2111 COMPREHENSIVE DRIVE.
AURORA, IL 60505.
FAX (630) 851-5040.
PHONE (630) 851-4722.
Specifications subject to change without notice.
HCMOS output. Based on a
stability.
ABSOLUTE MAXIMUM RATINGS TABLE 1.0
PARAMETER UNITS MINIMUM NOMINAL MAXIMUM UNITS NOTE
Storage Temperature -55 - 125 °C
Supply Voltage (Vcc) -0.5 - 7.0 Vdc
Control Voltage (Vc) -0.5 - 7.0 Vdc
MODEL SPECIFICATIONS TABLE 2.0
PARAMETER UNITS MINIMUM NOMINAL MAXIMUM UNITS NOTE
VSLD61TJ3EN-065.536M
Center Frequency (Fo) - 65.536 - MHz
Frequency Tolerance (Vc=1.65V) -25 - 25 ppm 1
Operating Temperature Range -40 - 85 °C
Frequency Tolerance (Vc=1.65V) -20 - 20 ppm 1
Operating Temperature Range 0 - 70 °C
VSLD61TJ3EN-077.76M
Center Frequency (Fo) - 77.760 - MHz
Frequency Tolerance (Vc=1.65V) -25 - 25 ppm 1
Operating Temperature Range -40 - 85 °C
OPERATING SPECIFICATIONS TABLE 3.0
PARAMETER UNITS MINIMUM NOMINAL MAXIMUM UNITS NOTE
Supply Voltage (Vcc) 3.135 3.300 3.465 Vdc
Supply Current (Icc) - - 50 mA
Jitter (BW=10Hz to 20MHz) - - 5 pS rms
Jitter (BW=12kHz to 20MHz) - - 1 pS rms
SSB Phase Noise at 10Hz offset - -60 - dBc/Hz
SSB Phase Noise at 100Hz offset - -90 - dBc/Hz
SSB Phase Noise at 1KHz offset - -100 - dBc/Hz
SSB Phase Noise at 10KHz offset - -135 - dBc/Hz
SSB Phase Noise at 100KHz offset - -140 - dBc/Hz
INPUT CHARACTERISTICS TABLE 4.0
PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE
Control Voltage Range (Vc) 0.3 1.65 3.0 Vdc
Frequency Pullabilty @25°C ±75 - ±150 ppm 2
Absolute Pull Range ±50 - - ppm 3
Monotonic Linearity -10 - 10 %
Input Impedance - 50K - Ohm
Modulation Bandwidth (3dB) 15 - - KHz
Enable Input Voltage (High) (Vih) 2.0 - - Vdc 4
Disable Input Voltage (Low) (Vil) - - 0.5 Vdc 4
Output Enable / Disable Time - - 100 nS
HCMOS OUTPUT CHARACTERISTICS TABLE 5.0
PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE
LOAD - - 15 pF
Voltage (High) (Voh) 2.4 - - Vdc
(Low) (Vol) - - 0.4 Vdc
Current (High) (Ioh) -8 - - mA
(Low) (Ioh) - - 8 mA
Duty Cycle measured at 1.5 Vdc 45 50 55 %
Rise / Fall Time 20% to 80% - 1.0 1.5 nS
PACKAGE CHARACTERISTICS TABLE 6.0
Package Non-hermetic package consisting of an FR4 substrate with grounded metal
cover.
PROCESS RECOMMENDATIONS TABLE 7.0
Solder Reflow The component solder used internal to this device has a melting point of
221°C. The peak temperature inside the device should be less than or equal
to 220°C for a maximum of 10 seconds
Wash Ultrasonic cleaning is not recommended.