BU4209G Datasheet Voltage Detector IC Series Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42xx series BU43xx series General Description ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. Features Free delay time setting by external capacitor Two output types (Nch open drain and CMOS output) Ultra-low current consumption Wide operating temperature range Very small and low height package Package SSOP5 and SOP4 is similar to SOT-23-5 and SC-82 respectively (JEDEC) Typical Application Circuit VDD1 Key Specifications Detection voltage: 0.9V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: 1.0% Ultra-low current consumption: 0.55A (Typ.) Operating temperature range: -40C to +125C Package SSOP5: 2.90mm x 2.80mm x 1.15mm SOP4: 2.00mm x 2.10mm x 0.95mm VSOF5: 1.60mm x 1.60mm x 0.60mm Applications All electronic devices that use micro controllers and logic circuits VDD1 VDD2 RL RST BU42xx CIN CT CIN RST BU43xx Micro controller CT CL CL (Capacitor for noise filtering) (Capacitor for noise filtering) GND Open Drain Output type BU42xx series Connection Diagram & Pin Descriptions SSOP5 SOP4 N.C. CT TOP VIEW TOP VIEW VOUT 3 GND 4 5 CMOS Output type BU43xx series VOUT 4 VSOF5 TOP VIEW CT 3 Lot. No 1 GND VDD GND PIN Symbol Function No. 1 VOUT Reset output 2 VDD Power supply voltage GND Marking Lot. No Marking Micro controller GND 3 CT N.C. Unconnected terminal 4 VOUT CT Capacitor connection terminal for output delay time Marking 1 2 3 VOUT SUB CT 2 VDD PIN Symbol Function No. 1 GND GND 2 VDD Power supply voltage GND VDD 4 5 Lot. No PIN Symbol Function No. 1 VOUT Reset output 2 SUB Substrate* Capacitor connection terminal for output delay time 3 CT Capacitor connection terminal for output delay time Reset output 4 VDD Power supply voltage 5 GND GND *Connect the substrate to VDD Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Ordering Information B U x Part Number x x Output Type 42 : Open Drain 43 : CMOS 5 0.2Min. 2.80.2 +0.2 1.6 -0.1 2 3 - Package G : SSOP5 F : SOP4 FVE : VSOF5 Tape Embossed carrier tape Quantity 3000pcs The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 0.95 0.1 Direction of feed Reel +6 4 -4 2 0.05 1.2 0.05 2.10.2 1 +0.05 0.13 -0.03 4 (MAX 1.28 include BURR) 5 0.270.15 3 1.6 0.05 1.3 4 0.2MAX 1.60.05 1.00.05 2.00.2 +0.2 1.25 -0.1 Order quantity needs to be multiple of the minimum quantity. VSOF5 SOP4 (SC-82) 0.90.05 ) 1pin (Unit : mm) 1 2 3 S 0.130.05 +0.05 0.42 -0.04 0.1 0.6MAX 0.050.05 Packageing and forming specification TR : Embossed tape and reel +0.05 0.42 -0.04 0.050.05 1.10.05 1.25Max. R TR Direction of feed +0.05 0.13 -0.03 1.05Max. T <Tape and Reel information> +6 4 -4 4 1 x Reset Voltage Value 09 : 0.9V 0.1V step 48 : 4.8V SSOP5 (SOT-23-5) 2.90.2 x S +0.05 0.32 -0.04 0.5 0.220.05 (Unit : mm) (Unit : mm) Lineup Making ZR ZQ ZP ZN ZM ZL ZK ZJ ZH ZG ZF ZE ZD ZC ZB ZA YZ YY YX YW Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4248 BU4247 BU4246 BU4245 BU4244 BU4243 BU4242 BU4241 BU4240 BU4239 BU4238 BU4237 BU4236 BU4235 BU4234 BU4233 BU4232 BU4231 BU4230 BU4229 Making YV YU YT YS YR YQ YP YN YM YL YK YJ YH YG YF YE YD YC YB YA Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V Part Number BU4228 BU4227 BU4226 BU4225 BU4224 BU4223 BU4222 BU4221 BU4220 BU4219 BU4218 BU4217 BU4216 BU4215 BU4214 BU4213 BU4212 BU4211 BU4210 BU4209 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/12 Making 1H 1G 1F 1E 1D 1C 1B 1A 0Z 0Y 0X 0W 0V 0U 0T 0S 0R 0Q 0P 0N Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4348 BU4347 BU4346 BU4345 BU4344 BU4343 BU4342 BU4341 BU4340 BU4339 BU4338 BU4337 BU4336 BU4335 BU4334 BU4333 BU4332 BU4331 BU4330 BU4329 Making 0M 0L 0K 0J 0H 0G 0F 0E 0D 0C 0B 0A ZZ ZY ZX ZW ZV ZU ZT ZS Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V Part Number BU4328 BU4327 BU4326 BU4325 BU4324 BU4323 BU4322 BU4321 BU4320 BU4319 BU4318 BU4317 BU4316 BU4315 BU4314 BU4313 BU4312 BU4311 BU4310 BU4309 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Absolute Maximum Ratings (Ta=25C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*4 SSOP5(SOT-23-5) Power *2*4 SOP4(SC-82) Dissipation *3*4 VSOF5 Symbol VDD VOUT Pd Limit -0.3 to +7 GND-0.3 to +7 GND-0.3 to VDD+0.3 540 400 210 Unit V V mW Operation Temperature Range Topt -40 to +125 C Ambient Storage Temperature Tstg -55 to +125 C *1 When used at temperatures higher than Ta=25C, the power is reduced by 5.4mW per 1C above 25C. *2 When used at temperatures higher than Ta=25C, the power is reduced by 4.0mW per 1C above 25C. *3 When used at temperatures higher than Ta=25C, the power is reduced by 2.1mW per 1C above 25C. *4 When a ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board)is mounted. Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125C) Parameter Detection Voltage Symbol VDET Circuit Current when ON IDD1 Circuit Current when OFF IDD2 Operating Voltage Range VOPL `High' Output Current (Pch) IOH `Low' Output Current (Nch) IOL Leak Current when OFF Ileak `High' Output Current (Pch) IOH CT pin Threshold Voltage VCTH Output Delay Resistance RCT CT pin Output Current ICT Detection Voltage Temperature coefficient Hysteresis Voltage Condition Min. VDET(T) VDET(T) x1.01 0.70 0.90 2.0 20 1.0 3.6 1.7 2.0 VDD x0.35 VDD x0.40 9 5 200 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 4.0 100 3.3 6.5 0 0 3.4 4.0 VDD x0.45 VDD x0.50 10 40 400 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.1 1 VDD x0.55 VDD x0.60 11 - - 30 - VDET1.0V VDET x0.03 VDET x0.05 VDET x0.08 VDET1.1V VDET x0.03 VDET x0.05 VDET x0.07 VDET =0.9 to 1.3V VDET =1.4 TO 2.1V VDET =2.2 TO 2.7V VDD=VDET-0.2V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VDET =0.9 TO 1.3V VDET =1.4 TO 2.1V VDET =2.2 to 2.7V VDD=VDET+2.0V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VOL0.4V, Ta=25 to 125C, RL=470k VOL0.4V, Ta=-40 to 25C, RL=470k VDS=0.5V VDD=6.0V VDET=4.0 to 4.8V VDS=0.05V VDD=0.85V VDS=0.5V VDD=1.5V VDET=1.7 to 4.8V VDS=0.5V VDD=2.4V VDET=2.7 to 4.8V VDD=VDS=7V Ta=-40 to 85C VDD=VDS=7V Ta=85 to 125C VDS=0.5V VDD=4.8V VDET=0.9 to 3.9V VDS=0.5V VDD=6.0V VDET=4.0 to 4.8V VDD=VDETx1.1, VDET=0.9 to 2.5V Ta=25C RL=470k VDD=VDETx1.1, VDET=2.6 to 4.8V Ta=25C RL=470k *1 VDD=VDETx1.1 VCT=0.5V Ta=25C VCT=0.1V VDD=0.85V VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V VDET/T Ta=-40C to 125C VDET Max. VDET(T) x0.99 VDD=HAEL, Ta=25C, RL=470k VDD=LAEHAEL Ta=-40 to 125C RL=470k Limit Typ. Unit V A A V mA A mA A mA V M A ppm/C V *1: Designed guarantee. (Outgoing inspection is not done all products.) VDET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Block Diagrams VDD VOUT Vref CT GND Fig.1 BU42xx Series VDD VOUT Vref CT GND Fig.2 BU43xx www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/12 Series TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Typical Performance Curves "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT IDD [A] 0.6 BU4216 BU4316 0.5 0.4 0.3 0.2 0.1 0.0 1 2 3 4 5 6 7 BU4216F BU4216 BU4316 4 3 2 VDD =1.2V 1 0 0.0 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE VDD [V] DRAIN-SOURCE VOLTAGE VDS[V] Fig.3 Circuit Current Fig.4 "LOW" Output Current 25 7 BU4318G BU4318 20 OUTPUT VOLTAGE VOUT [V] "HIGH" OUTPUT CURRENT IOH [mA] 0 5 VDD =6.0V 15 VDD =4.8V 10 5 0 BU4216F BU4216 BU4316 6 5 4 3 2 1 0 0 1 2 3 4 5 6 0 2 3 4 5 6 VDD SUPPLY VOLTAGE VDD [V] Fig.5 "High" Output Current Fig.6 I/O Characteristics www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 DRAIN-SOURCE VOLTAGE VDS[V] 5/12 7 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series 700 0.8 BU4216F BU4216 BU4316 CT OUTPUT CURRENT ICT [A] OUTPUT VOLTAGE VOUT [V] 1.0 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 400 300 200 100 0 0 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE VDD [V] VDD SUPPLY VOLTAGE VDD [V] Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current CIRCUIT CURRENT WHEN ON IDD1 [A] DETECTION VOLTAGE VDET[V] 500 2.5 2.0 Low to high(VDET+VDET) 1.5 High to low(VDET) BU4216 BU4316 BU4216F 1.0 -40 BU4216F BU4216 BU4316 600 0 40 80 120 TEMPERATURE Ta[] 0.5 BU4216 BU4216F BU4316 0.4 0.3 0.2 0.1 0.0 -40 0 40 80 120 TEMPERATURE Ta[] Fig.9 Detecting Voltage Release Voltage Fig.10 Circuit Current when ON www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 Datasheet BU43xx series 1.0 1.0 MINIMUM OPERATING VOLTAGE V OPL[V] CIRCUIT CURRENT WHEN OFF IDD2 [A] BU42xx series BU4216 BU4216F BU4316 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 BU4216 BU4216F BU4316 0.5 0.0 -40 Fig.11 Circuit Current when OFF DELAY TIME TPLH[ms] RESISTANCE OF CT RCT [M] BU4216 BU4216F 1000 12 10 8 6 4 2 BU4316 100 10 1 0.1 0.01 0.001 0 40 80 120 0.0001 0.001 0.01 0.1 CAPACITANCE OF CT CCT[F] TEMPERATURE Ta[] Fig.13 CT Terminal Circuit Resistance Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 120 10000 BU4216F BU4216 BU4316 0 -40 80 Fig.12 Operating Limit Voltage 18 14 40 TEMPERATURE Ta[] TEMPERATURE Ta[] 16 0 7/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Application Information Explanation of Operation For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VouT terminal voltage switches from either "High" to "Low" or from "Low" to "High". BU42xx and BU43xx series have delay time function which set tPLH (Output "Low"AE"High") using an external capacitor (CCT). Because the BU42xx series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD Q2 R1 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 VOUT Q1 Q3 Q3 R3 R3 GND GND CT CT Fig.15 BU42xx type internal block diagram Fig.16 BU43xx type internal block diagram Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD tPLH:Time until when VouT rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+VDET) TPLH=-1xCCTxRCTxln CCT: RCT: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Internal Impedance(P.3 RCT refer.) VCTH: ln: CT pin Threshold Voltage(P.3 VCTH refer.) Natural Logarithm Reference Data of Falling Time (tPHL) Output Examples of Falling Time (tPHL) Output Part Number tPHL [s] BU4245 275.7 BU4345 359.3 * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL. There fore it is VDET+VDET possible that the reset signal is not outputted when the rise time of VDET VDD is faster than tPHL. VDD VOPL When VDD is greater than VOPL but less than the reset release 0V voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. 1/2 VDD If VDD exceeds the reset release voltage (VDET+VDET), then VOUT VCT switches from L to H (with a delay to the CT terminal). If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, tPLH tPHL tPLH VOUT switches to L (with a delay of tPHL). tPHL VOUT The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply Fig.17 Timing Waveforms fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Circuit Applications 1) Examples of a common power supply detection reset circuit VDD1 VDD2 RL Micro RST controller BU42xx CIN CT CL (Capacitor for noise filtering) GND Fig.18 Open Drain Output type VDD1 Micro RST controller BU43xx CIN CT CL (Capacitor for noise filtering) Application examples of BU42xx series (Open Drain output type) and BU43xx series (CMOS output type) are shown below. CASE1:The power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the Open Drain Output Type (BU42xx series) attached a load resistance (RL) between the output and VDD2. (As shown Fig.18) CASE2:The power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BU43xx series) or Open Drain Output Type (BU42xx series) attached a load resistance (RL) between the output and VDD1. (As shown Fig.19) When a capacitance CL for noise filtering is connected to the VouT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VouT). GND Fig.19 CMOS Output type www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series 2) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from "High" to "Low" or vice versa.) V1 IDD R2 I1 Through Current V DD BU42xx R1 CIN V OUT BU43xx CL GND VDD VDET 0 Fig.20 A voltage drop of [the through-current (I1)] x [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from "Low" to "High". When the input voltage decreases and falls below the detection voltage, the output voltage switches from "High" to "Low". At this time, the through-current stops flowing through output "Low", and the voltage drop is eliminated. As a result, the output switches from "Low" to "High", which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. Consider the use of BD52xx when the power supply input it with resistor dividers. VDD - IDD Peak Current Ta=25C Temp - IDD(BU42xx) BU49xx,BU43xx 10 VDD3V VDD6V VDD7V VDD4V 2.5 BU48xx,BU42xx BD52xx IDD peak Current[mA] IDD-peak[mA] 2.0 BD53xx 1 0.1 0.01 0.001 1.5 1.0 0.5 0.0 3 4 5 6 7 8 9 10 VDD[V] -50 -30 -10 10 30 50 Temp 70 90 110 130 Fig.21 Current Consumption vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series Operational Notes 1. Absolute Maximum Range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND Potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7 . The VDD line inpedance might cause oscillation because of the detection current. 8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. Case of needless Delay time, recommended to insert more 470k resister between VDD and CT. Recommended value of RL Resistar is over 50k (VDET=1.5 to 4.8V),over 100k (VDET=0.9 to 1.4V). 11. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by x RCT x CCT changes. 12. Delay time (tPLH) tPLH = x RCT x CCT (sec) : time constant RCT : 10M (typ.) (built-in resistor) CCT : capacitor connected CT pin. Recommended value of CCT capacitor is over 100pF. The reference value ( x RCT) x106 VDET = 0.9 to 2.5V Ta = 25C (min. = 5.1 x 106 typ.= 6.0 x 106 Ta = -25 to 125C (min. = 3.3 x 106 typ. = 6.0 x 106 VDET = 2.6 to 4.8V Ta = 25C (min. = 5.9 x 106 typ.= 6.9 x 106 Ta = -25 to 125C (min. = 3.8 x 106 typ.= 6.9 x 106 max = 6.9 x 106) max = 8.7 x 106) max = 7.9 x 106) max = 10.0 x 106) 13. External parameters The recommended parameter range for CT is 100pF to 0.1F. For RL, the recommended range is 50k to 1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 14. CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 15. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 BU42xx series Datasheet BU43xx series 16. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 17. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/12 TSZ02201-0R7R0G300050-1-2 08.Aug.2012 Rev.004 Datasheet Notice General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 (c) 2012 ROHM Co., Ltd. All rights reserved. Datasheet Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 (c) 2012 ROHM Co., Ltd. All rights reserved. Datasheet Other Precaution 1) The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 (c) 2012 ROHM Co., Ltd. All rights reserved.