Qualification Test Report 501-662 12Aug08 Rev B HDMI/E-SATA and HDMI/HDMI Stacked Connector Assemblies | 1. INTRODUCTION 1.1. Purpose | | | | Testing was perform ed on Tyco Electronics HDMI/E-SATA and HDMI/HDMI Stacked Connector Assem blies to determ ine their conform ance to the requirem ents of Version 1.3a of the High-Definition Multim edia Interface Specification, Version 1.3c of the HDMI Com pliance Test Specification, and Revision 2.6 of the Serial ATA as applicable. 1.2. | | Scope This report covers the electrical, m echanical, and environm ental perform ance of the HDMI/E-SATA and HDMI/HDMI Stacked Connector Assem blies. Testing was perform ed at the EME Laboratory and the Engineering Assurance Product Testing Laboratory between 21Feb07 and 19Jul07. The test file num bers for this testing are EMEB079940-001, CTLB079940-004, CTLB079940-006, CTLB079940007, CTLB079940-008, CTLB079940-009, CTLB079940-010 and CTLB079940-011. Additional testing was perform ed on 11Jun08. The test file num ber for this testing is EA20080513T. This docum entation is on file at and available from the EME Laboratory and the Engineering Assurance Product Testing Laboratory. | | 1.3. | Conclusion The HDMI/E-SATA and HDMI/HDMI Stacked Connector Assem blies listed in paragraph 1.5., conform ed to the electrical, m echanical, and environm ental perform ance requirem ents of Version 1.3a of the High-Definition Multim edia Interface Specification, Version 1.3c of the HDMI Com pliance Test Specification, and Revision 2.6 of the Serial ATA as applicable. | | 1.4. | Product Description The HDMI/E-SATA and HDMI/HDMI Stacked Connector Assem blies com bines video and audio into a single digital interface for use with DVD players, set-top boxes, televisions and other audiovisual devices. 1.5. | | Test Specim ens Test specim ens were representative of norm al production lots. Specim ens identified with part num bers 1888540-1 and 1888811-1 were used for testing. Specim ens were tested with 0.3 :m m inim um gold plating on the m ating surface of the contacts and gold flash over 0.3 :m m inim um palladium -nickel plating on the m ating surface of the contacts. 1.6. Environm ental Conditions Unless otherwise stated, the following environm ental conditions prevailed during testing: ! ! Tem perature: 15 to 35/C Relative Hum idity: 25 to 75% (c)2008 Tyco Electronics Corporation Harrisburg, PA All International Rights Reserved * Trademark | Indicates change 1 of 10 LOC B 501-662 2. QUALIFICATION TEST SEQUENCES 2.1. High-Definition Multim edia Interface Specification, Version 1.3a Test Group Test or Exam ination 1 2 3 4 5 Test Sequence Contact and shell resistance 2,6 Insulation resistance 2 Dielectric strength 1 Current rating 1 Applied voltage rating 3 Electrostatic discharge 1 Tim e dom ain im pedance 1 Crosstalk (FEXT) 1,5 W ithdrawal force 3,7 Durability, 10000 cycles | 2.2. 2 Insertion force 4 HDMI Com pliance Test Specification, Version 1.3c Test Group Test or Exam ination 1 2 3 4 Test Sequence Contact and shell resistance 1,3,5,7,9 1,3,5 Insulation resistance 10 4,6 Dielectric strength 11 1,3 Electrostatic discharge Durability, 100 cycles 2(a) Mechanical shock 4 Vibration 2 Hum idity/tem perature cycling 8(b) Therm al aging 6 Therm al shock 4 NOTE Rev B 1 (a) (b) (c) 5(c) 2 One hundred durability cycles performed on only one half of the specimens. Specimens unmated. Specimens mated. 2 of 10 501-662 2.3. Serial ATA, Revision 2.6 A. Electrical and Mechanical Requirem ents Test Group Test or Exam ination A B C D E Test Sequence Exam ination of product 1,5 1,9 1,7 1,8 LLCR 2,4 3,7 2,4,6 4,6 Insulation resistance 2,6 Dielectric withstanding voltage 3,7 Insertion force 2 Rem oval force Durability 1,7 8 3 4 Mechanical shock 6 Vibration 5 2 Hum idity 5 Tem perature life 3 Reseating 5 5 Mixed flowing gas 3 Therm al shock B. 4 High Speed Signal Requirem ents Test Group Test or Exam ination A B C D E F Test Sequence Mated connector differential im pedance Com m on m ode im pedance Maxim um insertion loss of cable (10 to 4500 MHz) Maxim um crosstalk (10 to 4500 MHz) Maxim um rise tim e Maxim um intra-pair skew 2.4. Rev B 1 1 1 1 1 1 Com ponent Heat Resistance to Lead-Free Reflow Soldering 3 of 10 501-662 3. SUM M ARY OF TESTING 3.1. High-Definition Multim edia Interface Specification, Version 1.3a and HDMI Com pliance Test Specification Version, 1.3c | A. Contact and Shell Resistance The change in all contact resistance m easurem ents from the initial m easurem ents were less than 30 m illiohm s. The change in all shell resistance m easurem ents from the initial m easurem ents were less than 50 m illiohm s. B. Insulation Resistance All insulation resistance m easurem ents were greater than 100 m egohm s for unm ated specim ens and 10 m egohm s for m ated specim ens. C. Dielectric Strength No dielectric breakdown or flashover occurred. D. Current Rating All contact current rating m easurem ents were greater than 0.5 am pere. E. Applied Voltage Rating No breakdown or flashover occurred. F. Electrostatic Discharge There was no evidence of discharge to the contacts. G. Tim e Dom ain Im pedance All tim e dom ain im pedance m easurem ents were within 100 ohm s 15% differential. H. Crosstalk (FEXT) All FEXT ratios were less than 5%. I. Insertion Force All insertion force m easurem ents were less than 44.1 N. J. W ithdrawal Force All withdrawal force m easurem ents were less than 39.2 N and greater than 9.8 N. K. Durability No physical dam age occurred as a result of m ating and unm ating the specim ens either 10000 or 100 tim es. Rev B 4 of 10 501-662 L. Mechanical Shock No discontinuities were detected during m echanical shock testing. Following m echanical shock testing, no cracks, breaks, or loose parts on the specim ens were visible. M. Vibration No discontinuities were detected during vibration testing. Following vibration testing, no cracks, breaks, or loose parts on the specim ens were visible. N. Hum idity/tem perature Cycling No evidence of physical dam age was visible as a result of hum idity/tem perature cycling. O. Therm al Aging No evidence of physical dam age was visible as a result of therm al aging. P. Therm al Shock No evidence of physical dam age was visible as a result of therm al shock testing. 3.2 Serial ATA Revision 2.6 A. Electrical and Mechanical Requirem ents 1. Exam ination of Product Specim ens were visually exam ined and no evidence of physical dam age detrim ental to product perform ance was observed. 2. Low Level Contact Resistance (LLCR) All LLCR m easurem ents were less than 30 m illiohm s initially and the increase in resistance was less than 15 m illiohm s after testing. 3. Insulation Resistance All insulation resistance m easurem ents were greater than 1000 m egohm s. 4. Dielectric W ithstanding Voltage No dielectric breakdown or flashover occurred. 5. Insertion Force All insertion force m easurem ents were less than 40 N. 6. Rem oval Force All rem oval force m easurem ents were greater than 10 N. 7. Durability No physical dam age occurred as a result of m ating and unm ating the specim ens 2500 tim es. Rev B 5 of 10 501-662 8. Mechanical Shock No discontinuities were detected during m echanical shock testing. Following m echanical shock testing, no cracks, breaks, or loose parts on the specim ens were visible. 9. Vibration No discontinuities were detected during vibration testing. Following vibration testing, no cracks, breaks, or loose parts on the specim ens were visible. 10. Hum idity No evidence of physical dam age was visible as a result of hum idity testing. 11. Tem perature Life No evidence of physical dam age was visible as a result of tem perature life testing. 12. Reseating No physical dam age occurred as a result of m ating and unm ating the specim ens 3 tim es. 13. Mixed Flowing Gas No evidence of physical dam age was visible as a result of exposure to the pollutants of m ixed flowing gas. 14. Therm al Shock No evidence of physical dam age was visible as a result of therm al shock testing. B. High Speed Signal Requirem ents 1. Mated Connector Differential Im pedance All m ated connector differential im pedance m easurem ents were within 100 ohm s 15%. 2. Com m on Mode Im pedance All com m on m ode im pedance m easurem ents were within 25 to 40 ohm s. 3. Maxim um Insertion Loss of Cable (10 to 4500 MHz) All insertion loss of cable (10 to 4500 MHz) m easurem ents were less than 8 dB. 4. Maxim um Crosstalk (10 to 4500 MHz) All crosstalk (10 to 4500 MHz) loss m easurem ents were less than 26 dB. 5. Maxim um Rise Tim e Tests were conducted with rise tim e less than 150 picoseconds (20 to 80% ). Rev B 6 of 10 501-662 6. Maxim um Intra-pair Skew Tests were conducted with inter-pair skew less than 20 picoseconds. 3.3. Com ponent Heat Resistance to Lead-Free Reflow Soldering Specim ens were visually exam ined and no evidence of physical dam age detrim ental to product perform ance was observed. 4. TEST M ETHODS 4.1. High-Definition Multim edia Interface Specification, Version 1.3a and HDMI Com pliance Test Specification Version, 1.3c | A. Contact and Shell Resistance Contact resistance m easurem ents were m ade using a 4 term inal m easuring technique. The test current was m aintained at 100 m illiam peres m axim um with a 20 m illivolt m axim um open circuit voltage for contact resistance m easurem ents and 100 m illiam peres m axim um with a 5 volt m axim um open circuit voltage for the shell resistance m easurem ents. B. Insulation Resistance Insulation resistance was m easured between adjacent term inals of both m ated and unm ated specim ens. A test voltage of 150 volts DC was applied to m ated specim ens and 500 volts DC was applied to unm ated specim ens. These voltages were applied for 2 m inutes before the resistance was m easured. C. Dielectric Strength A test potential of 300 volts AC was applied between adjacent term inals of m ated specim ens. A test potential of 500 volts AC was applied between adjacent term inals of unm ated specim ens. These potentials were applied for 1 m inute and then returned to zero. D. Current Rating The tem perature of specim ens fully energized at 0.5 am pere was m easured using therm al im aging. A sm all hole was drilled in the back of the specim ens to expose the contact tails at the 90 degree bend. Specim ens were coated with an em issivity correction coating with a correction factor of 0.93. Therm al im aging equipm ent was used for data processing. The software uses a tem perature box m easurem ent feature which allows a m easurem ent inside the box when placed on the area of interest. E. Applied Voltage Rating A test potential of 40 volts AC was applied between contacts and the shield. This potential was applied for 1 m inute and then returned to zero. F. Electrostatic Discharge Unm ated specim ens were subjected to 10 pulses of positive 8 kilovolts and 10 pulses of negative 8 kilovolts using an 8 m m ball probe. G. Tim e Dom ain Im pedance Tim e dom ain im pedance was m easured per EIA-364-108. Rev B 7 of 10 501-662 H. Crosstalk (FEXT) FEXT was m easured per EIA-364-90. I. Insertion Force The force required to m ate individual specim ens was m easured using a tensile/com pression device with a free floating fixture and a rate of travel of 25 m m per m inute. J. W ithdrawal Force The force required to unm ate individual specim ens was m easured using a tensile/com pression device with a free floating fixture and a rate of travel of 25 m m per m inute. K. Durability Specim ens were m ated and unm ated either 10000 or 100 tim es at a rate of 100 50 cycles per hour. L. Mechanical Shock Specim ens were subjected to a m echanical shock test having a half-sine waveform of 50 gravity units (g peak) and a duration of 11 m illiseconds. Three shocks in each direction were applied along the 3 m utually perpendicular planes for a total of 18 shocks. Specim ens were m onitored for discontinuities of 1 m icrosecond or greater using a current of 100 m illiam peres DC. M. Vibration Specim ens were subjected to sinusoidal vibration, having a sim ple harm onic m otion with an am plitude of 1.52 m m double am plitude (15 g peak). The vibration frequency was varied uniform ly between the lim its of 50 and 2000 Hz and returned to 50 Hz in 20 m inutes. This cycle was perform ed 12 tim es in each of 3 m utually perpendicular planes. Specim ens were m onitored for discontinuities of 1 m icrosecond or greater using a current of 100 m illiam peres DC. N. Hum idity/tem perature Cycling Specim ens were exposed to 4 hum idity/tem perature cycles. Each cycle lasted 24 hours and consisted of cycling the tem perature between 25 and 85/C while m aintaining 80 to 95% hum idity. O. Therm al Aging Specim ens were exposed to a tem perature of 105 2/C for 250 hours. P. Therm al Shock Specim ens were subjected to 10 cycles of therm al shock with each cycle consisting of 30 m inute dwells at -55 and 85/C. The transition between tem peratures was less than 1 m inute. 4.2 Serial ATA Revision 2.6 A. Electrical and Mechanical Requirem ents 1. Exam ination of Product Specim ens were exam ined visually and dim ensionally and no evidence of physical dam age detrim ental to product perform ance was observed. Rev B 8 of 10 501-662 2. Low Level Contact Resistance (LLCR) LLCR m easurem ents were m ade using a 4 term inal m easuring technique. The test current was m aintained at 100 m illiam peres m axim um with a 20 m illivolt m axim um open circuit voltage for m ated specim ens. 3. Insulation Resistance Insulation resistance was m easured between adjacent contacts of m ated and unm ated specim ens. A test voltage of 500 volts DC was applied for 1 m inute before the resistance was m easured. 4. Dielectric W ithstanding Voltage A test potential of 500 volts AC was applied between adjacent contacts of m ated and unm ated specim ens. This potential was applied for 1 m inute and then returned to zero. 5. Insertion Force The force required to m ate individual specim ens was m easured using a tensile/com pression device with a free floating fixture and a rate of travel of 12.7 m m per m inute. 6. Rem oval Force The force required to unm ate individual specim ens was m easured using a tensile/com pression device with a free floating fixture and a rate of travel of 12.7 m m per m inute. 7. Durability Specim ens were m ated and unm ated 2500 tim es at a m axim um rate of 200 cycles per hour. 8. Mechanical Shock Mated specim ens were subjected to a m echanical shock test having a half-sine waveform of 30 gravity units (g peak) and a duration of 11 m illiseconds. Three shocks in each direction were applied along the 3 m utually perpendicular planes for a total of 18 shocks. Specim ens were m onitored for discontinuities of 1 m icrosecond or greater using a current of 100 m illiam peres DC. 9. Vibration Mated specim ens were subjected to a random vibration test, specified by a random vibration spectrum , with excitation frequency bounds of 50 and 2000 Hz. The Power Spectral Density (PSD) at 50 Hz was 0.005 G 2/Hz. The spectrum sloped up at 6 dB per octave to a PSD of 0.02 G 2/Hz at 100 Hz. The spectrum was flat at 0.02 G 2/Hz from 100 to 1000 Hz. The spectrum sloped down at 6 dB per octave to the upper boundary frequency of 2000 Hz at which the PSD was 0.005 G 2/Hz. The root-m ean square am plitude of the excitation was 5.35 GRMS. This was perform ed for 30 m inutes in each of 3 m utually perpendicular planes for a total vibration tim e of 90 m inutes. Specim ens were m onitored for discontinuities of 1 m icrosecond or greater using a current of 100 m illiam peres in the m onitoring circuit. 10. Hum idity Mated specim ens were subjected to a relative hum idity of 90 t0 95% and a tem perature of 40/C for 96 hours. Rev B 9 of 10 501-662 11. Tem perature Life Mated specim ens were exposed to a tem perature of 85/C for 500 hours. 12. Reseating Specim ens were m anually m ated and unm ated 3 tim es. 13. Mixed Flowing Gas Mated and unm ated specim ens were exposed for 14 days to a m ixed flowing gas Class IIA exposure. Half the specim ens were unm ated for the first 7 days and then m ated for the rem aining 7 days, the other half of the specim ens were m ated for the entire 14 days. Class IIA exposure is defined as a tem perature of 30/C and a relative hum idity of 70% with the pollutants of Cl2 at 10 ppb, NO 2 at 200 ppb, H 2S at 10 ppb and SO 2 at 100 ppb. 14. Therm al Shock Mated specim ens were subjected to 10 cycles of therm al shock with each cycle consisting of 30 m inute dwells at -55 and 85/C. The transition between tem peratures was less than 1 m inute. B. High Speed Signal Requirem ents 1. Mated Connector Differential Im pedance Measured per procedure P1 of Revision 2.6 of the Serial ATA. 2. Com m on Mode Im pedance Measured per procedure P4 of Revision 2.6 of the Serial ATA. 3. Maxim um Insertion Loss of Cable (10 to 4500 MHz) Measured per procedure P5 of Revision 2.6 of the Serial ATA. 4. Maxim um Crosstalk (10 to 4500 MHz) Measured per procedure P6 of Revision 2.6 of the Serial ATA. 5. Maxim um Rise Tim e Measured per procedure P8 of Revision 2.6 of the Serial ATA. 6. Maxim um Intra-pair Skew Measured per procedure P10 of Revision 2.6 of the Serial ATA. 4.3. Com ponent Heat Resistance to Lead-Free Reflow Soldering Specim ens were exposed to a tem perature of 85/C and 85% relative hum idity for 168 hours. Specim ens were then placed on ceram ic substrates on the conveyor belt of a convection air oven where they were exposed to tem peratures between 150 and 200/C for 60 to 180 seconds, between 255 and 260/C for 20 to 40 seconds, and above liquidus (217/C) for 60 to 150 seconds. Specim ens were allowed to cool prior to repeating this sequence twice m ore for a total of 3 cycles. Rev B 10 of 10