DR output value Depending on boundary-scan chain, see BSDL-file. INTEST This instruction selects the boundary-scan chain as Data Register for testing internal logic in the device. The logic inputs are determined by the boundary-scan chain, and the logic outputs are captured by the boundary-scan chain. The device output pins are driven from the boundary-scan chain. Starting in Run-Test/Idle, the INTEST instruction is accessed the following way: 1. Select the IR Scan path. 2. In Capture-IR: The IR output value is latched into the shift register. 3. In Shift-IR: The instruction register is shifted by the TCK input. 4. In Update-IR: The data from the boundary-scan chain is applied to the internal logic inputs. 5. Return to Run-Test/Idle. 6. Select the DR Scan path. 7. In Capture-DR: The data on the internal logic is sampled into the boundary-scan chain. 8. In Shift-DR: The boundary-scan chain is shifted by the TCK input. 9. In Update-DR: The data from the boundary-scan chain is applied to internal logic inputs. 10. Return to Run-Test/Idle. Table 8-7. INTEST Details Instructions Details IR input value 0100 (0x4) IR output value p001 DR Size Depending on boundary-scan chain, see BSDL-file. DR input value Depending on boundary-scan chain, see BSDL-file. DR output value Depending on boundary-scan chain, see BSDL-file. 75 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.7.14.4 CLAMP This instruction selects the Bypass register as Data Register. The device output pins are driven from the boundary-scan chain. Starting in Run-Test/Idle, the CLAMP instruction is accessed the following way: 1. Select the IR Scan path. 2. In Capture-IR: The IR output value is latched into the shift register. 3. In Shift-IR: The instruction register is shifted by the TCK input. 4. In Update-IR: The data from the boundary-scan chain is applied to the output pins. 5. Return to Run-Test/Idle. 6. Select the DR Scan path. 7. In Capture-DR: A logic `0' is loaded into the Bypass Register. 8. In Shift-DR: Data is scanned from TDI to TDO through the Bypass register. 9. Return to Run-Test/Idle. Table 8-8. CLAMP Details Instructions Details IR input value 0101 (0x5) IR output value p00s DR Size 1 DR input value x DR output value x 76 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.8 AHB-AP Access Port The AHB-AP is a Memory Access Port (MEM-AP) as defined in the ARM Debug Interface v5 Architecture Specification. The AHB-AP provides access to all memory and registers in the system, including processor registers through the System Control Space (SCS). System access is independent of the processor status. Either SW-DP or SWJ-DP is used to access the AHB-AP. The AHB-AP is a master into the Bus Matrix. Transactions are made using the AHB-AP programmers model (please refer to the ARM Cortex-M4 Technical Reference Manual), which generates AHB-Lite transactions into the Bus Matrix. The AHB-AP does not perform back-toback transactions on the bus, so all transactions are non-sequential. The AHB-AP can perform unaligned and bit-band transactions. The Bus Matrix handles these. The AHB-AP transactions are not subject to MPU lookups. AHB-AP transactions bypass the FPB, and so the FPB cannot remap AHB-AP transactions. AHB-AP transactions are little-endian. Note that while an external reset is applied, AHB-AP accesses are not possible. In addition, access is denied when the protected state is set. In order to discard the protected state, a chip erase operation is necessary. 77 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9 System Manager Access Port (SMAP) Rev.: 1.0.0.0 8.9.1 Features * * * * * 8.9.2 Chip Erase command and status Cortex-M4 core reset source 32-bit Cyclic Redundancy check of any memory accessible through the bus matrix Unlimited Flash User page read access Chip identification register Overview The SMAP provides memory-related services and also Cortex-M4 core reset control to a debugger through the Debug Port. This makes possible to halt the CPU and program the device after reset. 8.9.3 Block Diagram Figure 8-7. SMAP Block Diagram SMAP Ahb_Master System Bus Matrix AHB AHB DAP Bus DAP Interface Core Flash Controller chip_erase SMAP Core reset request PM Reset Controller Cortex-M4 core reset System reset 8.9.4 Initializing the Module The SMAP can be accessed only if the CPU clock is running and the SWJ-DP has been activated by issuing a CDBGPWRUP request. For more details, refer to the ARM Debug Interface v5.1 Architecture Specification. Then it must be enabled by writing a one to the EN bit of the CR register (CR.EN) before writing or reading other registers. If the SMAP is not enabled it will discard any read or write operation. 8.9.5 Stopping the Module To stop the module, the user must write a one to the DIS bit of the CR register (CR.DIS). All the user interface and internal registers will be cleared and the internal clock will be stopped. 78 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.6 Security Considerations In protected state this module may access sensible information located in the device memories. To avoid any risk of sensible data extraction from the module registers, all operations are non interruptible except by a disable command triggered by writing a one to CR.DIS. Issuing this command clears all the interface and internal registers. Some registers have some special protection: * It is not possible to read or write the LENGTH register when the part is protected. * In addition, when the part is protected and an operation is ongoing, it is not possible to read the ADDR and DATA registers. Once an operation has started, the user has to wait until it has terminated by polling the DONE field in the Status Register (SR.DONE). 8.9.7 Chip Erase The Chip erase operation consists in: 1. clearing all the volatile memories in the system 2. clearing the whole flash array 3. clearing the protected state No proprietary or sensitive information is left in volatile memories once the protected state is disabled. This feature is operated by writing a one to the CE bit of the Control Register (CR.CE). When the operation completes, SR.DONE is asserted. 8.9.8 Cortex-M4 Core Reset Source The SMAP processes the EDP Core hold reset requests (Refer to Section 1.1.8 "SMAP Core Reset Request Source" on page 6). When requested, it instructs the Power Manager to hold the Cortex-M4 core under reset. The SMAP can de-assert the core reset request if a one is written to the Hold Core Reset bit in the Status Clear Register (SCR.HCR). This has the effect of releasing the CPU from its reset state. To assert again this signal, a new reset sequence with TCK tied low must be issued. Note that clearing HCR with this module is only possible when it is enabled, for more information refer to Section 8.9.4 "Initializing the Module" on page 78. Also note that asserting RESET_N automatically clears HCR. 79 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.9 Unlimited Flash User Page Read Access The SMAP can access the User page even if the protected state is set. Prior to operate such an access, the user should check that the module is not busy by checking that SR.STATE is equal to zerp. Once the offset of the word to access inside the page is written in ADDR.ADDR, the read operation can be initiated by writing a one in CR.FSPR. The SR.STATE field will indicate the FSPR state. Addresses written to ADDR.ADDR must be world aligned. Failing to do so will result in unpredictable behavior. The result can be read in the DATA register as soon as SR.DONE rises. The ADDR field is used as an offset in the page, bits outside a page boundary will be silently discarded. The ADDR register is automatically incremented at the end of the read operation making possible to dump consecutive words without writing the next offset into ADDR.ADDR. 8.9.10 32-bit Cyclic Redundancy Check (CRC) The SMAP unit provides support for calculating a Cyclic Redundancy Check (CRC) value for a memory area. The algorithm used is the industry standard CRC32 algorithm using the generator polynomial 0xEDB88320. 8.9.10.1 Starting CRC Calculation To calculate CRC for a memory range, the start address must be written into the ADDR register, and the size of the memory range into the LENGTH register. Both the start address and the length must be word aligned. The initial value used for the CRC calculation must be written to the DATA register. This value will usually be 0xFFFFFFFF, but can be e.g. the result of a previous CRC calculation if generating a common CRC of separate memory blocks. Once completed, the calculated CRC value can be read out of the DATA register. The read value must be inverted to match standard CRC32 implementations, or kept non-inverted if used as starting point for subsequent CRC calculations. If the device is in protected state, it is only possible to calculate the CRC of the whole flash array. In most cases this area will be the entire onboard nonvolatile memory. The ADDR, LENGTH, and DATA registers will be forced to predefined values once the CRC operation is started, and user-written values are ignored. This allows the user to verify the contents of a protected device. The actual test is started by writing a one in CR.CRC. A running CRC operation can be cancelled by disabling the module (write a one in CR.DIS). This has the effect of resetting the module. The module has to be restarted by issuing an enable command (write a one in CR.EN). 8.9.10.2 Interpreting the Results The user should monitor the SR register (Refer to Section 8.9.11.2 "Status Register" on page 83). When the operation is completed SR.DONE is set. Then the SR.BERR and SR.FAIL must be read to ensure that no bus error nor functional error occured. 80 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11 SMAP User Interface Table 8-9. SMAP Register Memory Map Offset Register Register Name Access Access (unprotected) (protected) 0x0000 Control Register CR Write-Only 0x0004 Status Register SR Read-Only 0x0008 Status Clear Register SCR Write-Only 0x000C Address Register ADDR Read/Write 0x0010 Length Register LENGTH Read/Write Write-Only (partial) Reset (2) Read-Only Write-Only (partial) 0x00000000 0x00000000 (3) 0x00000000 (4) 0x00000000 Read/Write (partial) denied 0x0014 Data Register DATA Read/Write 0x0028 VERSION Register VERSION Read-Only Read-Only -(1) 0x00F0 Chip ID Register CIDR Read-Only Read-Only -(1) 0x00F4 Chip ID Extension Register EXID Read-Only Read-Only -(1) 0x00FC AP Identification register IDR Read-Only Read-Only 0x003E0000 Note: Read/Write (partial) 0x00000000 (4) 0x00000000 1. The reset value for this register is device specific. Refer to the Module Configuration section at the end of this chapter. 2. CR.MBIST is ignored 3. SCR.HCR is ignored 4. Access is not allowed when an operation is ongoing 81 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.1 Name: Control Register CR Access Type: Write-Only Offset: 0x00 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 - - - - - - - - 23 22 21 20 19 18 17 16 - - - - - - - - 15 14 13 12 11 10 9 8 - - - - - - - - 7 6 5 4 3 2 1 0 - - - CE FSPR CRC DIS EN Writing a zero to a bit in this register has no effect. * CE: Chip Erase Writing a one to this bit triggers the FLASH Erase All (EA) operation which clears all volatile memories, the whole flash array, the general purpose fuses and the protected state. The Status register DONE field indicates the completion of the operation. Reading this bit always returns 0 * FSPR: Flash User Page Read Writing a one to this bit triggers a read operation in the User page. The word pointed by the ADDR register in the page is read and written to the DATA register. ADDR is post incremented allowing a burst of reads without modifying ADDR. SR.DONE must be read high prior to reading the DATA register. Reading this bit always returns 0 * CRC: Cyclic Redundancy Code Writing a one triggers a CRC calculation over a memory area defined by the ADDR and LENGTH registers. Reading this bit always returns 0 Note: This feature is restricted while in protected state * DIS: Disable Writing a one to this bit disables the module. Disabling the module resets the whole module immediately. * EN: Enable Writing a one to this bit enables the module. 82 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.2 Name: Status Register SR Access Type: Read-Only Offset: 0x04 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 - - - - - 23 22 21 20 19 18 17 16 - - - - - - - - 15 14 13 12 11 10 9 8 - - - - - DBGP PROT EN 7 6 5 4 3 2 1 0 - - - LCK FAIL BERR HCR DONE STATE * STATE: State Value State Description 0 IDLE Idle state 1 CE Chip erase operation is ongoing 2 CRC32 CRC32 operation is ongoing 3 FSPR Flash User Page Read 4-7 - reserved * DBGP: Debugger present 1: A debugger is present (TCK falling edge detected) 0: No debugger is present * PROT: Protected 1: The protected state is set. The only way to overcome this is to issue a Chip Erase command. 0: The protected state is not set * EN: Enabled 1: The block is in ready for operation 0: the block is disabled. Write operations are not possible until the block is enabled by writing a one in CR.EN. * LCK: Lock 1: An operation could not be performed because chip protected state is on. 0: No security issues have been detected sincle last clear of this bit * FAIL: Failure 1: The requested operation failed 0: No failure has been detected sincle last clear of this bit * BERR: Bus Error 1: A bus error occured due to the unability to access part of the requested memory area. 83 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 0: No bus error has been detected sincle last clear of this bit * HCR: Hold Core reset 1: The Cortex-M4 core is held under reset 0: The Cortex-M4 core is not held under reset * DONE: Operation done 1: At least one operation has terminated since last clear of this field 0: No operation has terminated since last clear of this field 84 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.3 Name: Status Clear Register SCR Access Type: Write-Only Offset: 0x08 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 - - - - - - - - 23 22 21 20 19 18 17 16 - - - - - - - - 15 14 13 12 11 10 9 8 - - - - - - - - 7 6 5 4 3 2 1 0 - - - LCK FAIL BERR HCR DONE Writing a zero to a bit in this register has no effect. Writing a one to a bit clears the corresponding SR bit Note: Writing a one to bit HCR while the chip is in protected state has no effect 85 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.4 Name: Address Register ADDR Access Type: Read/Write Offset: 0x0C Reset Value: 0x00000000 31 30 29 28 27 26 25 24 19 18 17 16 11 10 9 8 3 2 1 0 - - ADDR 23 22 21 20 ADDR 15 14 13 12 ADDR 7 6 5 4 ADDR * ADDR: Address Value Addess values are always world aligned 86 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.5 Name: Length Register LENGTH Access Type: Read/Write Offset: 0x10 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 19 18 17 16 11 10 9 8 3 2 1 0 - - LENGTH 23 22 21 20 LENGTH 15 14 13 12 LENGTH 7 6 5 4 LENGTH * LENGTH: Length Value, Bits 1-0 are always zero 87 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.6 Name: Data Register DATA Access Type: Read/Write Offset: 0x14 Reset Value: 0x00000000 31 30 29 28 27 26 25 24 19 18 17 16 11 10 9 8 3 2 1 0 DATA 23 22 21 20 DATA 15 14 13 12 DATA 7 6 5 4 DATA * DATA: Generic data register 88 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.7 Name: Module Version VERSION Access Type: Read-Only Offset: 0x28 Reset Value: - 31 30 29 28 27 26 25 24 - - - - - - - - 23 22 21 20 19 18 17 16 - - - - 15 14 13 12 9 8 - - - - 7 6 5 4 1 0 VARIANT 11 10 VERSION 3 2 VERSION * VARIANT: Variant number Reserved. No functionality associated. * VERSION: Version number Version number of the module. No functionality associated. 89 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.8 Name: Chip Identification Register CIDR Access Type: Read-Only Offset: 0xF0 Reset Value: - 31 30 29 EXT 23 28 27 NVPTYP 22 21 20 19 18 24 17 16 9 8 1 0 SRAMSIZ 14 13 12 11 10 NVPSIZ2 7 25 ARCH ARCH 15 26 6 NVPSIZ 5 EPROC 4 3 2 VERSION Note: Refer to section CHIPID for more information on this register. 90 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.9 Name: Chip Identification Extension Register EXID Access Type: Read-Only Offset: 0xF4 Reset Value: - 31 30 29 28 27 26 25 24 19 18 17 16 11 10 9 8 3 2 1 0 EXID 23 22 21 20 EXID 15 14 13 12 EXID 7 6 5 4 EXID Note: Refer to section CHIPID for more information on this register. 91 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.9.11.10 Name: Identification Register IDR Access Type: Read-Only Offset: 0xFC Reset Value: - 31 30 29 28 27 26 REVISION 23 22 25 24 17 16 CC 21 20 19 18 IC 15 14 13 CLSS 12 11 10 9 8 3 2 1 0 Reserved 7 6 5 APID 4 APIDV * REVISION: Revision * CC: JEP-106 Continuation Code Atmel continuation code is 0x0 * IC: JEP-106 Identity Code Atmel identification code is 0x1F * CLSS: Class 0: This AP is not a Memory Access Port 1: This AP is a Memory Access Port * APID: AP Identification * APIDV: AP Identification Variant For more information about this register, refer to the ARM Debug Interface v5.1 Architecture Specification document. 92 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.10 Available Features in Protected State Table 8-10. Features availablility when in protected state Feature Provider Availability when protected Hot plugging EDP yes System bus R/W Access AHB-AP no Flash User Page read access SMAP yes Core Hold Reset clear from the SMAP interface SMAP no CRC32 of any memory accessible through the bus matrix SMAP restricted (limited to the entire flash array) Chip Erase SMAP yes IDCODE SMAP yes 93 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.11 8.11.1 Functional Description Debug Environment Figure 8-8 shows a complete debug environment example. The SWJ-DP interface is used for standard debugging functions, such as downloading code and single-stepping through the program and viewing core and peripheral registers. Figure 8-8. Application Debug Environment Example Host Debugger PC SWJ-DP Emulator/Probe SWJ-DP Connector SAM4 SAM4-based Application Board 8.11.2 Test Environment Figure 8-9 shows a test environment example (JTAG Boundary scan). Test vectors are sent and interpreted by the tester. In this example, the "board in test" is designed using a number of JTAG-compliant devices. These devices can be connected to form a single scan chain. 94 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 8-9. Application Test Environment Example Test Adaptor Tester JTAG Probe JTAG Connector SAM4 Chip n Chip 2 Chip 1 SAM4-based Application Board In Test 8.11.3 How to initialize test and debug features To enable the JTAG pins a falling edge event must be detected on the TCK pin at any time after the RESET_N pin is released. Certain operations requires that the system is prevented from running code after reset is released. This is done by holding low the TCK pin after the RESET_N is released. This makes the SMAP assert the core_hold_reset signal that hold the Cortex-M4 core under reset. To make the CPU run again, clear the CHR bit in the Status Register (SR.CHR) to de-assert the core_hold_reset signal. Independent of the initial state of the TAP Controller, the Test-LogicReset state can always be entered by holding TMS high for 5 TCK clock periods. This sequence should always be applied at the start of a JTAG session and after enabling the JTAG pins to bring the TAP Controller into a defined state before applying JTAG commands. Applying a 0 on TMS for 1 TCK period brings the TAP Controller to the Run-Test/Idle state, which is the starting point for JTAG operations. 8.11.4 How to disable test and debug features To disable the JTAG pins the TCK pin must be held high while RESET_N pin is released. 8.11.5 Typical JTAG sequence Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is: 8.11.5.1 Scanning in JTAG instruction At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift Instruction Register - Shift-IR state. While in this state, shift the 4 bits of the JTAG instructions into the JTAG instruction register from the TDI input at the rising edge of TCK. The TMS input must be held low during input of the 4 LSBs in order to remain in the Shift-IR state. The JTAG Instruction selects a particular Data Register as path between TDI and TDO and controls the circuitry surrounding the selected Data Register. 95 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched onto the parallel output from the shift register path in the Update-IR state. The Exit-IR, Pause-IR, and Exit2-IR states are only used for navigating the state machine. Figure 8-10. Scanning in JTAG instruction TCK TAP State TLR RTI SelDR SelIR CapIR ShIR Ex1IR UpdIR RTI TMS TDI TDO 8.11.5.2 Instruction ImplDefined Scanning in/out data At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift Data Register - Shift-DR state. While in this state, upload the selected Data Register (selected by the present JTAG instruction in the JTAG Instruction Register) from the TDI input at the rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must be held low. While the Data Register is shifted in from the TDI pin, the parallel inputs to the Data Register captured in the Capture-DR state is shifted out on the TDO pin. Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data Register has a latched parallel-output, the latching takes place in the Update-DR state. The Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine. As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting JTAG instruction and using Data Registers. 8.11.6 Boundary-Scan The Boundary-Scan chain has the capability of driving and observing the logic levels on the digital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having off-chip connections. At system level, all ICs having JTAG capabilities are connected serially by the TDI/TDO signals to form a long shift register. An external controller sets up the devices to drive values at their output pins, and observe the input values received from other devices. The controller compares the received data with the expected result. In this way, Boundary-Scan provides a mechanism for testing interconnections and integrity of components on Printed Circuits Boards by using the 4 TAP signals only. The four IEEE 1149.1 defined mandatory JTAG instructions IDCODE, BYPASS, SAMPLE/PRELOAD, and EXTEST can be used for testing the Printed Circuit Board. Initial scanning of the data register path will show the ID-code of the device, since IDCODE is the default JTAG instruction. It may be desirable to have the device in reset during test mode. If not reset, inputs to the device may be determined by the scan operations, and the internal software may be in an undetermined state when exiting the test mode. Entering reset, the outputs of any Port Pin will instantly enter the high impedance state, making the HIGHZ instruction redundant. If needed, the BYPASS instruction can be issued to make the shortest possible scan chain through the device. The device can be set in the reset state by pulling the external RESET_N pin low. The EXTEST instruction is used for sampling external pins and loading output pins with data. The data from the output latch will be driven out on the pins as soon as the EXTEST instruction is loaded into the JTAG IR-register. Therefore, the SAMPLE/PRELOAD should also be used for setting initial values to the scan ring, to avoid damaging the board when issuing the EXTEST 96 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 instruction for the first time. SAMPLE/PRELOAD can also be used for taking a snapshot of the external pins during normal operation of the part. When using the JTAG interface for Boundary-Scan, the JTAG TCK clock is independent of the internal chip clock, which is not required to run. NOTE: For pins connected to 5V lines care should be taken to not drive the pins to a logic one using boundary scan, as this will create a current flowing from the 3,3V driver to the 5V pullup on the line. Optionally a series resistor can be added between the line and the pin to reduce the current. 8.11.7 Flash Programming typical procedure Flash programming is performed by operating Flash controller commands. The Flash controller is connected to the system bus matrix and is then controllable from the AHP-AP. The AHB-AP cannot write the FLASH page buffer while the core_hold_reset is asserted. The AHB-AP cannot be accessed when the device is in protected state. It is important to ensure that the CPU is halted prior to operating any flash programming operation to prevent it from corrupting the system configuration. The recommended sequence is shown below: 1. At power up, RESET_N is driven low by a debugger. The on-chip regulator holds the system in a POR state until the input supply is above the POR threshold. The system continues to be held in this static state until the internally regulated supplies have reached a safe operating. 2. PM starts, clocks are switched to the slow clock (Core Clock, System Clock, Flash Clock, and any Bus Clocks that do not have clock gate control). Internal resets are maintained due to the external reset. - The Debug Port (DP) and Access Ports (AP) receives a clock and leave the reset state, 3. The debugger maintains a low level on TCK and release RESET_N. - The SMAP asserts the core_hold_reset signal 4. The Cortex-M4 core remains in reset state, meanwhile the rest of the system is released. 5. The debugger then configures the NVIC to catch the Cortex-M4 core reset vector fetch. For more information on how to program the NVIC, refer to the ARMv7-M Architecture Reference Manual. 6. The debugger writes a one in the SMAP SCR.HCR to release the Cortex-M4 core reset to make the system bus matrix accessible from the AHB-AP. 7. The Cortex-M4 core initializes the SP, then read the exception vector and stalls 8. Programming is available through the AHB-AP 9. After operation is completed, the chip can be restarted either by asserting RESET_N or switching power off/on or clearing SCR.HCR. Make sure that the TCK pin is high when releasing RESET_N not to halt the core. 97 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8.11.8 Chip erase typical procedure The chip erase operation is triggered by writing a one in the CE bit in the Control Register (CR.CE). This clears first all volatile memories in the system and second the whole flash array. Note that the User page is not erased in this process. To ensure that the chip erase operation is completed, check the DONE bit in the Status Register (SR.DONE). Also note that the chip erase operation depends on clocks and power management features that can be altered by the CPU. It is important to ensure that it is stopped. The recommended sequence is shown below: 1. At power up, RESET_N is driven low by a debugger. The on-chip regulator holds the system in a POR state until the input supply is above the POR threshold. The system continues to be held in this static state until the internally regulated supplies have reached a safe operating. 2. PM starts, clocks are switched to the slow clock (Core Clock, System Clock, Flash Clock, and any Bus Clocks that do not have clock gate control). Internal resets are maintained due to the external reset. - The debug port and access ports receives a clock and leave the reset state 3. The debugger maintains a low level on TCK and release RESET_N. - The SMAP asserts the core_hold_reset signal 4. The Cortex-M4 core remains in reset state, meanwhile the rest of the system is released. 5. The Chip erase operation can be performed by issuing the SMAP Chip Erase command. In this case: - volatile memories are cleared first - followed by the clearing of the flash array - followed by the clearing of the protected state 6. After operation is completed, the chip must be restarted by either controling RESET_N or switching power off/on. Make sure that the TCK pin is high when releasing RESET_N not to halt the core. 8.11.9 Setting the protected state This is done by issuing a specific flash controller command, for more information, refer to the Flash Controller chapter and to section 8.11.7Flash Programming typical procedure97. The protected state is defined by a highly secure Flash builtin mechanism. Note that for this programmation to propagate, it is required to reset the chip. 98 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9. Electrical Characteristics 9.1 Absolute Maximum Ratings* Table 9-1. Absolute Maximum Ratings Operating temperature .................................... -40C to +85C *NOTICE: Storage temperature ...................................... -60C to +150C Voltage on input pins with respect to ground ..........................-0.3V to VVDD (1)+0.3V Total DC output current on all I/O pins VDDIO ......................................................................... 120 mA Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Total DC output current on all I/O pins VDDIN ........................................................................ 100 mA Total DC output current on all I/O pins VDDANA........................................................................ 50 mA Maximum operating voltage VDDIO, VDDIN .................... 3.6V 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 9.2 Operating Conditions All the electrical characteristics are applicable to the following conditions unless otherwise specified : - operating voltage range 1,68V to 3,6V for VDDIN, VDDIO & VDDANA - Power Scaling 0 and 2 modes - operating temperature range: TA = -40C to 85C and for a junction temperature up to TJ = 100C. Typical values are base on TA = 25c and VDDIN,VDDIO,VDDANA = 3,3V unless otherwise specified 9.3 Supply Characteristics Table 9-2. Supply Characteristics Voltage Symbol VVDDIO, VVDDIN, VVDDANA Conditions Min PS1 (FCPU<=12MHz) Linear mode 1.68 PS0 & PS2 (FCPU>12MHz) Linear mode 1.8 Switching mode 1. Max Unit 3.6 V 2.0 (1) Below 2.3V, linear mode is more power efficient than switching mode. Refer to Section 6. "Power and Startup Considerations" on page 46 for details about Power Supply 99 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-3. Supply Rise Rates and Order (1) VDDIO, VDDIN and VDDANA must be connected together and as a consequence, rise synchronously Rise Rate Symbol Parameter Min Max Unit VVDDIO DC supply peripheral I/Os 0.0001 2.5 V/s VVDDIN DC supply peripheral I/Os and internal regulator 0.0001 2.5 V/s VVDDANA Analog supply voltage 0.0001 2.5 V/s 1. Comment These values are based on characterization. These values are not covered by test limits in production. 100 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.4 Maximum Clock Frequencies Table 9-4. Maximum Clock Frequencies in Power Scaling Mode 0/2 and RUN Mode Symbol Parameter Description Max fCPU CPU clock frequency 48 fPBA PBA clock frequency 48 fPBB PBB clock frequency 48 fPBC PBC clock frequency 48 fPBD PBD clock frequency 48 fGCLK0 GCLK0 clock frequency DFLLIF main reference, GCLK0 pin 50 fGCLK1 GCLK1 clock frequency DFLLIF dithering and SSG reference, GCLK1 pin 50 fGCLK2 GCLK2 clock frequency AST, GCLK2 pin 20 fGCLK3 GCLK3 clock frequency CATB, GCLK3 pin 50 fGCLK4 GCLK4 clock frequency FLO and AESA 50 fGCLK5 GCLK5 clock frequency GLOC, TC0 and RC32KIFB_REF 80 fGCLK6 GCLK6 clock frequency ABDACB and IISC 50 fGCLK7 GCLK7 clock frequency USBC 50 fGCLK8 GCLK8 clock frequency TC1 and PEVC[0] 50 fGCLK9 GCLK9 clock frequency PLL0 and PEVC[1] 50 fGCLK10 GCLK10 clock frequency ADCIFE 50 fGCLK11 GCLK11 clock frequency Master generic clock. Can be used as source for other generic clocks 150 Oscillator 0 in crystal mode 30 fOSC0 OSC0 output frequency Oscillator 0 in digital clock mode 50 fPLL PLL output frequency Phase Locked Loop 240 fDFLL DFLL output frequency Digital Frequency Locked Loop 220 fRC80M RC80M output frequency Internal 80MHz RC Oscillator 80 Units MHz 101 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-5. Maximum Clock Frequencies in Power Scaling Mode 1 and RUN Mode Symbol Parameter Description Max fCPU CPU clock frequency 12 fPBA PBA clock frequency 12 fPBB PBB clock frequency 12 fPBC PBC clock frequency 12 fPBD PBD clock frequency 12 fGCLK0 GCLK0 clock frequency DFLLIF main reference, GCLK0 pin 16.6 fGCLK1 GCLK1 clock frequency DFLLIF dithering and SSGreference, GCLK1 pin 16.6 fGCLK2 GCLK2 clock frequency AST, GCLK2 pin 6.6 fGCLK3 GCLK3 clock frequency CATB, GCLK3 pin 17.3 fGCLK4 GCLK4 clock frequency FLO and AESA 16.6 fGCLK5 GCLK5 clock frequency GLOC, TC0 and RC32KIFB_REF 26.6 fGCLK6 GCLK6 clock frequency ABDACB and IISC 16.6 fGCLK7 GCLK7 clock frequency USBC 16.6 fGCLK8 GCLK8 clock frequency TC1 and PEVC[0] 16.6 fGCLK9 GCLK9 clock frequency PLL0 and PEVC[1] 16.6 fGCLK10 GCLK10 clock frequency ADCIFE 16.6 fGCLK11 GCLK11 clock frequency Master generic clock. Can be used as source for other generic clocks 51.2 fOSC0 OSC0 output frequency fPLL Oscillator 0 in crystal mode 16 Oscillator 0 in digital clock mode 16 PLL output frequency Phase Locked Loop N/A fDFLL DFLL output frequency Digital Frequency Locked Loop N/A fRC80M RC80M output frequency Internal 80MHz RC Oscillator N/A Units MHz 102 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.5 Power Consumption 9.5.1 Power Scaling 0 and 2 The values in Table 9-6 are measured values of power consumption under the following conditions, except where noted: * Operating conditions for power scaling mode 0 and 2 - VVDDIN = 3.3V - Power Scaling mode 0 is used for CPU frequencies under 36MHz - Power Scaling mode 2 is used for CPU frequencies above 36MHz * Wake up time from low power modes is measured from the edge of the wakeup signal to the first instruction fetched in flash. * Oscillators - OSC0 (crystal oscillator) stopped - OSC32K (32kHz crystal oscillator) running with external 32kHz crystal - DFLL using OSC32K as reference and running at 48MHz * Clocks - DFLL used as main clock source - CPU, AHB clocks undivided - APBC and APBD clocks divided by 4 - APBA and APBB bridges off - The following peripheral clocks running * PM, SCIF, AST, FLASHCALW, APBC and APBD bridges - All other peripheral clocks stopped * I/Os are inactive with internal pull-up * CPU is running on flash with 1 wait state * Low power cache enabled * BOD18 and BOD33 disabled Table 9-6. Mode ATSAM4L4/2 Current consumption and Wakeup time for power scaling mode 0 and 2 Conditions TA CPU running a Fibonacci algorithm Linear mode 25C Typical Wakeup Time Typ Max (1) 296 326 300 332 320 377 326 380 177 198 179 200 186 232 195 239 Unit N/A 85C CPU running a CoreMark algorithm Linear mode 25C CPU running a Fibonacci algorithm Switching mode 25C CPU running a CoreMark algorithm Switching mode 25C N/A 85C RUN A/MHz N/A 85C 85C N/A 103 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-6. ATSAM4L4/2 Current consumption and Wakeup time for power scaling mode 0 and 2 Max (1) 3817 4033 3934 4174 2341 2477 2437 2585 1758 1862 1847 1971 51 60 5.9 8.7 4.7 7.6 3.1 5.1 AST and OSC32K stopped 2.2 4.2 OSC32K running AST running at 1kHz 1.5 3.1 AST and OSC32K stopped 0.9 1.7 Conditions SLEEP0 Switching mode TA 25C 85C 25C SLEEP1 Switching mode 85C 25C SLEEP2 Switching mode 85C SLEEP3 Typical Wakeup Time Typ Mode 9 * Main clock cycles 9 * Main clock cycles + 500ns 9 * Main clock cycles + 500ns Linear mode OSC32K and AST running Fast wake-up enable WAIT RETENTION BACKUP OSC32K running AST running at 1kHz 25C 1.5s These values are based on characterization. These values are not covered by test limits in production. Table 9-7. Mode A 1.5s OSC32K and AST stopped Fast wake-up enable 1. Unit ATSAM4L8 Current consumption and Wakeup time for power scaling mode 0 and 2 Conditions TA CPU running a Fibonacci algorithm Linear mode 25C Typical Wakeup Time Typ Max (1) 319 343 326 350 343 387 351 416 181 198 186 203 192 232 202 239 Unit N/A 85C CPU running a CoreMark algorithm Linear mode 25C CPU running a Fibonacci algorithm Switching mode 25C CPU running a CoreMark algorithm Switching mode 25C N/A 85C RUN A/MHz N/A 85C 85C N/A 104 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-7. ATSAM4L8 Current consumption and Wakeup time for power scaling mode 0 and 2 Mode Conditions TA SLEEP0 Switching mode 25C 85C 25C SLEEP1 Switching mode 85C 25C SLEEP2 Switching mode 85C SLEEP3 Typical Wakeup Time 9 * Main clock cycles 9 * Main clock cycles + 500ns 9 * Main clock cycles + 500ns Linear mode OSC32K and AST running Fast wake-up enable 3817 4033 4050 4507 2341 2477 2525 2832 1758 1862 1925 1971 51 60 Unit A 1.5s OSC32K and AST stopped Fast wake-up enable RETENTION BACKUP 9.5.2 Max (1) 6.7 WAIT 1. Typ OSC32K running AST running at 1kHz 5.5 25C 3.9 1.5s AST and OSC32K stopped 3.0 OSC32K running AST running at 1kHz 1.5 3.1 AST and OSC32K stopped 0.9 1.7 These values are based on characterization. These values are not covered by test limits in production. Power Scaling 1 The values in Table 34-7 are measured values of power consumption under the following conditions, except where noted: * Operating conditions for power scaling mode 1 - VVDDIN = 3.3V * Wake up time from low power modes is measured from the edge of the wakeup signal to the first instruction fetched in flash. * Oscillators - OSC0 (crystal oscillator) and OSC32K (32kHz crystal oscillator) stopped - RCFAST Running at 12MHz * Clocks - RCFAST used as main clock source - CPU, AHB clocks undivided - APBC and APBD clocks divided by 4 - APBA and APBB bridges off - The following peripheral clocks running * PM, SCIF, AST, FLASHCALW, APBC and APBD bridges 105 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 - All other peripheral clocks stopped * I/Os are inactive with internal pull-up * CPU is running on flash with 1 wait state * Low power cache enabled * BOD18 and BOD33 disabled Table 9-8. Mode ATSAM4L4/2 Current consumption and Wakeup time for power scaling mode 1 Typical Wakeup Time Typ Max (1) 205 224 212 231 213 244 230 270 95 112 100 119 100 128 107 138 527 627 579 739 369 445 404 564 305 381 334 442 Linear mode 46 55 OSC32K and AST running Fast wake-up enable 4.7 7.5 3.5 6.3 2.6 4.8 AST and OSC32K stopped 1.5 4 OSC32K running AST running at 1kHz 1.5 3.1 AST and OSC32K stopped 0.9 1.7 Conditions TA CPU running a Fibonacci algorithm Linear mode 25C N/A 85C CPU running a CoreMark algorithm Linear mode 25C CPU running a Fibonacci algorithm Switching mode 25C CPU running a CoreMark algorithm Switching mode 25C N/A 85C RUN A/MHz Switching mode 25C Switching mode 85C 25C SLEEP2 Switching mode 85C SLEEP3 N/A 85C 85C SLEEP1 N/A 85C 25C SLEEP0 WAIT 9 * Main clock cycles 9 * Main clock cycles + 500ns 9 * Main clock cycles + 500ns A 1.5s OSC32K and AST stopped Fast wake-up enable RETENTION BACKUP 1. Unit OSC32K running AST running at 1kHz 25C 1.5s These values are based on characterization. These values are not covered by test limits in production. 106 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-9. Mode ATSAM4L8 Current consumption and Wakeup time for power scaling mode 1 Conditions TA CPU running a Fibonacci algorithm Linear mode 25C Typical Wakeup Time Typ Max (1) 222 240 233 276 233 276 230 270 100 112 100 119 104 128 107 138 527 627 579 739 369 445 404 564 305 381 334 442 46 55 N/A 85C CPU running a CoreMark algorithm Linear mode 25C CPU running a Fibonacci algorithm Switching mode 25C CPU running a CoreMark algorithm Switching mode 25C N/A 85C RUN A/MHz Switching mode 25C Switching mode 85C 25C SLEEP2 Switching mode 85C SLEEP3 N/A 85C 85C SLEEP1 N/A 85C 25C SLEEP0 9 * Main clock cycles 9 * Main clock cycles + 500ns 9 * Main clock cycles + 500ns Linear mode OSC32K and AST running Fast wake-up enable 5.5 WAIT A 1.5s OSC32K and AST stopped Fast wake-up enable RETENTION BACKUP 1. Unit OSC32K running AST running at 1kHz 4.3 25C 3.4 1.5s AST and OSC32K stopped 2.3 OSC32K running AST running at 1kHz 1.5 3.1 AST and OSC32K stopped 0.9 1.7 These values are based on characterization. These values are not covered by test limits in production. Table 9-10. Clock Source Typical Power Consumption running CoreMark on CPU clock sources (1) Conditions Regulator Frequency (MHz) Typ Unit 107 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-10. RCSYS (MCSEL = 0) Typical Power Consumption running CoreMark on CPU clock sources (1) 0.115 978 0.5 354 12 114 12 228 30 219 0.6 292 12 111 12 193 50 194 40 188 50 185 Power scaling mode 0 Input Freq = 32kHz from OSC32K 20 214 Power scaling mode 2 Input Freq = 32kHz from OSC32K 50 195 RC1M (MCSEL = 4) Power scaling mode 1 1 267 RCFAST (MCSEL = 5) Power scaling mode 1 RCFAST frequency is configurable from 4 to 12MHz 4 153 12 114 RC80M (MCSEL = 6) Power scaling mode 2 fCPU = RC80M / 2 = 40MHz 40 211 Power scaling mode 1 Power scaling mode 1 OSC0 (MCSEL = 1) Power scaling mode 0 OSC0 (MCSEL = 1) External Clock (MODE=0) PLL (MCSEL = 2) DFLL (MCSEL = 3) 1. Power scaling mode 1 Power scaling mode 0 Power scaling mode 2 Power scaling mode 2 Input Freq = 4MHz from OSC0 Switching Mode A/MHz These values are based on characterization. These values are not covered by test limits in production. 108 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 9-1. Note: Typical Power Consumption running Coremark (from above table) For variable frequency oscillators, linear interpolation between high and low settings Figure 9-2. Measurement Schematic, Switching Mode VDDIN VDDANA VDDIO VDDOUT Amp 0 VDDCORE 109 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.5.3 Peripheral Power Consumption in Power Scaling mode 0 and 2 The values in Table 9-11 are measured values of power consumption under the following conditions: * Operating conditions, internal core supply (Figure 9-2) - VVDDIN = 3.3V - VVDDCORE supplied by the internal regulator in switching mode * TA = 25C * Oscillators - OSC0 (crystal oscillator) stopped - OSC32K (32KHz crystal oscillator) running with external 32KHz crystal - DFLL running at 48MHz with OSC32K as reference clock * Clocks - DFLL used as main clock source - CPU, AHB, and PB clocks undivided * I/Os are inactive with internal pull-up * Flash enabled in high speed mode * CPU in SLEEP0 mode * BOD18 and BOD33 disabled Consumption active is the added current consumption when the module clock is turned on. 110 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-11. Peripheral Typ Consumption Active IISC 1.0 SPI 1.9 TC 6.3 TWIM 1.5 TWIS 1.2 USART ADCIFE 9.5.4 Typical Current Consumption by Peripheral in Power Scaling Mode 0 and 2 (1) Unit 8.5 (2) 3.1 DACC 1.3 ACIFC (2) 3.1 GLOC 0.4 ABDACB 0.7 TRNG 0.9 PARC 0.7 CATB 3.0 LCDCA 4.4 PDCA 1.0 CRCCU 0.3 USBC 1.5 PEVC 5.6 CHIPID 0.1 SCIF 6.4 FREQM 0.5 GPIO 7.1 BPM 0.9 BSCIF 4.6 AST 1.5 WDT 1.4 EIC 0.6 PICOUART 0.3 A/MHz 1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies 2. Includes the current consumption on VDDANA and ADVREFP. .Peripheral Power Consumption in Power Scaling mode 1 The values in Table 9-13 are measured values of power consumption under the following conditions: 111 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 * Operating conditions, internal core supply (Figure 9-2) - VVDDIN = 3.3V - VVDDCORE = 1.2 V, supplied by the internal regulator in switching mode * TA = 25C * Oscillators - OSC0 (crystal oscillator) stopped - OSC32K (32KHz crystal oscillator) running with external 32KHz crystal - RCFAST running @ 12MHz * Clocks - RCFAST used as main clock source - CPU, AHB, and PB clocks undivided * I/Os are inactive with internal pull-up * Flash enabled in normal mode * CPU in SLEEP0 mode * BOD18 and BOD33 disabled Consumption active is the added current consumption when the module clock is turned on 112 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-12. Peripheral Typical Current Consumption by Peripheral in Power Scaling Mode 1 (1) Typ Consumption Active IISC 0.5 SPI 1.1 TC 3.1 TWIM 0.8 TWIS 0.7 USART ADCIFE Unit 4.4 (2) 1.6 DACC 0.6 ACIFC (2) 1.6 GLOC 0.1 ABDACB 0.3 TRNG 0.3 PARC 0.3 CATB 1.5 LCDCA 2.2 PDCA 0.4 CRCCU 0.3 USBC 0.9 PEVC 2.8 CHIPID 0.1 SCIF 3.1 FREQM 0.2 GPIO 3.4 BPM 0.4 BSCIF 2.3 AST 0.8 WDT 0.8 EIC 0.3 PICOUART 0.2 A/MHz 1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies 2. Includes the current consumption on VDDANA and ADVREFP. 113 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.6 I/O Pin Characteristics 9.6.1 Normal I/O Pin Table 9-13. Symbol RPULLUP Normal I/O Pin Characteristics (1) Parameter Pull-up resistance Conditions Min (2) (2) Typ Max 40 k 40 k RPULLDOWN Pull-down resistance VIL Input low-level voltage -0.3 0.2 * VVDD VIH Input high-level voltage 0.8 * VVDD VVDD + 0.3 VOL Output low-level voltage VOH Output high-level voltage Output low-level current VVDD - 0.4 (3) ODCR0=1 ODCR0=0 IOH Output high-level current (3) ODCR0=1 OSRR0=0 OSRR0=1 tRISE Rise time(2) OSRR0=0 OSRR0=1 OSRR0=0 OSRR0=1 tFALL Fall time(2) OSRR0=0 OSRR0=1 OSRR0=0 FPINMAX Output frequency(2) OSRR0=1 OSRR0=0 OSRR0=1 ILEAK Input leakage current(3) CIN Input capacitance(2) V 0.4 ODCR0=0 IOL Units 1.68V<VVDD<2.7V 0.8 2.7V<VVDD<3.6V 1.6 1.68V<VVDD<2.7V 1.6 2.7V<VVDD<3.6V 3.2 1.68V<VVDD<2.7V 0.8 2.7V<VVDD<3.6V 1.6 1.68V<VVDD<2.7V 1.6 2.7V<VVDD<3.6V 3.2 ODCR0=0 1.68V<VVDD<2.7V, load = 25pF 35 mA mA mA mA ns 45 ODCR0=0 2.7V<VVDD<3.6V, load = 25pF 19 ns 23 ODCR0=0 1.68V<VVDD<2.7V, load = 25pF 36 ns 47 20 ODCR0=0 2.7V<VVDD<3.6V, load = 25pF ns 24 ODCR0=0, VVDD>2.7V load = 25pF 17 MHz 15 MHz ODCR0=1, VVDD>2.7V load = 25pF 27 MHz 23 MHz 1 A Pull-up resistors disabled 0.01 5 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 114 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 3. These values are based on characterization. These values are not covered by test limits in production 9.6.2 High-drive I/O Pin : PA02, PC04, PC05, PC06 Table 9-14. High-drive I/O Pin Characteristics (1) Symbol Parameter Conditions RPULLUP Pull-up resistance (2) 40 k RPULLDOWN Pull-down resistance(2) 40 k VIL Input low-level voltage -0.3 0.2 * VVDD VIH Input high-level voltage 0.8 * VVDD VVDD + 0.3 VOL Output low-level voltage VOH Output high-level voltage Output low-level current (3) ODCR0=0 Output high-level current (3) ODCR0=1 OSRR0=0 OSRR0=1 tRISE Rise time(2) OSRR0=0 OSRR0=1 OSRR0=0 OSRR0=1 tFALL Fall time(2) OSRR0=0 OSRR0=1 OSRR0=0 FPINMAX OSRR0=1 Output frequency(2) OSRR0=0 OSRR0=1 ILEAK CIN Input leakage current (2) Input capacitance (3) Max Units V VVDD - 0.4 ODCR0=1 IOH Typ 0.4 ODCR0=0 IOL Min 1.68V<VVDD<2.7V 1.8 2.7V<VVDD<3.6V 3.2 1.68V<VVDD<2.7V 3.2 2.7V<VVDD<3.6V 6 1.68V<VVDD<2.7V 1.6 2.7V<VVDD<3.6V 3.2 1.68V<VVDD<2.7V 3.2 2.7V<VVDD<3.6V 6 ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF 20 mA mA mA mA ns 40 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF 11 ns 18 ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF 20 ns 40 11 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF ns 18 ODCR0=0, VVDD>2.7V load = 25pF 22 MHz 17 MHz ODCR0=1, VVDD>2.7V load = 25pF 35 MHz 26 MHz 2 A Pull-up resistors disabled 0.01 10 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production 115 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.6.3 USB I/O Pin : PA25, PA26 Table 9-15. USB I/O Pin Characteristics in GPIO configuration (1) Symbol Parameter Conditions Min Typ Max Units RPULLUP Pull-up resistance (2) 40 k RPULLDOWN Pull-down resistance(2) 40 k VIL Input low-level voltage -0.3 0.2 * VVDD VIH Input high-level voltage 0.8 * VVDD VVDD + 0.3 VOL Output low-level voltage VOH Output high-level voltage IOL Output low-level current (3) IOH Output high-level current(3) FPINMAX Maximum frequency(2) ODCR0=0 OSRR0=0 ILEAK Input leakage current(3) Pull-up resistors disabled CIN Input capacitance(2) V 0.4 VVDD - 0.4 ODCR0=0 ODCR0=0 1.68V<VVDD<2.7V 20 2.7V<VVDD<3.6V 30 1.68V<VVDD<2.7V 20 2.7V<VVDD<3.6V 30 mA mA load = 25pF 0.01 20 MHz 1 A 5 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production 9.6.4 TWI Pin : PA21, PA22, PA23, PA24, PB14, PB15 Table 9-16. TWI Pin Characteristics in TWI configuration (1) Symbol Parameter RPULLUP Pull-up resistance (2) 40 k RPULLDOWN Pull-down resistance(2) 40 k VIL Input low-level voltage -0.3 0.3 * VVDD V VIH Input high-level voltage 0.7 * VVDD VVDD + 0.3 V VOL Output low-level voltage 0.4 V IOL Output low-level current (3) Conditions Min Typ Max DRIVEL=0 0.5 DRIVEL=1 1.0 DRIVEL=2 1.6 DRIVEL=3 3.1 DRIVEL=4 6.2 DRIVEL=5 9.3 DRIVEL=6 15.5 DRIVEL=7 21.8 Units mA 116 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-16. Symbol TWI Pin Characteristics in TWI configuration (1) Parameter Conditions Current Source(3) ICS Min Typ DRIVEH=0 0.5 DRIVEH=1 1 DRIVEH=2 1.5 DRIVEH=3 3 Max mA fMAX Max frequency(2) HsMode with Current source; DRIVEx=3, SLEW=0 Cbus = 400pF, VVDD = 1.68V tRISE Rise time(2) HsMode Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 28 38 Standard Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 50 95 HsMode Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 50 Fall time(2) tFALL Units 3.5 6.4 MHz ns ns 95 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production Table 9-17. Symbol RPULLUP TWI Pin Characteristics in GPIO configuration (1) Parameter Conditions Min Typ Max Units (2) 40 k (2) 40 k Pull-up resistance RPULLDOWN Pull-up resistance VIL Input low-level voltage -0.3 0.2 * VVDD V VIH Input high-level voltage 0.8 * VVDD VVDD + 0.3 V VOL Output low-level voltage 0.4 V VOH Output high-level voltage VVDD - 0.4 ODCR0=0 IOL Output low-level current (3) ODCR0=1 ODCR0=0 IOH Output high-level current(3) ODCR0=1 1.68V<VVDD<2.7V 1.8 2.7V<VVDD<3.6V 3.5 1.68V<VVDD<2.7V 3.6 2.7V<VVDD<3.6V 6.8 1.68V<VVDD<2.7V 1.8 2.7V<VVDD<3.6V 3.5 1.68V<VVDD<2.7V 3.6 2.7V<VVDD<3.6V 6.8 mA mA 117 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-17. Symbol TWI Pin Characteristics in GPIO configuration (1) Parameter Conditions OSRR0=0 OSRR0=1 Rise time(2) tRISE OSRR0=0 OSRR0=1 OSRR0=0 OSRR0=1 Fall time(2) tFALL OSRR0=0 OSRR0=1 Min Typ Max Units 18 ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF ns 110 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF 10 ns 50 ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF 19 ns 140 12 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF ns 63 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production Table 9-18. Common TWI Pin Characteristics Symbol Parameter Conditions ILEAK Input leakage current (1) Pull-up resistors disabled CIN Input capacitance(2) 1. Min Typ Max Units 0.01 1 A 5 pF These values are based on simulation. These values are not covered by test limits in production or characterization 118 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.6.5 High Drive TWI Pin : PB00, PB01 Table 9-19. High Drive TWI Pin Characteristics in TWI configuration (1) Symbol Parameter Conditions RPULLUP Pull-up resistance (2) PB00, PB01 RPULLDOWN Pull-down resistance(2) VIL Input low-level voltage -0.3 0.3 * VVDD VIH Input high-level voltage 0.7 * VVDD VVDD + 0.3 VOL Output low-level voltage VOH Output high-level voltage IOL ICS fMAX tRISE tFALL Output low-level current (3) Current Source(2) Max frequency(2) (2) Rise time Fall time(2) Min Typ Max Units 40 k 40 k V 0.4 VVDD - 0.4 DRIVEL=0 0.5 DRIVEL=1 1.0 DRIVEL=2 1.6 DRIVEL=3 3.1 DRIVEL=4 6.2 DRIVEL=5 9.3 DRIVEL=6 15.5 DRIVEL=7 21.8 mA DRIVEH=0 0.5 DRIVEH=1 1 DRIVEH=2 1.5 DRIVEH=3 3 mA HsMode with Current source; DRIVEx=3, SLEW=0 Cbus = 400pF, VVDD = 1.68V 3.5 6.4 MHz HsMode Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 28 38 Standard Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 50 95 HsMode Mode, DRIVEx=3, SLEW=0 Cbus = 400pF, Rp = 440Ohm, VVDD = 1.68V 50 ns ns 95 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production 119 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-20. Symbol RPULLUP High Drive TWI Pin Characteristics in GPIO configuration (1) Parameter Conditions Min Typ Max 40 k (2) 40 k Pull-up resistance RPULLDOWN Pull-up resistance VIL Input low-level voltage -0.3 0.2 * VVDD VIH Input high-level voltage 0.8 * VVDD VVDD + 0.3 VOL Output low-level voltage VOH Output high-level voltage Output low-level current VVDD - 0.4 (3) ODCR0=1 ODCR0=0 IOH Output high-level current (3) ODCR0=1 OSRR0=0 OSRR0=1 Rise time(2) tRISE OSRR0=0 OSRR0=1 OSRR0=0 OSRR0=1 Fall time(2) tFALL V 0.4 ODCR0=0 IOL Units (2) OSRR0=0 OSRR0=1 1.68V<VVDD<2.7V 3.4 2.7V<VVDD<3.6V 6 1.68V<VVDD<2.7V 5.2 2.7V<VVDD<3.6V 8 1.68V<VVDD<2.7V 3.4 2.7V<VVDD<3.6V 6 1.68V<VVDD<2.7V 5.2 2.7V<VVDD<3.6V 8 mA mA mA mA ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF 18 ns 110 10 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF ns 50 ODCR0=0 1.68V<VVDD<2.7V, Cload = 25pF 19 ns 140 12 ODCR0=0 2.7V<VVDD<3.6V, Cload = 25pF ns 63 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3-5 on page 13 for details 2. These values are based on simulation. These values are not covered by test limits in production or characterization 3. These values are based on characterization. These values are not covered by test limits in production Table 9-21. Symbol ILEAK CIN 1. Common High Drive TWI Pin Characteristics Parameter Conditions Input leakage current Input capacitance (1) (1) Pull-up resistors disabled Min Typ Max Units 0.01 2 A 10 pF These values are based on simulation. These values are not covered by test limits in production or characterization 120 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.7 Oscillator Characteristics 9.7.1 Oscillator 0 (OSC0) Characteristics 9.7.1.1 Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN. Table 9-22. Digital Clock Characteristics Symbol Parameter fCPXIN XIN clock frequency (1) tCPXIN XIN clock duty cycle (1) tSTARTUP Startup time 1. Conditions Min Typ 40 Max Units 50 MHz 60 % N/A cycles These values are based on simulation. These values are not covered by test limits in production or characterization. 9.7.1.2 Crystal Oscillator Characteristics The following table describes the characteristics for the oscillator when a crystal is connected between XIN and XOUT as shown in Figure 9-3. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can then be computed as follows: C LEXT = 2 ( C L - C STRAY - C SHUNT ) where CSTRAY is the capacitance of the pins and PCB, CSHUNT is the shunt capacitance of the crystal. Table 9-23. Symbol fOUT ESR Crystal Oscillator Characteristics Parameter Crystal oscillator frequency Conditions (1) Crystal Equivalent Series Resistance Min 0.6 (2) Typ Max Unit 30 MHz f = 0.455MHz, CLEXT = 100pF SCIF.OSCCTRL.GAIN = 0 17000 f = 2MHz, CLEXT = 20pF SCIF.OSCCTRL.GAIN = 0 2000 f = 4MHz, CLEXT = 20pF SCIF.OSCCTRL.GAIN = 1 1500 f = 8MHz, CLEXT = 20pF SCIF.OSCCTRL.GAIN = 2 300 f = 16MHz, CLEXT = 20pF SCIF.OSCCTRL.GAIN = 3 350 f = 30MHz, CLEXT = 18pF SCIF.OSCCTRL.GAIN = 4 45 121 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-23. Symbol Crystal Oscillator Characteristics Parameter Conditions CL Crystal load capacitance CSHUNT Crystal shunt capacitance CXIN Parasitic capacitor load(2) CXOUT Parasitic capacitor load(2) tSTARTUP IOSC Min (1) Startup time Typ 6 Max 18 (1) 7 pF 4.91 TQFP100 package 3.22 (1) Current consumption(1) SCIF.OSCCTRL.GAIN = 2 30 000 (3) Active mode, f = 0.6MHz, SCIF.OSCCTRL.GAIN = 0 30 Active mode, f = 4MHz, SCIF.OSCCTRL.GAIN = 1 130 Active mode, f = 8MHz, SCIF.OSCCTRL.GAIN = 2 260 Active mode, f = 16MHz, SCIF.OSCCTRL.GAIN = 3 590 Active mode, f = 30MHz, SCIF.OSCCTRL.GAIN = 4 960 1. These values are based on simulation. These values are not covered by test limits in production or characterization. 2. These values are based on characterization. These values are not covered by test limits in production. 3. Nominal crystal cycles. Figure 9-3. Unit cycles A Oscillator Connection Xin C LEXT C rystal LM C SH UN T RM C STRAY CM Xout C LEXT 122 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.7.2 32kHz Crystal Oscillator (OSC32K) Characteristics Figure 9-3 and the equation above also applies to the 32kHz oscillator connection. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can then be found in the crystal datasheet. Table 9-24. Digital Clock Characteristics Symbol Parameter Conditions fCPXIN32 XIN32 clock frequency (1) XIN32 clock duty cycle(1) tSTARTUP 1. Min Typ 40 Startup time Max Units 6 MHz 60 % N/A cycles These values are based on simulation. These values are not covered by test limits in production or characterization. Table 9-25. 32 kHz Crystal Oscillator Characteristics Symbol Parameter fOUT Crystal oscillator frequency tSTARTUP Startup time Conditions Min 30000 (1) CL Crystal load capacitance CSHUNT Crystal shunt capacitance(1) CXIN Parasitic capacitor load (3) CXOUT Parasitic capacitor load(3) IOSC32K Current consumption cycles 12.5 0.8 1.7 pF TQFP100 package 2.72 350 OSCCTRL32.SELCURR=8 nA 28 OSCCTRL32.SELCURR=4 72 CL=6pF 114 OSCCTRL32.SELCURR=15 313 OSCCTRL32.SELCURR=0 14 OSCCTRL32.SELCURR=4 OSCCTRL32.SELCURR=8 Crystal equivalent series resistance(3) f=32.768kHz OSCCTRL32.MODE=1 Safety Factor = 3 Hz (2) 6 OSCCTRL32.SELCURR=0 ESRXTAL Unit 3.4 (1) Crystal equivalent series resistance(1) f=32.768kHz OSCCTRL32.MODE=1 Safety Factor = 3 Max 32 768 Rm = 100k, CL = 12.5pF (1) Typ 36 CL=9pF 100 OSCCTRL32.SELCURR=15 170 OSCCTRL32.SELCURR=4 15.2 OSCCTRL32.SELCURR=6 61.8 OSCCTRL32.SELCURR=8 CL=12.5pF 101.8 OSCCTRL32.SELCURR=10 138.5 OSCCTRL32.SELCURR=15 228.5 1. These values are based on simulation. These values are not covered by test limits in production or characterization. 2. Nominal crystal cycles. 3. These values are based on characterization. These values are not covered by test limits in production. k k k 123 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.7.3 Phase Locked Loop (PLL) Characteristics Table 9-26. Phase Locked Loop Characteristics Symbol Parameter Conditions Min fOUT Output frequency (1) PLL is not availabe in PS1 48 240 fIN Input frequency(1) 4 16 IPLL Current consumption(1) tSTARTUP Startup time, from enabling the PLL until the PLL is locked(1) 1. Unit MHz fout=80MHz 200 fout=240MHz 500 A Wide Bandwidth mode disabled 8 Wide Bandwidth mode enabled 30 s Digital Frequency Locked Loop (DFLL) Characteristics Table 9-27. Digital Frequency Locked Loop Characteristics Symbol Parameter fOUT Output frequency (1) Reference frequency Conditions Min DFLL is not availabe in PS1 (1) FINE lock, fREF = 32kHz, SSG disabled Accuracy(1) IDFLL Max These values are based on simulation. These values are not covered by test limits in production or characterization. 9.7.4 fREF Typ Power consumption(1) Max Unit 20 150 MHz 8 150 kHz (2) Typ 0.1 0.5 ACCURATE lock, fREF = 32kHz, dither clk RCSYS/2, SSG disabled(2) 0.06 0.5 FINE lock, fREF = 8-150kHz, SSG disabled(2) 0.2 1 ACCURATE lock, fREF = 8-150kHz, dither clk RCSYS/2, SSG disabled(2) 0.1 1 % RANGE 0 96 to 220MHz COARSE=0, FINE=0, DIV=0 430 509 545 RANGE 0 96 to 220MHz COARSE=31, FINE=255, DIV=0 1545 1858 1919 RANGE 1 50 to 110MHz COARSE=0, FINE=0, DIV=0 218 271 308 RANGE 1 50 to 110MHz COARSE=31, FINE=255, DIV=0 704 827 862 A RANGE 2 25 to 55MHz COARSE=0, FINE=0, DIV=1 140 187 226 RANGE 2 25 to 55MHz COARSE=31, FINE=255, DIV=1 365 441 477 RANGE 3 20 to 30MHz COARSE=0, FINE=0, DIV=1 122 174 219 RANGE 3 20 to 30MHz COARSE=31, FINE=255, DIV=1 288 354 391 124 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-27. Symbol Digital Frequency Locked Loop Characteristics Parameter tSTARTUP Startup time Conditions (1) Typ Within 90% of final values fREF = 32kHz, FINE lock, SSG disabled (1) tLOCK Min Lock time (2) Max Unit 100 s 600 fREF = 32kHz, ACCURATE lock, dithering clock = RCSYS/2, SSG disabled(2) 1100 1. These values are based on simulation. These values are not covered by test limits in production or characterization. 2. Spread Spectrum Generator (SSG) is disabled by writing a zero to the EN bit in the SCIF.DFLL0SSG register. 9.7.5 32kHz RC Oscillator (RC32K) Characteristics Table 9-28. 32kHz RC Oscillator Characteristics Symbol Parameter Conditions Min Typ Max Unit fOUT Output frequency (1) Calibrated against a 32.768kHz reference Temperature compensation disabled 20 32.768 44 kHz IRC32K Current consumption (2) tSTARTUP Startup time(1) Without temperature compensation 0.5 A Temperature compensation enabled 2 A 1 cycle 1. These values are based on characterization. These values are not covered by test limits in production. 2. These values are based on simulation. These values are not covered by test limits in production or characterization. 9.7.6 System RC Oscillator (RCSYS) Characteristics Table 9-29. Symbol fOUT System RC Oscillator Characteristics Parameter Output frequency IRCSYS (1) Current consumption (1) tSTARTUP Startup time Duty Duty cycle(1) Conditions Min Typ Max Unit Calibrated at 85C 110 113.6 116 kHz 12 A (2) 25 38 63 s 49.6 50 50.3 % 1. These values are based on characterization. These values are not covered by test limits in production. 2. These values are based on simulation. These values are not covered by test limits in production or characterization. 125 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.7.7 1MHz RC Oscillator (RC1M) Characteristics Table 9-30. RC1M Oscillator Characteristics Symbol Parameter Conditions fOUT Output frequency (1) IRC1M Current consumption (2) Duty (1) Min Typ Max Unit 0.91 1 1.12 MHz 35 Duty cycle 48.6 49.9 A 54.4 1. These values are based on characterization. These values are not covered by test limits in production. 2. These values are based on simulation. These values are not covered by test limits in production or characterization. 9.7.8 % 4/8/12MHz RC Oscillator (RCFAST) Characteristics Table 9-31. Symbol RCFAST Oscillator Characteristics Parameter Conditions Output frequency (1) fOUT IRCFAST Current consumption (1) Duty Duty cycle tSTARTUP Startup time(1) (2) Min Typ Max Calibrated, FRANGE=0 4 4.3 4.6 Calibrated, FRANGE=1 7.8 8.2 8.5 Calibrated, FRANGE=2 11.3 12 12.3 Calibrated, FRANGE=0 90 110 Calibrated, FRANGE=1 130 150 Calibrated, FRANGE=2 180 205 Calibrated, FRANGE=0 48.8 49.6 50.1 Calibrated, FRANGE=1 47.8 49.2 50.1 Calibrated, FRANGE=2 46.7 48.8 50.0 Calibrated, FRANGE=2 0.1 0.31 0.71 1. These values are based on characterization. These values are not covered by test limits in production. 2. These values are based on simulation. These values are not covered by test limits in production or characterization. Unit MHz A % s 126 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.7.9 80MHz RC Oscillator (RC80M) Characteristics Table 9-32. Internal 80MHz RC Oscillator Characteristics Symbol Parameter Conditions Min Typ Max Unit fOUT Output frequency (1) After calibration Note that RC80M is not available in PS1 60 80 100 MHz IRC80M Current consumption (2) 330 (1) tSTARTUP Startup time Duty Duty cycle(2) A 0.57 1.72 3.2 s 45 50 55 % 1. These values are based on characterization. These values are not covered by test limits in production. 2. These values are based on simulation. These values are not covered by test limits in production or characterization. 9.8 Flash Characteristics Table 9-33 gives the device maximum operating frequency depending on the number of flash wait states and the flash read mode. The FWS bit in the FLASHCALW FCR register controls the number of wait states used when accessing the flash memory. Table 9-33. Maximum Operating Frequency (1) PowerScaling Mode Flash Read Mode 0 Low power (HSDIS) + Flash internal reference: BPM.PMCON.FASTWKUP=1 Flash Wait States Maximum Operating Frequency 1 12 0 18 1 36 1 12 0 8 1 12 0 24 1 48 Unit Low power(HSDIS) Low power (HSDIS) + Flash internal reference: BPM.PMCON.FASTWKUP=1 1 MHz Low power (HSDIS) 2 1. High speed (HSEN) These values are based on simulation. These values are not covered by test limits in production or characterization. Table 9-34. Flash Characteristics (1) Symbol Parameter tFPP Page programming time tFPE Page erase time tFFP Fuse programming time tFEA Full chip erase time (EA) tFCE JTAG chip erase time (CHIP_ERASE) Conditions Min Typ Max Unit 4.38 4.38 fCLK_AHB = 48MHz 0.63 ms 5.66 fCLK_AHB = 115kHz 304 127 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 1. These values are based on simulation. These values are not covered by test limits in production or characterization. Table 9-35. Flash Endurance and Data Retention (1) Symbol Parameter Conditions Min NFARRAY Array endurance (write/page) fCLK_AHB > 10MHz 100k NFFUSE General Purpose fuses endurance (write/bit) fCLK_AHB > 10MHz 10k tRET Data retention 1. Typ Max Unit cycles 15 years These values are based on simulation. These values are not covered by test limits in production or characterization. 128 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.9 Analog Characteristics 9.9.1 Voltage Regulator Characteristics Table 9-36. VREG Electrical Characteristics in Linear and Switching Modes Symbol Parameter DC output current (1) Power scaling mode 0 & 2 IOUT DC output current Power scaling mode 1 VVDDCORE Typ Max Low power mode (WAIT) 2000 3600 5600 Ultra Low power mode (RETENTION) 100 180 300 Low power mode (WAIT) 4000 7000 10000 Ultra Low power mode (RETENTION) 200 350 600 Units DC output voltage All modes 1.9 V Max Units These values are based on simulation. These values are not covered by test limits in production. Table 9-37. VREG Electrical Characteristics in Linear mode Symbol Parameter VVDDIN Input voltage range (1) VVDDCORE IOUT DC output voltage Power scaling mode 0 & 2 DC output current IQ 1. Min A (1) 1. Conditions (1) Conditions Min Typ IOUT=10mA 1.68 3.6 IOUT=50mA 1.8 3.6 IOUT = 0 mA 1.777 1.814 1.854 IOUT = 50 mA 1.75 1.79 1.83 VVDDCORE > 1.65V V 100 mA Output DC load regulation(1) Transient load regulation IOUT = 0 to 80mA, VVDDIN = 3V -34 -27 -19 mV Output DC regulation(1) IOUT = 80 mA, VVDDIN = 2V to 3.6V 10 28 48 mV Quescient current(1) IOUT = 0 mA RUN and SLEEPx modes 88 107 128 A These values are based on characterization. These values are not covered by test limits in production. Table 9-38. External components requirements in Linear Mode Symbol Parameter CIN1 Input regulator capacitor 1 33 CIN2 Input regulator capacitor 2 100 CIN3 Input regulator capacitor 3 10 F COUT1 Output regulator capacitor 1 100 nF COUT2 Output regulator capacitor 2 4.7 F Table 9-39. Technology Typ Units nF Tantalum or MLCC 0.5<ESR<10 VREG Electrical Characteristics in Switching mode Symbol Parameter Conditions Min Typ Max VVDDIN Input voltage range VVDDCORE = 1.65V, IOUT=50mA 2.0 DC output voltage (1) Power scaling mode 0 & 2 IOUT = 0 mA 1.75 1.82 1.87 VVDDCORE IOUT = 50 mA 1.66 1.71 1.79 Units 3.6 V 129 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-39. Symbol VREG Electrical Characteristics in Switching mode Parameter DC output current IOUT Conditions (1) Typ VVDDCORE > 1.65V (1) Max Units 55 mA Output DC load regulation Transient load regulation IOUT = 0 to 50mA, VVDDIN = 3V -136 -101 -82 mV Output DC regulation(1) IOUT = 50 mA, VVDDIN = 2V to 3.6V -20 38 99 mV VVDDIN = 2V, IOUT = 0 mA 97 186 546 VVDDIN > 2.2V, IOUT = 0 mA 97 111 147 82.7 88.3 95 IQ Quescient current(1) PEFF Power efficiency(1) 1. Min IOUT = 5mA, 50mA Reference power not included A % These values are based on characterization. These values are not covered by test limits in production. Table 9-40. Decoupling Requirements in Switching Mode Symbol Parameter CIN1 Input regulator capacitor 1 33 CIN2 Input regulator capacitor 2 100 CIN3 Input regulator capacitor 3 10 F COUT1 Output regulator capacitor 1 X7R MLCC 100 nF COUT2 Output regulator capacitor 2 X7R MLCC (ex : GRM31CR71A475) 4.7 F LEXT External inductance (ex: Murata LQH3NPN220MJ0) 22 H RDCLEXT Serial resistance of LEXT 0.7 ISATLEXT Saturation current of LEXT 300 mA Note: Technology Typ Units nF 1. Refer to Section 6. on page 46. 130 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.9.2 Power-on Reset 33 Characteristics Table 9-41. POR33 Characteristics (1) Symbol Parameter VPOT+ Voltage threshold on VVDDIN rising 1.25 1.55 VPOT- Voltage threshold on VVDDIN falling 0.95 1.30 1. Conditions Min Typ Max Units V These values are based on characterization. These values are not covered by test limits in production. POR33 Operating Principle VVDDIN Figure 9-4. VPOT+ VPOT- Reset Time 9.9.3 Brown Out Detectors Characteristics Table 9-42. BOD18 Characteristics (1) Symbol Parameter Conditions Min Step size, between adjacent values in BSCIF.BOD18LEVEL(1) Typ Max Units 10.1 mV VHYST BOD hysteresis(1) T = 25C tDET Detection time(1) Time with VVDDCORE < BOD18.LEVEL necessary to generate a reset signal IBOD Current consumption(1) tSTARTUP Startup time(1) on VDDIN 3 40 1.2 s 7.4 14 A on VDDCORE 7 4.5 s 131 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 1. These values are based on simulation. These values are not covered by test limits in production or characterization. The values in Table 9-43 describe the values of the BOD33.LEVEL in the flash User Page fuses. Table 9-43. BOD33.LEVEL Values BOD33.LEVEL Value Table 9-44. Min Typ Max 16 2.08 20 2.18 24 2.33 28 2.48 32 2.62 36 2.77 40 2.92 44 3.06 48 3.21 Units V BOD33 Characteristics (1) Symbol Parameter Conditions Min Step size, between adjacent values in BSCIF.BOD33LEVEL(1) Typ Max Units 34.4 mV VHYST Hysteresis(1) tDET Detection time(1) Time with VDDIN < VTH necessary to generate a reset signal IBOD33 Current consumption(1) Normal mode 36 A Normal mode 6 s tSTARTUP 1. (1) Startup time 45 170 s These values are based on simulation. These values are not covered by test limits in production or characterization. 132 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.9.4 Analog- to Digital Converter Characteristics Table 9-45. Symbol Operating conditions Parameter Conditions Min Temperature range Resolution Typ -40 (1) Max Sampling clock (3) fADC ADC clock frequency(3) TSAMPLEHOLD Sampling time(3) 12 Max Units +85 C 12 (2) Differential modes, Gain=1X 5 300 Unipolar modes, Gain=1X 5 250 Differential modes 0.03 1.8 Unipolar modes 0.03 1.5 Differential modes 16.5 277 Unipolar modes 16.5 333 Bit kHz MHz s Conversion rate(1) 1X gain, differential 300 kSps Internal channel conversion rate(3) VVDD/10, Bandgap and Temperature channels 125 kSps Conversion time (latency) Differential mode (no windowing) 1X gain, (resolution/2)+gain (4) 6 2X and 4X gain 7 8X and 16X gain 8 32X and 64X gain 9 64X gain and unipolar 10 1. These values are based on characterization. These values are not covered by test limits in production 2. Single ended or using divide by two max resolution: 11 bits 3. These values are based on simulation. These values are not covered by test limits in production 4. See Figure 9-5 Figure 9-5. Cycles Maximum input common mode voltage M AX in p u t co m m o n m o de v o lta g e 3 2.5 ICMR 2 vc m _vref= 3V 1.5 vc m _vref= 1V 1 0.5 0 1. 6 3.6 V cc 133 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-46. Symbol VDDANA DC Characteristics Parameter Supply voltage Conditions Max Units 1.6 3.6 V Differential mode 1.0 VDDANA -0.6 Unipolar and Window modes 1.0 1.0 Using divide by two function (differential) 2.0 VDDANA -0,1 VDDANA +0.1 V 24 Cycles No gain compensation Reference buffer 5 s Gain compensation Reference buffer 60 Cycles 0.5 k 4.3 pF Gain compensation 2 k No gain compensation 1 M 60 Cycles (1) Reference range (2) Absolute min, max input voltage(2) Min Typ ADC with reference already enabled Start up time(2) RSAMPLE CSAMPLE 12 Input channel source resistance(2) Sampling capacitance (2) 2.9 Reference input source resistance(2) 3.6 After changing reference/mode (3) ADC reference settling time(2) 5 1. These values are based on characterization. These values are not covered by test limits in production 2. These values are based on simulation. These values are not covered by test limits in production 3. Requires refresh/flush otherwise conversion time (latency) + 1 Table 9-47. Symbol V Differential mode, gain=1 Parameter Conditions Accuracy without compensation (1) Min (1) Typ Max 7 Accuracy after compensation (INL, gain and offset) INL Integral Non Linearity (2) After calibration, Gain compensation DNL Differential Non Linearity(2) After calibration Units ENOB 11 ENOB 1.2 1.7 LSBs 0.7 1.0 LSBs -1.0 5.0 External reference -5.0 VDDANA/1.6 -40 40 VDDANA/2.0 -40 40 Bandgap After calibration -30 30 Gain error drift vs voltage External reference -2 2 mV/V Gain error drift vs temperature(1) After calibration + bandgap drift If using onchip bandgap 0.08 mV/K Gain error (2) (1) Offset error (2) Offset error drift vs voltage(1) External reference -5.0 5.0 VDDANA/1.6 -10 10 VDDANA/2.0 -10 10 Bandgap After calibration -10 10 -4 4 mV mV mV/V 134 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-47. Differential mode, gain=1 Offset error drift vs temperature(1) Conversion range (2) Vin-Vip -Vref mV/K Vref V see Figure 9-5 ICMR(1) PSRR 0.04 (1) DC supply current (2) fvdd=1Hz, ext ADVREFP=3.0V VVDD=3.6V 100 fvdd=2MHz, ext ADVREFP=3.0V VVDD=3.6 50 VDDANA=3.6V, ADVREFP=3.0V 1.2 VDDANA=1.6V, ADVREFP=1.0V 0.6 dB mA 1. These values are based on simulation only. These values are not covered by test limits in production or characterization 2. These values are based on characterization and not tested in production, and valid for an input voltage between 10% to 90% of reference voltage. Table 9-48. Symbol Unipolar mode, gain=1 Parameter Conditions Accuracy without compensation Min (1) Typ 7 (1) Accuracy after compensation INL DNL Integral Non Linearity (2) Differential Non Linearity(2) Gain error(2) Max Units ENOB 11 After calibration Dynamic tests No gain compensation 3 After calibration Dynamic tests Gain compensation 3 ENOB LSBs After calibration 2.8 External reference -15 15 VDDANA/1.6 -50 50 VDDANA/2.0 -30 30 LSBs mV Bandgap After calibration -10 10 Gain error drift vs voltage(1) External reference -8 8 mV/V Gain error drift temperature(1) + bandgap drift If using bandgap 0.08 mV/K Offset error(2) External reference -15 15 VDDANA/1.6 -15 15 VDDANA/2.0 -15 15 Bandgap After calibration -10 10 (1) Offset error drift -4 Offset error drift temperature(1) Conversion range(1) ICMR(1) 0 Vin-Vip -Vref mV 4 mV/V 0.04 mV/K Vref V see Figure 9-5 135 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-48. Unipolar mode, gain=1 PSRR(1) DC supply current(1) fVdd=100kHz, VDDIO=3.6V 62 fVdd=1MHz, VDDIO=3.6V 49 VDDANA=3.6V 1 2 VDDANA=1.6V, ADVREFP=1.0V 1 1.3 dB mA 1. These values are based on simulation. These values are not covered by test limits in production or characterization. 2. These values are based on characterization and not tested in production, and valid for an input voltage between 10% to 90% of reference voltage. 9.9.4.1 Inputs and Sample and Hold Acquisition Times The analog voltage source must be able to charge the sample and hold (S/H) capacitor in the ADC in order to achieve maximum accuracy. Seen externally the ADC input consists of a resistor ( R SAMPLE ) and a capacitor ( C SAMPLE ). In addition, the source resistance ( R SOURCE ) must be taken into account when calculating the required sample and hold time. Figure 9-6 shows the ADC input channel equivalent circuit. Figure 9-6. ADC Input VDDANA/2 Analog Input ADx RSOURCE CSAMPLE RSAMPLE VIN To achieve n bits of accuracy, the C SAMPLE capacitor must be charged at least to a voltage of V CSAMPLE V IN x ( 1 - 2 -( n + 1 ) ) The minimum sampling time t SAMPLEHOLD for a given R SOURCE can be found using this formula: t SAMPLEHOLD ( R SAMPLE + R SOURCE ) x ( C SAMPLE ) x ( n + 1 ) x ln ( 2 ) for a 12 bits accuracy : t SAMPLEHOLD ( R SAMPLE + R SOURCE ) x ( C SAMPLE ) x 9, 02 where 1 t SAMPLEHOLD = -----------------------2 x fADC 136 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.9.5 Digital to Analog Converter Characteristics Table 9-49. Symbol Operating conditions Parameter Conditions Analog Supply Voltage (1) Min on VDDANA 2.4 3 3.6 V Digital Supply Voltage(1) on VDDCORE 1.62 1.8 1.98 V Resolution (2) Clock frequency (1) Differential Non Linearity Zero Error (offset) (1) Gain Error bits 500 kHz CLoad 50 pF k 5 Best fit-line method (1) (1) Units Cload = 50pF ; Rload = 5k RLoad Integral Non Linearity DNL Max 10 (1) Load(1) INL Typ Best fit-line method -0.9 2 LSBs +1 LSBs CDR[9:0] = 0 1 5 mV CDR[9:0] = 1023 5 10 mV 7 dB Total Harmonic Distortion(1) 80% of VDDANA @ fin = 70kHz Delay to vout (1) CDR[9:0] = 512/ Cload = 50 pF / Rload = 5 k 2 Startup time(1) CDR[9:0] = 512 5 9 s Output Voltage Range (ADVREFP < VDDANA - 100mV) is mandatory 0 ADVREFP V ADVREFP Voltage Range(1) (ADVREFP < VDDANA - 100mV) is mandatory 2.3 3.5 V ADVREFN Voltage Range(1) Standby Current(1) DC Current consumption (1) -56 s ADVREFP = GND 0 V On VDDANA 500 On VDDCORE 100 On VDDANA (no Rload) 485 660 On ADVREFP (CDR[9:0] = 512) 250 295 1. These values are based on simulation. These values are not covered by test limits in production or characterization 2. These values are based on characterization. These values are not covered by test limits in production nA A 9.9.6 Analog Comparator Characteristics Table 9-50. Analog Comparator Characteristics Symbol Parameter Conditions Positive input voltage range Min 0.1 Typ Max Units VDDIO-0.1 V Negative input voltage range Offset (1) 0.1 VDDIO-0.1 VACREFN =0.1V to VDDIO-0.1V, hysteresis = 0 (2) Fast mode -12 13 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 0(2) Low power mode -11 12 mV 137 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-50. Symbol Analog Comparator Characteristics Parameter Hysteresis(1) Propagation delay(1) tSTARTUP IAC Startup time(1) Channel current consumption (3) Conditions Min VACREFN =0.1V to VDDIO-0.1V, hysteresis = 1(2) Fast mode Typ Max Units 10 55 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 1(2) Low power mode 10 68 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 2(2) Fast mode 26 83 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 2(2) Low power mode 19 91 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 3(2) Fast mode 43 106 mV VACREFN =0.1V to VDDIO-0.1V, hysteresis = 3(2) Low power mode 32 136 mV Changes for VACM=VDDIO/2 100mV Overdrive Fast mode 67 ns Changes for VACM=VDDIO/2 100mV Overdrive Low power mode 315 ns Enable to ready delay Fast mode 1.19 s Enable to ready delay Low power mode 3.61 s Low power mode, no hysteresis 4.9 8.7 Fast mode, no hysteresis 63 127 A 1. These values are based on characterization. These values are not covered by test limits in production 2. HYSTAC.CONFn.HYS field, refer to the Analog Comparator Interface chapter 3. These values are based on simulation. These values are not covered by test limits in production or characterization 138 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.9.7 Liquid Crystal Display Controler characteristics Table 9-51. Liquid Crystal Display Controler characteristics Symbol Parameter SEG Segment Terminal Pins 40 COM Common Terminal Pins 4 fFrame LCD Frame Frequency CFlying Flying Capacitor VLCD Conditions FCLKLCD Min Typ 31.25 512 100 Units Hz nF 3 LCD Regulated Voltages (1) CFG.FCST=0 BIAS2 CFlying = 100nF 100nF on VLCD, BIAS2 and BIAS1 pins 2*VLCD/3 BIAS1 1. Max V VLCD/3 These values are based on simulation. These values are not covered by test limits in production or characterization 9.9.7.1 Liquid Crystal Controler supply current The values in Table 9-52 are measured values of power consumption under the following conditions, except where noted: * T=25C, WAIT mode, Low power waveform, Frame Rate = 32Hz from OSC32K * Configuration: 4COMx40SEG, 1/4 Duty, 1/3 Bias, No animation * All segments on, Load = 160 x 22pF between each COM and each SEG. * LCDCA current based on ILCD = IWAIT(Lcd On) - IWAIT(Lcd Off) Table 9-52. Symbol Liquid Crystal Display Controler supply current Conditions Min Typ Internal voltage generation CFG.FCST=0 VVDDIN = 3.6V 8.85 VVDDIN = 1.8V 6.16 External bias VVDDIN = 3.3V 0.98 VLCD=3.0V VVDDIN = 1.8V 1.17 ILCD Max Units A 139 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.10 Timing Characteristics 9.10.1 RESET_N Timing Table 9-53. RESET_N Waveform Parameters (1) Symbol Parameter tRESET RESET_N minimum pulse length 1. Conditions Min 10 Max Units ns These values are based on simulation. These values are not covered by test limits in production. 9.10.2 9.10.2.1 USART in SPI Mode Timing Master mode Figure 9-7. USART in SPI Master Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI0 USPI1 MOSI USPI2 Figure 9-8. USART in SPI Master Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI3 USPI4 MOSI USPI5 140 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-54. USART0 in SPI Mode Timing, Master Mode(1) Symbol Parameter Conditions USPI0 MISO setup time before SPCK rises USPI1 MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay Table 9-55. Symbol Parameter MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 24.74 -tSAMPLE(2) 513.56 125.99 + ns tSAMPLE(2) 24.74 -tSAMPLE(2) Min 69.28 + VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Max Units tSAMPLE(2) 25.75 -tSAMPLE(2) 99.66 73.12 + ns tSAMPLE(2) 28.10 -tSAMPLE(2) 102.01 USART2 in SPI Mode Timing, Master Mode(1) Parameter Conditions USPI0 MISO setup time before SPCK rises USPI1 MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay Min 69.09 + VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Max Units tSAMPLE(2) 26.52 -tSAMPLE(2) 542.96 ns 72.55 + tSAMPLE(2) 28.37 -tSAMPLE(2) 544.80 USART3 in SPI Mode Timing, Master Mode(1) Symbol Parameter USPI0 MISO setup time before SPCK rises USPI1 MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay Notes: 123.2 + tSAMPLE(2) Conditions USPI1 Table 9-57. Units USART1 in SPI Mode Timing, Master Mode(1) MISO setup time before SPCK rises Symbol Max 516.55 USPI0 Table 9-56. Min Conditions Min Max Units 147.24 + tSAMPLE(2) VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 25.80 -tSAMPLE(2) 88.23 ns 154.9 + tSAMPLE(2) 26.89 -tSAMPLE(2) 89.32 1. These values are based on simulation. These values are not covered by test limits in production. t SPCK 1 2. Where: t SAMPLE = t SPCK - -------------------------------------- x t CLKUSART 2xt 2 CLKUSART 141 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Maximum SPI Frequency, Master Output The maximum SPI master output frequency is given by the following formula: 1 f CLKSPI x 2 f SPCKMAX = MIN (f PINMAX,------------, -----------------------------) SPIn 9 Where SPIn is the MOSI delay, USPI2 or USPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. refer to the I/O Pin Characteristics section for the maximum frequency of the pins. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: f CLKSPI x 2 1 f SPCKMAX = MIN (------------------------------------,-----------------------------) SPIn + t VALID 9 Where SPIn is the MISO setup and hold time, USPI0 + USPI1 or USPI3 + USPI4 depending on CPOL and NCPHA. T VALID is the SPI slave response time. refer to the SPI slave datasheet for T VALID . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. 9.10.2.2 Slave mode Figure 9-9. USART in SPI Slave Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI6 MOSI USPI7 USPI8 142 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 9-10. USART in SPI Slave Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI9 MOSI USPI10 USPI11 Figure 9-11. USART in SPI Slave Mode, NPCS Timing USPI12 USPI13 USPI14 USPI15 SPCK, CPOL=0 SPCK, CPOL=1 NSS Table 9-58. USART0 in SPI mode Timing, Slave Mode(1) Symbol Parameter USPI6 SPCK falling to MISO delay Conditions Min Max 740.67 tSAMPLE(2) + USPI7 MOSI setup time before SPCK rises 56.73 + tCLK_USART USPI8 MOSI hold time after SPCK rises 45.18 -( tSAMPLE(2) + tCLK_USART ) USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 NSS setup time before SPCK rises USPI13 NSS hold time after SPCK falls USPI14 NSS setup time before SPCK falls USPI15 NSS hold time after SPCK rises Units VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 670.18 tSAMPLE(2) 56.73 +( tCLK_USART ) + ns 45.18 -( tSAMPLE(2) + tCLK_USART ) 688.71 -2.25 688.71 -2.25 143 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-59. USART1 in SPI mode Timing, Slave Mode(1) Symbol Parameter USPI6 SPCK falling to MISO delay USPI7 MOSI setup time before SPCK rises USPI8 MOSI hold time after SPCK rises USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 NSS setup time before SPCK rises USPI13 NSS hold time after SPCK falls USPI14 NSS setup time before SPCK falls USPI15 NSS hold time after SPCK rises Table 9-60. Conditions Min Max Units 373.58 tSAMPLE(2) 4.16 + tCLK_USART + 46.69 -( tSAMPLE(2) + tCLK_USART ) VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 373.54 4.16 +( tSAMPLE(2) + tCLK_USART ) ns 46.69 -( tSAMPLE(2) + tCLK_USART ) 200.43 -16.5 200.43 -16.5 USART2 in SPI mode Timing, Slave Mode(1) Symbol Parameter USPI6 SPCK falling to MISO delay USPI7 MOSI setup time before SPCK rises USPI8 MOSI hold time after SPCK rises USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 NSS setup time before SPCK rises USPI13 NSS hold time after SPCK falls USPI14 NSS setup time before SPCK falls USPI15 NSS hold time after SPCK rises Conditions Min Max Units 770.02 tSAMPLE(2) 136.56 + tCLK_USART + 47.9 -( tSAMPLE(2) + tCLK_USART ) VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 570.19 tSAMPLE(2) 136.73 +( tCLK_USART ) + ns 47.9 -( tSAMPLE(2) + tCLK_USART ) 519.87 -1.83 519.87 -1.83 144 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-61. USART3 in SPI mode Timing, Slave Mode(1) Symbol Parameter Conditions USPI6 SPCK falling to MISO delay Min Max 593.9 tSAMPLE(2) + USPI7 MOSI setup time before SPCK rises 45.93 + tCLK_USART USPI8 MOSI hold time after SPCK rises 47.03 -( tSAMPLE(2) + tCLK_USART ) USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 NSS setup time before SPCK rises 237.5 USPI13 NSS hold time after SPCK falls -1.81 USPI14 NSS setup time before SPCK falls 237.5 USPI15 NSS hold time after SPCK rises -1.81 Notes: Units VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 593.38 45.93 +( tSAMPLE(2) + tCLK_USART ) ns 47.03 -( tSAMPLE(2) + tCLK_USART ) 1. These values are based on simulation. These values are not covered by test limits in production. t SPCK 1 + --- x t CLKUSART 2. Where: t SAMPLE = t SPCK - -----------------------------------2 2xt CLKUSART Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: f CLKSPI x 2 1 f SPCKMAX = MIN (-----------------------------,------------) 9 SPIn Where SPIn is the MOSI setup and hold time, USPI7 + USPI8 or USPI10 + USPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: f CLKSPI x 2 1 f SPCKMAX = MIN (-----------------------------, f PINMAX,------------------------------------) 9 SPIn + t SETUP Where SPIn is the MISO delay, USPI6 or USPI9 depending on CPOL and NCPHA. T SETUP is the SPI master setup time. refer to the SPI master datasheet for T SETUP . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. f PINMAX is the maximum frequency of the SPI pins. refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 145 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 9.10.3 SPI Timing 9.10.3.1 Master mode Figure 9-12. SPI Master Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI0 SPI1 MOSI SPI2 Figure 9-13. SPI Master Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI3 SPI4 MOSI SPI5 Table 9-62. SPI Timing, Master Mode(1) Symbol Parameter Conditions SPI0 MISO setup time before SPCK rises SPI1 MISO hold time after SPCK rises SPI2 SPCK rising to MOSI delay SPI3 MISO setup time before SPCK falls SPI4 MISO hold time after SPCK falls SPI5 SPCK falling to MOSI delay Note: Min Max Units 9 VVDDIO from 2.85V to 3.6V, maximum external capacitor = 40pF 0 9 21 ns 7.3 0 9 22 1. These values are based on simulation. These values are not covered by test limits in production. Maximum SPI Frequency, Master Output 146 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 The maximum SPI master output frequency is given by the following formula: 1 f SPCKMAX = MIN (f PINMAX,------------) SPIn Where SPIn is the MOSI delay, SPI2 or SPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. refer to the I/O Pin Characteristics section for the maximum frequency of the pins. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: 1 f SPCKMAX = -----------------------------------SPIn + t VALID Where SPIn is the MISO setup and hold time, SPI0 + SPI1 or SPI3 + SPI4 depending on CPOL and NCPHA. t VALID is the SPI slave response time. refer to the SPI slave datasheet for t VALID . 9.10.3.2 Slave mode Figure 9-14. SPI Slave Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI6 MOSI SPI7 SPI8 Figure 9-15. SPI Slave Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI9 MOSI SPI10 SPI11 147 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 9-16. SPI Slave Mode, NPCS Timing SPI12 SPI13 SPI14 SPI15 SPCK, CPOL=0 SPCK, CPOL=1 NPCS Table 9-63. SPI Timing, Slave Mode(1) Symbol Parameter SPI6 Conditions Min Max SPCK falling to MISO delay 19 47 SPI7 MOSI setup time before SPCK rises 0 SPI8 MOSI hold time after SPCK rises SPI9 SPCK rising to MISO delay SPI10 MOSI setup time before SPCK falls SPI11 MOSI hold time after SPCK falls SPI12 NPCS setup time before SPCK rises SPI13 NPCS hold time after SPCK falls SPI14 NPCS setup time before SPCK falls SPI15 NPCS hold time after SPCK rises Note: Units 5.4 VVDDIO from 2.85V to 3.6V, maximum external capacitor = 40pF 19 46 0 ns 5.3 4 2.5 6 1.1 1. These values are based on simulation. These values are not covered by test limits in production. Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: 1 f SPCKMAX = MIN (f CLKSPI,------------) SPIn Where SPIn is the MOSI setup and hold time, SPI7 + SPI8 or SPI10 + SPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: 1 f SPCKMAX = MIN (f PINMAX,------------------------------------) SPIn + t SETUP 148 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Where SPIn is the MISO delay, SPI6 or SPI9 depending on CPOL and NCPHA. t SETUP is the SPI master setup time. refer to the SPI master datasheet for t SETUP . f PINMAX is the maximum frequency of the SPI pins. refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 9.10.4 TWIM/TWIS Timing Figure 9-64 shows the TWI-bus timing requirements and the compliance of the device with them. Some of these requirements (tr and tf) are met by the device without requiring user intervention. Compliance with the other requirements (tHD-STA, tSU-STA, tSU-STO, tHD-DAT, tSU-DAT-TWI, tLOW-TWI, tHIGH, and fTWCK) requires user intervention through appropriate programming of the relevant TWIM and TWIS user interface registers. refer to the TWIM and TWIS sections for more information. Table 9-64. TWI-Bus Timing Requirements Minimum Symbol Parameter tr TWCK and TWD rise time tf TWCK and TWD fall time tHD-STA (Repeated) START hold time tSU-STA (Repeated) START set-up time tSU-STO STOP set-up time tHD-DAT Data hold time Mode Requirement 1000 20 + 0.1Cb 300 - 300 20 + 0.1Cb 300 ns 4 Fast 0.6 Standard 4.7 Fast 0.6 Standard 4.0 Fast 0.6 Standard Standard 250 Fast 100 - 4.7 Fast 1.3 TWCK LOW period TWCK HIGH period fTWCK TWCK frequency - Standard 4.0 Fast 0.6 Standard Notes: - s tclkpb - s 4tclkpb - s 2tclkpb - Standard tclkpb 3.45() 0.3(2) Fast tHIGH Unit ns Standard tLOW Device - Fast tSU-DAT Requirement (1) Standard tLOW-TWI Device Standard(1) Fast tSU-DAT-TWI Data set-up time Maximum s 2tclkpb - ns tclkpb - - 4tclkpb - s tclkpb - - 8tclkpb - s 100 - Fast 15tprescaled + tclkpb 0.9() 400 1 -----------------------12t clkpb kHz 1. Standard mode: f TWCK 100 kHz ; fast mode: f TWCK > 100 kHz . 149 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 2. A device must internally provide a hold time of at least 300 ns for TWD with reference to the falling edge of TWCK. Notations: Cb = total capacitance of one bus line in pF tclkpb = period of TWI peripheral bus clock tprescaled = period of TWI internal prescaled clock (see chapters on TWIM and TWIS) The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW-TWI) of TWCK. 9.10.5 JTAG Timing Figure 9-17. JTAG Interface Signals JTAG2 TCK JTAG0 JTAG1 TMS/TDI JTAG3 JTAG4 JTAG7 JTAG8 TDO JTAG5 JTAG6 Boundary Scan Inputs Boundary Scan Outputs JTAG9 JTAG10 150 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-65. JTAG Timings(1) Symbol Parameter JTAG0 TCK Low Half-period 21.8 JTAG1 TCK High Half-period 8.6 JTAG2 TCK Period 30.3 JTAG3 TDI, TMS Setup before TCK High JTAG4 TDI, TMS Hold after TCK High JTAG5 TDO Hold Time JTAG6 TCK Low to TDO Valid JTAG7 Boundary Scan Inputs Setup Time JTAG8 Boundary Scan Inputs Hold Time 6.9 JTAG9 Boundary Scan Outputs Hold Time 9.3 JTAG10 TCK to Boundary Scan Outputs Valid Note: Conditions VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Min Max Units 2.0 2.3 9.5 ns 21.8 0.6 32.2 1. These values are based on simulation. These values are not covered by test limits in production. 9.10.6 SWD Timing Figure 9-18. SWD Interface Signals Read Cycle From debugger to SWDIO pin Stop Park Tri State Thigh Tos Data Data Parity Start Tlow From debugger to SWDCLK pin SWDIO pin to debugger Tri State Acknowledge Tri State Write Cycle From debugger to SWDIO pin Stop Park Tri State Tis Start Tih From debugger to SWDCLK pin SWDIO pin to debugger Tri State Acknowledge Data Data Parity Tri State 151 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 9-66. SWD Timings(1) Symbol Parameter Thigh SWDCLK High period Tlow SWDCLK Low period Tos SWDIO output skew to falling edge SWDCLK Tis Input Setup time required between SWDIO Tih Input Hold time required between SWDIO and rising edge SWDCLK Note: Conditions VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Min Max 10 500 000 10 500 000 -5 5 4 - 1 - Units ns 1. These values are based on simulation. These values are not covered by test limits in production or characterization. 152 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 10. Mechanical Characteristics 10.1 10.1.1 Thermal Considerations Thermal Data Table 10-1 summarizes the thermal resistance data depending on the package. Table 10-1. 10.1.2 Thermal Resistance Data Symbol Parameter Condition Package Typ JA Junction-to-ambient thermal resistance Still Air TQFP100 48.1 JC Junction-to-case thermal resistance TQFP100 13.3 JA Junction-to-ambient thermal resistance VFBGA100 31.1 JC Junction-to-case thermal resistance VFBGA100 6.9 JA Junction-to-ambient thermal resistance WLCSP64 26.9 JC Junction-to-case thermal resistance WLCSP64 0.2 JA Junction-to-ambient thermal resistance TQFP64 49.6 JC Junction-to-case thermal resistance TQFP64 13.5 JA Junction-to-ambient thermal resistance QFN64 22.0 JC Junction-to-case thermal resistance QFN64 1.3 JA Junction-to-ambient thermal resistance TQFP48 51.1 JC Junction-to-case thermal resistance TQFP48 13.7 JA Junction-to-ambient thermal resistance QFN48 24.9 JC Junction-to-case thermal resistance QFN48 1.3 Still Air Still Air Still Air Still Air Still Air Still Air Unit C/W C/W C/W C/W C/W C/W C/W Junction Temperature The average chip-junction temperature, TJ, in C can be obtained from the following: 1. T J = T A + ( P D x JA ) 2. T J = T A + ( P D x ( HEATSINK + JC ) ) where: * JA = package thermal resistance, Junction-to-ambient (C/W), provided in Table 10-1. * JC = package thermal resistance, Junction-to-case thermal resistance (C/W), provided in Table 10-1. * HEAT SINK = cooling device thermal resistance (C/W), provided in the device datasheet. * PD = device power consumption (W) estimated from data provided in Section 9.5 on page 103. * TA = ambient temperature (C). From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in C. 153 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 10.2 Package Drawings Figure 10-1. VFBGA-100 package drawing Table 10-2. Device and Package Maximum Weight 120 Table 10-3. mg Package Characteristics Moisture Sensitivity Level Table 10-4. MSL3 Package Reference JEDEC Drawing Reference N/A JESD97 Classification E1 154 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-2. TQFP-100 Package Drawing Table 10-5. Device and Package Maximum Weight 500 Table 10-6. mg Package Characteristics Moisture Sensitivity Level Table 10-7. MSL3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 155 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-3. WLCSP64 SAM4LC4/2 Package Drawing Table 10-8. Device and Package Maximum Weight 14.8 Table 10-9. mg Package Characteristics Moisture Sensitivity Level MSL3 Table 10-10. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E1 156 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-4. WLCSP64 SAM4LS4/2 Package Drawing Table 10-11. Device and Package Maximum Weight 14.8 mg Table 10-12. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-13. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E1 157 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-5. WLCSP64 SAM4LC8 Package Drawing Table 10-14. Device and Package Maximum Weight 14.8 mg Table 10-15. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-16. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E1 158 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-6. WLCSP64 SAM4LS8 Package Drawing Table 10-17. Device and Package Maximum Weight 14.8 mg Table 10-18. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-19. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E1 159 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-7. TQFP-64 Package Drawing Table 10-20. Device and Package Maximum Weight 300 mg Table 10-21. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-22. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 160 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-8. QFN-64 Package Drawing Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Table 10-23. Device and Package Maximum Weight 200 mg Table 10-24. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-25. Package Reference JEDEC Drawing Reference MO-220 JESD97 Classification E3 161 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-9. TQFP-48 (ATSAM4LC4/2 and ATSAM4LS4/2 Only) Package Drawing Table 10-26. Device and Package Maximum Weight 140 mg Table 10-27. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-28. Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 162 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-10. QFN-48 Package Drawing for ATSAM4LC4/2 and ATSAM4LS4/2 Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Table 10-29. Device and Package Maximum Weight 140 mg Table 10-30. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-31. Package Reference JEDEC Drawing Reference MO-220 JESD97 Classification E3 163 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Figure 10-11. QFN-48 Package Drawing for ATSAM4LC8 and ATSAM4LS8 Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Table 10-32. Device and Package Maximum Weight 140 mg Table 10-33. Package Characteristics Moisture Sensitivity Level MSL3 Table 10-34. Package Reference JEDEC Drawing Reference MO-220 JESD97 Classification E3 164 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 10.3 Soldering Profile Table 10-35 gives the recommended soldering profile from J-STD-20. Table 10-35. Soldering Profile Profile Feature Green Package Average Ramp-up Rate (217C to Peak) 3C/s max Preheat Temperature 175C 25C 150-200C Time Maintained Above 217C 60-150 s Time within 5C of Actual Peak Temperature 30 s Peak Temperature Range 260C Ramp-down Rate 6C/s max Time 25C to Peak Temperature 8 minutes max A maximum of three reflow passes is allowed per component. 165 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 11. Ordering Information Table 11-1. ATSAM4LC8 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LC8CA-AU Conditioning Package Type Temperature Operating Range Green Industrial -40C to 85C Package Type Temperature Operating Range Tray TQFP100 ATSAM4LC8CA-AUR Reel ATSAM4LC8CA-CFU Tray VFBGA100 ATSAM4LC8CA-CFUR Reel ATSAM4LC8BA-AU Tray TQFP64 ATSAM4LC8BA-AUR 512 Reel 64 ATSAM4LC8BA-MU Tray QFN64 ATSAM4LC8BA-MUR Reel ATSAM4LC8BA-UUR WLCSP64 ATSAM4LC8AA-MU Reel Tray QFN48 ATSAM4LC8AA-MUR Table 11-2. Reel ATSAM4LC4 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LC4CA-AU-ES Conditioning ES ATSAM4LC4CA-AU TQFP100 N/A Tray Industrial -40C to 85C ATSAM4LC4CA-AUR Reel ATSAM4LC4CA-CFU Tray VFBGA100 Industrial -40C to 85C ATSAM4LC4CA-CFUR Reel ATSAM4LC4BA-AU-ES ES ATSAM4LC4BA-AU TQFP64 N/A Tray Industrial -40C to 85C ATSAM4LC4BA-AUR Reel ATSAM4LC4BA-MU-ES ES 256 ATSAM4LC4BA-MU 32 N/A Green QFN64 Tray Industrial -40C to 85C ATSAM4LC4BA-MUR ATSAM4LC4BA-UUR Reel WLCSP64 ATSAM4LC4AA-AU-ES ATSAM4LC4AA-AU TQFP48 Reel Industrial -40C to 85C ES N/A Tray Industrial -40C to 85C ATSAM4LC4AA-AUR Reel ATSAM4LC4AA-MU-ES ATSAM4LC4AA-MU ES QFN48 N/A Tray Industrial -40C to 85C ATSAM4LC4AA-MUR Reel 166 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 11-3. ATSAM4LC2 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LC2CA-AU Conditioning Package Type Temperature Operating Range Green Industrial -40C to 85C Tray TQFP100 ATSAM4LC2CA-AUR Reel ATSAM4LC2CA-CFU Tray VFBGA100 ATSAM4LC2CA-CFUR Reel ATSAM4LC2BA-AU Tray TQFP64 ATSAM4LC2BA-AUR ATSAM4LC2BA-MU Reel 128 Tray 32 QFN64 ATSAM4LC2BA-MUR Reel ATSAM4LC2BA-UUR WLCSP64 ATSAM4LC2AA-AU Reel Tray TQFP48 ATSAM4LC2AA-AUR Reel ATSAM4LC2AA-MU Tray QFN48 ATSAM4LC2AA-MUR Table 11-4. Reel ATSAM4LS8 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LS8CA-AU Conditioning Package Type Temperature Operating Range Green Industrial -40C to 85C Tray TQFP100 ATSAM4LS8CA-AUR Reel ATSAM4LS8CA-CFU Tray VFBGA100 ATSAM4LS8CA-CFUR Reel ATSAM4LS8BA-AU Tray TQFP64 ATSAM4LS8BA-AUR 512 Reel 64 ATSAM4LS8BA-MU Tray QFN64 ATSAM4LS8BA-MUR ATSAM4LS8BA-UUR Reel WLCSP64 ATSAM4LS8AA-MU Reel Tray QFN48 ATSAM4LS8AA-MUR Reel 167 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table 11-5. ATSAM4LS4 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LS4CA-AU-ES Conditioning Package Type ES ATSAM4LS4CA-AU TQFP100 Temperature Operating Range N/A Tray Industrial -40C to 85C ATSAM4LS4CA-AUR Reel ATSAM4LS4CA-CFU Tray VFBGA100 Industrial -40C to 85C ATSAM4LS4CA-CFUR Reel ATSAM4LS4BA-AU-ES ES ATSAM4LS4BA-AU TQFP64 N/A Tray Industrial -40C to 85C ATSAM4LS4BA-AUR Reel ATSAM4LS4BA-MU-ES ES 256 32 ATSAM4LS4BA-MU N/A Green QFN64 Tray Industrial -40C to 85C ATSAM4LS4BA-MUR Reel ATSAM4LS4BA-UUR WLCSP64 ATSAM4LS4AA-AU-ES ATSAM4LS4AA-AU TQFP48 Reel Industrial -40C to 85C ES N/A Tray Industrial -40C to 85C ATSAM4LS4AA-AUR Reel ATSAM4LS4AA-MU-ES ES ATSAM4LS4AA-MU QFN48 N/A Tray Industrial -40C to 85C ATSAM4LS4AA-MUR Table 11-6. Reel ATSAM4LS2 Sub Serie Ordering Information Ordering Code Flash (Kbytes) RAM (Kbytes) Package ATSAM4LS2CA-AU Conditioning Package Type Temperature Operating Range Green Industrial -40C to 85C Tray TQFP100 ATSAM4LS2CA-AUR Reel ATSAM4LS2CA-CFU Tray VFBGA100 ATSAM4LS2CA-CFUR Reel ATSAM4LS2BA-AU Tray TQFP64 ATSAM4LS2BA-AUR ATSAM4LS2BA-MU Reel 128 Tray 32 QFN64 ATSAM4LS2BA-MUR ATSAM4LS2BA-UUR Reel WLCSP64 ATSAM4LS2AA-AU Reel Tray TQFP48 ATSAM4LS2AA-AUR Reel ATSAM4LS2AA-MU Tray QFN48 ATSAM4LS2AA-MUR Reel 168 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 12. Errata 12.1 12.1.1 ATSAM4L4 /2 Rev. B & ATSAM4L8 Rev. A General PS2 mode is not supported by Engineering Samples PS2 mode support is supported only by parts with calibration version higher than 0. Fix/Workaround The calibration version can be checked by reading a 32-bit word at address 0x0080020C. The calibration version bitfield is 4-bit wide and located from bit 4 to bit 7 in this word. Any value higher than 0 ensures that the part supports the PS2 mode 12.1.2 SCIF PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 12.1.3 WDT WDT Control Register does not have synchronization feedback When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN), Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization takes a finite amount of time, but only the status of the synchronization of the EN bit is reflected back to the user. Writing to the synchronized fields during synchronization can lead to undefined behavior. Fix/Workaround -When writing to the affected fields, the user must ensure a wait corresponding to 2 clock cycles of both the WDT peripheral bus clock and the selected WDT clock source. -When doing writes that changes the EN bit, the EN bit can be read back until it reflects the written value. 12.1.4 SPI SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. 169 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 12.1.5 TC Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 12.1.6 USBC In USB host mode, entering suspend mode for low speed device can fail when the USB freeze (USBCON.FRZCLK=1) is done just after UHCON.SOFE=0. Fix/Workaround When entering suspend mode (UHCON.SOFE is cleared), check that USBFSM.DRDSTATE is not equal to three before freezing the clock (USBCON.FRZCLK=1). In USB host mode, the asynchronous attach detection (UDINT.HWUPI) can fail when the USB clock freeze (USBCON.FRZCLK=1) is done just after setting the USBSTA.VBUSRQ bit. Fix/Workaround After setting USBS TA.VBUSRQ bit, wait until the USBFSM register value is `A_WAIT_BCON' before setting the USBCON.FRZCLK bit. 170 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 12.1.7 FLASHCALW Corrupted data in flash may happen after flash page write operations. After a flash page write operation, reading (data read or code fetch) in flash may fail. This may lead to an expecption or to others errors derived from this corrupted read access. Fix/Workaround Before any flash page write operation, each 64-bit doublewords write in the page buffer must preceded by a 64-bit doublewords write in the page buffer with 0xFFFFFFFF_FFFFFFFF content at any address in the page. Note that special care is required when loading page buffer, refer to Section 2.5.9 "Page Buffer Operations" on page 11. 171 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 13. Datasheet Revision History Note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 13.1 13.2 13.3 13.4 Rev. A - 09/12 1. Initial revision. 1. Fixed ordering code 2. Changed BOD18CTRL and BOD33CTRL ACTION field from "Reserved" to `No action" 1. Fixed ball pitch for VFBGA100 package 2. Added VFBGA100 and WLCSP64 pinouts 3. Added Power Scaling Mode 2 for high frequency support 4. Minor update on several modules chapters 5. Major update on Electrical characteristics 6. Updated errata 7. Fixed GPIO multiplexing pin numbers 1. Removed WLCSP package information 2. Added errata text for detecting whether a part supports PS2 mode or not 3. Removed temperature sensor feature (not supported by production flow) 4. Fixed MUX selection on Positive ADC input channel table 5. Added information about TWI instances capabilities 6. Added some details on errata Corrupted data in flash may happen after flash page write operations.171 Rev. B - 10/12 Rev. C - 02/13 Rev. D - 03/13 172 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 13.5 13.6 13.7 13.8 Rev. E - 07/13 1. Added ATSAM4L8 derivatives and WLCSP packages for ATSAM4L4/2 2. Added operating conditions details in Electrical Characteristics Chapter 3. Fixed "Supply Rise Rates and Order" 4. Added number of USART available in sub-series 5. Fixed IO line considerations for USB pins 6. Removed useless information about CPU local bus which is not implemented 7. Removed useless information about Modem support which is not implemented 8. Added information about unsupported features in Power Scaling mode 1 9. Fixed SPI timings 1. Fixed table 3-6 - TDI is connected to pin G3 in WLCSP package 2. Changed table 42-48 -ADCIFE Electricals in unipolar mode : PSRR & DC supply current typical values 3. Fixed SPI timing characteristics 4. Fixed BOD33 typical step size value 1. Added WLCSP64 packages for SAM4LC8 and SAM4LS8 sub-series 2. Removed unsuppported SWAP feature in LCD module 3. Added mnimal value for ADC Reference range 1. Fixed AESA configuration in Overview chapter for SAM4LS sub-series Rev. F- 12/13 Rev. G- 03/14 Rev. H- 11/16 173 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 Table of Contents Summary.................................................................................................... 1 Features ..................................................................................................... 1 1 Description ............................................................................................... 3 2 Overview ................................................................................................... 5 3 4 5 6 7 2.1 Block Diagram ...................................................................................................5 2.2 Configuration Summary .....................................................................................6 Package and Pinout ................................................................................. 9 3.1 Package .............................................................................................................9 3.2 Peripheral Multiplexing on I/O lines .................................................................19 3.3 Signals Description ..........................................................................................31 3.4 I/O Line Considerations ...................................................................................34 Cortex-M4 processor and core peripherals ......................................... 36 4.1 Cortex-M4 ........................................................................................................36 4.2 System level interface .....................................................................................37 4.3 Integrated configurable debug .........................................................................37 4.4 Cortex-M4 processor features and benefits summary .....................................38 4.5 Cortex-M4 core peripherals .............................................................................38 4.6 Cortex-M4 implementations options ................................................................39 4.7 Cortex-M4 Interrupts map ................................................................................39 4.8 Peripheral Debug .............................................................................................42 Memories ................................................................................................ 43 5.1 Product Mapping .............................................................................................43 5.2 Embedded Memories ......................................................................................44 5.3 Physical Memory Map .....................................................................................44 Power and Startup Considerations ...................................................... 46 6.1 Power Domain Overview .................................................................................46 6.2 Power Supplies ................................................................................................48 6.3 Startup Considerations ....................................................................................53 6.4 Power-on-Reset, Brownout and Supply Monitor .............................................53 Low Power Techniques ......................................................................... 55 7.1 Power Save Modes .........................................................................................55 7.2 Power Scaling ..................................................................................................60 174 42023HS-SAM-11/2016 ATSAM4L8/L4/L2 8 9 Debug and Test ...................................................................................... 62 8.1 Features ..........................................................................................................62 8.2 Overview ..........................................................................................................62 8.3 Block diagram ..................................................................................................63 8.4 I/O Lines Description .......................................................................................63 8.5 Product dependencies .....................................................................................64 8.6 Core debug ......................................................................................................64 8.7 Enhanced Debug Port (EDP) ..........................................................................67 8.8 AHB-AP Access Port .......................................................................................77 8.9 System Manager Access Port (SMAP) ............................................................78 8.10 Available Features in Protected State .............................................................93 8.11 Functional Description .....................................................................................94 Electrical Characteristics ...................................................................... 99 9.1 Absolute Maximum Ratings* ...........................................................................99 9.2 Operating Conditions .......................................................................................99 9.3 Supply Characteristics .....................................................................................99 9.4 Maximum Clock Frequencies ........................................................................101 9.5 Power Consumption ......................................................................................103 9.6 I/O Pin Characteristics ...................................................................................114 9.7 Oscillator Characteristics ...............................................................................121 9.8 Flash Characteristics .....................................................................................127 9.9 Analog Characteristics ...................................................................................129 9.10 Timing Characteristics ...................................................................................140 10 Mechanical Characteristics ................................................................. 153 10.1 Thermal Considerations ................................................................................153 10.2 Package Drawings .........................................................................................154 10.3 Soldering Profile ............................................................................................165 11 Ordering Information ........................................................................... 166 12 Errata ..................................................................................................... 169 12.1 ATSAM4L4 /2 Rev. B & ATSAM4L8 Rev. A ..................................................169 13 Datasheet Revision History ................................................................ 172 13.1 Rev. A - 09/12 ...............................................................................................172 13.2 Rev. B - 10/12 ...............................................................................................172 13.3 Rev. C - 02/13 ...............................................................................................172 175 42023HS-SAM-11/2016 13.4 Rev. D - 03/13 ...............................................................................................172 13.5 Rev. E - 07/13 ...............................................................................................173 13.6 Rev. F- 12/13 ................................................................................................173 13.7 Rev. G- 03/14 ...............................................................................................173 13.8 Rev. H- 11/16 ................................................................................................173 Table of Contents.................................................................................. 174 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 (c) 2013 Atmel Corporation. All rights reserved. Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. 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Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 42023HS-SAM-11/2016