Murata Electronics Oy SCA3300-D01 1/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Data Sheet
Overview
The SCA3300-D01 is a high performance accelerometer sensor component. It is three axis accelerometer sensor based on
Murata's proven capacitive 3D-MEMS technology. Signal processing is done in mixed signal ASIC with flexible SPI digital
interface. Sensor element and ASIC are packaged to 12 pin premolded plastic housing that guarantees reliable operation
over product's lifetime.
The SCA3300-D01 is designed, manufactured and tested for high stability, reliability and quality requirements. The
component has extremely stable output over wide range of temperature and vibration. The component has several
advanced self diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives.
SCA3300-D01 3-axis Industrial
Accelerometer and Inclinometer with
Digital SPI Interface
Features
3-axis high performance accelerometer with ±1.5g to
±6g user selectable measurement range
Extensive self-diagnostics features
Excellent bias stability and low noise level
Mechanically damped sensing element design for
superior vibration robustness
SPI digital interface
−40°C…+125°C operating temperature range
3.0V…3.6V supply voltage with low 1mA current
consumption
RoHS compliant robust DFL plastic package suitable
for lead free soldering process and SMD mounting
Proven capacitive 3D-MEMS technology
Applications
SCA3300-D01 is targeted at applications demanding high
stability with tough environmental requirements.
Typical applications include:
Professional Leveling
Platform Angle Measurement
Tilt Compensation
Inertial Measurement Units (IMUs) for highly
demanding environments
Motion Analysis and Control
Navigation Systems
Murata Electronics Oy SCA3300-D01 2/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
TABLE OF CONTENTS
1 Introduction .................................................................................................................. 3
2 Specifications ............................................................................................................... 3
2.1 General Specifications .................................................................................................................. 3
2.2 Performance Specifications ........................................................................................................ 3
2.3 Performance Specification for Temperature Sensor ............................................................ 4
2.4 Absolute Maximum Ratings ......................................................................................................... 4
2.5 Pin Description ................................................................................................................................ 5
2.6 Typical Performance Characteristics ........................................................................................ 6
2.7 Digital I/O Specification ............................................................................................................... 9
2.8 Measurement Axis and Directions ............................................................................................11
2.9 Package Characteristics .............................................................................................................. 12
2.10 PCB Footprint ................................................................................................................................ 13
3 General Product Description ................................................................................... 14
3.1 Factory Calibration....................................................................................................................... 15
4 Component Operation, Reset and Power Up ....................................................... 15
4.1 Recommended Start Up Sequence .......................................................................................... 15
4.2 Recommended Operation Sequence ...................................................................................... 15
5 Component Interfacing ............................................................................................ 16
5.1 General ............................................................................................................................................ 16
5.2 Protocol .......................................................................................................................................... 16
5.3 SPI Frame ........................................................................................................................................ 17
5.4 Example of Acceleration Data Conversion ............................................................................. 18
5.5 Example of Temperature Data Conversion ............................................................................ 18
5.6 Example of Self-Test Analysis ................................................................................................... 19
6 Application Information .......................................................................................... 20
6.1 Application Circuitry and External Component Characteristics ....................................... 20
6.2 Assembly Instructions ................................................................................................................. 21
Murata Electronics Oy SCA3300-D01 3/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
1 Introduction
This document contains essential technical information about the SCA3300-D01 sensor including
specifications, SPI interface descriptions, electrical properties and application information. This
document should be used as a reference when designing in SCA3300-D01 component.
2 Specifications
2.1 General Specifications
General specifications for SCA3300-D01 component are presented in Table 1. All analog voltages
are referenced to the potential at AVSS and all digital voltages are referenced to the potential at
DVSS.
Table 1. General specifications.
Parameter
Condition
Min
Typ
Max
Units
Supply voltage: VDD, DVIO
3.0
3.3
3.6
V
I_VDD
Normal mode
1.2
mA
2.2 Performance Specifications
Table 2. Accelerometer performance specifications (VDD=3.3V and room temperature unless
otherwise specified).
Parameter
Min
Typ
Max
Unit
Measurement range
-6
6
g
Offset (zero acceleration output)
0
LSB
Offset error (A
±20
±1.15
mg
°
Offset temperature drift (B
±10
±0.57
±15
±0.86
mg
°
mg
°
Sensitivity
5400
2700
1350
LSB/g
Sensitivity error (A
±0.7
%
Sensitivity temperature drift (B
±0.3
%
Linearity error (C
±1
±15
mg
mg
Integrated noise (RMS)
1.2
mgRMS
Noise density
37
µg/ Hz
Cross axis sensitivity (D
-1
+1
%
Amplitude response
-3dB frequency
88
10
Hz
Hz
Power on start-up time
1
ms
ODR
2000
Hz
VALUES ARE ±3 SIGMA VARIATION LIMITS FROM TEST POPULATION. VALUES ARE NOT GUARANTEED.
A. INCLUDES CALIBRATION ERROR AND DRIFT OVER LIFETIME.
B. DEVIATION FROM VALUE AT ROOM TEMPERATURE.
C. STRAIGHT LINE THROUGH SPECIFIED MEASUREMENT RANGE END POINTS.
D. CROSS AXIS SENSITIVITY IS THE MAXIMUM SENSITIVITY IN THE PLANE PERPENDICULAR TO THE MEASURING DIRECTION. X-AXIS OUTPUT CROSS AXIS
SENSITIVITY (CROSS AXIS FOR Y AND Z-AXIS OUTPUTS ARE DEFINED CORRESPONDINGLY):
CROSS AXIS FOR Y AXIS = SENSITIVITY Y / SENSITIVITY X
CROSS AXIS FOR Z AXIS = SENSITIVITY Z / SENSITIVITY X
Murata Electronics Oy SCA3300-D01 4/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.3 Performance Specification for Temperature Sensor
Table 3. Temperature sensor performance specifications.
Parameter
Condition
Min.
Typ
Max.
Unit
Temperature signal range
-50
+150
°C
Temperature signal sensitivity
Unsigned 16-bit word
18.9
LSB/°C
Temperature signal offset
°C output
-283
-273
-263
°C
Temperature is converted to °C with following equation:
Temperature [°C] = -273 + (TEMP / 18.9),
where TEMP is temperature sensor output in decimal format.
2.4 Absolute Maximum Ratings
Within the maximum ratings (Table 4), no damage to the component shall occur. Parametric
values may deviate from specification, yet no functional failure shall occur.
Table 4. Absolute maximum ratings.
Parameter
Remark
Min.
Typ
Max.
Unit
VDD
Supply voltage analog circuitry
-0.3
4.3
V
DIN/DOUT
Maximum voltage at digital input and output pins
-0.3
DVIO+0.3
V
Topr
Operating temperature range
-40
125
°C
Tstg
Storage temperature range
-40
150
°C
ESD_HBM
ESD according Human Body Model (HBM),
Q100-002
±2000
V
ESD_CDM
ESD according Charged Device Model (CDM),
Q100-011
±500
±750 (corner
pins)
V
US
Ultrasonic agitation (cleaning, welding, etc)
Prohibited
Murata Electronics Oy SCA3300-D01 5/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.5 Pin Description
The pinout for SCA3300-D01 is presented in Figure 1, while the pin descriptions can be found in
Table 5.
Figure 1. Pinout for SCA3300-D01.
Table 5. SCA3300-D01 pin descriptions.
Pin#
Name
Type
Description
1
AVSS
GND
Analog reference ground, connect externally to AVSS
2
A_EXTC
AOUT
External capacitor connection for positive reference voltage
3
RESERVED
-
Factory use only, leave floating or connect to GND
4
VDD
SUPPLY
Analog Supply voltage
5
CSB
DIN
Chip Select of SPI Interface, 3.3V logic compatible Schmitt-trigger input
6
MISO
DOUT
Data Out of SPI Interface
7
MOSI
DIN
Data In of SPI Interface, 3.3V logic compatible Schmitt-trigger input
8
SCK
DIN
CLK signal of SPI Interface
9
DVIO
SUPPLY
SPI interface Supply Voltage
10
D_EXTC
AOUT
External capacitor connection for digital core
11
DVSS
GND
Digital Supply Return, connect externally to GND
12
EMC_GND
EMC GND
EMC ground pin, connect externally to AVSS
AVSS 1
A_EXTC 2
RESERVED 3
VDD 4
CSB 5
MISO 6 7 MOSI
8 SCK
9 DVIO
10 D_EXTC
11 DVSS
12 EMC_ GND
Murata Electronics Oy SCA3300-D01 6/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.6 Typical Performance Characteristics
Figure 2. SCA3300-D01 accelerometer typical offset temperature behavior.
Figure 3. SCA3300-D01 accelerometer typical long term stability during 1000h HTOL. T=+125°C
Vsupply=3.6V
Murata Electronics Oy SCA3300-D01 7/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Figure 4. SCA3300-D01 accelerometer typical sensitivity temperature error in %.
Figure 5. Vibration rectification error. Sine sweep 500...5KHz with 4g amplitude and 5kHz...25kHz
with 2g amplitude.
Murata Electronics Oy SCA3300-D01 8/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Figure 6. SCA3300-D01 accelerometer typical linearity behavior.
Figure 7. SCA3300-D01 accelerometer typical noise density
Figure 8. SCA3300-D01 typical allan deviation.
Murata Electronics Oy SCA3300-D01 9/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.7 Digital I/O Specification
2.7.1 DC Characteristics
Table 6. Input terminal: CSB
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
1
Pull-up current
VIN = 0V
IPU
10
16.5
50
uA
2
Input voltage '1'
DVIO = 3.3 V
VIH
2.5
DVIO
V
3
Input voltage '0'
DVIO = 3.3 V
VIL
0
1.1
V
Table 7. Input terminal: MOSI, SCK
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
1
Pull-down
current
VIN = 0V
IPU
10
16.5
50
uA
2
Input voltage '1'
DVIO = 3.3 V
VIH
2.5
DVIO
V
3
Input voltage '0'
DVIO = 3.3 V
VIL
0
1.1
V
Table 8. Output terminal: MISO
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
9
Output high voltage
I > -1 mA
DVIO = 3.3 V
VOH
DVIO-
0.5V
uA
10
Output low voltage
I < 1 mA
VOL
0.5
V
11
Tri-state leakage
0 < VMISO <
3.3 V
ILEAK
TBD
uA
12
Maximum Capacitive
load
50
pF
2.7.2 SPI AC Characteristics
The AC characteristics of SCA3300-D01 SPI interface are defined in Figure 9 and Table 9.
Figure 9. Timing diagram of SPI communication.
Murata Electronics Oy SCA3300-D01 10/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Table 9. SPI AC electrical characteristics.
Terminals
Parameter
Description
Min
Typ
Max
Unit
SCK
TCL
SCK low time
Tper/2
200
ns
TCH
SCK high time
Tper/2
200
ns
fSCK = 1/Tper
SCK Frequency
0.1
2.5
8
MHz
CSB, SCK
TLS1
Time from CSB (10%)
to SCK (90%)
Tper/2
1740
ns
TLS2
Time from SCK (10%)
to CSB (90%)
Tper/2
920
ns
MOSI, SCK
TSET
Time from changing
MOSI (10%, 90%) to
SCK (90%). Data
setup time
Tper/4
200
ns
THOL
Time from SCK (90%)
to changing MOSI
(10%, 90%). Data
hold time
Tper/4
200
ns
MISO, CSB
TVAL1
Time from CSB (10%)
to stable MISO (10%,
90%)
120
ns
TLZ
Time from CSB (90%)
to high impedance
state of MISO
110
ns
SCK, MISO
TVAL2
Time from SCK (10%)
to stable MISO (10%,
90%)
110
ns
MISO
LOAD
Capacitive load
50
pF
CSB
TLH
Time between SPI
cycles, CSB at high
level (90%)
10
us
Murata Electronics Oy SCA3300-D01 11/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.8 Measurement Axis and Directions
Figure 10. SCA3300-D01 measurement directions.
Table 10. SCA3300-D01 accelerometer measurement directions.
x: 0g
y: 0g
z: +1g
x: +1g
y: 0g
z: 0g
x: 0g
y: 0g
z: -1g
x: 0g
y: -1g
z: 0g
x: -1g
y: 0g
z: 0g
x: 0g
y: +1g
z: 0g
Murata Electronics Oy SCA3300-D01 12/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.9 Package Characteristics
2.9.1 Package Outline Drawing
Figure 11. Package outline. The tolerances are according to ISO2768-f (see Table 11).
Table 11. Limits for linear measures (ISO2768-f).
Tolerance
class
Limits in mm for nominal size in mm
0.5 to 3
Above 3 to 6
Above 6 to 30
f (fine)
±0.05
±0.05
±0.1
Murata Electronics Oy SCA3300-D01 13/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
2.10 PCB Footprint
Figure 12. Recommended PWB pad layout for SCA3300-D01. The tolerances are according to
ISO2768-f (see Table 11).
Murata Electronics Oy SCA3300-D01 14/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
3 General Product Description
The SCA3300-D01 sensor includes acceleration sensing element and Application-Specific
Integrated Circuit (ASIC). Figure 13 contains an upper level block diagram of the component.
Figure 13. SCA3300-D01 component block diagram.
The sensing elements are manufactured using Murata proprietary High Aspect Ratio (HAR) 3D-
MEMS process, which enables making robust, extremely stable and low noise capacitive sensors.
The acceleration sensing element consists of four acceleration sensitive masses. Acceleration
causes capacitance change that is converted into a voltage change in the signal conditioning
ASIC.
Acceleration
sensing
element
AFE ADC
Signal
conditioning
and filtering
EEPROM
SPI
Self diagnostics Temperature sensor
Murata Electronics Oy SCA3300-D01 15/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
3.1 Factory Calibration
SCA3300-D01 sensors are factory calibrated. No separate calibration is required in the
application. Calibration parameters are stored to non-volatile memory during manufacturing.
The parameters are read automatically from the internal non-volatile memory during the start-
up.
It should be noted that assembly can cause minor offset/bias errors to the sensor output. If
best possible offset/bias accuracy is required, system level offset/bias calibration (zeroing)
after assembly is recommended.
4 Component Operation, Reset and Power Up
4.1 Recommended Start Up Sequence
Item
Procedure
Function
Note
1
Set VDD = 3.0 ..
3.6 V
Set DVIO =
3.0 .. 3.6 V
Startup the
device
VDD and DVIO don't need to
rise at the same time
2
Wait 10 ms
Memory reading
Settling of signal
path
3
Set
Measurement
mode
Select operation
mode
Mode1: 3g full-scale. 88 Hz 1st
order low pass filter (default)
Mode2: 6g full-scale. 88 Hz 1st
order low pass filter
Mode3: 1.5g full-scale. 88 Hz
1st order low pass filter.
Mode4: 1.5g full-scale. 10 Hz
1st order low pass filter.
4
Wait 5 ms
Settling of signal
path
5
Read
ERR_STATUS,
ACCX, ACCY,
ACCZ, STO
Read error status
and acceleration
data and self-
test output
4.2 Recommended Operation Sequence
Sensor ODR in normal operation mode is 2000Hz. Registers are updated in every 0.5ms and if all
data is not read the full noise performance of sensor is not met.
During normal operation during every cycle needed acceleration outputs ACCX, ACCY, ACCZ are
read in wanted ODR. Error summary is read if return status (RS) indicates error.
For fail safe option self-test output STO is read after reading all corresponding acceleration
outputs. If STO is not within ±400d then corresponding acceleration readings are not reliable. If
STO is not returned within limits in no vibration condition after HW reset, it is possible that
component failure has occurred.
Murata Electronics Oy SCA3300-D01 16/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
5 Component Interfacing
5.1 General
SPI communication transfers data between the SPI master and SCA3300-D01 ASIC. The SCA3300-
D01 always operates as a slave device in master-slave operation mode. 3-wire SPI connection
cannot be used.
SPI interface pins:
CSB Chip Select (active low) MCU ASIC
SCK Serial Clock MCU ASIC
MOSI Master Out Slave In MCU ASIC
MISO Master In Slave Out ASIC MCU
5.2 Protocol
The SPI is a 32-bit 4-wire slave configured bus. Off-frame protocol is used so each transfer
consists of two phases. A response to the request is sent within next request frame. The
response concurrent to the request contains the data requested by the previous command.
The SPI transmission is always started with the falling edge of chip select (CSB) and terminated
with the CSB rising edge. The data bits are sampled from MOSI line at the rising edge of the SCK
signal and it is propagated on the falling edge (MISO line) of the SCK. This equals to SPI Mode 0
(CPOL = 0 and CPHA = 0).
The first bit in a sequence is an MSB.
Request 1
CSB
SCK
MOSI
* Undefined
MISO
Request 2
Response 1
Request 3
Response 2
* The first response after reset is
undefined and shall be discarded
Figure 14. SPI Protocol
Murata Electronics Oy SCA3300-D01 17/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
5.3 SPI Frame
SPI operating commands can be found in Table 13. Response frame has data bits and read
status determined in Table 12.
Figure 15 - SPI Frame
Table 12. SPI Frame Specification
Name
Description
MISO
RS
Return status(1
'00' - Startup in progress
'01' - Normal operation, no flags
'11' - Error
D
Data
Returned data
Return Status (RS) shows error (i.e. '11') when an error flag (or flags) is active in, or if previous
MOSI-command was incorrect frame.
5.3.1 Operations
Table 13. Operations and their equivalent SPI frames.
Operation
SPI Frame
SPI Frame Hex
Read ACCX
0000 0100 0000 0000 0000 0000 1111 0111
040000F7h
Read ACCY
0000 1000 0000 0000 0000 0000 1111 1101
080000FDh
Read ACCZ
0000 1100 0000 0000 0000 0000 1111 1011
0C0000FBh
Read STO(self-test output)
0001 0000 0000 0000 0000 0000 1110 1001
0x100000E9
Read TEMP
0001 0100 0000 0000 0000 0000 1110 1111
140000EFh
Read Status Summary
0001 1000 0000 0000 0000 0000 1110 0101
180000E5h
SW reset
1011 0100 0000 0000 0010 0000 1001 1000
0xB4002098
Change to mode1
1011 0100 0000 0000 0000 0000 0001 1111
B400001Fh
Change to mode2
1011 0100 0000 0000 0000 0001 0000 0010
B4000102h
Change to mode3
1011 0100 0000 0000 0000 0010 0010 0101
B4000225h
Change to mode4
1011 0100 0000 0000 0000 0011 0011 1000
B4000338h
Read WHOAMI
0100 0000 0000 0000 0000 0000 1001 0001
40000091h
1
) PRIORITY OF RETURN STATUS STATES FROM HIGHEST TO LOWEST IS: '00' -> '11' -> '01'
Murata Electronics Oy SCA3300-D01 18/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
5.3.2 Status Explanation
Status summary contain more accurate information of possible error source. SW reset is done
with SPI bus. HW reset means that to resolve error there is need to power cycling. If this does
not reset the error then possible component error has occurred and system needs to be
shutdown and part returned to supplier. Status summary explanations:
Status summary bits
Bit
Name
Description
Note/Action
15:10
reserved
Not used
9
digi1
Digital block error type 1
SW or HW reset needed
8
digi2
Digital block error type 2
SW or HW reset needed
7
clock
ASIC clock error
SW or HW reset needed
6
sat
Signal saturated in signal
path
Acceleration too high and
acceleration reading not
usable. Component
failure possible
5
temp
Signal saturated in
temperature compensation
External temperature too
high or low. Component
failure possible
4
power
Voltage level failure
External voltages too
high or low. Component
failure possible
3
mem
Memory error
Memory check failed. SW
or HW reset needed.
Possible component
failure.
2
digi3
Digital block error type 3
SW or HW reset needed
1
mode_change
Operation mode has
changed
If mode change is not
requested. SW or HW
reset needed.
0
pin_continuity
Component internal
connection error
Possible component
failure.
5.4 Example of Acceleration Data Conversion
For example, if ACC_X read results: ACC_X = 0500DC02h, the content is converted to acceleration
rate as follows:
05h = 000001 01b
01b = return status (RS bits) = no error
00DCh = bin 0000 0000 1101 1100b = ACC_X
00DCh in 2's complement format = 220d
Acceleration(Mode1) = 220LSB / sensitivity(mode1) = 220LSB/2700=0.081g=81mg
Mode1 sensitivity = 2700 LSB/g
Mode2 sensitivity = 1350 LSB/g
Mode3 and 4 sensitivity = 5400 LSB/g
5.5 Example of Temperature Data Conversion
For example, if TEMP read results: TEMP = 15161E4Eh, the content is converted to temperature as
follows:
15h = bin 000111 01b
01 = return status (RS bits) = no error
161Eh = bin 0001 0110 0001 1110 = TEMP
FE6Fh in 2's complement format = 5662d
Temperature = -273 + ( TEMP / 18.9) = -273 + [298/18.9] = +26.6°C
See section 2.3 for temperature conversion equation
Murata Electronics Oy SCA3300-D01 19/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
5.6 Example of Self-Test Analysis
If Self-test data read results: 0500DC02h, the content analyzed as follows:
05h = 000001 01b
01b = return status (RS bits) = no error
00DCh = bin 0000 0000 1101 1100b = self-test reading
00DCh in 2's complement format = 220d
If self-test readings are higher than 400d or lower than -400d, acceleration data read same time
is not usable. If self-test output is not returned within requested limits there is possible
component failure.
Murata Electronics Oy SCA3300-D01 20/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
6 Application Information
6.1 Application Circuitry and External Component Characteristics
See Figure 16 and Table 14 for specification of the external components. The PCB layout example
is shown in Figure 17.
Figure 16. Application schematic.
Table 14. External component description for SCA3300-D01.
Symbol
Description
Min.
Nom.
Max.
Unit
C1
Decoupling capacitor between VDD and GND
ESR
Recommended component:
Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R
70
100
130
100
nF
m
C2
Decoupling capacitor between A_EXTC and AVSS
ESR
Recommended component:
Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R
70
100
130
100
nF
m
C3
Decoupling capacitor between D_EXTC and GND
ESR
Recommended component:
Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R
70
100
130
100
nF
m
C4
Decoupling capacitor between DVIO and GND
ESR
Recommended component:
Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R
70
100
130
100
nF
m
Murata Electronics Oy SCA3300-D01 21/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Figure 17. Application PCB layout.
General circuit diagram and PCB layout recommendations for SCA3300-D01 (refer to Figure 16
and Figure 17):
Connect decoupling SMD capacitors (C1 - C5) right next to respective component pins.
Locate ground plate under component.
Do not route signals or power supplies under the component on top layer.
Ensure good ground connection of DVSS, AVSS and EMC_GND pins
6.2 Assembly Instructions
The Moisture Sensitivity Level of the component is Level 3 according to the IPC/JEDEC JSTD-
020C. The part is delivered in a dry pack. The manufacturing floor time (out of bag) at the
customer’s end is 168 hours.
Usage of PCB coating materials may penetrate component lid and affect component
performance. PCB coating is not allowed.
Sensor components shall not be exposed to chemicals which are known to react with silicones,
such as solvents. Sensor components shall not be exposed to chemicals with high impurity
levels, such as Cl-, Na+, NO3-, SO4-, NH4+ in excess of >10 ppm. Flame retardants such as Br or P
containing materials shall be avoided in close vicinity of sensor component. Materials with high
amount of volatile content should also be avoided.
If heat stabilized polymers are used in application, user should check that no iodine, or other
halogen, containing additives are used.
For additional assembly related details please refer to Technical Note Assembly instructions of
Dual Flat Lead Package (DFL). 82201500A_DFL Assembly instructions
Murata Electronics Oy SCA3300-D01 22/21
www.murata.com Doc.Nr. 82 2290 00 Rev. A1
Subject to changes
Document Change Control
Authors
Approved by
Antti Viitanen
Iivari Heikkilä
Department/Role
Product Division / Product Manager
Product Division / Product Engineer
Rev.
Date
Change Description
Author
Reviewed by
ECN
A0
29.9.2016
Preliminary release
ASV
A1
3.11.2016
New outlook. Updated figures. Low-power mode removed.
ASV/IIHE