Qualification Test
Report 501-662
12Aug08 Re v B
HDMI/E-SATA and HDMI/HDMI Stacked Connector|Assemblies
©2008 Tyco Electronics Corporation
Harrisburg , PA
All International Rights Reserved
* Trademark
| Indicates change 1 of 10
LOC B
1. INTRODUCTION
1.1. Purpose
| Testing was perform ed on Tyco Electronics HD M I/E-SAT A and HD MI/HD M I Stacked Connector
| Assem blies to determ ine their conform ance to the requirem ents of Version 1.3a of the High-Definition
| Multim edia Interface Specification, Version 1.3c of the HD M I Compliance Test Specification, and
| Revision 2.6 of the Serial ATA as applicable.
1.2. Scope
| This report covers the electrical, mechanical, and environm ental perform ance of the HDM I/E-SATA and
| HD M I/HDM I Stacked Connector Assem blies. T esting was performed at the EME Laboratory and the
E n g in e er in g A s su r a n c e Pr o d u c t Te s ting L a b or a to r y b e twe e n 2 1 Feb 0 7 a n d 1 9 Ju l0 7 . Th e test f ile
num bers for this testing are EMEB079940-001, CTLB079940-004, CTLB079940-006, CT LB079940-
| 007, CT LB079940-008, CTLB079940-009, CTLB079940-010 and CT LB079940-011. Additional testing
| was perform ed on 11Jun08. T he test file number for this testing is EA20080513T . T his docum entation
is on file at and available from the EME Laboratory and the Engineering Assurance Product Testing
Laboratory.
1.3. Conclusion
| The H DMI/E-SA T A a n d HDMI/HDMI S ta c k ed C o n n ec to r A ss e mb lies liste d in pa ra g rap h 1 .5.,
conform ed to the electrical, m echanical, and environm ental performance requirements of Version 1.3a
| of the High-D efinition Multimedia Interface Specification, Version 1.3c of the HDM I Compliance Test
| Specification, and Revision 2.6 of the Serial ATA as applicable.
1.4. Product Description
| The HD M I/E-SATA and HD M I/HDM I Stacked Connector Assem blies com bines video and audio into a
single digital interface for use with DVD players, set-top boxes, televisions and other audiovisual
devices.
1.5. Test Specim ens
| T es t spec imens were represen tative of no rm al produc tion lots. Spe cim en s identified with part nu mbe rs
| 1888540-1 and 1888811-1 were used for testing. Specim ens were tested with 0.3 :m min imu m g o ld
plating on the m ating surface of the contacts and gold flash over 0.3 :m minim um palladium -nickel
plating on the m ating surface of the contacts.
1.6. Environmental Conditions
Unless otherwise stated, the following environm ental conditions prevailed during testing:
!Temperature: 15 to 35/C
!Relative Humidity: 25 to 75%
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2. QU ALIFICATION TEST SEQ UENC ES
2.1. High-Definition Multim edia Interface Specification, Version 1.3a
Test or Exam ination
Test Group
12345
Test Sequence
C o nta c t an d sh e ll resis tan c e 2,6
Insulation resistance 2
D iele ctric stre n g th 1
Current rating 1
Applied voltage rating 3
Electrostatic discharge 1
Tim e dom ain im pedance 1
Crosstalk (FEXT) 2
Ins e rtion fo rc e 1,5
Withd ra w a l forc e 3,7
Durability, 10000 cycles 4
| 2.2. HD M I Compliance T est Specification, Version 1.3c
Test or Exam ination
Test Group
1234
Test Sequence
C o nta c t an d sh e ll re s istan c e 1,3 ,5 ,7,9 1,3 ,5
Ins u lation res is tan c e 10 4,6
D iele ctric stre n g th 11 1,3
Electrostatic discharge 1
Durability, 100 cycles 2(a)
Mechanical shock 4
Vibration 2
Humidity/temperature cycling 8(b) 5(c)
Therm al aging 6
Therm al shock 4 2
(a) O ne hundred durability cycles perform ed on only one half of the specimens.
NOTE (b) Specim ens unmated.
(c) Specim ens mated.
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2.3 . S eria l ATA , R e v ision 2.6
A . E lec trica l an d Mec h a nic al R e q uire me nts
Test or Exam ination
Test Group
ABCDE
Test Sequence
E xa min ation o f p rod u c t 1,5 1,9 1,7 1,8 1,7
LLCR 2,4 3,7 2,4,6 4,6
Ins u lation re sis tan c e 2,6
D iele ctric w ithsta n din g vo lta ge 3,7
Insertion force 2
Removal force 8
Durability 3 4 2
Mechanical shock 6
Vibration 5
Humidity 5
T emperature life 3
Reseating 5 5
Mixed flowing gas 3
Therm al shock 4
B . H igh S p ee d Sig na l R e qu iremen ts
Test or Exam ination
Test Group
ABCDEF
Test Sequence
Mated connector differential im pedance 1
Common m ode im pedance 1
M a x imu m ins e rtion los s of c a b le (1 0 to 45 0 0 M H z) 1
M a x imu m c ro s sta lk (1 0 to 45 0 0 MH z) 1
Ma ximu m r is e time 1
Maxim um intra-pair skew 1
2.4. Component Heat Resistance to Lead-Free Reflow Soldering
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3. SUM M ARY OF TESTING
3.1. High-Definition Multim edia Interface Specification, Version 1.3a and HDM I Com pliance Test
| Specification Version, 1.3c
A. Contact and Shell Resistance
The change in all contact resistance measurem ents from the initial m easurements were less than
30 millioh ms . T h e ch a ng e in all sh e ll re sis tan c e me a s ure men ts from th e in itia l m e a s ure me n ts
w ere les s tha n 50 millioh ms .
B. Insulation Resistance
All insulation resistance measurem ents were greater than 100 megohms for unmated specimens
and 10 m egohm s for m ated specimens.
C . D iele ctric S tren g th
No dielectric breakdown or flashover occurred.
D. Current Rating
All contact current rating m easurem ents were greater than 0.5 ampere.
E. Applied Voltage Rating
No breakdown or flashover occurred.
F. Electrostatic Discharge
There was no evidence of discharge to the contacts.
G . T im e Domain Impedance
A ll time doma in imp e da n ce me a s u r e men ts we r e w ith in 1 00 o h ms ± 1 5 % d if f e re ntial.
H. Crosstalk (FEXT)
All FEX T ratios were less than 5% .
I. Insertion Force
All insertion force measurem ents were less than 44.1 N.
J. Withdrawal Force
All withdrawal force measurem ents were less than 39.2 N and greater than 9.8 N.
K. Durability
No physical dam age occurred as a result of m ating and unm ating the specim ens either 10000 or
100 tim es.
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L. Mechanical Shock
No discontinuities were detected during mechanical shock testing. Following mechanical shock
testing, no cracks, breaks, or loose parts on the specimens were visible.
M. Vibration
No discontinuities were detected during vibration testing. Following vibration testing, no cracks,
breaks, or loose parts on the specim ens were visible.
N. Hum idity/tem perature Cycling
No evidence of physical dam age was visible as a result of hum idity/temperature cycling.
O . T herm al Aging
No evidence of physical dam age was visible as a result of therm al aging.
P. Therm al Shock
No evidence of physical dam age was visible as a result of therm al shock testing.
3.2 S eria l ATA Re vis ion 2.6
A . E lec trica l an d Mec h a nic al R e q uire me nts
1. Exam ination of Product
S pe c ime n s w ere vis ua lly exa mine d an d no e vide nc e o f ph ysic a l damag e d e trime n tal to
product perform ance was observed.
2. Low Level Contact Resistance (LLCR)
All LLCR m easurem ents were less than 30 milliohms initially and the increase in resistance
was less than 15 m illiohm s after testing.
3. Insulation Resistance
All insulation resistance m easurements were greater than 1000 m egohm s.
4. Dielectric Withstanding Voltage
No dielectric breakdown or flashover occurred.
5. Insertion Force
All insertion force measurem ents were less than 40 N.
6. Rem oval Force
All removal force measurem ents were greater than 10 N.
7. Durability
No physical dam age occurred as a result of m ating and unm ating the specim ens 2500 tim es.
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8. Mechanical Shock
No discontinuities were detected during mechanical shock testing. Following mechanical
shock testing, no cracks, breaks, or loose parts on the specim ens were visible.
9. Vibration
No discontinuities were detected during vibration testing. Following vibration testing, no
cracks, breaks, or loose parts on the specim ens were visible.
10. Humidity
No evidence of physical dam age was visible as a result of hum idity testing.
11. T empe rature Life
No evidence of physical dam age was visible as a result of temperature life testing.
12. Reseating
No physical dam age occurred as a result of m ating and unm ating the specim ens 3 times.
13. Mixed Flowing G as
No evidence of physical dam age was visible as a result of exposure to the pollutants of m ixed
flowing gas.
14. Therm al Shock
No evidence of physical dam age was visible as a result of therm al shock testing.
B . H igh S p ee d Sig na l R e qu iremen ts
1. Mated Connector Differential Im pedance
All m ated connector differential im pedance m easurements were within 100 ohm s ± 15% .
2. Com mon Mode Impedance
All com mon m ode im pedance m easurem ents were within 25 to 40 ohms.
3. M a x imu m In se rtion L os s o f C a ble (1 0 to 45 0 0 MH z)
All insertion loss of cable (10 to 4500 MHz) m easurem ents were less than 8 dB.
4. M a x imu m C ro s s talk (1 0 to 4 50 0 M Hz)
All crosstalk (10 to 4500 MH z) loss m easurem ents were less than 26 dB.
5 . M a ximu m Ris e Time
T ests w ere co nduc ted w ith rise tim e less than 150 picosec onds (20 to 80%).
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6. Maximum Intra-pair Skew
Tests were conducted with inter-pair skew less than 20 picoseconds.
3.3. Component Heat Resistance to Lead-Free Reflow Soldering
Specim ens were visually examined and no evidence of physical damage detrim ental to product
perform ance was observed.
4. TEST METHODS
4.1. High-Definition Multim edia Interface Specification, Version 1.3a and HDM I Com pliance Test
| Specification Version, 1.3c
A. Contact and Shell Resistance
Contact resistance m easurem ents were m ade using a 4 term inal measuring technique. The test
c u r re n t wa s ma intain e d a t 10 0 milliamp e r e s ma ximu m w ith a 2 0 millivo lt ma x imu m o p e n c ir c u it
voltag e f o r c o n ta ct r e s is tanc e me a s u r e me n ts a n d 1 0 0 milliamp e r e s ma ximu m w ith a 5 v o lt
m axim um open circuit voltage for the shell resistance m easurements.
B. Insulation Resistance
Insulation resistance was m easured between adjacent term inals of both m ated and unm ated
specim ens. A test voltage of 150 volts DC was applied to m ated specim ens and 500 volts DC was
applied to unm ated specim ens. These voltages were applied for 2 m inutes before the resistance
was m easured.
C . D iele ctric S tren g th
A tes t po te ntial o f 30 0 vo lts A C w a s ap p lie d b e twe e n a d jac e n t termin als of ma te d s p e cime ns . A
test potential of 500 volts AC was applied between adjacent terminals of unm ated specim ens.
These potentials were applied for 1 m inute and then returned to zero.
D. Current Rating
The tem perature of specimens fully energized at 0.5 am pere was measured using therm al
im aging. A sm all hole was drilled in the back of the specim ens to expose the contact tails at the 90
degree bend. Specim ens were coated with an em issivity correction coating with a correction factor
of 0.93. Thermal imaging equipm ent was used for data processing. The software uses a
temperature box m easurem ent feature which allows a measurem ent inside the box when placed
on th e a re a o f inte re s t.
E. Applied Voltage Rating
A test potential of 40 volts AC was applied between contacts and the shield. This potential was
applied for 1 minute and then returned to zero.
F. Electrostatic Discharge
U nmated sp ecimen s w ere su bjected to 10 p ulses of po sitive 8 kilovo lts and 1 0 pulses of nega tive
8 kilovolts using an 8 mm ball probe.
G . T im e Domain Impedance
Tim e dom ain im pedance was m easured per EIA-364-108.
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H. Crosstalk (FEXT)
FEX T was measured per EIA-364-90.
I. Insertion Force
The force required to m ate individual specim ens was m easured using a tensile/com pression
device with a free floating fixture and a rate of travel of 25 m m per m inute.
J. Withdrawal Force
The force required to unm ate individual specimens was measured using a tensile/com pression
device with a free floating fixture and a rate of travel of 25 m m per m inute.
K. Durability
Specim ens were m ated and unm ated either 10000 or 100 tim es at a rate of 100 ± 50 cycles per
hour.
L. Mechanical Shock
S pe c ime n s w ere s u bje c ted to a me c ha n ica l sh oc k te st h a ving a ha lf-s ine wa v efo rm of 5 0 gra v ity
units (g peak) and a duration of 11 m illiseconds. Three shocks in each direction were applied
along the 3 m utually perpendicular planes for a total of 18 shocks. Specim ens were m onitored for
discontinuities of 1 microsecond or greater using a current of 100 m illiam peres DC.
M. Vibration
Specim ens were subjected to sinusoidal vibration, having a sim ple harm onic m otion with an
a mp litud e o f 1 .5 2 mm d o u b le a mp litu d e ( 1 5 g p e a k) . Th e v ib ra tion f r e q u e n c y wa s v a r ie d u n if o rmly
between the lim its of 50 and 2000 Hz and returned to 50 Hz in 20 m inutes. This cycle was
perform ed 12 tim es in each of 3 m utually perpendicular planes. Specim ens were m onitored for
discontinuities of 1 microsecond or greater using a current of 100 m illiam peres DC.
N. Hum idity/tem perature Cycling
Specim ens were exposed to 4 hum idity/temperature cycles. Each cycle lasted 24 hours and
consisted of cycling the tem perature between 25 and 85/C w hile ma in ta in in g 8 0 to 9 5 % h u mid ity.
O . T herm al Aging
Specimens were exposed to a temperature of 105 ± 2/C for 250 hours.
P. Therm al Shock
S pe c ime n s w ere s u bje c ted to 1 0 cyc les of th e rma l sh o ck w ith e ac h c ycle c o ns is ting o f 3 0 min ute
dwells at -55 and 85/C. The transition between tem peratures was less than 1 m inute.
4.2 S eria l ATA Re vis ion 2.6
A . E lec trica l an d Mec h a nic al R e q uire me nts
1. Exam ination of Product
Specim ens were exam ined visually and dim ensionally and no evidence of physical damage
detrim ental to product perform ance was observed.
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2. Low Level Contact Resistance (LLCR)
LLCR m easurem ents were m ade using a 4 term inal m easuring technique. The test current
w a s ma in ta in e d a t 10 0 milliamp e r e s ma ximu m w ith a 2 0 millivo lt ma x imu m o p e n c ir c u it
voltage for m ated specim ens.
3. Insulation Resistance
Insulation resistance was m easured between adjacent contacts of m ated and unm ated
specim ens. A test voltage of 500 volts DC was applied for 1 minute before the resistance was
measured.
4. Dielectric Withstanding Voltage
A test potential of 500 volts AC was applied between adjacent contacts of m ated and
unm ated specimens. This potential was applied for 1 minute and then returned to zero.
5. Insertion Force
The force required to m ate individual specimens was m easured using a tensile/com pression
device with a free floating fixture and a rate of travel of 12.7 m m per minute.
6. Rem oval Force
The force required to unm ate individual specim ens was m easured using a
tensile/compression device with a free floating fixture and a rate of travel of 12.7 m m per
minute.
7. Durability
Spe cim en s w ere mated an d unmated 2500 times at a max im um rate of 200 c ycles per hou r.
8. Mechanical Shock
Mated specim ens were subjected to a m echanical shock test having a half-sine waveform of
30 gravity units (g peak) and a duration of 11 m illiseconds. Three shocks in each direction
were applied along the 3 m utually perpendicular planes for a total of 18 shocks. Specim ens
were m onitored for discontinuities of 1 m icrosecond or greater using a current of 100
m illiam peres DC.
9. Vibration
Mated specim ens were subjected to a random vibration test, specified by a random vibration
sp e c trum, with e x cita tion fre q u e nc y bo u nd s o f 50 a nd 2 00 0 H z. T h e P ow e r S p ec tra l D e ns ity
(PSD) at 50 Hz was 0.005 G /H z. The spectrum sloped up at 6 dB per octave to a PSD of
2
0.02 G /Hz at 100 Hz. The spectrum was flat at 0.02 G /Hz from 100 to 1000 Hz. The
22
spectrum sloped down at 6 dB per octave to the upper boundary frequency of 2000 Hz at
which the PSD was 0.005 G /H z. The root-m ean square amplitude of the excitation was 5.35
2
G R M S . This was performed for 30 minutes in eac h of 3 mutually perpendicular planes for a
total vibration tim e o f 90 minutes. Spec im en s were mon itored fo r disc ontinuities of 1
micro s e co n d or g re a ter u s ing a c u rre n t of 1 0 0 milliampe re s in the mo nitorin g circ u it.
10. Humidity
Mated specim ens were subjected to a relative humidity of 90 t0 95% and a tem perature of
40/C for 96 hours.
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11. T empe rature Life
Mated specim ens were exposed to a tem perature of 85/C for 500 hours.
12. Reseating
Specim ens were m anually m ated and unm ated 3 tim es.
13. Mixed Flowing G as
M a te d a n d u n mate d sp e c ime n s w e re e xp o se d fo r 14 d ays to a mixe d flow ing g as C la ss IIA
exposure. Half the specim ens were unm ated for the first 7 days and then m ated for the
rem aining 7 days, the other half of the specim ens were m ated for the entire 14 days. C lass
IIA exposure is defined as a tem perature of 30/C and a relative hum idity of 70% with the
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pollutants of Cl at 10 ppb, NO at 200 ppb, H S at 10 ppb and SO at 100 ppb.
14. Therm al Shock
Mated specim ens were subjected to 10 cycles of therm al shock with each cycle consisting of
30 m inute dwells at -55 and 85/C. The transition between tem peratures was less than 1
minute.
B . H igh S p ee d Sig na l R e qu iremen ts
1. Mated Connector Differential Im pedance
Measured per procedure P1 of Revision 2.6 of the Serial ATA.
2. Com mon Mode Impedance
Measured per procedure P4 of Revision 2.6 of the Serial ATA.
3. M a x imu m In se rtion L os s o f C a ble (1 0 to 45 0 0 MH z)
Measured per procedure P5 of Revision 2.6 of the Serial ATA.
4. M a x imu m C ro s s talk (1 0 to 4 50 0 M Hz)
Measured per procedure P6 of Revision 2.6 of the Serial ATA.
5 . M a ximu m Ris e Time
Measured per procedure P8 of Revision 2.6 of the Serial ATA.
6. Maximum Intra-pair Skew
Measured per procedure P10 of Revision 2.6 of the Serial ATA.
4.3. Component Heat Resistance to Lead-Free Reflow Soldering
Specim ens were exposed to a tem perature of 85/C and 85% relative hum idity for 168 hours.
Specim ens were then placed on ceram ic substrates on the conveyor belt of a convection air oven
where they were exposed to tem peratures between 150 and 200/C for 60 to 180 seconds, between 255
and 260/C for 20 to 40 seconds, and above liquidus (217/C) for 60 to 150 sec onds . Spe cim en s w ere
allowed to cool prior to repeating this sequence twice m ore for a total of 3 cycles.
