2016-2017 Microchip Technology Inc. DS00002117F-page 1
Features
Single-Chip 10/100/1000 Mbps Ethernet Trans-
ceiver Suitable for IEEE 802.3 Applications
RGMII Timing Supports On-Chip Delay According
to RGMII Version 2.0, with Programming Options
for External Delay and Making Adjustments and
Corrections to TX and RX Timing Paths
RGMII with 3.3V/2.5V/1.8V Tolerant I/Os
Auto-Negotiation to Automatically Select the
Highest Link-Up Speed (10/100/1000 Mbps) and
Duplex (Half/Full)
On-Chip Termination Resistors for the Differential
Pairs
On-Chip LDO Controller to Support Single 3.3V
Supply Operation – Requires Only One External
FET to Generate 1.2V for the Core
Jumbo Frame Support up to 16 KB
125 MHz Reference Clock Output
Energy Detect Power-Down Mode for Reduced
Power Consumption When the Cable is Not
Attached
Wake-On-LAN (WOL) Support with Robust Cus-
tom-Packet Detection
Programmable LED Outputs for Link, Activity, and
Speed
Baseline Wander Correction
LinkMD TDR-Based Cable Diagnostic to Identify
Faulty Copper Cabling
Parametric NAND Tree Support to Detect Faults
Between Chip I/Os and Board
Loopback Modes for Diagnostics
Automatic MDI/MDI-X Crossover to Detect and
Correct Pair Swap at all Speeds of Operation
Automatic Detection and Correction of Pair
Swaps, Pair Skew, and Pair Polarity
MDC/MDIO Management Interface for PHY Reg-
ister Configuration
Interrupt Pin Option
Power-Down and Power-Saving Modes
Operating Voltages
- Core (DVDDL, AVDDL, AVDDL_PLL): 1.2V
(External FET or Regulator)
- VDD I/O (DVDDH): 3.3V, 2.5V, or 1.8V
- Transceiver (AVDDH): 3.3V or 2.5V (Com-
mercial Temp.)
AEC-Q100 Grade 3 (KSZ9031RNXUA/UB) and
Grade 2 (KSZ9031RNXVA/VB) Qualified for Auto-
motive Applications
48-pin QFN (7 mm × 7 mm) Package
Target Applications
Laser/Network Printer
Network Attached Storage (NAS)
Network Server
Gigabit LAN on Motherboard (GLOM)
Broadband Gateway
Gigabit SOHO/SMB Router
•IPTV
IP Set-Top Box
Game Console
Triple-Play (Data, Voice, Video) Media Center
Industrial Control
Automotive In-Vehicle Networking
KSZ9031RNX
Gigabit Ethernet Transceiver with RGMII
Support
KSZ9031RNX
DS00002117F-page 2 2016-2017 Microchip Technology Inc.
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2016-2017 Microchip Technology Inc. DS00002117F-page 3
KSZ9031RNX
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Pin Description and Configuration .................................................................................................................................................. 5
3.0 Functional Description .................................................................................................................................................................. 13
4.0 Register Descriptions .................................................................................................................................................................... 31
5.0 Operational Characteristics ........................................................................................................................................................... 52
6.0 Electrical Characteristics ............................................................................................................................................................... 53
7.0 Timing Diagrams ........................................................................................................................................................................... 57
8.0 Reset Circuit ................................................................................................................................................................................. 63
9.0 Reference Circuits — LED Strap-In Pins ...................................................................................................................................... 65
10.0 Reference Clock - Connection and Selection ............................................................................................................................. 66
11.0 On-Chip LDO Controller - MOSFET Selection ............................................................................................................................ 66
12.0 Magnetic - Connection and Selection ......................................................................................................................................... 67
13.0 Package Outlines ........................................................................................................................................................................ 69
Appendix A: Data Sheet Revision History ........................................................................................................................................... 74
The Microchip Web Site ...................................................................................................................................................................... 76
Customer Change Notification Service ............................................................................................................................................... 76
Customer Support ............................................................................................................................................................................... 76
Product Identification System ............................................................................................................................................................. 77
2016-2017 Microchip Technology Inc. DS00002117F-page 4
KSZ9031RNX
1.0 INTRODUCTION
1.1 General Description
The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical-
layer transceiver for transmission and reception of data on standard CAT-5 unshielded twisted pair (UTP) cable.
The KSZ9031RNX provides the Reduced Gigabit Media Independent Interface (RGMII) for direct connection to RGMII
MACs in Gigabit Ethernet processors and switches for data transfer at 10/100/1000 Mbps.
The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four
differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core.
The KSZ9031RNX offers diagnostic features to facilitate system bring-up and debugging in production testing and in
product deployment. Parametric NAND tree support enables fault detection between KSZ9031 I/Os and the board. The
LinkMD® TDR-based cable diagnostic identifies faulty copper cabling. Remote and local loopback functions verify ana-
log and digital data paths.
The standard KSZ9031RNX is available in a 48-pin, lead-free QFN package, and the AEC-Q100 automotive qualified
parts, KSZ9031RNXUA/UB and KSZ9031RNXVA/VB, are available in a 48-pin lead-free VQFN (wettable) package.
FIGURE 1-1: SYSTEM BLOCK DIAGRAM
RGMII
10/100/1000Mbps
RGMII
ETHERNET MAC MDC/MDIO
MANAGEMENT
KSZ9031RNX
LDO
CONTROLLER
ON-CHIP TERMINATION
RESISTORS
VIN
3.3VA
VOUT
1.2V (FOR CORE VOLTAGES)
MAGNETICS
RJ-45
CONNECTOR
MEDIA TYPES
10Base-T
100Base-TX
1000Base-T
(SYSTEM POWER CIRCUIT)
PME_N
2016-2017 Microchip Technology Inc. DS00002117F-page 5
KSZ9031RNX
2.0 PIN DESCRIPTION AND CONFIGURATION
FIGURE 2-1: 48-QFN PIN ASSIGNMENT (TOP VIEW)
1
TXRXP_A
LED2/
PHYAD1
4142434445464748
PADDLE GROUND
(ON BOTTOM OF CHIP)
37383940
2
TXRXM_A 3
4
5
AVDDL
6
AVDDH
7
8
9
10
TXRXP_B
11
TXRXM_B
AVDDL
2019181716151413 24232221
LED1 /
PME_N1 /
PHYAD0
DVDDH
TXD0
DVDDL
TXD2
TXD3
DVDDL
36
35
34
33
32
31
30
29
28
27
26
25
DVDDL
TX_EN
RXD1/
MODE1
RXD0/
MODE0
RX_DV/
CLK125_EN
DVDDH
VSS
RX_CLK/
PHYAD2
RESET_N
ISET
NC
XI
XO
AVDDL_PLL
LDO_O
DVDDH
CLK125_NDO/
LED_MODE
DVDDL
INT_N/
PME_N2
MDIO
TXD1
DVDDL
KSZ9031RNX
12
AVDDH
TXRXP_C
TXRXM_C
TXRXP_D
TXRXM_D
MDC
RXD2/
MODE2
RXD3/
MODE3
DVDDL
GTX_CLK
NC
KSZ9031RNX
DS00002117F-page 6 2016-2017 Microchip Technology Inc.
TABLE 2-1: SIGNALS - KSZ9031RNX
Pin
Number
Pin
Name
Type
Note
2-1
Description
1 AVDDH P 3.3V/2.5V (commercial temp only) analog VDD
2 TXRXP_A I/O
Media Dependent Interface[0], positive signal of differential pair
1000BASE-T mode:
TXRXP_A corresponds to BI_DA+ for MDI configuration and BI_DB+ for MDI-
X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXP_A is the positive transmit signal (TX+) for MDI configuration and the
positive receive signal (RX+) for MDI-X configuration, respectively.
3 TXRXM_A I/O
Media Dependent Interface[0], negative signal of differential pair
1000BASE-T mode:
TXRXM_A corresponds to BI_DA– for MDI configuration and BI_DB– for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXM_A is the negative transmit signal (TX–) for MDI configuration and the
negative receive signal (RX–) for MDI-X configuration, respectively.
4 AVDDL P 1.2V analog VDD
5 TXRXP_B I/O
Media Dependent Interface[1], positive signal of differential pair
1000BASE-T mode:
TXRXP_B corresponds to BI_DB+ for MDI configuration and BI_DA+ for MDI-
X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXP_B is the positive receive signal (RX+) for MDI configuration and the
positive transmit signal (TX+) for MDI-X configuration, respectively.
6 TXRXM_B I/O
Media Dependent Interface[1], negative signal of differential pair
1000BASE-T mode:
TXRXM_B corresponds to BI_DB– for MDI configuration and BI_DA– for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXM_B is the negative receive signal (RX–) for MDI configuration and the
negative transmit signal (TX–) for MDI-X configuration, respectively.
7 TXRXP_C I/O
Media Dependent Interface[2], positive signal of differential pair
1000BASE-T mode:
TXRXP_C corresponds to BI_DC+ for MDI configuration and BI_DD+ for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXP_C is not used.
8 TXRXM_C I/O
Media Dependent Interface[2], negative signal of differential pair
1000BASE-T mode:
TXRXM_C corresponds to BI_DC– for MDI configuration and BI_DD– for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXM_C is not used.
9 AVDDL P 1.2V analog VDD
2016-2017 Microchip Technology Inc. DS00002117F-page 7
KSZ9031RNX
10 TXRXP_D I/O
Media Dependent Interface[3], positive signal of differential pair
1000BASE-T mode:
TXRXP_D corresponds to BI_DD+ for MDI configuration and BI_DC+ for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXP_D is not used.
11 TXRXM_D I/O
Media Dependent Interface[3], negative signal of differential pair
1000BASE-T mode:
TXRXM_D corresponds to BI_DD– for MDI configuration and BI_DC– for
MDI-X configuration, respectively.
10BASE-T/100BASE-TX mode:
TXRXM_D is not used.
12 AVDDH P 3.3V/2.5V (commercial temp only) analog VDD
13 NC No connect. This pin is not bonded and can be connected to digital ground for
footprint compatibility with the KSZ9021RN Gigabit PHY.
14 DVDDL P 1.2V digital VDD
TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)
Pin
Number
Pin
Name
Type
Note
2-1
Description
KSZ9031RNX
DS00002117F-page 8 2016-2017 Microchip Technology Inc.
15 LED2/
PHYAD1 I/O
LED output: Programmable LED2 output
Config mode: The pull-up/pull-down value is latched as PHYAD[1] during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
The LED2 pin is programmed by the LED_MODE strapping option (Pin 41),
and is defined as follows:
Single-LED Mode
Link Pin State LED Definition
Link Off H OFF
Link On (any speed) L ON
Tri-Color Dual-LED Mode
Link/Activity
Pin State LED Definition
LED2 LED1 LED2 LED1
Link Off H H OFF OFF
1000 Link/No Activity L H ON OFF
1000 Link/Activity
(RX, TX) Toggle H Blinking OFF
100 Link/No Activity H L OFF ON
100 Link/Activity
(RX, TX) H Toggle OFF Blinking
10 Link/No Activity L L ON ON
10 Link/Activity
(RX, TX) Toggle Toggle Blinking Blinking
For tri-color dual-LED mode, LED2 works in conjunction with LED1 (Pin 17) to
indicate 10 Mbps link and activity.
16 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O
TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)
Pin
Number
Pin
Name
Type
Note
2-1
Description
2016-2017 Microchip Technology Inc. DS00002117F-page 9
KSZ9031RNX
17
LED1/
PHYAD0/
PME_N1
I/O
LED1 output: Programmable LED1 output
Config mode: The voltage on this pin is sampled and latched during the
power-up/reset process to determine the value of PHYAD[0]. See the Strap-In
Options - KSZ9031RNX section for details.
PME_N output: Programmable PME_N output (pin option 1). This pin function
requires an external pull-up resistor to DVDDH (digital VDD_I/O) in a range
from 1.0 k to 4.7 k. When asserted low, this pin signals that a WOL event
has occurred.
This pin is not an open-drain for all operating modes.
The LED1 pin is programmed by the LED_MODE strapping option (Pin 41),
and is defined as follows:
Single-LED Mode
Activity Pin State LED Definition
No Activity H OFF
Activity (RX, TX) Toggle Blinking
Tri-Color Dual-LED Mode
Link/Activity
Pin State LED Definition
LED2 LED1 LED2 LED1
Link Off H H OFF OFF
1000 Link/No Activity L H ON OFF
1000 Link/Activity
(RX, TX) Toggle H Blinking OFF
100 Link/No Activity H L OFF ON
100 Link/Activity
(RX, TX) H Toggle OFF Blinking
10 Link/No Activity L L ON ON
10 Link/Activity
(RX, TX) Toggle Toggle Blinking Blinking
For tri-color dual-LED mode, LED1 works in conjunction with LED2 (Pin 15) to
indicate 10 Mbps link and activity.
18 DVDDL P 1.2V digital VDD
19 TXD0 I RGMII mode: RGMII TD0 (Transmit Data 0) input
20 TXD1 I RGMII mode: RGMII TD1 (Transmit Data 1) input
21 TXD2 I RGMII mode: RGMII TD2 (Transmit Data 2) input
22 TXD3 I RGMII mode: RGMII TD3 (Transmit Data 3) input
23 DVDDL P 1.2V digital VDD
24 GTX_CLK I RGMII mode: RGMII TXC (Transmit Reference Clock) input
TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)
Pin
Number
Pin
Name
Type
Note
2-1
Description
KSZ9031RNX
DS00002117F-page 10 2016-2017 Microchip Technology Inc.
25 TX_EN I RGMII mode: RGMII TX_CTL (Transmit Control) input
26 DVDDL P 1.2V digital VDD
27 RXD3/
MODE3 I/O
RGMII mode: RGMII RD3 (Receive Data 3) output
Config mode: The pull-up/pull-down value is latched as MODE3 during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
28 RXD2/
MODE2 I/O
RGMII mode: RGMII RD2 (Receive Data 2) output
Config mode: The pull-up/pull-down value is latched as MODE2 during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
29 VSS GND Digital ground
30 DVDDL P 1.2V digital VDD
31 RXD1/
MODE1 I/O
RGMII mode: RGMII RD1 (Receive Data 1) output
Config mode: The pull-up/pull-down value is latched as MODE1 during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
32 RXD0/
MODE0 I/O
RGMII mode: RGMII RD0 (Receive Data 0) output
Config mode: The pull-up/pull-down value is latched as MODE0 during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
33 RX_DV/
CLK125_EN I/O
RGMII mode: RGMII RX_CTL (Receive Control) output
Config mode: Latched as CLK125_NDO Output Enable during power-up/
reset. See the Strap-In Options - KSZ9031RNX section for details.
34 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O
35 RX_CLK/
PHYAD2 I/O
RGMII mode: RGMII RXC (Receive Reference Clock) output
Config mode: The pull-up/pull-down value is latched as PHYAD[2] during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
36 MDC Ipu Management data clock input
This pin is the input reference clock for MDIO (Pin 37).
37 MDIO Ipu/O
Management data input/output
This pin is synchronous to MDC (Pin 36) and requires an external pull-up
resistor to DVDDH (digital VDD_I/O) in a range from 1.0 k to 4.7 k.
38 INT_N/
PME_N2 O
Interrupt output: Programmable interrupt output, with Register 1Bh as the
Interrupt Control/Status register, for programming the interrupt conditions and
reading the interrupt status. Register 1Fh, Bit [14] sets the interrupt output to
active low (default) or active high.
PME_N output: Programmable PME_N output (pin option 2). When asserted
low, this pin signals that a WOL event has occurred.
For Interrupt (when active low) and PME functions, this pin requires an exter-
nal pull-up resistor to DVDDH (digital VDD_I/O) in a range from 1.0 k to
4.7 k.
This pin is not an open-drain for all operating modes.
39 DVDDL P 1.2V digital VDD
40 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_I/O
TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)
Pin
Number
Pin
Name
Type
Note
2-1
Description
2016-2017 Microchip Technology Inc. DS00002117F-page 11
KSZ9031RNX
Note 2-1 P = power supply
GND = ground
I = input
O = output
I/O = bi-directional
Ipu = Input with internal pull-up (see Section 6.0, "Electrical Characteristics" for value).
Ipu/O = Input with internal pull-up (see Section 6.0, "Electrical Characteristics" for value) during
power-up/reset; output pin otherwise.
41 CLK125_NDO/
LED_MODE I/O
125 MHz clock output
This pin provides a 125 MHz reference clock output option for use by the
MAC.
Config mode: The pull-up/pull-down value is latched as LED_MODE during
power-up/reset. See the Strap-In Options - KSZ9031RNX section for details.
42 RESET_N Ipu
Chip reset (active low)
Hardware pin configurations are strapped-in at the de-assertion (rising edge)
of RESET_N. See the Strap-In Options - KSZ9031RNX section for details.
43 LDO_O O
On-chip 1.2V LDO controller output
This pin drives the input gate of a P-channel MOSFET to generate 1.2V for
the chip’s core voltages. If the system provides 1.2V and this pin is not used,
it can be left floating.
Note: This pin should never be driven externally.
44 AVDDL_PLL P 1.2V analog VDD fo r P LL
45 XO O 25 MHz crystal feedback
This pin is a no connect if an oscillator or external clock source is used.
46 XI I Crystal/Oscillator/External Clock input
25 MHz ±50 ppm tolerance
47 NC
No connect
This pin is not bonded and can be connected to AVDDH power for footprint
compatibility with the KSZ9021RN Gigabit PHY.
48 ISET I/O Set the transmit output level
Connect a 12.1 k 1% resistor to ground on this pin.
Paddle P_GND GND Exposed paddle on bottom of chip
Connect P_GND to ground.
TABLE 2-1: SIGNALS - KSZ9031RNX (CONTINUED)
Pin
Number
Pin
Name
Type
Note
2-1
Description
KSZ9031RNX
DS00002117F-page 12 2016-2017 Microchip Technology Inc.
Pin strap-ins are latched during power-up or reset. In some systems, the MAC receive input pins may be driven during
power-up or reset, and consequently cause the PHY strap-in pins on the RGMII signals to be latched to an incorrect
configuration. In this case, external pull-up or pull-down resistors should be added on the PHY strap-in pins to ensure
the PHY is configured to the correct pin strap-in mode.
Note 2-2 I/O = Bi-directional.
TABLE 2-2: STRAP-IN OPTIONS - KSZ9031RNX
Pin Number Pin Name Type
Note 2-2 Description
35
15
17
PHYAD2
PHYAD1
PHYAD0
I/O
I/O
I/O
The PHY address, PHYAD[2:0], is sampled and latched at power-up/
reset and is configurable to any value from 0 to 7. Each PHY address
bit is configured as follows:
Pull-up = 1
Pull-down = 0
PHY Address Bits [4:3] are always set to ‘00’.
27
28
31
32
MODE3
MODE2
MODE1
MODE0
I/O
I/O
I/O
I/O
The MODE[3:0] strap-in pins are sampled and latched at power-up/
reset and are defined as follows:
MODE[3:0] Mode
0000 Reserved - not used
0001 Reserved - not used
0010 Reserved - not used
0011 Reserved - not used
0100 NAND tree mode
0101 Reserved - not used
0110 Reserved - not used
0111 Chip power-down mode
1000 Reserved - not used
1001 Reserved - not used
1010 Reserved - not used
1011 Reserved - not used
1100 RGMII mode - Advertise 1000BASE-T full-duplex
only
1101 RGMII mode - Advertise 1000BASE-T full- and half-
duplex only
1110
RGMII mode - Advertise all capabilities (10/100/1000
speed half-/full-duplex), except 1000BASE-T half-
duplex
1111 RGMII mode - Advertise all capabilities (10/100/1000
speed half-/full-duplex)
33 CLK125_EN I/O
CLK125_EN is sampled and latched at power-up/reset and is
defined as follows:
Pull-up (1) = Enable 125 MHz clock output
Pull-down (0) = Disable 125 MHz clock output
Pin 41 (CLK125_NDO) provides the 125 MHz reference clock output
option for use by the MAC.
41 LED_MODE I/O
LED_MODE is sampled and latched at power-up/reset and is
defined as follows:
Pull-up (1) = Single-LED mode
Pull-down (0) = Tri-color dual-LED mode
2016-2017 Microchip Technology Inc. DS00002117F-page 13
KSZ9031RNX
3.0 FUNCTIONAL DESCRIPTION
The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical
layer transceiver solution for transmission and reception of data over a standard CAT-5 unshielded twisted pair (UTP)
cable.
The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four
differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core.
On the copper media interface, the KSZ9031RNX can automatically detect and correct for differential pair misplace-
ments and polarity reversals, and correct propagation delays and re-sync timing between the four differential pairs, as
specified in the IEEE 802.3 standard for 1000BASE-T operation.
The KSZ9031RNX provides the RGMII interface for connection to RGMII MACs in Gigabit Ethernet processors and
switches for data transfer at 10/100/1000 Mbps.
Figure 3-1 shows a high-level block diagram of the KSZ9031RNX.
FIGURE 3-1: KSZ9031RNX BLOCK DIAGRAM
3.1 10BASE-T/100BASE-TX Transceiver
3.1.1 100BASE-TX TRANSMIT
The 100BASE-TX transmit function performs parallel-to-serial conversion, 4B/5B coding, scrambling, NRZ-to-NRZI con-
version, and MLT-3 encoding and transmission.
The circuitry starts with a parallel-to-serial conversion, which converts the MII data from the MAC into a 125 MHz serial
bit stream. The data and control stream is then converted into 4B/5B coding, followed by a scrambler. The serialized
data is further converted from NRZ-to-NRZI format, and then transmitted in MLT-3 current output. The output current is
set by an external 12.1 k 1% resistor for the 1:1 transformer ratio.
The output signal has a typical rise/fall time of 4 ns and complies with the ANSI TP-PMD standard regarding amplitude
balance, and overshoot. The wave-shaped 10BASE-T output is also incorporated into the 100BASE-TX transmitter.
3.1.2 100BASE-TX RECEIVE
The 100BASE-TX receiver function performs adaptive equalization, DC restoration, MLT-3-to-NRZI conversion, data
and clock recovery, NRZI-to-NRZ conversion, de-scrambling, 4B/5B decoding, and serial-to-parallel conversion.
The receiving side starts with the equalization filter to compensate for inter-symbol interference (ISI) over the twisted
pair cable. Because the amplitude loss and phase distortion are a function of the cable length, the equalizer must adjust
its characteristics to optimize performance. In this design, the variable equalizer makes an initial estimation based on
comparisons of incoming signal strength against some known cable characteristics, then tunes itself for optimization.
This is an ongoing process and self-adjusts against environmental changes such as temperature variations.
MEDIA
INTERFACE
PMA
TX10/100/1000
PMA
RX1000
PMA
RX100
PMA
RX10
CLOCK
RESET
PCS10
AUTO-
NEGOTIATION
PCS100
PCS1000
INTERFACE
LED
DRIVERS
CONFIGURATIONS
RGMII
KSZ9031RNX
DS00002117F-page 14 2016-2017 Microchip Technology Inc.
Next, the equalized signal goes through a DC-restoration and data-conversion block. The DC-restoration circuit com-
pensates for the effect of baseline wander and improves the dynamic range. The differential data conversion circuit con-
verts the MLT-3 format back to NRZI. The slicing threshold is also adaptive.
The clock-recovery circuit extracts the 125 MHz clock from the edges of the NRZI signal. This recovered clock is then
used to convert the NRZI signal into the NRZ format. This signal is sent through the de-scrambler followed by the 4B/
5B decoder. Finally, the NRZ serial data is converted to the RGMII format and provided as the input data to the MAC.
3.1.3 SCRAMBLER/DE-SCRAMBLER (100BASE-TX ONLY)
The purpose of the scrambler is to spread the power spectrum of the signal to reduce electromagnetic interference (EMI)
and baseline wander. Transmitted data is scrambled using an 11-bit wide linear feedback shift register (LFSR). The
scrambler generates a 2047-bit non-repetitive sequence, then the receiver de-scrambles the incoming data stream
using the same sequence as at the transmitter.
3.1.4 10BASE-T TRANSMIT
The 10BASE-T output drivers are incorporated into the 100BASE-TX drivers to allow for transmission with the same
magnetic. The drivers perform internal wave-shaping and pre-emphasis, and output signals with typical amplitude of
2.5V peak for standard 10BASE-T mode and 1.75V peak for energy-efficient 10BASE-Te mode. The 10BASE-T/
10BASE-Te signals have harmonic contents that are at least 31 dB below the fundamental frequency when driven by
an all-ones Manchester-encoded signal.
3.1.5 10BASE-T RECEIVE
On the receive side, input buffer and level-detecting squelch circuits are used. A differential input receiver circuit and a
phase-locked loop (PLL) perform the decoding function. The Manchester-encoded data stream is separated into clock
signal and NRZ data. A squelch circuit rejects signals with levels less than 300 mV or with short pulse widths to prevent
noises at the receive inputs from falsely triggering the decoder. When the input exceeds the squelch limit, the PLL locks
onto the incoming signal and the KSZ9031RNX decodes a data frame. The receiver clock is maintained active during
idle periods between receiving data frames.
The KSZ9031RNX removes all 7 bytes of the preamble and presents the received frame starting with the SFD (start of
frame delimiter) to the MAC.
Auto-polarity correction is provided for the receiving differential pair to automatically swap and fix the incorrect +/– polar-
ity wiring in the cabling.
3.2 1000BASE-T Transceiver
The 1000BASE-T transceiver is based-on a mixed-signal/digital-signal processing (DSP) architecture, which includes
the analog front-end, digital channel equalizers, trellis encoders/decoders, echo cancelers, cross-talk cancelers, preci-
sion clock recovery scheme, and power-efficient line drivers.
Figure 3-2 shows a high-level block diagram of a single channel of the 1000BASE-T transceiver for one of the four dif-
ferential pairs.
2016-2017 Microchip Technology Inc. DS00002117F-page 15
KSZ9031RNX
FIGURE 3-2: KSZ9031RNX 1000BASE-T BLOCK DIAGRAM - SINGLE CHANNEL
3.2.1 ANALOG ECHO-CANCELLATION CIRCUIT
In 1000BASE-T mode, the analog echo-cancellation circuit helps to reduce the near-end echo. This analog hybrid circuit
relieves the burden of the ADC and the adaptive equalizer.
This circuit is disabled in 10BASE-T/100BASE-TX mode.
3.2.2 AUTOMATIC GAIN CONTROL (AGC)
In 1000BASE-T mode, the automatic gain control (AGC) circuit provides initial gain adjustment to boost up the signal
level. This pre-conditioning circuit is used to improve the signal-to-noise ratio of the receive signal.
3.2.3 ANALOG-TO-DIGITAL CONVERTER (ADC)
In 1000BASE-T mode, the analog-to-digital converter (ADC) digitizes the incoming signal. ADC performance is essen-
tial to the overall performance of the transceiver.
This circuit is disabled in 10BASE-T/100BASE-TX mode.
3.2.4 TIMING RECOVERY CIRCUIT
In 1000BASE-T mode, the mixed-signal clock recovery circuit together with the digital phase-locked loop is used to
recover and track the incoming timing information from the received data. The digital phase-locked loop has very low
long-term jitter to maximize the signal-to-noise ratio of the receive signal.
The 1000BASE-T slave PHY must transmit the exact receive clock frequency recovered from the received data back to
the 1000BASE-T master PHY. Otherwise, the master and slave will not be synchronized after long transmission. This
also helps to facilitate echo cancellation and NEXT removal.
3.2.5 ADAPTIVE EQUALIZER
In 1000BASE-T mode, the adaptive equalizer provides the following functions:
Detection for partial response signaling
Removal of NEXT and ECHO noise
Channel equalization
Signal quality is degraded by residual echo that is not removed by the analog hybrid because of impedance mismatch.
The KSZ9031RNX uses a digital echo canceler to further reduce echo components on the receive signal.
In 1000BASE-T mode, data transmission and reception occurs simultaneously on all four pairs of wires (four channels).
This results in high-frequency cross-talk coming from adjacent wires. The KSZ9031RNX uses three NEXT cancelers on
each receive channel to minimize the cross-talk induced by the other three channels.
CLOCK
GENERATION
BASELINE
WANDER
COMPENSATION
ECHO
CANCELLER
TRANSMIT
BLOCK
NEXT Canceller
NEXT Canceller
NEXT
CANCELLER
RX-
ADC
AGC
+FFE SLICER
CLOCK AND PHASE
RECOVERY
AUTO -
NEGOTIATION
PMA STATE
MACHINES
MII
REGISTERS
MII
MANAGEMENT
CONTROL
DFE
ANALOG
HYBRID
PCS STATE
MACHINES
PAIR SWAP
AND
ALIGN UNIT DESCRAMBLER
+
DECODER
SIDE-STREAM
SCRAMBLER
AND
SYMBOL ENCODER
LED DRIVER
XTAL OTHER
CHANNELS
TX
SIGNAL
RX
SIGNAL
KSZ9031RNX
DS00002117F-page 16 2016-2017 Microchip Technology Inc.
In 10BASE-T/100BASE-TX mode, the adaptive equalizer needs only to remove the inter-symbol interference and
recover the channel loss from the incoming data.
3.2.6 TRELLIS ENCODER AND DECODER
In 1000BASE-T mode, the transmitted 8-bit data is scrambled into 9-bit symbols and further encoded into 4D-PAM5
symbols. The initial scrambler seed is determined by the specific PHY address to reduce EMI when more than one
KSZ9031RNX is used on the same board. On the receiving side, the idle stream is examined first. The scrambler seed,
pair skew, pair order, and polarity must be resolved through the logic. The incoming 4D-PAM5 data is then converted
into 9-bit symbols and de-scrambled into 8-bit data.
3.3 Auto MDI/MDI-X
The Automatic MDI/MDI-X feature eliminates the need to determine whether to use a straight cable or a crossover cable
between the KSZ9031RNX and its link partner. This auto-sense function detects the MDI/MDI-X pair mapping from the
link partner, and assigns the MDI/MDI-X pair mapping of the KSZ9031RNX accordingly.
Table 3-1 shows the KSZ9031RNX 10/100/1000 pin configuration assignments for MDI/MDI-X pin mapping.
Auto MDI/MDI-X is enabled by default. It is disabled by writing a one to Register 1Ch, Bit [6]. MDI and MDI-X mode is
set by Register 1Ch, Bit [7] if Auto MDI/MDI-X is disabled.
An isolation transformer with symmetrical transmit and receive data paths is recommended to support Auto MDI/MDI-X.
3.4 Pair-Swap, Alignment, and Polarity Check
In 1000BASE-T mode, the KSZ9031RNX
Detects incorrect channel order and automatically restores the pair order for the A, B, C, D pairs (four channels).
Supports 50 ns ±10 ns difference in propagation delay between pairs of channels in accordance with the IEEE
802.3 standard, and automatically corrects the data skew so the corrected four pairs of data symbols are synchro-
nized.
Incorrect pair polarities of the differential signals are automatically corrected for all speeds.
3.5 Wave Shaping, Slew-Rate Control, and Partial Response
In communication systems, signal transmission encoding methods are used to provide the noise-shaping feature and
to minimize distortion and error in the transmission channel.
For 1000BASE-T, a special partial-response signaling method is used to provide the band-limiting feature for the
transmission path.
For 100BASE-TX, a simple slew-rate control method is used to minimize EMI.
For 10BASE-T, pre-emphasis is used to extend the signal quality through the cable.
3.6 PLL Clock Synthesizer
The KSZ9031RNX generates 125 MHz, 25 MHz, and 10 MHz clocks for system timing. Internal clocks are generated
from the external 25 MHz crystal or reference clock.
TABLE 3-1: MDI/MDI-X PIN MAPPING
Pin
(RJ-45 Pair)
MDI MDI-X
1000BASE-T 100BASE-T 10BASE-T 1000BASE-T 100BASE-T 10BASE-T
TXRXP/M_A
(1, 2)
A+/– TX+/– TX+/– B+/– RX+/– RX+/–
TXRXP/M_B
(3, 6)
B+/– RX+/– RX+/– A+/– TX+/– TX+/–
TXRXP/M_C
(4, 5)
C+/– Not Used Not Used D+/– Not Used Not Used
TXRXP/M_D
(7, 8)
D+/– Not Used Not Used C+/– Not Used Not Used
2016-2017 Microchip Technology Inc. DS00002117F-page 17
KSZ9031RNX
3.7 Auto-Negotiation
The KSZ9031RNX conforms to the auto-negotiation protocol, defined in Clause 28 of the IEEE 802.3 Specification.
Auto-negotiation allows UTP (unshielded twisted pair) link partners to select the highest common mode of operation.
During auto-negotiation, link partners advertise capabilities across the UTP link to each other, and then compare their
own capabilities with those they received from their link partners. The highest speed and duplex setting that is common
to the two link partners is selected as the operating mode.
The following list shows the speed and duplex operation mode from highest-to-lowest:
Priority 1: 1000BASE-T, full-duplex
Priority 2: 1000BASE-T, half-duplex
Priority 3: 100BASE-TX, full-duplex
Priority 4: 100BASE-TX, half-duplex
Priority 5: 10BASE-T, full-duplex
Priority 6: 10BASE-T, half-duplex
If auto-negotiation is not supported or the KSZ9031RNX link partner is forced to bypass auto-negotiation for 10BASE-
T and 100BASE-TX modes, the KSZ9031RNX sets its operating mode by observing the input signal at its receiver. This
is known as parallel detection, and allows the KSZ9031RNX to establish a link by listening for a fixed signal protocol in
the absence of the auto-negotiation advertisement protocol.
The auto-negotiation link-up process is shown in Figure 3-3.
FIGURE 3-3: AUTO-NEGOTIATION FLOW CHART
For 1000BASE-T mode, auto-negotiation is required and always used to establish a link. During 1000BASE-T auto-
negotiation, the master and slave configuration is first resolved between link partners. Then the link is established with
the highest common capabilities between link partners.
Auto-negotiation is enabled by default after power-up or hardware reset. After that, auto-negotiation can be enabled or
disabled through Register 0h, Bit [12]. If auto-negotiation is disabled, the speed is set by Register 0h, Bits [6, 13] and
the duplex is set by Register 0h, Bit [8].
If the speed is changed on the fly, the link goes down and auto-negotiation and parallel detection initiate until a common
speed between KSZ9031RNX and its link partner is re-established for a link.
If the link is already established and there is no change of speed on the fly, the changes (for example, duplex and pause
capabilities) will not take effect unless either auto-negotiation is restarted through Register 0h, Bit [9], or a link-down to
link-up transition occurs (that is, disconnecting and reconnecting the cable).
START AUTO-NEGOTIATION
FORCE LINK SETTING
LISTEN FOR 10BASE-T
LINK PULSES
LISTEN FOR 100BASE-TX
IDLES
ATTEMPT AUTO-
NEGOTIATION
LINK MODE SET
BYPASS AUTO-NEGOTIATION
AND SET LINK MODE
LINK MODE SET?
PARALLEL
OPERATION
NO
YES
YES
NO
JOIN FLOW
KSZ9031RNX
DS00002117F-page 18 2016-2017 Microchip Technology Inc.
After auto-negotiation is completed, the link status is updated in Register 1h, Bit [2], and the link partner capabilities are
updated in Registers 5h, 6h, 8h, and Ah.
The auto-negotiation finite state machines use interval timers to manage the auto-negotiation process. The duration of
these timers under normal operating conditions is summarized in Table 3-2.
3.8 10/100 Mbps Speeds Only
Some applications require link-up to be limited to 10/100 Mbps speeds only.
After power-up/reset, the KSZ9031RNX can be restricted to auto-negotiate and link-up to 10/100 Mbps speeds only by
programming the following register settings:
1. Set Register 0h, Bit [6] = ‘0’ to remove 1000 Mbps speed.
2. Set Register 9h, Bits [9:8] = ‘00’ to remove Auto-Negotiation advertisements for 1000 Mbps full-/half-duplex.
3. Write a ‘1’ to Register 0h, Bit [9], a self-clearing bit, to force a restart of Auto-Negotiation.
Auto-Negotiation and 10BASE-T/100BASE-TX speeds use only differential pairs A (pins 2, 3) and B (pins 5, 6). Differ-
ential pairs C (pins 7, 8) and D (pins 10, 11) can be left as no connects.
3.9 RGMII Interface
The Reduced Gigabit Media Independent Interface (RGMII) supports on-chip data-to-clock delay timing according to
the RGMII Version 2.0 Specification, with programming options for external delay timing and to adjust and correct TX
and RX timing paths.
RGMII provides a common interface between RGMII PHYs and MACs, and has the following key characteristics:
Pin count is reduced from 24 pins for the IEEE Gigabit Media Independent Interface (GMII) to 12 pins for RGMII.
All speeds (10 Mbps, 100 Mbps, and 1000 Mbps) are supported at both half- and full-duplex.
Data transmission and reception are independent and belong to separate signal groups.
Transmit data and receive data are each four bits wide, a nibble.
In RGMII operation, the RGMII pins function as follows:
The MAC sources the transmit reference clock, TXC, at 125 MHz for 1000 Mbps, 25 MHz for 100 Mbps, and
2.5 MHz for 10 Mbps.
The PHY recovers and sources the receive reference clock, RXC, at 125 MHz for 1000 Mbps, 25 MHz for
100 Mbps, and 2.5 MHz for 10 Mbps.
For 1000BASE-T, the transmit data, TXD[3:0], is presented on both edges of TXC, and the received data,
RXD[3:0], is clocked out on both edges of the recovered 125 MHz clock, RXC.
For 10BASE-T/100BASE-TX, the MAC holds TX_CTL low until both PHY and MAC operate at the same speed.
TABLE 3-2: AUTO-NEGOTIATION TIMERS
Auto-Negotiation Interval Timers Time Duration
Transmit Burst Interval 16 ms
Transmit Pulse Interval 68 µs
FLP Detect Minimum Time 17.2 µs
FLP Detect Maximum Time 185 µs
Receive Minimum Burst Interval 6.8 ms
Receive Maximum Burst Interval 112 ms
Data Detect Minimum Interval 35.4 µs
Data Detect Maximum Interval 95 µs
NLP Test Minimum Interval 4.5 ms
NLP Test Maximum Interval 30 ms
Link Loss Time 52 ms
Break Link Time 1480 ms
Parallel Detection Wait Time 830 ms
Link Enable Wait Time 1000 ms
2016-2017 Microchip Technology Inc. DS00002117F-page 19
KSZ9031RNX
During the speed transition, the receive clock is stretched on either a positive or negative pulse to ensure that no
clock glitch is presented to the MAC.
TX_ER and RX_ER are combined with TX_EN and RX_DV, respectively, to form TX_CTL and RX_CTL. These
two RGMII control signals are valid at the falling clock edge.
After power-up or reset, the KSZ9031RNX is configured to RGMII mode if the MODE[3:0] strap-in pins are set to one of
the RGMII mode capability options. See the Strap-In Options - KSZ9031RNX section.
The KSZ9031RNX has the option to output a 125 MHz reference clock on the CLK125_NDO pin. This clock provides a
lower-cost reference clock alternative for RGMII MACs that require a 125 MHz crystal or oscillator. The 125 MHz clock
output is enabled after power-up or reset if the CLK125_EN strap-in pin is pulled high.
3.9.1 RGMII SIGNAL DEFINITION
Table 3-3 describes the RGMII signals. Refer to the RGMII Version 2.0 Specification for more detailed information.
3.9.2 RGMII SIGNAL DIAGRAM
The KSZ9031RNX RGMII pin connections to the MAC are shown in Figure 3-4.
FIGURE 3-4: KSZ9031RNX RGMII INTERFACE
TABLE 3-3: RGMII SIGNAL DEFINITION
RGMII Signal
Name (per spec)
RGMII Signal
Name (per
KSZ9031RNX)
Pin Type (with
respect to PHY)
Pin Type (with
respect to MAC) Description
TXC GTX_CLK Input Output Transmit Reference Clock
(125MHz for 1000Mbps, 25MHz for
100Mbps, 2.5MHz for 10Mbps)
TX_CTL TX_EN Input Output Transmit Control
TXD[3:0] TXD[3:0] Input Output Transmit Data[3:0]
RXC RX_CLK Output Input Receive Reference Clock
(125 MHz for 1000 Mbps, 25 MHz
for 100 Mbps, 2.5 MHz for
10 Mbps)
RX_CTL RX_DV Output Input Receive Control
RXD[3:0] RXD[3:0] Output Input Receive Data[3:0]
KSZ9031RNX
GTX _CLK
TX _EN
TXD[3:0]
RX_CLK
RX _DV
RXD[3:0]
GMII
ETHERNET MAC
TXC
TX _CTL
TXD[3:0]
RXC
RX _CTL
RXD[3:0]
R
KSZ9031RNX
DS00002117F-page 20 2016-2017 Microchip Technology Inc.
3.9.3 RGMII PAD SKEW REGISTERS
Pad skew registers are available for all RGMII pins (clocks, control signals, and data bits) to provide programming
options to adjust or correct the timing relationship for each RGMII pin. Because RGMII is a source-synchronous bus
interface, the timing relationship needs to be maintained only within the RGMII pin’s respective timing group.
RGMII transmit timing group pins: GTX_CLK, TX_EN, TXD[3:0]
RGMII receive timing group pins: RX_CLK, RX_DV, RXD[3:0]
Table 3-4 details the four registers located at MMD Address 2h that are provided for pad skew programming.
The RGMII control signals and data bits have 4-bit skew settings, while the RGMII clocks have 5-bit skew settings.
Each register bit is approximately a 0.06 ns step change. A single-bit decrement decreases the delay by approximately
0.06 ns, while a single-bit increment increases the delay by approximately 0.06 ns.
Table 3-5 and Ta b l e 3 - 6 list the approximate absolute delay for each pad skew (value) setting.
TABLE 3-4: RGMII PAD SKEW REGISTERS
Address Name Description Mode Default
MMD Address 2h, Register 4h – RGMII Control Signal Pad Skew
2.4.15:8 Reserved Reserved RW 0000_0000
2.4.7:4 RX_DV
Pad Skew
RGMII RX_CTL output pad skew control (0.06 ns/
step)
RW 0111
2.4.3:0 TX_EN
Pad Skew
RGMII TX_CTL input pad skew control (0.06 ns/
step)
RW 0111
MMD Address 2h, Register 5h – RGMII RX Data Pad Skew
2.5.15:12 RXD3
Pad Skew
RGMII RXD3 output pad skew control (0.06 ns/
step)
RW 0111
2.5.11:8 RXD2
Pad Skew
RGMII RXD2 output pad skew control (0.06 ns/
step)
RW 0111
2.5.7:4 RXD1
Pad Skew
RGMII RXD1 output pad skew control (0.06 ns/
step)
RW 0111
2.5.3:0 RXD0
Pad Skew
RGMII RXD0 output pad skew control (0.06 ns/
step)
RW 0111
MMD Address 2h, Register 6h – RGMII TX Data Pad Skew
2.6.15:12 TXD3
Pad Skew
RGMII TXD3 input pad skew control (0.06 ns/step) RW 0111
2.6.11:8 TXD2
Pad Skew
RGMII TXD2 input pad skew control (0.06 ns/step) RW 0111
2.6.7:4 TXD1
Pad Skew
RGMII TXD1 input pad skew control (0.06 ns/step) RW 0111
2.6.3:0 TXD0
Pad Skew
RGMII TXD0 input pad skew control (0.06 ns/step) RW 0111
MMD Address 2h, Register 8h – RGMII Clock Pad Skew
2.8.15:10 Reserved Reserved RW 0000_00
2.8.9:5 GTX_CLK
Pad Skew
RGMII GTX_CLK input pad skew control (0.06 ns/
step)
RW 01_111
2.8.4:0 RX_CLK
Pad Skew
RGMII RX_CLK output pad skew control (0.06 ns/
step)
RW 0_1111
2016-2017 Microchip Technology Inc. DS00002117F-page 21
KSZ9031RNX
TABLE 3-5: ABSOLUTE DELAY FOR 5-BIT PAD SKEW SETTING
Pad Skew Value Delay (ns)
0_0000 –0.90
0_0001 –0.84
0_0010 –0.78
0_0011 –0.72
0_0100 –0.66
0_0101 –0.60
0_0110 –0.54
0_0111 –0.48
0_1000 –0.42
0_1001 –0.36
0_1010 –0.30
0_1011 –0.24
0_1100 –0.18
0_1101 –0.12
0_1110 –0.06
0_1111 No delay adjustment (default value)
1_0000 +0.06
1_0001 +0.12
1_0010 +0.18
1_0011 +0.24
1_0100 +0.30
1_0101 +0.36
1_0110 +0.42
1_0111 +0.48
1_1000 +0.54
1_1001 +0.60
1_1010 +0.66
1_1011 +0.72
1_1100 +0.78
1_1101 +0.84
1_1110 +0.90
1_1111 +0.96
KSZ9031RNX
DS00002117F-page 22 2016-2017 Microchip Technology Inc.
When computing the RGMII timing relationships, delays along the entire data path must be aggregated to determine the
total delay to be used for comparison between RGMII pins within their respective timing group. For the transmit data
path, total delay includes MAC output delay, MAC-to-PHY PCB routing delay, and PHY (KSZ9031RNX) input delay and
skew setting (if any). For the receive data path, the total delay includes PHY (KSZ9031RNX) output delay, PHY-to-MAC
PCB routing delay, and MAC input delay and skew setting (if any).
As the default, after power-up or reset, the KSZ9031RNX RGMII timing conforms to the timing requirements in the
RGMII Version 2.0 Specification for internal PHY chip delay.
For the transmit path (MAC to KSZ9031RNX), the KSZ9031RNX does not add any delay locally at its GTX_CLK, TX_EN
and TXD[3:0] input pins, and expects the GTX_CLK delay to be provided on-chip by the MAC. If MAC does not provide
any delay or insufficient delay for the GTX_CLK, the KSZ9031RNX has pad skew registers that can provide up to
1.38 ns on-chip delay.
For the receive path (KSZ9031RNX to MAC), the KSZ9031RNX adds 1.2ns typical delay to the RX_CLK output pin with
respect to RX_DV and RXD[3:0] output pins. If necessary, the KSZ9031RNX has pad skew registers that can adjust the
RX_CLK on-chip delay up to 2.58 ns from the 1.2 ns default delay.
The above default RGMII timings imply:
RX_CLK clock skew is set by the KSZ9031RNX default register settings.
GTX_CLK clock skew is provided by the MAC.
No PCB delay is required for GTX_CLK and RX_CLK clocks.
The following examples show how to read/write to MMD Address 2h, Register 8h for the RGMII GTX_CLK and RX_CLK
skew settings. MMD register access is through the direct portal Registers Dh and Eh. For more programming details,
refer to the MMD Registers section.
Read back value of MMD Address 2h, Register 8h.
- Write Register 0xD = 0x0002 // Select MMD Device Address 2h
- Write Register 0xE = 0x0008 // Select Register 8h of MMD Device Address 2h
- Write Register 0xD = 0x4002 // Select register data for MMD Device Address 2h, Register 8h
- Read Register 0xE // Read value of MMD Device Address 2h, Register 8h
TABLE 3-6: ABSOLUTE DELAY FOR 4-BIT PAD SKEW SETTING
Pad Skew Value Delay (ns)
0000 –0.42
0001 –0.36
0010 –0.30
0011 –0.24
0100 –0.18
0101 –0.12
0110 –0.06
0111 No delay adjustment (default value)
1000 +0.06
1001 +0.12
1010 +0.18
1011 +0.24
1100 +0.30
1101 +0.36
1110 +0.42
1111 +0.48
2016-2017 Microchip Technology Inc. DS00002117F-page 23
KSZ9031RNX
Write value 0x03FF (delay GTX_CLK and RX_CLK pad skews to their maximum values) to MMD Address 2h,
Register 8h
- Write Register 0xD = 0x0002 // Select MMD Device Address 2h
- Write Register 0xE = 0x0008 // Select Register 8h of MMD Device Address 2h
- Write Register 0xD = 0x4002 // Select register data for MMD Device Address 2h, Register 8h
- Write Register 0xE = 0x03FF // Write value 0x03FF to MMD Device Address 2h, Register 8h
3.9.4 RGMII IN-BAND STATUS
The KSZ9031RNX provides in-band status to the MAC during the inter-frame gap when RX_DV is de-asserted. RGMII
in-band status is always enabled after power-up.
The in-band status is sent to the MAC using the RXD[3:0] data pins, and is described in Ta b l e 3 - 7 .
3.10 MII Management (MIIM) Interface
The KSZ9031RNX supports the IEEE 802.3 MII management interface, also known as the Management Data Input/
Output (MDIO) interface. This interface allows upper-layer devices to monitor and control the state of the KSZ9031RNX.
An external device with MIIM capability is used to read the PHY status and/or configure the PHY settings. More details
about the MIIM interface can be found in Clause 22.2.4 of the IEEE 802.3 Specification.
The MIIM interface consists of the following:
A physical connection that incorporates the clock line (MDC) and the data line (MDIO).
A specific protocol that operates across the physical connection mentioned earlier, which allows an external con-
troller to communicate with one or more KSZ9031RNX devices. Each KSZ9031RNX device is assigned a unique
PHY address between 0h and 7h by the PHYAD[2:0] strapping pins.
A 32-register address space for direct access to IEEE-defined registers and vendor-specific registers, and for indi-
rect access to MMD addresses and registers. See the Register Map section.
PHY Address 0h is supported as the unique PHY address only; it is not supported as the broadcast PHY address, which
allows for a single write command to simultaneously program an identical PHY register for two or more PHY devices
(for example, using PHY Address 0h to set Register 0h to a value of 0x1940 to set Bit [11] to a value of one to enable
software power-down). Instead, separate write commands are used to program each PHY device.
Table 3-8 shows the MII management frame format for the KSZ9031RNX.
3.11 Interrupt (INT_N)
The INT_N pin is an optional interrupt signal that is used to inform the external controller that there has been a status
update in the KSZ9031RNX PHY register. Bits [15:8] of Register 1Bh are the interrupt control bits that enable and dis-
able the conditions for asserting the INT_N signal. Bits [7:0] of Register 1Bh are the interrupt status bits that indicate
which interrupt conditions have occurred. The interrupt status bits are cleared after reading Register 1Bh.
Bit [14] of Register 1Fh sets the interrupt level to active high or active low. The default is active low.
TABLE 3-7: RGMII IN-BAND STATUS
RX_DV RXD3 RXD[2:1] RXD0
0
(valid only when RX_DV is
low)
Duplex Status
0 = Half-duplex
1 = Full-duplex
RX_CLK clock speed
00 = 2.5 MHz (10 Mbps)
01 = 25 MHz (100 Mbps)
10 = 125 MHz (1000 Mbps)
11 = Reserved
Link Status
0 = Link down
1 = Link up
TABLE 3-8: MII MANAGEMENT FRAME FORMAT FOR THE KSZ9031RNX
Preamble Start of
Frame
Read/Write
OP Code
PHY
Address
Bits [4:0]
REG
Address
Bits [4:0]
TA Data Bits [15:0] Idle
Read 32 1’s 01 10 00AAA RRRRR Z0 DDDDDDDD_DDDDDDDD Z
Write 32 1’s 01 01 00AAA RRRRR 10 DDDDDDDD_DDDDDDDD Z
KSZ9031RNX
DS00002117F-page 24 2016-2017 Microchip Technology Inc.
The MII management bus option gives the MAC processor complete access to the KSZ9031RNX control and status
registers. Additionally, an interrupt pin eliminates the need for the processor to poll the PHY for status change.
3.12 LED Mode
The KSZ9031RNX provides two programmable LED output pins, LED2 and LED1, which are configurable to support
two LED modes. The LED mode is configured by the LED_MODE strap-in (Pin 41). It is latched at power-up/reset and
is defined as follows:
Pull-Up: Single-LED Mode
Pull-Down: Tri-Color Dual-LED Mode
Each LED output pin can directly drive an LED with a series resistor (typically 220 to 470).
3.12.1 SINGLE-LED MODE
In single-LED mode, the LED2 pin indicates the link status while the LED1 pin indicates the activity status, as shown in
Table 3-9.
3.12.2 TRI-COLOR DUAL-LED MODE
In tri-color dual-LED mode, the link and activity status are indicated by the LED2 pin for 1000BASE-T; by the LED1 pin
for 100BASE-TX; and by both LED2 and LED1 pins, working in conjunction, for 10BASE-T. This is summarized in
Table 3-10.
TABLE 3-9: SINGLE-LED MODE - PIN DEFINITION
LED Pin Pin State LED Definition Link/Activity
LED2 H OFF Link Off
L ON Link On (any speed)
LED1 H OFF No Activity
Toggle Blinking Activity (RX, TX)
TABLE 3-10: TRI-COLOR DUAL-LED MODE - PIN DEFINITION
LED Pin (State) LED Pin (Definition)
Link/Activity
LED2 LED1 LED2 LED1
H H OFF OFF Link Off
L H ON OFF 1000 Link/No Activity
Toggle H Blinking OFF 1000 Link/Activity (RX, TX)
H L OFF ON 100 Link/No Activity
H Toggle OFF Blinking 100 Link/Activity (RX, TX)
L L ON ON 10 Link/No Activity
Toggle Toggle Blinking Blinking 10 Link/Activity (RX, TX)
2016-2017 Microchip Technology Inc. DS00002117F-page 25
KSZ9031RNX
3.13 Loopback Mode
The KSZ9031RNX supports the following loopback operations to verify analog and/or digital data paths.
Local (digital) loopback
Remote (analog) loopback
3.13.1 LOCAL (DIGITAL) LOOPBACK
This loopback mode checks the RGMII transmit and receive data paths between KSZ9031RNX and external MAC, and
is supported for all three speeds (10/100/1000 Mbps) at full-duplex.
The loopback data path is shown in Figure 3-5.
1. RGMII MAC transmits frames to KSZ9031RNX.
2. Frames are wrapped around inside KSZ9031RNX.
3. KSZ9031RNX transmits frames back to RGMII MAC.
FIGURE 3-5: LOCAL (DIGITAL) LOOPBACK
The following programming steps and register settings are used for local loopback mode.
For 1000 Mbps loopback,
1. Set Register 0h,
- Bit [14] = 1 // Enable local loopback mode
- Bits [6, 13] = 10 // Select 1000 Mbps speed
- Bit [12] = 0 // Disable auto-negotiation
- Bit [8] = 1 // Select full-duplex mode
2. Set Register 9h,
- Bit [12] = 1 // Enable master-slave manual configuration
- Bit [11] = 0 // Select slave configuration (required for loopback mode)
For 10/100 Mbps loopback,
1. Set Register 0h,
- Bit [14] = 1 // Enable local loopback mode
- Bits [6, 13] = 00 / 01 // Select 10 Mbps/100 Mbps speed
- Bit [12] = 0 // Disable auto-negotiation
- Bit [8] = 1 // Select full-duplex mode
3.13.2 REMOTE (ANALOG) LOOPBACK
This loopback mode checks the line (differential pairs, transformer, RJ-45 connector, Ethernet cable) transmit and
receive data paths between KSZ9031RNX and its link partner, and is supported for 1000BASE-T full-duplex mode only.
The loopback data path is shown in Figure 3-6.
1. The Gigabit PHY link partner transmits frames to KSZ9031RNX.
2. Frames are wrapped around inside KSZ9031RNX.
3. KSZ9031RNX transmits frames back to the Gigabit PHY link partner.
PCS
(DIGITAL)
AFE
(ANALOG)
KSZ9031RNX
RGMII RGMII
MAC
KSZ9031RNX
DS00002117F-page 26 2016-2017 Microchip Technology Inc.
FIGURE 3-6: REMOTE (ANALOG) LOOPBACK
The following programming steps and register settings are used for remote loopback mode.
1. Set Register 0h,
- Bits [6, 13] = 10 // Select 1000 Mbps speed
- Bit [12] = 0 // Disable auto-negotiation
- Bit [8] = 1 // Select full-duplex mode
Or just auto-negotiate and link up at 1000BASE-T full-duplex mode with the link partner.
2. Set Register 11h,
- Bit [8] = 1 // Enable remote loopback mode
3.14 LinkMD® Cable Diagnostic
The LinkMD function uses Time Domain Reflectometry (TDR) to analyze the cabling plant for common cabling prob-
lems, such as open circuits, short circuits, and impedance mismatches.
LinkMD operates by sending a pulse of known amplitude and duration down the selected differential pair, then analyzing
the polarity and shape of the reflected signal to determine the type of fault: open circuit for a positive/non-inverted ampli-
tude reflection and short circuit for a negative/inverted amplitude reflection. The time duration for the reflected signal to
return provides the approximate distance to the cabling fault. The LinkMD function processes this TDR information and
presents it as a numerical value that can be translated to a cable distance.
LinkMD is initiated by accessing Register 12h, the LinkMD Cable Diagnostic register, in conjunction with Register 1Ch,
the Auto MDI/MDI-X register. The latter register is needed to disable the Auto MDI/MDI-X function before running the
LinkMD test. Additionally, a software reset (Reg. 0h, Bit [15] = 1) should be performed before and after running the
LinkMD test. The reset helps to ensure the KSZ9031RNX is in the normal operating state before and after the test.
3.15 NAND Tree Support
The KSZ9031RNX provides parametric NAND tree support for fault detection between chip I/Os and board. NAND tree
mode is enabled at power-up/reset with the MODE[3:0] strap-in pins set to ‘0100’. Ta b le 3 - 11 lists the NAND tree pin
order.
TABLE 3-11: NAND TREE TEST PIN ORDER FOR KSZ9031RNX
Pin Description
LED2 Input
LED1/PME_N1 Input
TXD0 Input
TXD1 Input
TXD2 Input
TXD3 Input
RJ-45
RJ-45
CAT-5
(UTP)
KSZ9031RNX
1000BASE-T
LINK PARTNER
AFE
(ANALOG)
PCS
(DIGITAL)
RGMII
2016-2017 Microchip Technology Inc. DS00002117F-page 27
KSZ9031RNX
3.16 Power Management
The KSZ9031RNX incorporates a number of power-management modes and features that provide methods to consume
less energy. These are discussed in the following sections.
3.16.1 ENERGY-DETECT POWER-DOWN MODE
Energy-detect power-down (EDPD) mode is used to further reduce the transceiver power consumption when the cable
is unplugged. It is enabled by writing a one to MMD Address 1Ch, Register 23h, Bit [0], and is in effect when auto-nego-
tiation mode is enabled and the cable is disconnected (no link).
In EDPD Mode, the KSZ9031RNX shuts down all transceiver blocks, except for the transmitter and energy detect cir-
cuits. Power can be reduced further by extending the time interval between the transmissions of link pulses to check for
the presence of a link partner. The periodic transmission of link pulses is needed to ensure the KSZ9031RNX and its
link partner, when operating in the same low-power state and with Auto MDI/MDI-X disabled, can wake up when the
cable is connected between them. By default, EDPD mode is disabled after power-up.
3.16.2 SOFTWARE POWER-DOWN MODE
This mode is used to power down the KSZ9031RNX device when it is not in use after power-up. Software power-down
(SPD) mode is enabled by writing a one to Register 0h, Bit [11]. In the SPD state, the KSZ9031RNX disables all internal
functions, except for the MII management interface. The KSZ9031RNX exits the SPD state after a zero is written to Reg-
ister 0h, Bit [11].
3.16.3 CHIP POWER-DOWN MODE
This mode provides the lowest power state for the KSZ9031RNX device when it is mounted on the board but not in use.
Chip power-down (CPD) mode is enabled after power-up/reset with the MODE[3:0] strap-in pins set to ‘0111’. The
KSZ9031RNX exits CPD mode after a hardware reset is applied to the RESET_N pin (Pin 42) with the MODE[3:0] strap-
in pins set to an operating mode other than CPD.
3.17 Wake-On-LAN
Wake-On-LAN (WOL) is normally a MAC-based function to wake up a host system (for example, an Ethernet end
device, such as a PC) that is in standby power mode. Wake-up is triggered by receiving and detecting a special packet
(commonly referred to as the “magic packet”) that is sent by the remote link partner. The KSZ9031RNX can perform the
same WOL function if the MAC address of its associated MAC device is entered into the KSZ9031RNX PHY registers
for magic-packet detection. When the KSZ9031RNX detects the magic packet, it wakes up the host by driving its power
management event (PME) output pin low.
By default, the WOL function is disabled. It is enabled by setting the enabling bit and configuring the associated registers
for the selected PME wake-up detection method.
The KSZ9031RNX provides three methods to trigger a PME wake-up:
Magic-packet detection
Customized-packet detection
Link status change detection
GTX_CLK Input
TX_EN Input
RX_DV Input
RX_CLK Input
INT_/PME_N2 Input
MDC Input
MDIO Input
CLK125_NDO Output
TABLE 3-11: NAND TREE TEST PIN ORDER FOR KSZ9031RNX (CONTINUED)
Pin Description
KSZ9031RNX
DS00002117F-page 28 2016-2017 Microchip Technology Inc.
3.17.1 MAGIC-PACKET DETECTION
The magic packet’s frame format starts with 6 bytes of 0xFFh and is followed by 16 repetitions of the MAC address of
its associated MAC device (local MAC device).
When the magic packet is detected from its link partner, the KSZ9031RNX asserts its PME output pin low.
The following MMD Address 2h registers are provided for magic-packet detection:
Magic-packet detection is enabled by writing a ‘1’ to MMD Address 2h, Register 10h, Bit [6]
The MAC address (for the local MAC device) is written to and stored in MMD Address 2h, Registers 11h – 13h
The KSZ9031RNX does not generate the magic packet. The magic packet must be provided by the external system.
3.17.2 CUSTOMIZED-PACKET DETECTION
The customized packet has associated register/bit masks to select which byte, or bytes, of the first 64 bytes of the packet
to use in the CRC calculation. After the KSZ9031RNX receives the packet from its link partner, the selected bytes for
the received packet are used to calculate the CRC. The calculated CRC is compared to the expected CRC value that
was previously written to and stored in the KSZ9031RNX PHY registers. If there is a match, the KSZ9031RNX asserts
its PME output pin low.
Four customized packets are provided to support four types of wake-up scenarios. A dedicated set of registers is used
to configure and enable each customized packet.
The following MMD registers are provided for customized-packet detection:
Each of the four customized packets is enabled via MMD Address 2h, Register 10h,
- Bit [2] // For customized packets, type 0
- Bit [3] // For customized packets, type 1
- Bit [4] // For customized packets, type 2
- Bit [5] // For customized packets, type 3
32-bit expected CRCs are written to and stored in:
- MMD Address 2h, Registers 14h – 15h // For customized packets, type 0
- MMD Address 2h, Registers 16h – 17h // For customized packets, type 1
- MMD Address 2h, Registers 18h – 19h // For customized packets, type 2
- MMD Address 2h, Registers 1Ah – 1Bh // For customized packets, type 3
Masks to indicate which of the first 64-bytes to use in the CRC calculation are set in:
- MMD Address 2h, Registers 1Ch – 1Fh // For customized packets, type 0
- MMD Address 2h, Registers 20h – 23h // For customized packets, type 1
- MMD Address 2h, Registers 24h – 27h // For customized packets, type 2
- MMD Address 2h, Registers 28h – 2Bh // For customized packets, type 3
2016-2017 Microchip Technology Inc. DS00002117F-page 29
KSZ9031RNX
3.17.3 LINK STATUS CHANGE DETECTION
If link status change detection is enabled, the KSZ9031RNX asserts its PME output pin low whenever there is a link
status change using the following MMD Address 2h registers bits and their enabled (1) or disabled (0) settings:
MMD Address 2h, Register 10h, Bit [0] // For link-up detection
MMD Address 2h, Register 10h, Bit [1] // For link-down detection
The PME output signal is available on either LED1/PME_N1 (Pin 17) or INT_N/PME_N2 (Pin 38), and is selected and
enabled using MMD Address 2h, Register 2h, Bits [8] and [10], respectively. Additionally, MMD Address 2h, Register
10h, Bits [15:14] defines the output functions for Pins 17 and 38.
The PME output is active low and requires a 1 k pull-up to the VDDIO supply. When asserted, the PME output is
cleared by disabling the register bit that enabled the PME trigger source (magic packet, customized packet, link status
change).
3.18 Typical Current/Power Consumption
Table 3-12, Table 3-13 , Table 3-14, and Tab l e 3 - 1 5 show the typical current consumption by the core (DVDDL, AVDDL,
AVDDL_PLL), transceiver (AVDDH), and digital I/O (DVDDH) supply pins, and the total typical power for the entire
KSZ9031RNX device for various nominal operating voltage combinations.
TABLE 3-12: TYPICAL CURRENT/POWER CONSUMPTION
TRANSCEIVER (3.3V), DIGITAL I/O (3.3V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
3.3V Transceiver
(AVDDH)
3.3V Digital I/O
(DVDDH)
Total
Chip Power
1000BASE-T Link-Up (no traffic) 210 mA 67.4 mA 19.5 mA 538 mW
1000BASE-T Full-Duplex at
100% Utilization
221 mA 66.3 mA 41.5 mA 621 mW
100BASE-TX Link-Up (no traffic) 63.6 mA 28.7 mA 13.9 mA 217 mW
100BASE-TX Full-Duplex at
100% Utilization
63.8 mA 28.6 mA 17.2 mA 228 mW
10BASE-T Link-Up (no traffic) 7.1 mA 15.9 mA 11.5 mA 99 mW
10BASE-T Full-Duplex at
100% Utilization
7.7 mA 28.6 mA 13.7 mA 149 mW
Software Power-Down Mode
(Reg. 0h.11 = 1)
1.0 mA 4.2 mA 9.3 mA 46 mW
TABLE 3-13: TYPICAL CURRENT/POWER CONSUMPTION
TRANSCEIVER (3.3V), DIGITAL I/O (1.8V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
3.3V Transceiver
(AVDDH)
1.8V Digital I/O
(DVDDH)
Total
Chip Power
1000BASE-T Link-Up (no traffic) 210 mA 67.4 mA 11.2 mA 494 mW
1000BASE-T Full-Duplex at
100% Utilization
221 mA 66.3 mA 23.6 mA 526 mW
100BASE-TX Link-Up (no traffic) 63.6 mA 28.7 mA 8.4 mA 186 mW
100BASE-TX Full-Duplex at
100% Utilization
63.8 mA 28.6 mA 9.8 mA 189 mW
10BASE-T Link-Up (no traffic) 7.1 mA 15.9 mA 3.6 mA 67 mW
10BASE-T Full-Duplex at
100% Utilization
7.7 mA 28.6 mA 5.6 mA 114 mW
Software Power-Down Mode
(Reg. 0h.11 = 1)
1.0 mA 4.2 mA 5.5 mA 25 mW
KSZ9031RNX
DS00002117F-page 30 2016-2017 Microchip Technology Inc.
Note 3-1 2.5V AVDDH is recommended for commercial temperature range (0°C to +70°C) operation only.
Note 3-2 2.5V AVDDH is recommended for commercial temperature range (0°C to +70°C) operation only.
TABLE 3-14: TYPICAL CURRENT/POWER CONSUMPTION
TRANSCEIVER (2.5V; Note 3-1), DIGITAL I/O (2.5V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
2.5V Transceiver
(AVDDH)
2.5V Digital I/O
(DVDDH)
Total
Chip Power
1000BASE-T Link-Up (no traffic) 210 mA 58.8 mA 14.7 mA 435 mW
1000BASE-T Full-Duplex at
100% Utilization
221 mA 57.9 mA 31.5 mA 488 mW
100BASE-TX Link-Up (no traffic) 63.6 mA 24.9 mA 10.5 mA 165 mW
100BASE-TX Full-Duplex at
100% Utilization
63.8 mA 24.9 mA 13.0 mA 171 mW
10BASE-T Link-Up (no traffic) 7.1 mA 11.5 mA 6.3 mA 53 mW
10BASE-T Full-Duplex at
100% Utilization
7.7 mA 25.3 mA 9.0 mA 95 mW
Software Power-Down Mode
(Reg. 0h.11 = 1)
1.0 mA 3.1 mA 6.7 mA 26 mW
TABLE 3-15: TYPICAL CURRENT/POWER CONSUMPTION
TRANSCEIVER (2.5V; Note 3-2), DIGITAL I/O (1.8V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
2.5V Transceiver
(AVDDH)
1.8V Digital I/O
(DVDDH)
Total
Chip Power
1000BASE-T Link-Up (no traffic) 210 mA 58.8 mA 11.2 mA 419 mW
1000BASE-T Full-Duplex at
100% Utilization
221 mA 57.9 mA 23.6 mA 452 mW
100BASE-TX Link-Up (no traffic) 63.6 mA 24.9 mA 8.4 mA 154 mW
100BASE-TX Full-Duplex at
100% Utilization
63.8 mA 24.9 mA 9.8 mA 156 mW
10BASE-T Link-Up (no traffic) 7.1 mA 11.5 mA 3.6 mA 44 mW
10BASE-T Full-Duplex at
100% Utilization
7.7 mA 25.3 mA 5.6 mA 83 mW
Software Power-Down Mode
(Reg. 0h.11 = 1)
1.0 mA 3.1 mA 5.5 mA 19 mW
2016-2017 Microchip Technology Inc. DS00002117F-page 31
KSZ9031RNX
4.0 REGISTER DESCRIPTIONS
This chapter describes the various control and status registers (CSRs).
4.1 Register Map
The register space within the KSZ9031RNX consists of two distinct areas.
Standard registers // Direct register access
MDIO Manageable device (MMD) registers // Indirect register access
The KSZ9031RNX supports the following standard registers.
The KSZ9031RNX supports the following MMD device addresses and their associated register addresses, which make
up the indirect MMD registers. These can be seen in Ta b l e 4 - 2 .
TABLE 4-1: STANDARD REGISTERS SUPPORTED BY KSZ9031RNX
Register Number (hex) Description
IEEE-Defined Registers
0h Basic Control
1h Basic Status
2h PHY Identifier 1
3h PHY Identifier 2
4h Auto-Negotiation Advertisement
5h Auto-Negotiation Link Partner Ability
6h Auto-Negotiation Expansion
7h Auto-Negotiation Next Page
8h Auto-Negotiation Link Partner Next Page Ability
9h 1000BASE-T Control
Ah 1000BASE-T Status
Bh - Ch Reserved
Dh MMD Access – Control
Eh MMD Access – Register/Data
Fh Extended Status
Vendor-Specific Registers
10h Reserved
11h Remote Loopback
12h LinkMD Cable Diagnostic
13h Digital PMA/PCS Status
14h Reserved
15h RXER Counter
16h - 1Ah Reserved
1Bh Interrupt Control/Status
1Ch Auto MDI/MDI-X
1Dh - 1Eh Reserved
1Fh PHY Control
KSZ9031RNX
DS00002117F-page 32 2016-2017 Microchip Technology Inc.
TABLE 4-2: MMD REGISTERS SUPPORTED BY KSZ9031RNX
Device Address (hex) Register Address (hex) Description
0h 3h AN FLP Burst Transmit – LO
4h AN FLP Burst Transmit – HI
1h 5Ah 1000BASE-T Link-Up Time Control
2h
0h Common Control
1h Strap Status
2h Operation Mode Strap Override
3h Operation Mode Strap Status
4h RGMII Control Signal Pad Skew
5h RGMII RX Data Pad Skew
6h RGMII TX Data Pad Skew
8h GMII Clock Pad Skew
10h Wake-On-LAN – Control
11h Wake-On-LAN – Magic Packet, MAC-DA-0
12h Wake-On-LAN – Magic Packet, MAC-DA-1
13h Wake-On-LAN – Magic Packet, MAC-DA-2
14h Wake-On-LAN – Customized Packet, Type 0, Expected
CRC 0
15h Wake-On-LAN – Customized Packet, Type 0, Expected
CRC 1
16h Wake-On-LAN – Customized Packet, Type 1, Expected
CRC 0
17h Wake-On-LAN – Customized Packet, Type 1, Expected
CRC 1
18h Wake-On-LAN – Customized Packet, Type 2, Expected
CRC 0
19h Wake-On-LAN – Customized Packet, Type 2, Expected
CRC 1
1Ah Wake-On-LAN – Customized Packet, Type 3, Expected
CRC 0
1Bh Wake-On-LAN – Customized Packet, Type 3, Expected
CRC 1
1Ch Wake-On-LAN – Customized Packet, Type 0, Mask 0
1Dh Wake-On-LAN – Customized Packet, Type 0, Mask 1
1Eh Wake-On-LAN – Customized Packet, Type 0, Mask 2
1Fh Wake-On-LAN – Customized Packet, Type 0, Mask 3
20h Wake-On-LAN – Customized Packet, Type 1, Mask 0
21h Wake-On-LAN – Customized Packet, Type 1, Mask 1
22h Wake-On-LAN – Customized Packet, Type 1, Mask 2
23h Wake-On-LAN – Customized Packet, Type 1, Mask 3
2016-2017 Microchip Technology Inc. DS00002117F-page 33
KSZ9031RNX
4.2 Standard Registers
Standard registers provide direct read/write access to a 32-register address space, as defined in Clause 22 of the IEEE
802.3 Specification. Within this address space, the first 16 registers (Registers 0h to Fh) are defined according to the
IEEE specification, while the remaining 16 registers (Registers 10h to 1Fh) are defined specific to the PHY vendor.
2h
24h Wake-On-LAN – Customized Packet, Type 2, Mask 0
25h Wake-On-LAN – Customized Packet, Type 2, Mask 1
26h Wake-On-LAN – Customized Packet, Type 2, Mask 2
27h Wake-On-LAN – Customized Packet, Type 2, Mask 3
28h Wake-On-LAN – Customized Packet, Type 3, Mask 0
29h Wake-On-LAN – Customized Packet, Type 3, Mask 1
2Ah Wake-On-LAN – Customized Packet, Type 3, Mask 2
2Bh Wake-On-LAN – Customized Packet, Type 3, Mask 3
1Ch 4h Analog Control 4
23h EDPD Control
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS
Address Name Description Mode
Note 4-1 Default
Register 0h – Basic Control
0.15 Reset 1 = Software PHY reset
0 = Normal operation
This bit is self-cleared after a ‘1’ is written to it.
RW/SC 0
0.14 Loopback 1 = Loopback mode
0 = Normal operation
RW 0
0.13 Speed Select
(LSB)
[0.6, 0.13]
[1,1] = Reserved
[1,0] = 1000 Mbps
[0,1] = 100 Mbps
[0,0] = 10 Mbps
This bit is ignored if auto-negotiation is enabled
(Reg. 0.12 = 1).
RW 0
0.12 Auto-Negoti-
ation Enable
1 = Enable auto-negotiation process
0 = Disable auto-negotiation process
If enabled, auto-negotiation result overrides set-
tings in Reg. 0.13, 0.8 and 0.6.
If disabled, Auto MDI-X is also automatically dis-
abled. Use Register 1Ch to set MDI/MDI-X.
RW 1
0.11 Power-Down 1 = Power-down mode
0 = Normal operation
When this bit is set to ‘1’, the link-down status
might not get updated in the PHY register. Software
should note link is down and should not rely on the
PHY register link status.
After this bit is changed from ‘1’ to ‘0’, an internal
global reset is automatically generated. Wait a min-
imum of 1 ms before read/write access to the PHY
registers.
RW 0
TABLE 4-2: MMD REGISTERS SUPPORTED BY KSZ9031RNX (CONTINUED)
Device Address (hex) Register Address (hex) Description
KSZ9031RNX
DS00002117F-page 34 2016-2017 Microchip Technology Inc.
0.10 Isolate 1 = Electrical isolation of PHY from RGMII
0 = Normal operation
RW 0
0.9 Restart Auto-
Negotiation
1 = Restart auto-negotiation process
0 = Normal operation
This bit is self-cleared after a ‘1’ is written to it.
RW/SC 0
0.8 Duplex Mode 1 = Full-duplex
0 = Half-duplex
RW 1
0.7 Reserved Reserved RW 0
0.6 Speed Select
(MSB)
[0.6, 0.13]
[1,1] = Reserved
[1,0] = 1000 Mbps
[0,1] = 100 Mbps
[0,0] = 10 Mbps
This bit is ignored if auto-negotiation is enabled
(Reg. 0.12 = 1).
RW Set by MODE[3:0]
strapping pins.
See the Strap-In
Options -
KSZ9031RNX
section for details.
0.5:0 Reserved Reserved RO 00_0000
Register 1h - Basic Status
1.15 100BASE-T4 1 = T4 capable
0 = Not T4 capable
RO 0
1.14 100BASE-TX
Full-Duplex
1 = Capable of 100 Mbps full-duplex
0 = Not capable of 100 Mbps full-duplex
RO 1
1.13 100BASE-TX
Half-Duplex
1 = Capable of 100 Mbps half-duplex
0 = Not capable of 100 Mbps half-duplex
RO 1
1.12 10BASE-T
Full-Duplex
1 = Capable of 10 Mbps full-duplex
0 = Not capable of 10 Mbps full-duplex
RO 1
1.11 10BASE-T
Half-Duplex
1 = Capable of 10 Mbps half-duplex
0 = Not capable of 10 Mbps half-duplex
RO 1
1.10:9 Reserved Reserved RO 00
1.8 Extended
Status
1 = Extended status info in Reg. 15h.
0 = No extended status info in Reg. 15h.
RO 1
1.7 Reserved Reserved RO 0
1.6 No Preamble 1 = Preamble suppression
0 = Normal preamble
RO 1
1.5 Auto-Negoti-
ation Com-
plete
1 = Auto-negotiation process completed
0 = Auto-negotiation process not completed
RO 0
1.4 Remote Fault 1 = Remote fault
0 = No remote fault
RO/LH 0
1.3 Auto-Negoti-
ation Ability
1 = Can perform auto-negotiation
0 = Cannot perform auto-negotiation
RO 1
1.2 Link Status 1 = Link is up
0 = Link is down
RO/LL 0
1.1 Jabber
Detect
1 = Jabber detected
0 = Jabber not detected (default is low)
RO/LH 0
1.0 Extended
Capability
1 = Supports extended capability registers RO 1
Register 2h - PHY Identifier 1
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 35
KSZ9031RNX
2.15:0 PHY ID
Number
Assigned to Bits [3:18] of the organizationally
unique identifier (OUI). KENDIN Communication’s
OUI is 0010A1h.
RO 0022h
Register 3h - PHY Identifier 2
3.15:10 PHY ID
Number
Assigned to Bits [19:24] of the organizationally
unique identifier (OUI). KENDIN Communication’s
OUI is 0010A1h.
RO 0001_01
3.9:4 Model
Number
Six-bit manufacturer’s model number RO 10_0010
3.3:0 Revision
Number
Four-bit manufacturer’s revision number RO Indicates silicon
revision
Register 4h - Auto-Negotiation Advertisement
4.15 Next Page 1 = Next page capable
0 = No next page capability
RW 0
4.14 Reserved Reserved RO 0
4.13 Remote Fault 1 = Remote fault supported
0 = No remote fault
RW 0
4.12 Reserved Reserved RO 0
4.11:10 Pause [4.11, 4.10]
[0,0] = No pause
[1,0] = Asymmetric pause (link partner)
[0,1] = Symmetric pause
[1,1] = Symmetric and asymmetric pause (local
device)
RW 00
4.9 100BASE-T4 1 = T4 capable
0 = No T4 capability
RO 0
4.8 100BASE-TX
Full-Duplex
1 = 100 Mbps full-duplex capable
0 = No 100 Mbps full-duplex capability
RW 1
4.7 100BASE-TX
Half-Duplex
1 = 100 Mbps half-duplex capable
0 = No 100 Mbps half-duplex capability
RW 1
4.6 10BASE-T
Full-Duplex
1 = 10 Mbps full-duplex capable
0 = No 10 Mbps full-duplex capability
RW 1
4.5 10BASE-T
Half-Duplex
1 = 10 Mbps half-duplex capable
0 = No 10 Mbps half-duplex capability
RW 1
4.4:0 Selector
Field
[00001] = IEEE 802.3 RW 0_0001
Register 5h - Auto-Negotiation Link Partner Ability
5.15 Next Page 1 = Next page capable
0 = No next page capability
RO 0
5.14 Acknowledge 1 = Link code word received from partner
0 = Link code word not yet received
RO 0
5.13 Remote Fault 1 = Remote fault detected
0 = No remote fault
RO 0
5.12 Reserved Reserved RO 0
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 36 2016-2017 Microchip Technology Inc.
5.11:10 Pause [5.11, 5.10]
[0,0] = No pause
[1,0] = Asymmetric Pause (link partner)
[0,1] = Symmetric pause
[1,1] = Symmetric and asymmetric pause (local
device)
RW 00
5.9 100BASE-T4 1 = T4 capable
0 = No T4 capability
RO 0
5.8 100BASE-TX
Full-Duplex
1 = 100 Mbps full-duplex capable
0 = No 100 Mbps full-duplex capability
RO 0
5.7 100BASE-TX
Half-Duplex
1 = 100 Mbps half-duplex capable
0 = No 100 Mbps half-duplex capability
RO 0
5.6 10BASE-T
Full-Duplex
1 = 10 Mbps full-duplex capable
0 = No 10 Mbps full-duplex capability
RO 0
5.5 10BASE-T
Half-Duplex
1 = 10 Mbps half-duplex capable
0 = No 10 Mbps half-duplex capability
RO 0
5.4:0 Selector
Field
[00001] = IEEE 802.3 RO 0_0000
Register 6h - Auto-Negotiation Expansion
6.15:5 Reserved Reserved RO 0000_0000_000
6.4 Parallel
Detection
Fault
1 = Fault detected by parallel detection
0 = No fault detected by parallel detection
RO/LH 0
6.3 Link Partner
Next Page
Able
1 = Link partner has next page capability
0 = Link partner does not have next page capability
RO 0
6.2 Next Page
Able
1 = Local device has next page capability
0 = Local device does not have next page capabil-
ity
RO 1
6.1 Page
Received
1 = New page received
0 = New page not received
RO/LH 0
6.0 Link Partner
Auto-Negoti-
ation Able
1 = Link partner has auto-negotiation capability
0 = Link partner does not have auto-negotiation
capability
RO 0
Register 7h - Auto-Negotiation Next Page
7.15 Next Page 1 = Additional next pages will follow
0 = Last page
RW 0
7.14 Reserved Reserved RO 0
7.13 Message
Page
1 = Message page
0 = Unformatted page
RW 1
7.12 Acknowl-
edge2
1 = Will comply with message
0 = Cannot comply with message
RW 0
7.11 Toggle 1 = Previous value of the transmitted link code
word equaled logic one
0 = Logic zero
RO 0
7.10:0 Message
Field
11-bit wide field to encode 2048 messages RW 000_0000_0001
Register 8h - Link Partner Next Page Ability
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 37
KSZ9031RNX
8.15 Next Page 1 = Additional next pages will follow
0 = Last page
RO 0
8.14 Acknowledge 1 = Successful receipt of link word
0 = No successful receipt of link word
RO 0
8.13 Message
Page
1 = Message page
0 = Unformatted page
RO 0
8.12 Acknowl-
edge2
1 = Able to act on the information
0 = Not able to act on the information
RO 0
8.11 Toggle 1 = Previous value of transmitted link code word
equal to logic zero
0 = Previous value of transmitted link code word
equal to logic one
RO 0
8.10:0 Message
Field
RO 000_0000_0000
Register 9h – 1000BASE-T Control
9.15:13 Test Mode
Bits
Transmitter test mode operations
[9.15:13] Mode
[000] Normal operation
[001] Test mode 1 –Transmit waveform test
[010] Test mode 2 –Transmit jitter test in master
mode
[011] Test mode 3 –Transmit jitter test in slave
mode
[100] Test mode 4 –Transmitter distortion test
[101] Reserved, operations not identified
[110] Reserved, operations not identified
[111] Reserved, operations not identified
To enable 1000BASE-T Test Mode:
1) Set Register 0h = 0x0140 to disable auto-negoti-
ation and select 1000 Mbps speed.
2) Set Register 9h, bits [15:13] = 001, 010, 011, or
100 to select one of the 1000BASE-T Test Modes.
After the above settings, the test waveform for the
selected test mode is transmitted onto each of the
4 differential pairs. No link partner is needed.
RW 000
9.12 Master-Slave
Manual Con-
figuration
Enable
1 = Enable master-slave manual configuration
value
0 = Disable master-slave manual configuration
value
RW 0
9.11 Master-Slave
Manual Con-
figuration
Value
1 = Configure PHY as master during master-slave
negotiation
0 = Configure PHY as slave during master-slave
negotiation
This bit is ignored if master-slave manual configu-
ration is disabled (Reg. 9.12 = 0).
RW 0
9.10 Port Type 1 = Indicate the preference to operate as multi-port
device (master)
0 = Indicate the preference to operate as single-
port device (slave)
This bit is valid only if master-slave manual config-
uration is disabled (Reg. 9.12 = 0).
RW 0
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 38 2016-2017 Microchip Technology Inc.
9.9 1000BASE-T
Full-Duplex
1 = Advertise PHY is 1000BASE-T full-duplex
capable
0 = Advertise PHY is not 1000BASE-T full-duplex
capable
RW 1
9.8 1000BASE-T
Half-Duplex
1 = Advertise PHY is 1000BASE-T half-duplex
capable
0 = Advertise PHY is not 1000BASE-T half-duplex
capable
RW Set by MODE[3:0]
strapping pins.
See the Strap-In
Options -
KSZ9031RNX
section for details.
9.7:0 Reserved Write as 0, ignore on read RO
Register Ah – 1000BASE-T Status
A.15 Master-Slave
Configura-
tion Fault
1 = Master-slave configuration fault detected
0 = No master-slave configuration fault detected
RO/LH/SC 0
A.14 Master-Slave
Configura-
tion Resolu-
tion
1 = Local PHY configuration resolved to master
0 = Local PHY configuration resolved to slave
RO 0
A.13 Local
Receiver
Status
1 = Local receiver OK (loc_rcvr_status = 1)
0 = Local receiver not OK (loc_rcvr_status = 0)
RO 0
A.12 Remote
Receiver
Status
1 = Remote receiver OK (rem_rcvr_status = 1)
0 = Remote receiver not OK (rem_rcvr_status = 0)
RO 0
A.11 Link Partner
1000BASE-T
Full-Duplex
Capability
1 = Link partner is capable of 1000BASE-T full-
duplex
0 = Link partner is not capable of 1000BASE-T
full-duplex
RO 0
A.10 Link Partner
1000BASE-T
Half-Duplex
Capability
1 = Link partner is capable of 1000BASE-T half-
duplex
0 = Link Partner is not capable of 1000BASE-T
half-duplex
RO 0
A.9:8 Reserved Reserved RO 00
A.7:0 Idle Error
Count
Cumulative count of errors detected when receiver
is receiving idles and PMA_TXMODE.indicate =
SEND_N.
The counter is incremented every symbol period
that rxerror_status = ERROR.
RO/SC 0000_0000
Register Dh - MMD Access – Control
D.15:14 MMD –
Operation
Mode
For the selected MMD device address (Bits [4:0] of
this register), these two bits select one of the fol-
lowing register or data operations and the usage
for MMD Access – Register/Data (Reg. Eh).
00 = Register
01 = Data, no post increment
10 = Data, post increment on reads and writes
11 = Data, post increment on writes only
RW 00
D.13:5 Reserved Reserved RW 00_0000_000
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 39
KSZ9031RNX
Note 4-1 RW = Read/Write; RO = Read Only; SC = Self-Cleared; LH = Latch High; LL = Latch Low.
D.4:0 MMD –
Device
Address
These five bits set the MMD device address. RW 0_0000
Register Eh - MMD Access – Register/Data
E.15:0 MMD –
Register/
Data
For the selected MMD device address (Reg. Dh,
Bits [4:0]),
When Reg. Dh, Bits [15:14] = 00, this register
contains the read/write register address for the
MMD device address.
Otherwise, this register contains the read/write
data value for the MMD device address and its
selected register address.
See also Reg. Dh, Bits [15:14], for descriptions of
post increment reads and writes of this register for
data operation.
RW 0000_0000_0000_00
00
Register Fh – Extended Status
F.15 1000BASE-X
Full-Duplex
1 = PHY can perform 1000BASE-X full-duplex
0 = PHY cannot perform 1000BASE-X full-duplex
RO 0
F.14 1000BASE-X
Half-Duplex
1 = PHY can perform 1000BASE-X half-duplex
0 = PHY cannot perform 1000BASE-X half-duplex
RO 0
F.13 1000BASE-T
Full-Duplex
1 = PHY can perform 1000BASE-T full-duplex
0 = PHY cannot perform 1000BASE-T full-duplex
RO 1
F.12 1000BASE-T
Half-Duplex
1 = PHY can perform 1000BASE-T half-duplex
0 = PHY cannot perform 1000BASE-T half-duplex
RO 1
F.11:0 Reserved Ignore when read RO
TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS
Address Name Description Mode
Note 4-1 Default
Register 11h – Remote Loopback
11.15:9 Reserved Reserved RW 0000_000
11.8 Remote
Loopback
1 = Enable remote loopback
0 = Disable remote loopback
RW 0
11.7:1 Reserved Reserved RW 1111_010
11.0 Reserved Reserved RO 0
Register 12h – LinkMD – Cable Diagnostic
12.15 Cable
Diagnostic
Test Enable
Write value:
1 = Enable cable diagnostic test. After test has
completed, this bit is self-cleared.
0 = Disable cable diagnostic test.
Read value:
1 = Cable diagnostic test is in progress.
0 = Indicates cable diagnostic test (if enabled) has
completed and the status information is valid for
read.
RW/SC 0
12.14 Reserved This bit should always be set to ‘0’. RW 0
TABLE 4-3: IEEE-DEFINED REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 40 2016-2017 Microchip Technology Inc.
12.13:12 Cable
Diagnostic
Test Pair
These two bits select the differential pair for testing:
00 = Differential pair A (Pins 2, 3)
01 = Differential pair B (Pins 5, 6)
10 = Differential pair C (Pins 7, 8)
11 = Differential pair D (Pins 10, 11)
RW 00
12.11:10 Reserved These two bits should always be set to ‘00’. RW 00
12.9:8 Cable
Diagnostic
Status
These two bits represent the test result for the
selected differential pair in Bits [13:12] of this regis-
ter.
00 = Normal cable condition (no fault detected)
01 = Open cable fault detected
10 = Short cable fault detected
11 = Reserved
RO 00
12.7:0 Cable
Diagnostic
Fault Data
For the open or short cable fault detected in Bits
[9:8] of this register, this 8-bit value represents the
distance to the cable fault.
RO 0000_0000
Register 13h – Digital PMA/PCS Status
13.15:3 Reserved Reserved RO/LH 0000_0000_0000_0
13.2 1000BASE-T
Link Status
1000BASE-T link status
1 = Link status is OK
0 = Link status is not OK
RO 0
13.1 100BASE-TX
Link Status
100BASE-TX link status
1 = Link status is OK
0 = Link status is not OK
RO 0
13.0 Reserved Reserved RO 0
Register 15h – RXER Counter
15.15:0 RXER
Counter
Receive error counter for symbol error frames RO/RC 0000_0000_0000_00
00
Register 1Bh – Interrupt Control/Status
1B.15 Jabber Inter-
rupt Enable
1 = Enable jabber interrupt
0 = Disable jabber interrupt
RW 0
1B.14 Receive
Error Inter-
rupt Enable
1 = Enable receive error interrupt
0 = Disable receive error interrupt
RW 0
1B.13 Page
Received
Interrupt
Enable
1 = Enable page received interrupt
0 = Disable page received interrupt
RW 0
1B.12 Parallel
Detect Fault
Interrupt
Enable
1 = Enable parallel detect fault interrupt
0 = Disable parallel detect fault interrupt
RW 0
1B.11 Link Partner
Acknowl-
edge Inter-
rupt Enable
1 = Enable link partner acknowledge interrupt
0 = Disable link partner acknowledge interrupt
RW 0
1B.10 Link-Down
Interrupt
Enable
1 = Enable link-down interrupt
0 = Disable link-down interrupt
RW 0
TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 41
KSZ9031RNX
1B.9 Remote Fault
Interrupt
Enable
1 = Enable remote fault interrupt
0 = Disable remote fault interrupt
RW 0
1B.8 Link-Up
Interrupt
Enable
1 = Enable link-up interrupt
0 = Disable link-up interrupt
RW 0
1B.7 Jabber Inter-
rupt
1 = Jabber occurred
0 = Jabber did not occur
RO/RC 0
1B.6 Receive
Error Inter-
rupt
1 = Receive error occurred
0 = Receive error did not occur
RO/RC 0
1B.5 Page
Receive
Interrupt
1 = Page receive occurred
0 = Page receive did not occur
RO/RC 0
1B.4 Parallel
Detect Fault
Interrupt
1 = Parallel detect fault occurred
0 = Parallel detect fault did not occur
RO/RC 0
1B.3 Link Partner
Acknowl-
edge Inter-
rupt
1 = Link partner acknowledge occurred
0 = Link partner acknowledge did not occur
RO/RC 0
1B.2 Link-Down
Interrupt
1 = Link-down occurred
0 = Link-down did not occur
RO/RC 0
1B.1 Remote Fault
Interrupt
1 = Remote fault occurred
0 = Remote fault did not occur
RO/RC 0
1B.0 Link-Up
Interrupt
1 = Link-up occurred
0 = Link-up did not occur
RO/RC 0
Register 1Ch – Auto MDI/MDI-X
1C.15:8 Reserved Reserved RW 0000_0000
1C.7 MDI Set When Swap-Off (Bit [6] of this register) is asserted
(1),
1 = PHY is set to operate as MDI mode
0 = PHY is set to operate as MDI-X mode
This bit has no function when Swap-Off is
de-asserted (0).
RW 0
1C.6 Swap-Off 1 = Disable Auto MDI/MDI-X function
0 = Enable Auto MDI/MDI-X function
RW 0
1C.5:0 Reserved Reserved RW 00_0000
Register 1Fh – PHY Control
1F.15 Reserved Reserved RW 0
1F.14 Interrupt
Level
1 = Interrupt pin active high
0 = Interrupt pin active low
RW 0
1F.13:12 Reserved Reserved RW 00
1F.11:10 Reserved Reserved RO/LH/RC 00
1F.9 Enable
Jabber
1 = Enable jabber counter
0 = Disable jabber counter
RW 1
1F.8:7 Reserved Reserved RW 00
TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 42 2016-2017 Microchip Technology Inc.
Note 4-1 RW = Read/Write; RO = Read Only; SC = Self-Cleared; RC = Read-Cleared; LH = Latch High.
1F.6 Speed
Status
1000BASE-T
1 = Indicate chip final speed status at 1000BASE-T RO 0
1F.5 Speed
Status
100BASE-TX
1 = Indicate chip final speed status at 100BASE-TX RO 0
1F.4 Speed
Status
10BASE-T
1 = Indicate chip final speed status at 10BASE-T RO 0
1F.3 Duplex
Status
Indicate chip duplex status
1 = Full-duplex
0 = Half-duplex
RO 0
1F.2 1000BASE-T
Master/Slave
Status
Indicate chip master/slave status
1 = 1000BASE-T master mode
0 = 1000BASE-T slave mode
RO 0
1F.1 Reserved Reserved RW 0
1F.0 Link Status
Check Fail
1 = Fail
0 = Not failing
RO 0
TABLE 4-4: VENDOR-SPECIFIC REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 43
KSZ9031RNX
4.3 MMD Registers
MMD registers provide indirect read/write access to up to 32 MMD device addresses with each device supporting up to
65,536 16-bit registers, as defined in Clause 22 of the IEEE 802.3 Specification. The KSZ9031RNX, however, uses only
a small fraction of the available registers. See the Register Map section for a list of supported MMD device addresses
and their associated register addresses.
The following two standard registers serve as the portal registers to access the indirect MMD registers.
Standard register Dh – MMD Access – Control
Standard register Eh – MMD Access – Register/Data
Note 4-1 RW = Read/Write.
Examples:
MMD Register Write
Write MMD - Device Address 2h, Register 10h = 0001h to enable link-up detection to trigger PME for WOL.
1. Write Register Dh with 0002h // Set up register address for MMD – Device Address 2h.
2. Write Register Eh with 0010h // Select Register 10h of MMD – Device Address 2h.
3. Write Register Dh with 4002h // Select register data for MMD – Device Address 2h, Register 10h.
4. Write Register Eh with 0001h // Write value 0001h to MMD – Device Address 2h, Register 10h.
MMD Register Read
Read MMD - Device Address 2h, Register 11h – 13h for the magic packet’s MAC address.
1. Write Register Dh with 0002h // Set up register address for MMD – Device Address 2h.
2. Write Register Eh with 0011h // Select Register 11h of MMD – Device Address 2h.
3. Write Register Dh with 8002h // Select register data for MMD – Device Address 2h, Register 11h.
4. Read Register Eh // Read data in MMD – Device Address 2h, Register 11h.
5. Read Register Eh // Read data in MMD – Device Address 2h, Register 12h.
6. Read Register Eh // Read data in MMD – Device Address 2h, Register 13h.
TABLE 4-5: MMD PORTAL REGISTERS
Address Name Description Mode
Note 4-1 Default
Register Dh - MMD Access – Control
D.15:14 MMD -
Operation
Mode
For the selected MMD device address (Bits [4:0] of
this register), these two bits select one of the fol-
lowing register or data operations and the usage
for MMD Access – Register/Data (Reg. Eh).
00 = Register
01 = Data, no post increment
10 = Data, post increment on reads and writes
11 = Data, post increment on writes only
RW 00
D.13:5 Reserved Reserved RW 00_0000_000
D.4:0 MMD –
Device
Address
These five bits set the MMD device address RW 0_0000
Register Eh - MMD Access – Register/Data
E.15:0 MMD –
Register/
Data
For the selected MMD device address (Reg. Dh,
Bits [4:0]),
When Reg. Dh, Bits [15:14] = 00, this register
contains the read/write register address for the
MMD device address.
Otherwise, this register contains the read/write
data value for the MMD device address and its
selected register address.
See also Register Dh, Bits [15:14] descriptions for
post increment reads and writes of this register for
data operation.
RW 0000_0000_
0000_0000
KSZ9031RNX
DS00002117F-page 44 2016-2017 Microchip Technology Inc.
TABLE 4-6: MMD REGISTER DESCRIPTIONS
Address Name Description Mode
Note 4-1 Default
MMD Address 0h, Register 3h – AN FLP Burst Transmit – LO
0.3.15:0 AN FLP
Burst Trans-
mit – LO
This register and the following register set the
Auto-Negotiation FLP burst transmit timing. The
same timing must be set for both registers.
0x4000 = Select 8 ms interval timing (default)
0x1A80 = Select 16 ms interval timing
All other values are reserved.
RW 0x4000
MMD Address 0h, Register 4h – AN FLP Burst Transmit – HI
0.4.15:0 AN FLP
Burst Trans-
mit – HI
This register and the previous register set the Auto-
Negotiation FLP burst transmit timing. The same
timing must be set for both registers.
0x0003 = Select 8 ms interval timing (default)
0x0006 = Select 16 ms interval timing
All other values are reserved.
RW 0x0003
MMD Address 1h, Register 5Ah – 1000BASE-T Link-Up Time Control
1.5A.8:4 Reserved Reserved RW 1_0000
1.5A.3:1 1000BASE-T
Link-Up Time
When the link partner is another KSZ9031 device,
the 1000BASE-T link-up time can be long. These
three bits provide an optional setting to reduce the
1000BASE-T link-up time.
100 = Default power-up setting
011 = Optional setting to reduce link-up time when
the link partner is a KSZ9031 device.
All other settings are reserved and should not be
used.
The optional setting is safe to use with any link
partner.
Note: Read/Write access to this register bit is avail-
able only when Reg. 0h is set to 0x2100 to disable
auto-negotiation and force 100BASE-TX mode.
RW 100
1.5A.0 Reserved Reserved RW 0
MMD Address 2h, Register 0h – Common Control
2.0.15:5 Reserved Reserved RW 0000_0000_000
2.0.4 LED Mode
Override
Override strap-in for LED_MODE
1 = Single-LED mode
0 = Tri-color dual-LED mode
This bit is write-only and always reads back a value
of ‘0’. The updated value is reflected in Bit [3] of
this register.
WO 0
2.0.3 LED Mode LED_MODE Status
1 = Single-LED mode
0 = Tri-color dual-LED mode
RO Set by LED_MODE
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
Can be updated by
Bit [4] of this register
after reset.
2.0.2 Reserved Reserved RW 0
2016-2017 Microchip Technology Inc. DS00002117F-page 45
KSZ9031RNX
2.0.1 CLK125_EN
Status
Override strap-in for CLK125_EN
1 = CLK125_EN strap-in is enabled
0 = CLK125_EN strap-in is disabled
RW Set by CLK125_EN
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.0.0 Reserved Reserved RW 0
MMD Address 2h, Register 1h – Strap Status
2.1.15:8 Reserved Reserved RO 0000_0000
2.1.7 LED_MODE
Strap-In
Status
Strap to
1 = Single-LED mode
0 = Tri-color dual-LED mode
RO Set by LED_MODE
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.1.6 Reserved Reserved RO 0
2.1.5 CLK125_EN
Strap-In
Status
Strap to
1 = CLK125_EN strap-in is enabled
0 = CLK125_EN strap-in is disabled
RO Set by CLK125_EN
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.1.4:3 Reserved Reserved RO 00
2.1.2:0 PHYAD[2:0]
Strap-In
Value
Strap-in value for PHY address
Bits [4:3] of PHY address are always set to ‘00’.
RO Set by PHYAD[2:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
MMD Address 2h, Register 2h – Operation Mode Strap Override
2.2.15 RGMII All
Capabilities
Override
1 = Override strap-in for RGMII to advertise all
capabilities
RW
Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.2.14 RGMII No
1000BT_HD
Override
1 = Override strap-in for RGMII to advertise all
capabilities except 1000BASE-T half-duplex
RW
2.2.13 RGMII
1000BT_H/
FD Only
Override
1 = Override strap-in for RGMII to advertise
1000BASE-T full- and half-duplex only
RW
2.2.12 RGMII
1000BT_FD
Only Over-
ride
1 = Override strap-in for RGMII to advertise
1000BASE-T full-duplex only
RW
2.2.11 Reserved Reserved RW 0
2.2.10 PME_N2
Output
Enable
For INT_N/PME_N2 (Pin 38),
1 = Enable PME output
0 = Disable PME output
This bit works in conjunction with MMD Address
2h, Reg. 10h, Bits [15:14] to define the output for
Pin 38.
RW 0
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 46 2016-2017 Microchip Technology Inc.
2.2.9 Reserved Reserved RW 0
2.2.8 PME_N1
Output
Enable
For LED1/PME_N1 (Pin 17),
1 = Enable PME output
0 = Disable PME output
This bit works in conjunction with MMD Address
2h, Reg. 10h, Bits [15:14] to define the output for
Pin 17.
RW 0
2.2.7 Chip Power-
Down
Override
1 = Override strap-in for chip power-down mode RW Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.2.6:5 Reserved Reserved RW 00
2.2.4 NAND Tree
Override
1 = Override strap-in for NAND Tree mode RW Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.2.3:0 Reserved Reserved RW 0000
MMD Address 2h, Register 3h – Operation Mode Strap Status
2.3.15 RGMII All
Capabilities
Strap-In
Status
1 = Strap to RGMII to advertise all capabilities RO
Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.3.14 RGMII No
1000BT_HD
Strap-In
Status
1 = Strap to RGMII to advertise all capabilities
except 1000BASE-T half-duplex
RO
2.3.13 RGMII Only
1000BT_H/
FD Strap-In
Status
1 = Strap to RGMII to advertise 1000BASE-T full-
and half-duplex only
RO
2.3.12 RGMII Only
1000BT_FD
Strap-In
Status
1 = Strap to RGMII to advertise 1000BASE-T full-
duplex only
RO
2.3.11:8 Reserved Reserved RO 0000
2.3.7 Chip Power-
Down Strap-
In Status
1 = Strap to chip power-down mode RO Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.3.6:5 Reserved Reserved RO 00
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 47
KSZ9031RNX
2.3.4 NAND Tree
Strap-In
Status
1 = Strap to NAND Tree mode RO Set by MODE[3:0]
strapping pin.
See the Strap-In
Options -
KSZ9031RNX
section for details.
2.3.3:0 Reserved Reserved RO 0000
MMD Address 2h, Register 4h – RGMII Control Signal Pad Skew
2.4.15:8 Reserved Reserved RW 0000_0000
2.4.7:4 RX_DV Pad
Skew
RGMII RX_CTL output pad skew control (0.06 ns/
step)
RW 0111
2.4.3:0 TX_EN Pad
Skew
RGMII TX_CTL input pad skew control (0.06 ns/
step)
RW 0111
MMD Address 2h, Register 5h – RGMII RX Data Pad Skew
2.5.15:12 RXD3 Pad
Skew
RGMII RXD3 output pad skew control (0.06 ns/
step)
RW 0111
2.5.11:8 RXD2 Pad
Skew
RGMII RXD2 output pad skew control (0.06 ns/
step)
RW 0111
2.5.7:4 RXD1 Pad
Skew
RGMII RXD1 output pad skew control (0.06 ns/
step)
RW 0111
2.5.3:0 RXD0 Pad
Skew
RGMII RXD0 output pad skew control (0.06 ns/
step)
RW 0111
MMD Address 2h, Register 6h – RGMII TX Data Pad Skew
2.6.15:12 TXD3 Pad
Skew
RGMII TXD3 input pad skew control (0.06 ns/step) RW 0111
2.6.11:8 TXD2 Pad
Skew
RGMII TXD2 input pad skew control (0.06 ns/step) RW 0111
2.6.7:4 TXD1 Pad
Skew
RGMII TXD1 input pad skew control (0.06 ns/step) RW 0111
2.6.3:0 TXD0 Pad
Skew
RGMII TXD0 input pad skew control (0.06 ns/step) RW 0111
MMD Address 2h, Register 8h – RGMII Clock Pad Skew
2.8.15:10 Reserved Reserved RW 0000_00
2.8.9:5 GTX_CLK
Pad Skew
RGMII GTX_CLK input pad skew control (0.06 ns/
step)
RW 01_111
2.8.4:0 RX_CLK
Pad Skew
RGMII RX_CLK output pad skew control (0.06 ns/
step)
RW 0_1111
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 48 2016-2017 Microchip Technology Inc.
MMD Address 2h, Register 10h – Wake-On-LAN – Control
2.10.15:14 PME Output
Select
These two bits work in conjunction with MMD
Address 2h, Reg. 2h, Bits [8] and [10] for PME_N1
and PME_N2 enable, to define the output for Pins
17 and 38, respectively.
LED1/PME_N1 (Pin 17)
00 = PME_N1 output only
01 = LED1 output only
10 = LED1 and PME_N1 output
11 = Reserved
INT_N/PME_N2 (Pin 38)
00 = PME_N2 output only
01 = INT_N output only
10 = INT_N and PME_N2 output
11 = Reserved
RW 00
2.10.13:7 Reserved Reserved RW 00_0000_0
2.10.6 Magic Packet
Detect
Enable
1 = Enable magic-packet detection
0 = Disable magic-packet detection
RW 0
2.10.5 Custom-
Packet Type
3 Detect
Enable
1 = Enable custom-packet, Type 3 detection
0 = Disable custom-packet, Type 3 detection
RW 0
2.10.4 Custom-
Packet Type
2 Detect
Enable
1 = Enable custom-packet, Type 2 detection
0 = Disable custom-packet, Type 2 detection
RW 0
2.10.3 Custom-
Packet Type
1 Detect
Enable
1 = Enable custom-packet, Type 1 detection
0 = Disable custom-packet, Type 1 detection
RW 0
2.10.2 Custom-
Packet Type
0 Detect
Enable
1 = Enable custom-packet, Type 0 detection
0 = Disable custom-packet, Type 0 detection
RW 0
2.10.1 Link-Down
Detect
Enable
1 = Enable link-down detection
0 = Disable link-down detection
RW 0
2.10.0 Link-Up
Detect
Enable
1 = Enable link-up detection
0 = Disable link-up detection
RW 0
MMD Address 2h, Register 11h – Wake-On-LAN – Magic Packet, MAC-DA-0
2.11.15:0 Magic Packet
MAC-DA-0
This register stores the lower two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 2 (MAC Address [15:8])
Bit [7:0] = Byte 1 (MAC Address [7:0])
The upper four bytes of the destination MAC
address are stored in the following two registers.
RW 0000_0000_0000_00
00
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 49
KSZ9031RNX
MMD Address 2h, Register 12h – Wake-On-LAN – Magic Packet, MAC-DA-1
2.12.15:0 Magic Packet
MAC-DA-1
This register stores the middle two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 4 (MAC Address [31:24])
Bit [7:0] = Byte 3 (MAC Address [23:16])
The lower two bytes and upper two bytes of the
destination MAC address are stored in the previous
and following registers, respectively.
RW 0000_0000_0000_00
00
MMD Address 2h, Register 13h – Wake-On-LAN – Magic Packet, MAC-DA-2
2.13.15:0 Magic Packet
MAC-DA-2
This register stores the upper two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 6 (MAC Address [47:40])
Bit [7:0] = Byte 5 (MAC Address [39:32])
The lower four bytes of the destination MAC
address are stored in the previous two registers.
RW 0000_0000_0000_00
00
MMD Address 2h, Register 14h – Wake-On-LAN – Customized Packet, Type 0, Expected CRC 0
MMD Address 2h, Register 16h – Wake-On-LAN – Customized Packet, Type 1, Expected CRC 0
MMD Address 2h, Register 18h – Wake-On-LAN – Customized Packet, Type 2, Expected CRC 0
MMD Address 2h, Register 1Ah – Wake-On-LAN – Customized Packet, Type 3, Expected CRC 0
2.14.15:0
2.16.15:0
2.18.15:0
2.1A.15:0
Custom
Packet Type
X CRC 0
This register stores the upper two bytes for the
expected CRC.
Bit [15:8] = Byte 2 (CRC [15:8])
Bit [7:0] = Byte 1 (CRC [7:0])
The lower two bytes for the expected CRC are
stored in the following register.
RW 0000_0000_0000_00
00
MMD Address 2h, Register 15h – Wake-On-LAN – Customized Packet, Type 0, Expected CRC 1
MMD Address 2h, Register 17h – Wake-On-LAN – Customized Packet, Type 1, Expected CRC 1
MMD Address 2h, Register 19h – Wake-On-LAN – Customized Packet, Type 2, Expected CRC 1
MMD Address 2h, Register 1Bh – Wake-On-LAN – Customized Packet, Type 3, Expected CRC 1
2.15.15:0
2.17.15:0
2.19.15:0
2.1B.15:0
Custom
Packet Type
X CRC 1
This register stores the lower two bytes for the
expected CRC.
Bit [15:8] = Byte 4 (CRC [31:24])
Bit [7:0] = Byte 3 (CRC [23:16])
The upper two bytes for the expected CRC are
stored in the previous register.
RW 0000_0000_0000_00
00
MMD Address 2h, Register 1Ch – Wake-On-LAN – Customized Packet, Type 0, Mask 0
MMD Address 2h, Register 20h – Wake-On-LAN – Customized Packet, Type 1, Mask 0
MMD Address 2h, Register 24h – Wake-On-LAN – Customized Packet, Type 2, Mask 0
MMD Address 2h, Register 28h – Wake-On-LAN – Customized Packet, Type 3, Mask 0
2.1C.15:0
2.20.15:0
2.24.15:0
2.28.15:0
Custom
Packet Type
X Mask 0
This register selects the bytes in the first 16 bytes
of the packet (bytes 1 through 16) that will be used
for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as fol-
lows:
Bit [15]: Byte 16
……
Bit [2]: Byte 2
Bit [0]: Byte 1
RW 0000_0000_0000_00
00
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
KSZ9031RNX
DS00002117F-page 50 2016-2017 Microchip Technology Inc.
MMD Address 2h, Register 1Dh – Wake-On-LAN – Customized Packet, Type 0, Mask 1
MMD Address 2h, Register 21h – Wake-On-LAN – Customized Packet, Type 1, Mask 1
MMD Address 2h, Register 25h – Wake-On-LAN – Customized Packet, Type 2, Mask 1
MMD Address 2h, Register 29h – Wake-On-LAN – Customized Packet, Type 3, Mask 1
2.1D.15:0
2.21.15:0
2.25.15:0
2.29.15:0
Custom
Packet Type
X Mask 1
This register selects the bytes in the second 16
bytes of the packet (bytes 17 thru 32) that will be
used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as fol-
lows:
Bit [15]: Byte 32
……
Bit [2]: Byte 18
Bit [0]: Byte 17
RW 0000_0000_0000_00
00
MMD Address 2h, Register 1Eh – Wake-On-LAN – Customized Packet, Type 0, Mask 2
MMD Address 2h, Register 22h – Wake-On-LAN – Customized Packet, Type 1, Mask 2
MMD Address 2h, Register 26h – Wake-On-LAN – Customized Packet, Type 2, Mask 2
MMD Address 2h, Register 2Ah – Wake-On-LAN – Customized Packet, Type 3, Mask 2
2.1E.15:0
2.22.15:0
2.26.15:0
2.2A.15:0
Custom
Packet Type
X Mask 2
This register selects the bytes in the third 16 bytes
of the packet (bytes 33 through 48) that will be
used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as fol-
lows:
Bit [15]: Byte 48
……
Bit [2]: Byte 34
Bit [0]: Byte 33
RW 0000_0000_0000_00
00
MMD Address 2h, Register 1Fh – Wake-On-LAN – Customized Packet, Type 0, Mask 3
MMD Address 2h, Register 23h – Wake-On-LAN – Customized Packet, Type 1, Mask 3
MMD Address 2h, Register 27h – Wake-On-LAN – Customized Packet, Type 2, Mask 3
MMD Address 2h, Register 2Bh – Wake-On-LAN – Customized Packet, Type 3, Mask 3
2.1F.15:0
2.23.15:0
2.27.15:0
2.2B.15:0
Custom
Packet Type
X Mask 3
This register selects the bytes in the fourth 16 bytes
of the packet (bytes 49 through 64) that will be
used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as fol-
lows:
Bit [15]: Byte 64
……
Bit [2]: Byte 50
Bit [0]: Byte 49
RW 0000_0000_0000_00
00
MMD Address 1Ch, Register 4h – Analog Control 4
1C.4.15:11 Reserved Reserved RW 0000_0
1C.4.10 10BASE-Te
Mode
1 = 10BASE-Te (1.75V TX amplitude)
0 = Standard 10BASE-T (2.5V TX amplitude)
RW 0
1C.4.9:0 Reserved Reserved RW 00_1111_1111
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 51
KSZ9031RNX
Note 4-1 RW = Read/Write; RO = Read Only; WO = Write Only; LH = Latch High.
MMD Address 1Ch, Register 23h – EDPD Control
1C.23.15:1 Reserved Reserved RW 0000_0000_0000_00
0
1C.23.0 EDPD Mode
Enable
Energy-detect power-down mode
1 = Enable
0 = Disable
RW 0
TABLE 4-6: MMD REGISTER DESCRIPTIONS (CONTINUED)
Address Name Description Mode
Note 4-1 Default
2016-2017 Microchip Technology Inc. DS00002117F-page 52
KSZ9031RNX
5.0 OPERATIONAL CHARACTERISTICS
5.1 Absolute Maximum Ratings*
Supply Voltage (VIN)
(DVDDL, AVDDL, AVDDL_PLL) ................................................................................................................ –0.5V to +1.8V
(AVDDH) ................................................................................................................................................... –0.5V to +5.0V
(DVDDH)................................................................................................................................................... –0.5V to +5.0V
Input Voltage (all inputs) ........................................................................................................................... –0.5V to +5.0V
Output Voltage (all outputs) ...................................................................................................................... –0.5V to +5.0V
Lead Temperature (soldering, 10s) ....................................................................................................................... +260°C
Storage Temperature (TS)...................................................................................................................... –55°C to +150°C
*Exceeding the absolute maximum rating may damage the device. Stresses greater than the absolute maximum rating
may cause permanent damage to the device. Operation of the device at these or any other conditions above those spec-
ified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect
reliability.
5.2 Operating Ratings**
Supply Voltage
(DVDDL, AVDDL, AVDDL_PLL) ........................................................................................................ +1.140V to +1.380V
(AVDDH @ 3.3V) .............................................................................................................................. +3.135V to +3.465V
(AVDDH @ 2.5V; Commercial temp. only)........................................................................................ +2.375V to +2.625V
(DVDDH @ 3.3V).............................................................................................................................. +3.135V to +3.465V
(DVDDH @ 2.5V).............................................................................................................................. +2.375V to +2.625V
(DVDDH @ 1.8V).............................................................................................................................. +1.710V to +1.890V
Ambient Temperature
(TA Commercial: KSZ9031RNXC) ............................................................................................................... 0°C to +70°C
(TA Industrial: KSZ9031RNXI) ................................................................................................................. –40°C to +85°C
(TA Automotive: KSZ9031RNXUA/UB) .................................................................................................... –40°C to +85°C
(TA Automotive: KSZ9031RNXVA/VB)................................................................................................... –40°C to +105°C
Maximum Junction Temperature (TJ max.) ........................................................................................................... +125°C
Thermal Resistance (JA)..............................................................................................................................+36.34°C/W
Thermal Resistance (JC) ...............................................................................................................................+9.47°C/W
**The device is not guaranteed to function outside its operating ratings.
Note: Do not drive input signals without power supplied to the device.
KSZ9031RNX
DS00002117F-page 53 2016-2017 Microchip Technology Inc.
6.0 ELECTRICAL CHARACTERISTICS
TA = 25°C. Specification is for packaged product only.
TABLE 6-1: SUPPLY CURRENT - CORE/DIGITAL I/O
Parameters Symbol Min. Typ. Max. Units Note
1.2V Total of:
DVDDL (digital core) +
AVDDL (analog core) +
AVDDL_PLL (PLL)
ICORE
—210—
mA
1000BASE-T link-up (no traffic)
—221— 1000BASE-T full-duplex @
100% utilization
63.6 100BASE-TX link-up (no traffic)
—63.8— 100BASE-TX full-duplex @
100% utilization
7.1 10BASE-T link-up (no traffic)
—7.7— 10BASE-T full-duplex @
100% utilization
—1.0— Software power-down mode
(Reg. 0.11 = 1)
—0.7— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
1.8V for Digital I/O
(RGMII operating @ 1.8V) IDVDDH_1.8
—11.2—
mA
1000BASE-T link-up (no traffic)
—23.6— 1000BASE-T full-duplex @
100% utilization
8.4 100BASE-TX link-up (no traffic)
—9.8— 100BASE-TX full-duplex @
100% utilization
3.6 10BASE-T link-up (no traffic)
—5.6— 10BASE-T full-duplex @
100% utilization
—5.5— Software power-down mode
(Reg. 0.11 = 1)
—0.3— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
2.5V for Digital I/O
(RGMII operating @ 2.5V) IDVDDH_2.5
—14.7—
mA
1000BASE-T link-up (no traffic)
—31.5— 1000BASE-T full-duplex @
100% utilization
10.5 100BASE-TX link-up (no traffic)
—13.0— 100BASE-TX full-duplex @
100% utilization
6.3 10BASE-T link-up (no traffic)
—9.0— 10BASE-T full-duplex @
100% utilization
—6.7— Software power-down mode
(Reg. 0.11 = 1)
—0.7— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
2016-2017 Microchip Technology Inc. DS00002117F-page 54
KSZ9031RNX
Note 6-1 Equivalent to current draw through external transformer center taps for PHY transceivers with current-
mode transmit drivers.
3.3V for Digital I/O
(RGMII operating @ 3.3V) IDVDDH_3.3
—19.5—
mA
1000BASE-T link-up (no traffic)
—41.5— 1000BASE-T full-duplex @
100% utilization
13.9 100BASE-TX link-up (no traffic)
—17.2— 100BASE-TX full-duplex @
100% utilization
11.5 10BASE-T link-up (no traffic)
—13.7— 10BASE-T full-duplex @
100% utilization
—9.3— Software power-down mode
(Reg. 0.11 = 1)
—2.2— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
TABLE 6-2: SUPPLY CURRENT - TRANSCEIVER (Note 6-1)
Parameters Symbol Min. Typ. Max. Units Note
2.5V for Transceiver
(Recommended for
commercial temperature
range operation only)
IAVDDH_2.5
—58.8—
mA
1000BASE-T link-up (no traffic)
—57.9— 1000BASE-T full-duplex @
100% utilization
24.9 100BASE-TX link-up (no traffic)
—24.9— 100BASE-TX full-duplex @
100% utilization
11.5 10BASE-T link-up (no traffic)
—25.3— 10BASE-T full-duplex @
100% utilization
—3.1— Software power-down mode
(Reg. 0.11 = 1)
—0.02— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
3.3V for Transceiver
Parameter IAVDDH_3.3
—67.4—
mA
1000BASE-T link-up (no traffic)
—66.3— 1000BASE-T full-duplex @
100% utilization
28.7 100BASE-TX link-up (no traffic)
—28.6— 100BASE-TX full-duplex @
100% utilization
15.9 10BASE-T link-up (no traffic)
—28.6— 10BASE-T full-duplex @
100% utilization
—4.2— Software power-down mode
(Reg. 0.11 = 1)
—0.02— Chip power-down mode
(strap-in pins MODE[3:0] = 0111)
TABLE 6-1: SUPPLY CURRENT - CORE/DIGITAL I/O (CONTINUED)
Parameters Symbol Min. Typ. Max. Units Note
KSZ9031RNX
DS00002117F-page 55 2016-2017 Microchip Technology Inc.
TABLE 6-3: CMOS INPUTS
Parameters Symbol Min. Typ. Max. Units Note
Input High Voltage VIH
2.0
V
DVDDH (digital I/O) = 3.3V
1.5 DVDDH (digital I/O) = 2.5V
1.1 DVDDH (digital I/O) = 1.8V
Input Low Voltage VIL
——1.3
V
DVDDH (digital I/O) = 3.3V
1.0 DVDDH (digital I/O) = 2.5V
0.7 DVDDH (digital I/O) = 1.8V
Input High
Leakage Current IIHL –2.0 2.0 µA DVDDH = 3.3V and VIH = 3.3V
All digital input pins
Input Low Leakage Current IILL
–2.0 2.0
µA
DVDDH = 3.3V and VIL = 0.0V
All digital input pins, except MDC,
MDIO, RESET_N.
–120 –40
DVDDH = 3.3V and VIL = 0.0V
MDC, MDIO, RESET_N pins with
internal pull-ups
TABLE 6-4: CMOS OUTPUTS
Parameter Symbol Min. Typ. Max. Units Note
Output High Voltage VOH
2.7
V
DVDDH (digital I/O) = 3.3V,
IOH (min) = 10 mA
All digital output pins
2.0
DVDDH (digital I/O) = 2.5V,
IOH (min) = 10 mA
All digital output pins
1.5
DVDDH (digital I/O) = 1.8V,
IOH (min) = 13 mA
All digital output pins, except LED1,
LED2
Output Low Voltage VOL
——0.3
V
DVDDH (digital I/O) = 3.3V,
IOL (min) = 10 mA
All digital output pins
——0.3
DVDDH (digital I/O) = 2.5V,
IOL (min) = 10 mA
All digital output pins
——0.3
DVDDH (digital I/O) = 1.8V,
IOL (min) = 13 mA
All digital output pins, except LED1,
LED2
Output Tri-State Leakage |Ioz|—10µA
TABLE 6-5: LED OUTPUTS
Parameters Symbol Min. Typ. Max. Units Note
Output Drive Current ILED 10 mA
DVDDH (digital I/O) = 3.3V or 2.5V,
and VOL at 0.3V
Each LED pin (LED1, LED2)
2016-2017 Microchip Technology Inc. DS00002117F-page 56
KSZ9031RNX
Note 6-2 Measured with pin input voltage level at one-half DVDDH.
Note 6-3 Measured differentially after 1:1 transformer.
Note 6-4 Measured differentially after 1:1 transformer.
TABLE 6-6: PULL-UP PINS (Note 6-2)
Parameters Symbol Min. Typ. Max. Units Note
Internal Pull-Up Resistance
(MDC, MDIO,
RESET_N pins)
pu
13 22 31
k
DVDDH (digital I/O) = 3.3V
16 28 39 DVDDH (digital I/O) = 2.5V
26 44 62 DVDDH (digital I/O) = 1.8V
TABLE 6-7: 100BASE-TX TRANSMIT (Note 6-3)
Parameters Symbol Min. Typ. Max. Units Note
Peak Differential Output
Voltage
VO0.95 1.05 V 100 termination across differential
output
Output Voltage Imbalance VIMB —— 2 %100 termination across differential
output
Rise/Fall Time tr, tf3—5ns
Rise/Fall Time Imbalance 0 0.5 ns
Duty Cycle Distortion ±0.25 ns
Overshoot 5 %
Output Jitter 0.7 ns Peak-to-peak
TABLE 6-8: 10BASE-T TRANSMIT (Note 6-4)
Parameters Symbol Min. Typ. Max. Units Note
Peak Differential Output
Voltage
VP2.2 2.8 V 100 termination across differential
output
Jitter Added 3.5 ns Peak-to-peak
Harmonic Rejection –31 dB Transmit all-one signal sequence
TABLE 6-9: 10BASE-T RECEIVE
Parameters Symbol Min. Typ. Max. Units Note
Squelch Threshold VSQ 300 400 mV 5 MHz square wave
TABLE 6-10: TRANSMITTER - DRIVE SETTING
Parameters Symbol Min. Typ. Max. Units Note
Reference Voltage of ISET VSET —1.2— V R(I
SET) = 12.1 k
TABLE 6-11: LDO CONTROLLER - DRIVE RANGE
Parameters Symbol Min. Typ. Max. Units Note
Output drive range for
LDO_O (Pin 43) to gate
input of P-channel
MOSFET
VLDO_O
0.85 2.8
V
AVDDH = 3.3V for MOSFET source
voltage
0.85 2.0
AVDDH = 2.5V for MOSFET source
voltage (recommended for commer-
cial temperature range operation only)
KSZ9031RNX
DS00002117F-page 57 2016-2017 Microchip Technology Inc.
7.0 TIMING DIAGRAMS
7.1 RGMII Timing
As the default, after power-up or reset, the KSZ9031RNX RGMII timing conforms to the timing requirements in the
RGMII Version 2.0 Specification for internal PHY chip delay.
For the transmit path (MAC to KSZ9031RNX), the KSZ9031RNX does not add any delay locally at its GTX_CLK, TX_EN
and TXD[3:0] input pins, and expects the GTX_CLK delay to be provided on-chip by the MAC. If MAC does not provide
any delay or insufficient delay for the GTX_CLK, the KSZ9031RNX has pad skew registers that can provide up to
1.38 ns on-chip delay.
For the receive path (KSZ9031RNX to MAC), the KSZ9031RNX adds 1.2 ns typical delay to the RX_CLK output pin
with respect to RX_DV and RXD[3:0] output pins. If necessary, the KSZ9031RNX has pad skew registers that can adjust
the RX_CLK on-chip delay up to 2.58 ns from the 1.2 ns default delay.
It is common to implement RGMII PHY-to-MAC designs that either PHY, MAC, or both PHY and MAC are not fully RGMII
v2.0 compliant with on-chip clock delay. These combinations of mixed RGMII v1.3/v2.0 designs and plus sometimes
non-matching RGMII PCB trace routings require a review of the entire RGMII system timings (PHY on-chip, PCB trace
delay, MAC on-chip) to compute the aggregate clock delay and determine if the clock delay timing is met. If timing adjust-
ment is needed, pad skew registers are provided by the KSZ9031RNX. Refer to RGMII Pad Skew Registers section.
The following Figure 7-1, Figure 7-2, and Table 7-1 from the RGMII v2.0 Specification are provided as references to
understanding RGMII v1.3 external delay and RGMII v2.0 on-chip delay timings.
FIGURE 7-1: RGMII V2.0 SPEC (MULTIPLEXING AND TIMING DIAGRAM – ORIGINAL RGMII
(V1.3) WITH EXTERNAL DELAY)
2016-2017 Microchip Technology Inc. DS00002117F-page 58
KSZ9031RNX
FIGURE 7-2: RGMII V2.0 SPEC (MULTIPLEXING AND TIMING DIAGRAM – RGMII-ID (V2.0)
WITH INTERNAL CHIP DELAY)
The following notes provide clarification for Figure 7-2.
TXC (SOURCE DATA), solid line, is the MAC GTX_CLK clock output timing per RGMII v1.3 Specification (PCB delay
line required or PHY internal delay required)
TXC (SOURCE DATA) WITH INTERNAL DELAY ADDED, dotted line, is the MAC GTX_CLK clock output timing per
RGMII v2.0 Specification (no PCB delay required and no PHY internal delay required)
RXC (SOURCE DATA), solid line, is the PHY RX_CLK clock output timing per RGMII v1.3 Specification (PCB delay line
required or MAC internal delay required)
RXC (SOURCE DATA) WITH INTERNAL DELAY ADDED, dotted line, is the PHY RX_CLK clock output timing per
RGMII v2.0 Specification (no PCB delay required and no MAC internal delay required)
TABLE 7-1: RGMII V2.0 SPECIFICATION
Parameter Description Min. Typ. Max. Units
TskewT Data-to-clock output skew (at transmitter) per
RGMII v1.3 (external delay)
–500 500 ps
TskewR Data-to-clock input skew (at receiver) per RGMII
v1.3 (external delay)
1.0 2.6
ns
TsetupT Data-to-clock output setup (at transmitter – inte-
grated delay)
1.2 2.0
TholdT Clock-to-data output hold (at transmitter – inte-
grated delay)
1.2 2.0
TsetupR Data-to-clock input setup (at receiver – integrated
delay)
1.0 2.0
TholdR Clock-to-data input hold (at receiver – integrated
delay)
1.0 2.0
tcyc (1000BASE-T) Clock cycle duration for 1000BASE-T 7.2 8.0 8.8
tcyc (100BASE-TX) Clock cycle duration for 100BASE-TX 36 40 44
tcyc (10BASE-T) Clock cycle duration for 10BASE-T 360 400 440
TXC(SOURCE DATA) TXC WITH INTERNAL
DELAY ADDED
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CTL
TXC (AT RECEIVER)
RXC (SOURCE DATA)
RXD[8:5][3:0]
RXD[7:4][3:0]
RX_CTL
RXC (AT RECEIVER)
TXD[3:0] TXD[8:5]
TXD[7:4]
TSETUPT
THOLDT
TSETUPR
THOLDR
TXD[4]
TXEN
TXD[9]
TXERR
RXC WITH INTERNAL
DELAY ADDED
RXD[3:0] RXD[8:5]
RXD[7:4]
TSETUPT
THOLDT
TSETUPR
THOLDR
RXD[4]
RXDV
RXD[9]
RXERR
KSZ9031RNX
DS00002117F-page 59 2016-2017 Microchip Technology Inc.
The RGMII Version 2.0 Specification defines the RGMII data-to-clock skews only for 1000 Mbps operation, which uses
both clock edges for sampling the data and control signals at the 125 MHz clock frequency (8 ns period). For 10/100
Mbps operations, the data signals are sampled on the rising clock edge and the control signals are sampled on both
clock edges. With slower clock frequencies, 2.5 MHz (400 ns period) for 10 Mbps and 25 MHz (40 ns period) for
100 Mbps, the RGMII data-to-clock skews for 10/100 Mbps operations will have greater timing margins than for
1000 Mbps operation, and therefore can be relaxed from 2.6 ns (maximum) for 1000 Mbps to 160 ns (maximum) for
10 Mbps and 16 ns (maximum) for 100 Mbps.
2016-2017 Microchip Technology Inc. DS00002117F-page 60
KSZ9031RNX
FIGURE 7-3: AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING
The KSZ9031RNX Fast Link Pulse (FLP) burst-to-burst transmit timing for Auto-Negotiation defaults to 8 ms. IEEE
802.3 Standard specifies this timing to be 16 ms ±8 ms. Some PHY link partners need to receive the FLP with 16 ms
centered timing; otherwise, there can be intermittent link failures and long link-up times.
After KSZ9031RNX power-up/reset, program the following register sequence to set the FLP timing to 16 ms:
1. Write Register Dh = 0x0000 // Set up register address for MMD – Device Address 0h
2. Write Register Eh = 0x0004 // Select Register 4h of MMD – Device Address 0h
3. Write Register Dh = 0x4000 // Select register data for MMD – Device Address 0h, Register 4h
4. Write Register Eh = 0x0006 // Write value 0x0006 to MMD – Device Address 0h, Register 4h
5. Write Register Dh = 0x0000 // Set up register address for MMD – Device Address 0h
6. Write Register Eh = 0x0003 // Select Register 3h of MMD – Device Address 0h
7. Write Register Dh = 0x4000 // Select register data for MMD – Device Address 0h, Register 3h
8. Write Register Eh = 0x1A80 // Write value 0x1A80 to MMD – Device Address 0h, Register 3h
9. Write Register 0h, Bit [9] = 1 // Restart Auto-Negotiation
The above setting for 16 ms FLP transmit timing is compatible with all PHY link partners.
TABLE 7-2: AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING PARAMETERS
Timing
Parameter Description Min. Typ. Max. Units
tBTB FLP burst to FLP burst 8 16 24 ms
tFLPW FLP burst width 2
tPW Clock/Data pulse width 100 ns
tCTD Clock pulse to data pulse 55.5 64 69.5 µs
tCTC Clock pulse to clock pulse 111 128 139
Number of clock/data pulses per FLP burst 17 33
KSZ9031RNX
DS00002117F-page 61 2016-2017 Microchip Technology Inc.
FIGURE 7-4: MDC/MDIO TIMING
The typical MDC clock frequency is 2.5 MHz (400 ns clock period).
The KSZ9031RNX can operate with MDC clock frequencies generated from bit banging with GPIO pin in the 10s/100s
of Hertz and have been tested up to a MDC clock frequency of 8.33 MHz (120 ns clock period). Test condition for
8.33 MHz is for one KSZ9031RNX PHY on the MDIO line with a 1.0 k pull-up to the DVDDH supply rail.
TABLE 7-3: MDC/MDIO TIMING PARAMETERS
Timing
Parameter Description Min. Typ. Max. Units
tPMDC period 120 400
ns
tMD1 MDIO (PHY input) setup to rising edge of MDC 10
tMD2 MDIO (PHY input) hold from rising edge of MDC 10
tMD3 MDIO (PHY output) delay from rising edge of MDC 0
2016-2017 Microchip Technology Inc. DS00002117F-page 62
KSZ9031RNX
FIGURE 7-5: POWER-UP/POWER-DOWN/RESET TIMING
Note 1: The recommended power-up sequence is to have the transceiver (AVDDH) and digital I/O (DVDDH) voltages
power up before the 1.2V core (DVDDL, AVDDL, AVDDL_PLL) voltage. If the 1.2V core must power up first, the maxi-
mum lead time for the 1.2V core voltage with respect to the transceiver and digital I/O voltages should be 200 µs.
There is no power sequence requirement between transceiver (AVDDH) and digital I/O (DVDDH) power rails.
The power-up waveforms should be monotonic for all supply voltages to the KSZ9031RNX.
Note 2: After the de-assertion of reset, wait a minimum of 100 µs before starting programming on the MIIM (MDC/MDIO)
interface.
Note 3: The recommended power-down sequence is to have the 1.2V core voltage power-down before powering down
the transceiver and digital I/O voltages.
Before the next power-up cycle, all supply voltages to the KSZ9031RNX should reach less than 0.4V and there should
be a minimum wait time of 150 ms from power-off to power-on.
TABLE 7-4: POWER-UP/POWER-DOWN/RESET TIMING PARAMETERS
Timing
Parameter Description Min. Typ. Max. Units
tVR Supply voltages rise time (must be monotonic) 200 µs
tSR Stable supply voltages to de-assertion of reset 10 ms
tCS Strap-in pin configuration setup time 5
nstCH Strap-in pin configuration hold time 5
tRC De-assertion of reset to strap-in pin output 6
tPC Supply voltages cycle off-to-on time 150 ms
t
SR
t
CS
t
CH
t
RC
SUPPLY
VOLTAGES
RESET_N
STRAP-IN
VALUE
STRAP-IN /
OUTPUT PIN
CORE (DVDDL, AVDDL, AVDDL_PLL)
TRANSCEIVER (AVDDH), DIGITAL I/Os (DVDDH)
t
VR
t
PC
NOTE
1
NOTE
2
NOTE
3
KSZ9031RNX
DS00002117F-page 63 2016-2017 Microchip Technology Inc.
8.0 RESET CIRCUIT
The following are some reset circuit suggestions.
Figure 8-1 illustrates the reset circuit for powering up the KSZ9031RNX if reset is triggered by the power supply.
FIGURE 8-1: RESET CIRCUIT IF TRIGGERED BY THE POWER SUPPLY
Figure 8-2 illustrates the reset circuit for applications where reset is driven by another device (for example, the CPU or
an FPGA). At power-on-reset, R, C, and D1 provide the monotonic rise time to reset the KSZ9031RNX device. The
RST_OUT_N from the CPU/FPGA provides the warm reset after power-up.
The KSZ9031RNX and CPU/FPGA references the same digital I/O voltage (DVDDH).
FIGURE 8-2: RECOMMENDED RESET CIRCUIT FOR CPU/FPGA RESET OUTPUT
Figure 8-3 illustrates the reset circuit with an MIC826 voltage supervisor driving the KSZ9031RNX reset input.
DVDDH
D1: 1N4148
D1 R 10K
KSZ9031RNX
RESET_N
C 10µF
2016-2017 Microchip Technology Inc. DS00002117F-page 64
KSZ9031RNX
FIGURE 8-3: RESET CIRCUIT WITH MIC826 VOLTAGE SUPERVISOR
KSZ9031RNX MIC826
Part
Number
RESET#
Reset
Threshold
DVDDH = 3.3V, 2.5V, or 1.8V
RESET_N
DVDDHDVDDH
MIC826TYMT / 3.075V
MIC826ZYMT / 2.315V
MIC826WYMT / 1.665V
KSZ9031RNX
DS00002117F-page 65 2016-2017 Microchip Technology Inc.
9.0 REFERENCE CIRCUITS — LED STRAP-IN PINS
The pull-up and pull-down reference circuits for the LED2/PHYAD1 and LED1/PHYAD0 strapping pins are shown in
Figure 9-1 for 3.3V and 2.5V DVDDH.
FIGURE 9-1: REFERENCE CIRCUITS FOR LED STRAPPING PINS
For 1.8V DVDDH, LED indication support requires voltage level shifters between LED[2:1] pins and LED indicator
diodes to ensure the multiplexed PHYAD[1:0] strapping pins are latched in high/low correctly. If LED indicator diodes
are not implemented, the PHYAD[1:0] strapping pins just need 10 k pull-up to 1.8V DVDDH for a value of 1, and 1.0 k
pull-down to ground for a value of 0.
LED PIN
220Ω
10k
PULL-UP
KSZ9031RNX
220Ω
PULL-DOWN
KSZ9031RNX
LED PIN
DVDDH = 3.3V, 2.5V
DVDDH = 3.3V, 2.5V
1k
2016-2017 Microchip Technology Inc. DS00002117F-page 66
KSZ9031RNX
10.0 REFERENCE CLOCK - CONNECTION AND SELECTION
A crystal or external clock source, such as an oscillator, is used to provide the reference clock for the KSZ9031RNX.
The reference clock is 25 MHz for all operating modes of the KSZ9031RNX.
The KSZ9031RNX uses the AVDDH supply, analog 3.3V (or analog 2.5V option for commercial temperature only), for
the crystal/clock pins (XI, XO). If the 25 MHz reference clock is provided externally, the XI input pin should have a min-
imum clock voltage peak-to-peak (VPP) swing of 2.5V reference to ground. If VPP is less than 2.5V, series capacitive
coupling is recommended. With capacitive coupling, the VPP swing can be down to 1.5V. Maximum VPP swing is 3.3V
+5%.
Figure 10-1 and Table 10-1 show the reference clock connection to XI and XO of the KSZ9031RNX, and the reference
clock selection criteria.
FIGURE 10-1: 25 MHZ CRYSTAL/OSCILLATOR REFERENCE CLOCK CONNECTION
11.0 ON-CHIP LDO CONTROLLER - MOSFET SELECTION
If the optional LDO controller is used to generate 1.2V for the core voltage, the selected MOSFET should exceed the
following minimum requirements:
P-channel
500 mA (continuous current)
3.3V or 2.5V (source – input voltage)
1.2V (drain – output voltage)
•V
GS in the range of:
- (–1.2V to –1.5V) @ 500 mA for 3.3V source voltage
- (–1.0V to –1.1V) @ 500 mA for 2.5V source voltage
The VGS for the MOSFET needs to be operating in the constant current saturated region, and not towards the VGS(th),
the threshold voltage for the cut-off region of the MOSFET.
See Table 6-11 for LDO controller output driving range to the gate input of the MOSFET.
Refer to application note ANLAN206 – KSZ9031 Gigabit PHY Optimized Power Scheme for High Efficiency, Low-Power
Consumption and Dissipation as a design reference.
TABLE 10-1: 25 MHZ CRYSTAL/REFERENCE CLOCK SELECTION CRITERIA
Characteristics Value
Frequency 25 MHz
Frequency Tolerance (max.) ±50 ppm
Crystal Series Resistance (typ.) 40
Total Period Jitter (peak-to-peak) <100 ps
22pF
22pF
NC
XI
XO
XI
XO
25 MHz XTAL
±50PPM
25 MHz OSC
±50PPM
KSZ9031RNX
DS00002117F-page 67 2016-2017 Microchip Technology Inc.
12.0 MAGNETIC - CONNECTION AND SELECTION
A 1:1 isolation transformer is required at the line interface. Use one with integrated common-mode chokes for designs
exceeding FCC requirements. An optional auto-transformer stage following the chokes provides additional common-
mode noise and signal attenuation.
The KSZ9031RNX design incorporates voltage-mode transmit drivers and on-chip terminations.
With the voltage-mode implementation, the transmit drivers supply the common-mode voltages to the four differential
pairs. Therefore, the four transformer center tap pins on the KSZ9031RNX side should not be connected to any power
supply source on the board; rather, the center tap pins should be separated from one another and connected through
separate 0.1 µF common-mode capacitors to ground. Separation is required because the common-mode voltage could
be different between the four differential pairs, depending on the connected speed mode.
Figure 12-1 shows the typical gigabit magnetic interface circuit for the KSZ9031RNX.
FIGURE 12-1: TYPICAL GIGABIT MAGNETIC INTERFACE CIRCUIT
Table 12-1 lists recommended magnetic characteristics.
Table 12-2 is a list of compatible single-port magnetics with separated transformer center tap pins on the G-PHY chip
side that can be used with the KSZ9031RNX.
TABLE 12-1: MAGNETICS SELECTION CRITERIA
Parameter Value Test Conditions
Turns Ratio 1 CT : 1 CT
Open-Circuit Inductance (min.) 350 µH 100 mV, 100 kHz, 8 mA
Insertion Loss (max.) 1.0 dB 0 MHz to 100 MHz
HIPOT (min.) 1500 VRMS
TABLE 12-2: COMPATIBLE SINGLE-PORT 10/100/1000 MAGNETICS
Manufacturer Part Number Auto-Transformer Temperature Range Magnetic + RJ-45
Bel Fuse 0826-1G1T-23-F Yes 0°C to 70°C Yes
HALO TG1G-E001NZRL No –40°C to 85°C No
1
2
3
7
8
4
5
6
4x75 Ω
1000 pF / 2kV
RJ
-
45 CONNECTOR
CHASSIS GROUND
(4 x 0.1µF)
TXRXP_A
TXRXM_A
KSZ9031RNX
SIGNAL GROUND
TXRXP_B
TXRXM_B
TXRXP_C
TXRXM_C
TXRXP_D
TXRXM_D
2016-2017 Microchip Technology Inc. DS00002117F-page 68
KSZ9031RNX
HALO TG1G-S001NZRL No 0°C to 70°C No
HALO TG1G-S002NZRL Yes 0°C to 70°C No
Pulse H5007NL Yes 0°C to 70°C No
Pulse H5062NL Yes 0°C to 70°C No
Pulse HX5008NL Yes –40°C to 85°C No
Pulse JK0654219NL Yes 0°C to 70°C Yes
Pulse JK0-0136NL No 0°C to 70°C Yes
TDK TLA-7T101LF No 0°C to 70°C No
Wurth/Midcom 000-7093-37R-LF1 Yes 0°C to 70°C No
TABLE 12-2: COMPATIBLE SINGLE-PORT 10/100/1000 MAGNETICS (CONTINUED)
Manufacturer Part Number Auto-Transformer Temperature Range Magnetic + RJ-45
2016-2017 Microchip Technology Inc. DS00002117F-page 69
KSZ9031RNX
13.0 PACKAGE OUTLINES
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
FIGURE 13-1: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 3.5 MM X 3.5 MM EXPOSED PAD
AREA
KSZ9031RNX
DS00002117F-page 70 2016-2017 Microchip Technology Inc.
FIGURE 13-2: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD
AREA
TITLE
48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING # QFN77-48LD-PL-1 UNIT MM
NOTE:
1. MAX PACKAGE WARPAGE IS 0.05mm.
2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.
3. PIN #1 IS ON TOP WILL BE LASER MARKED.
4. RED CIRCLE IN LAND PATTERN INDICATES THERMAL VIA. SIZE SHOULD BE 0.30-0.35mm IN DIAMETER AND SHOULD BE
CONNECTED TO GND FOR MAX THERMAL PERFORMANCE. PITCH is 1.00mm.
5. GREEN RECTANGLES (SHADED AREA) REPRESENT SOLDER STENCIL OPENING ON EXPOSED PAD AREA. RECOMMENDED SIZE
IS 1.00x1.00mm, SPACING IS 0.25mm.
NOTE: 1, 2, 3
0.25±0.05
5.50
Ref.
0.50 Bsc
0.40±0.05
PIN #1 ID
CHAMFER 0.35x45°
48
1
2
7.00±0.05
7.00±0.05
Top View
NOTE: 1, 2, 3
Bottom View
0.85±0.05
0.253 (REF)
0.00-0.05
NOTE: 1, 2, 3
Side View
5.10±0.05
Exp.DAP
5.10±0.05
Exp.DAP
2016-2017 Microchip Technology Inc. DS00002117F-page 71
KSZ9031RNX
FIGURE 13-3: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD
AREA RECOMMENDED LAND PATTERN
POD-Land Pattern drawing #: QFN77-48LD-PL-1-C
KSZ9031RNX
DS00002117F-page 72 2016-2017 Microchip Technology Inc.
FIGURE 13-4: 48-LEAD VQFN 7 MM X 7 MM PACKAGE (WETTABLE FLANK) WITH 5.05 MM X
5.05 MM EXPOSED PAD AREA
2016-2017 Microchip Technology Inc. DS00002117F-page 73
KSZ9031RNX
FIGURE 13-5: 48-LEAD VQFN 7 MM X 7 MM PACKAGE (WETTABLE FLANK) WITH 5.05 MM X
5.05 MM EXPOSED PAD AREA RECOMMENDED LAND PATTERN
2016-2017 Microchip Technology Inc. DS00002117F-page 74
KSZ9031RNX
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1: REVISION HISTORY
Revision Section/Figure/Entry Correction
DS00002117F (06-02-17) Table 2-1, "Signals -
KSZ9031RNX"
Added the following note to pin description for pin
43:
Note: This pin should never be driven externally.
DS00002117E (05-26-17) Product Identification System - Added “wettable flank lead frame” after VQFN for
automotive grade ordering examples e through l.
- Modified “automotive temperature” to automotive
grade 3 temperature” for ordering example e.
- Modified “automotive extended temperature” to
“automotive grade 2 temperature” for ordering
example f.
- In note 1, replaced “module #8” with “module
#11”.
Section 13.0 “Package Out-
lines”
Updated figure titles in Figure 13-4 and Figure 13-
5
Features on page 1 Updated ordering of bulleted list. Corrections to
part numbers in AEC-Q100 Grade 3 and Grade 2
part numbering.
Target Applications on page 1 Added Industrial Control. Removed Media Con-
verter.
Section 1.1, "General Descrip-
tion," on page 4
Modified description to refer to KSZ9031RNXUA/
UB and KSZ9031RNXVA/VB as the automotive
part names.
Section 5.2, "Operating Rat-
ings**," on page 52
Modified ratings to refer to KSZ9031RNXUA/UB
and KSZ9031RNXVA/VB as the automotive part
names.
FIGURE 13-4: 48-Lead VQFN
7 mm x 7 mm PackagE (wet-
table flank) with 5.05 mm x
5.05 mm Exposed Pad Area
on page 72 and FIGURE 13-5:
48-Lead VQFN 7 mm x 7 mm
Package (wettable flank) with
5.05 mm x 5.05 mm Exposed
Pad Area Recommended
Land Pattern on page 73
New package drawings to that change WQFN to
VQFN.
Product Identification System
on page 77
Corrections to PIS ordering code matrix.
KSZ9031RNX
DS00002117F-page 75 2016-2017 Microchip Technology Inc.
DS00002117D (01-05-17) All Sales listing and cover pages updated. Minor text
changes throughout.
Features on page 1 Updated info for AEC-Q100 Qualified for Automo-
tive Applications.
Target Applications on page 1 Added Automotive In-Vehicle Networking.
Section 5.2, "Operating Rat-
ings**," on page 52
Updated maximum operating voltage for (DVDDL,
AVDDL, AVDDL_PLL).
DS00002117C (07-26-16) All Removed Energy Efficient Ethernet functionality.
DS00002117B (05-24-16) 10.0 Reference Clock -
Connection and Selection
Specified jitter for 25 MHz reference crystal/clock.
DS00002117A (03-14-16) Converted Micrel data sheet KSZ9031RNX to
Microchip DS00002117A. Minor text changes
throughout.
Wake-On-LAN – Customized
Packet, Expected CRC 1 and
CRC 2 Registers.
The “lower” and “upper” denotations for the two
bytes of expected CRC are swapped in the previ-
ous revision.
Product Identification
System
Specified exposed pad size area for packages.
Package Information Corrected information for copper wire part num-
bers (KSZ9031RNXCC, KSZ9031RNXIC) to 48-
pin (7 mm x 7 mm) QFN with (5.1 mm x 5.1 mm)
exposed pad area. This is a data sheet correction.
There is no change to the copper wire package.
TABLE A-1: REVISION HISTORY (CONTINUED)
Revision Section/Figure/Entry Correction
2016-2017 Microchip Technology Inc. DS00002117F-page 76
KSZ9031RNX
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site
contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this
document.
Technical support is available through the web site at: http://microchip.com/support
2016-2017 Microchip Technology Inc. DS00002117F-page 77
KSZ9031RNX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: KSZ9031
Interface: R= RGMII
Package: NX = 48-pin QFN or VQFN
Temperature: C= 0C to +70C (Commercial)
I= -40C to +85C (Industrial)
U= -40C to +85C (Automotive Grade 3)
V= -40C to +105C (Automotive Grade 2)
Bond Wire: A or B = Gold
C = Copper
Media Type: Blank = Standard packaging (tray)
TR = Tape and Reel(1)
Automotive
Option:
VAO = Automotive Option(1)
Examples:
a) KSZ9031RNXCA
RGMII Interface
48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)
Commercial Temperature
Gold Wire Bonding
b) KSZ9031RNXCC
RGMII Interface
48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)
Commercial Temperature
Copper Wire Bonding
c) KSZ9031RNXIA
RGMII Interface
48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)
Industrial Temperature
Gold Wire Bonding
d) KSZ9031RNXIC
RGMII Interface
48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)
Industrial Temperature
Copper Wire Bonding
e) KSZ9031RNXUA
RGMII Interface
48-pin VQFN wettable flank lead frame
(Pb-Free, 5.05 mm x 5.05 mm ePad)
Automotive Grade 3 Temperature
Gold Wire Bonding
f) KSZ9031RNXVA
RGMII Interface
48-pin VQFN wettable flank lead frame
(Pb-Free, 5.05 mm x 5.05 mm ePad)
Automotive Grade 2 Temperature
Gold Wire Bonding
g) KSZ9031RNXUA-TR
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 3 Temperature
Gold Wire Bonding
Tape and Reel packaging
h) KSZ9031RNXUB-TRVAO
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 3 Temperature
Gold Wire Bonding
Tape and Reel packaging
Automotive Option
i) KSZ9031RNXUB-VAO
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 3 Temperature
Gold Wire Bonding
Automotive Option
j) KSZ9031RNXVA-TR
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 2 Temperature
Gold Wire Bonding
Tape and Reel packaging
k) KSZ9031RNXVB-TRVAO
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 2 Temperature
Gold Wire Bonding
Tape and Reel
Automotive Option
l) KSZ9031RNXVB-VAO
RGMII Interface
48-pin VQFN wettable flank lead frame
Automotive Grade 2 Temperature
Gold Wire Bonding
Automotive Option
PART NO. XXX
PackageInterface
Device
X
Temp.
XXX
Media
Type
XXX
Automotive
Option
Note 1: KSZ9031RNXUB and KSZ9031RNXVB corrects an erratum in the respective
KSZ9031RNXUA and KSZ9031RNXVA (see Module #11 in the
KSZ9031RNX errata document). KSZ9031RNXUB and KSZ9031RNXVB is
recommended for all new designs and is a 100% functional and pin equivalent
replacement for KSZ9031RNXUA and KSZ9031RNXVA, respectively.
Wire
Bond
-
2016-2017 Microchip Technology Inc. DS00002117F-page 78
KSZ9031RNX
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision
Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench,
MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
All other trademarks mentioned herein are property of their respective companies.
© 2016-2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 9781522417729
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
2016-2017 Microchip Technology Inc. DS00002117F-page 79
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