ISD4003-04MSIR - Nuvoton Technology

Publication Release Date: January 2004

- 1 - Revision 1.0

ISD4003 SERIES

SINGLE-CHIP, MULTIPLE-MESSAGES

VOICE RECORD/PLAYBACK DEVICES

4-, 5-, 6-, AND 8-MINUTE DURATION

ISD4003 SERIES

- 2 -

1. GENERAL DESCRIPTION

The ISD4003 ChipCorder® series provides high-quality, 3-volt, single-chip record/playback solutions

for 4- to 8-minute messaging applications ideally for cellular phones and other portable products. The

CMOS-based devices include an on-chip oscillator, anti-aliasing filter, smoothing filter, AutoMute®

feature, audio amplifier, and high density multilevel Flash memory array. The ISD4003 series is

designed to be used in a microprocessor- or microcontroller-based system. Address and control are

accomplished through a Serial Peripheral Interface (SPI) or Microwire Serial Interface to minimize pin

count.

Recordings are stored into the on-chip Flash memory cells, providing zero-power message storage.

This unique single-chip solution utilizes Winbond’s patented multilevel storage technology. Voice and

audio signals are directly stored onto memory array in their natural form, providing high-quality voice

reproduction.

ISD4003 SERIES

Publication Release Date: January 2004

- 3 - Revision 1.0

2. FEATURES

• Single-chip voice record/playback solution

• Single 3 volt supply

• Low-power consumption

 Operating current:

- ICC_Play = 15 mA (typical)

- ICC_Rec = 25 mA (typical)

 Standby current:

- ICC_Standby = 1 µA (typical)

• Duration: 4, 5, 6, and 8 minutes

• High-quality, natural voice/audio reproduction

• AutoMute feature provides background noise attenuation

• No algorithm development required

• Microcontroller SPI or Microwire™ Serial Interface

• Fully addressable to handle multiple messages

• Non-volatile message storage

• 100K record cycles (typical)

• 100-year message retention (typical)

• On-chip oscillator

• Power-down feature to reduce power consumption

• Available in die form, PDIP, SOIC, and TSOP

• Temperature:

- Commercial (die): 0°C to +50°C

- Commercial (packaged units): 0°C to +70°C

- Extended: -20°C to +70°C

- Industrial: -40°C to +85°C

ISD4003 SERIES

- 4 -

3. BLOCK DIAGRAM

Internal Clock Timing

Sampling Clock

1920K Cell

Nonvolatile

Multilevel Storage

Array

Analog Transceivers

Decoders

Power Conditioning

5-Pole Active

Antialiasing Filter

5-Pole Active

Smoothing Filter

Amp AUDOUT

VCCA VSSA VSSA VSSA

XCLK

Amp

ANA IN-

ANA IN+

AM CAP

Device Control

SCLK SS MOSI MISO INT RAC

AutoMuteTM

Feature

VSSD VCCD

ISD4003 SERIES

Publication Release Date: January 2004

- 5 - Revision 1.0

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 3

3. BLOCK DIAGRAM .............................................................................................................................. 4

4. TABLE OF CONTENTS ...................................................................................................................... 5

5. PIN CONFIGURATION ....................................................................................................................... 6

6. PIN DESCRIPTION............................................................................................................................. 7

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12

7.1. Detailed Description.................................................................................................................... 12

7.2. Serial Peripheral Interface (SPI) Description..............................................................................13

7.2.1. OPCODES ........................................................................................................................... 14

7.2.2. SPI Diagrams ....................................................................................................................... 15

7.2.3. SPI Control and Output Registers........................................................................................ 16

8. TIMING DIAGRAMS.......................................................................................................................... 18

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20

9.1. Operating Conditions .................................................................................................................. 21

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22

10.1. Parameters For Packaged Parts ........................................................................................ 22

10.2. Parameters For Die .............................................................................................................. 25

10.3. SPI AC Parameters .............................................................................................................. 26

11. TYPICAL APPLICATION CIRCUIT.................................................................................................27

12. PACKAGING AND DIE INFORMATION ......................................................................................... 30

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 31

12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 32

12.4. Die Information ......................................................................................................................... 33

13. ORDERING INFORMATION........................................................................................................... 35

14. VERSION HISTORY ....................................................................................................................... 36

ISD4003 SERIES

- 6 -

5. PIN CONFIGURATION

VSSA

RAC

INT

XCLK

VCCD

SCLK

MOSI

MISO

VSSD

ISD4003

VCCA

ANA IN+

ANA IN-

AM CAP

AUD OUT

VSSA

TSOP

SOIC / PDIP

MOSI

MISO

VSSD

VSSA

AUD OUT

AM CAP

VCCD

XCLK

INT

RAC

VSSA

VCCA

ANA IN+

ANA IN-

SCLK

ISD4003

ISD4003 SERIES

Publication Release Date: January 2004

- 7 - Revision 1.0

6. PIN DESCRIPTION

PIN NO. PIN NAME

SOIC /

PDIP

TSOP

FUNCTION

SS 1 9

Slave Select: This input, when LOW, will select the

ISD4003 device.

MOSI 2 10

Master Out Slave IN: This is the serial input to the

ISD4003 device when it is configured as slave. The master

microcontroller places data on the MOSI line one half-cycle

before the rising edge of SCLK for clocking into the device.

MISO 3 11

Master In Slave Out: This is the serial output (open drain)

of the ISD4003 device. This output goes into a high-

impedance state if the device is not selected.

VSSA / VSSD 11, 12,

23 / 4

1, 17, 18 /

Ground: The ISD4003 series utilizes separate analog and

digital ground busses. The analog ground (VSSA) pins

should be tied together as close as possible and connected

through a low-impedance path to power supply ground.

The digital ground (VSSD) pin should be connected through

a separate low-impedance path to power supply ground.

These ground paths should be large enough to ensure that

the impedance between the VSSA pins and the VSSD pin is

less than 3 Ω. The backside of the die is connected to VSS

through the substrate. For chip-on-board design, the die

attach area must be connected to VSS or left floating.

NC 5-10, 15,

19-22

3, 4, 13-

16, 19, 21,

23, 27, 28

Not connected

AUD OUT [1] 13 20 Audio Output: This pin provides an audio output of the

stored data and is recommended be AC coupled. It is

capable of driving a 5 KΩ impedance REXT.

[1] The AUD OUT pin is always at 1.2 volts when the device is powered up. When in playback, the output buffer

connected to this pin can drive a load as small as 5 KΩ. When in record, a built-in resistor connects AUD OUT to

the internal 1.2-volt analog ground supply. This resistor is approximately 850 KΩ, but will vary somewhat

according to the sample rate of the device. This relatively high impedance allows this pin to be connected to an

audio bus without loading it down.

ISD4003 SERIES

- 8 -

PIN NO. PIN NAME

SOIC /

PDIP

TSOP

FUNCTION

AM CAP 14 22 AutoMute™ Feature: The AutoMute feature only applies

for playback operation and helps to minimize noise (with 6

dB of attenuation) when there is no signal (i.e. during

periods of silence). A 1 µF capacitor to ground is

recommended to connect to the AM CAP pin.

This capacitor becomes a part of an internal peak detector

which senses the signal amplitude. This peak level is

compared to an internally set threshold to determine the

AutoMute trip point. For large signals, the AutoMute

attenuation is set to 0 dB automatically but 6 dB of

attenuation occurs for silence. The 1 µF capacitor also

affects the rate at which the AutoMute feature changes with

the signal amplitude (or the attack time).

The AutoMute feature can be disabled by connecting the

AM CAP pin directly to VCCA..

ANA IN- 16 24 Inverting Analog Input: This pin transfers the signal into

the device during recording via differential-input mode.

In this differential-input mode, a 16 mVp-p maximum input

signal should be capacitively coupled to ANA IN- for

optimal signal quality, as shown in Figure 1: ANA IN

Modes. This capacitor value should be equal to that used

on ANA IN+ pin. The input impedance at ANA IN- is

normally 56 KΩ.

In the single-ended mode, ANA IN- should be capacitively

coupled to VSSA through a capacitor equal to that used on

the ANA IN+ pin.

ANA IN+ 17 25 Non-Inverting Analog Input: This pin is the non-inverting

analog input that transfers the signal to the device for

recording. The analog input amplifier can be driven single

ended or differentially.

In the single-ended input mode, a 32 mVp-p (peak-to-peak)

maximum signal should be capacitively connected to this

pin for optimal signal quality. The external capacitor

associated with ANA IN+ together with the 3 KΩ input

impedance are selected to give cutoff at the low frequency

end of the voice passband.

In the differential-input mode, the maximum input signal at

ANA IN+ should be 16 mVp-p capacitively coupled for

optimal signal quality. The circuit connections for the two

modes are shown in Figure 1.

ISD4003 SERIES

Publication Release Date: January 2004

- 9 - Revision 1.0

PIN NO. PIN NAME

SOIC /

PDIP

TSOP

FUNCTION

VCCA / VCCD 18 / 27 26 / 7 Supply Voltage: To minimize noises, the analog and digital

circuits in the ISD4003 devices use separate power

busses. These +3V busses are brought out to separate

pins and should be tied together as close to the supply as

possible. In addition, these supplies should be decoupled

as close to the package as possible.

RAC 24 2

Row Address Clock: This is an open drain output that

provides the signal of a ROW with a 200 ms period for 8

KHz sampling frequency. (This represents a single row of

memory.) This signal stays HIGH for 175 ms and stays

LOW for 25 ms when it reaches the end of a row.

The RAC pin stays HIGH for 109.37 µsec and stays LOW

for 15.63 µsec in Message Cueing mode (see Message

Cueing section for detailed description). Refer to the AC

Parameters table for RAC timing information at other

sample rates.

When a record command is first initiated, the RAC pin

remains HIGH for an extra TRACL period. This is due to the

need of loading the internal sample and hold circuits in the

device. This pin can be used for message management

techniques.

A pull-up resistor is required to connect this pin to other

device.

INT 25 5

Interrupt: This is an open drain output pin. This pin goes

LOW and stays LOW when an Overflow (OVF) or End of

Message (EOM) marker is detected. Each operation that

ends with an EOM or OVF will generate an interrupt. The

interrupt will be cleared the next time an SPI cycle is

initiated. The interrupt status can also be read by an RINT

instruction.

A pull-up resistor is required to connect this pin to other

device.

Overflow Flag (OVF) – The Overflow flag indicates that the

end of memory has been reached during a record or

playback operation.

End of Message (EOM) – The End of Message flag is set

only during playback operation when an EOM is found.

There are eight EOM flag position options per row.

ISD4003 SERIES

- 10 -

PIN NO. PIN NAME

SOIC /

PDIP

TSOP

FUNCTION

XCLK 26 6

External Clock Input: The pin has an internal pull-down

device. The ISD4003 series is configured at the factory with

an internal sampling clock frequency centered to ±1

percent of specification. The frequency is then maintained

to a variation of ±2.25 percent over the entire commercial

temperature and operating voltage ranges. The internal

clock has a –6/+4 percent tolerance over the extended

temperature, industrial temperature and voltage ranges. A

regulated power supply is recommended for industrial

temperature range parts. If greater precision is required,

the device can be clocked through the XCLK pin as follows:

Part Number Sample Rate Required Clock

ISD4003-04M 8.0 kHz 1024 kHz

ISD4003-05M 6.4 kHz 819.2 kHz

ISD4003-06M 5.3 kHz 682.7 kHz

ISD4003-08M 4.0 kHz 512 kHz

These recommended clock rates should not be varied

because the anti-aliasing and smoothing filters are fixed.

Otherwise, aliasing problems can occur if the sample rate

differs from the one recommended. The duty cycle on the

input clock is not critical, as the clock is immediately

divided by two. If the XCLK is not used, this input must

be connected to ground.

SCLK 28 8

Serial Clock: This is the input clock to the ISD4003 device.

It is generated by the master device (typically

microcontoller) and is used to synchronize the data transfer

in and out of the device through the MOSI and MISO lines,

respectively. Data is latched into the ISD4003 on the rising

edge of SCLK and shifted out of the device on the falling

edge of SCLK.

ISD4003 SERIES

Publication Release Date: January 2004

- 11 - Revision 1.0

32m Vp-pSignal

0.1 F

ANA IN+

ANA IN-

Ω

53K

Ω

53K

Ω

1.2V

To Filter

Internal to the device

Single-Ended Input Mode

16m Vp-pInput Signal

0.1 F

ANA IN+

ANA IN-

Ω

53K

Ω

53K

Ω

1.2V

To Filter

Internal to the device

Differential Input Mode

16m Vp-p

180°

Input Signal

FIGURE 1: ISD4003 SERIES ANA IN MODES

RAC

TRAC

(200 ms)

25 ms

TRACL

FIGURE 2: RAC TIMING WAVEFORM DURING NORMAL OPERATION

(example of 8KHz sampling rate)

ISD4003 SERIES

- 12 -

7. FUNCTIONAL DESCRIPTION

7.1. DETAILED DESCRIPTION

Audio Quality

The Winbond’s ISD4003 ChipCorder® series is offered at 8.0, 6.4, 5.3 and 4.0 kHz sampling

frequencies, allowing the user a choice of speech quality options. Increasing the sampling frequency

will produce better sound quality, but affects duration. Please refer to Table 1: Product Summary for

details.

Analog speech samples are stored directly into on-chip non-volatile memory without the digitization

and compression associated with other solutions. Direct analog storage provides higher quality

reproduction of voice, music, tones, and sound effects than other solid-state solutions.

Duration

The ISD4003 Series is a single-chip solution with 4-, 5-, 6-, and 8-minute duration.

TABLE 1: PRODUCT SUMMARY OF ISD4003 SERIES

Part Number Duration

(Minutes)

Sample Rate

(kHz)

Typical Filter Pass

Band (kHz) *

ISD4003-04M 4 8.0 3.4

ISD4003-05M 5 6.4 2.7

ISD4003-06M 6 5.3 2.3

ISD4003-08M 8 4.0 1.7

* This is the –3dB point. This parameter is not checked during production testing and may vary due to process

variations and other factors. Therefore, the customer should not rely upon this value for testing purposes.

Flash Storage

The ISD4003 series utilizes on-chip Flash memory, providing zero-power message storage. The

message is retained for up to 100 years typically without power. In addition, the device can be re-

recorded typically over 100,000 times.

Memory Architecture

The ISD4003 series contains a total of 1,920K Flash memory cells, which is organized as 1,200 rows

of 1,600 cells each.

ISD4003 SERIES

Publication Release Date: January 2004

- 13 - Revision 1.0

Microcontroller Interface

A four-wire (SCLK, MOSI, MISO & SS ) SPI interface is provided for controlling and addressing

functions. The ISD4003 is configured to operate as a peripheral slave device, with a microcontroller-

based SPI bus interface. Read and write operations are controlled through this SPI interface. An

interrupt signal (INT ) and internal read only Status Register are provided for handshake purposes.

Programming

The ISD4003 series is also ideal for playback-only applications, where single- or multiple-messages

playback is controlled through the SPI port. Once the desired message configuration is created,

duplicates can easily be generated via a programmer.

7.2. SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION

The ISD4003 series operates via SPI serial interface with the following protocol.

First, the data transfer protocol assumes that the microcontroller’s SPI shift registers are clocked on

the falling edge of the SCLK. However, for the ISD4003, the protocols are as follows:

1. All serial data transfers begin with the falling edge of SS pin.

2. SS is held LOW during all serial communications and held HIGH between instructions.

3. Data is clocked in on the rising edge of the SCLK signal and clocked out on the falling edge of

the SCLK signal, with LSB first.

4. Playback and record operations are initiated when the device is enabled by asserting the SS

pin LOW, shifting in an opcode and an address data to the ISD4003 device (refer to the

Opcode Summary in the following page).

5. The opcodes contain <11 address bits> and <5 control bits>.

6. Each operation that ends with an EOM or Overflow will generate an interrupt. The Interrupt

will be cleared the next time a SPI cycle is initiated.

7. As Interrupt data is shifted out of the MISO pin, control and address data are simultaneously

shifted into the MOSI pin. Care should be taken such that the data shifted in is compatible

with current system operation. Because it is possible to read an interrupt data and start a new

operation within the same SPI cycle.

8. An operation begins with the RUN bit set and ends with the RUN bit reset.

9. All operations begin after the rising edge of SS .

ISD4003 SERIES

- 14 -

7.2.1. OPCODES

The available Opcodes are summarized as follows:

TABLE 2: OPCODE SUMMARY

OpCodes

Descriptions

Instructions

Address (11 bits)

Control bits (5 bits)

C0 C1 C2 C3 C4

POWERUP <XXXXXXXXXXX> 0 0 1 0 0 Power-Up: Device will be ready for an operation after

TPUD.

SETPLAY <A0 – A10> 0 0 1 1 1 Initiates playback from address <A0-A10>.

PLAY <XXXXXXXXXXX> 0 1 1 1 1 Playback from the current address (until EOM or OVF).

SETREC <A0 – A10> 0 0 1 0 1 Initiates a record operation from address <A0-A10>.

REC <XXXXXXXXXXX> 0 1 1 0 1 Records from current address until OVF is reached or

Stop command is sent.

SETMC <A0 – A10> 1 0 1 1 1 Initiates Message Cueing (MC) from address <A0-

A10>.

MC [1] <XXXXXXXXXXX> 1 1 1 1 1 Performs a Message Cueing from current location.

Proceeds to the end of message (EOM) or enters OVF

condition if no more messages are present.

STOP <XXXXXXXXXXX> 0 1 1 X 0 Stops the current operation.

STOPPWRDN <XXXXXXXXXXX> X 1 0 X 0 Stops the current operation and enters into standby

(power-down) mode.

RINT [2] <XXXXXXXXXXX> 0 1 1 X 0 Read Interrupt status bits: Overflow and EOM.

Notes:

C0 = Message cueing

C1 = Ignore address bit

C2 = Master power control

C3 = Record or playback operation

C4 = Enable or disable an operation

[1] Message Cueing can be selected only at the beginning of a playback operation.

[2] As the Interrupt data is shifted out of the ISD4003, control and address data are being shifted in. Care should

be taken such that the data shifted in is compatible with current system operation. It is possible to read interrupt

data and start a new operation at the same time. See Figures 5 - 8 for references.

ISD4003 SERIES

Publication Release Date: January 2004

- 15 - Revision 1.0

7.2.2. SPI Diagrams

Row Counter

Output Shift Register

Input Shift Register

Select Logic

MOSI

MISO

A0-A10

P0-P10

(Loaded to Row Counter

only if IAB = 0)

OVF EOM

FIGURE 3: SPI INTERFACE SIMPLIFIED BLOCK DIAGRAM

The following diagram describes the SPI port and the control bits associated with it.

OVF EOM P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 0 0 0

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 C0 C1 C2 C3 C4

MISO

MOSI

Message Cueing (MC)

Ignore Address Bit (IAB)

Power Up (PU)

Play/Record (P/R)

RUN

LSB MSB

FIGURE 4: SPI PORT

ISD4003 SERIES

- 16 -

7.2.3. SPI Control and Output Registers

The SPI control register provides control of individual function such as play, record, message cueing,

power-up, power-down, start, stop and ignore address pointer operations.

TABLE 3: SPI CONTROL REGISTERS

Control Bit Control Register Bit Device Function

C0 MC

Message Cueing function

Enable Message Cueing

Disable Message Cueing

C1 IAB

[1]

Ignore Address bit

Ignore input address register (A0-A10)

Use the input address register (A0-A10)

C2 PU

Power Up

Power-Up

Power-Down

C3 P/ R

Playback or Record

Play

Record

C4 RUN

Enable or Disable an operation

Start

Stop

Address Bits A0-A10 Input address register

TABLE 4: SPI OUTPUT REGISTERS

Output Bits Description

OVF Overflow

EOM End-of-Message

P0-P10 Output of the row pointer register

[1] When IAB (Ignore Address Bit) is set to 0, a playback or record operation starts from address (A0-A10). For

consecutive playback or record, IAB should be changed to a 1 before the end of that row (see RAC timing).

Otherwise the ISD4003 will repeat the operation from the same row address. For memory management, the Row

Address Clock (RAC) signal and IAB can be used to move around the memory segments.

ISD4003 SERIES

Publication Release Date: January 2004

- 17 - Revision 1.0

Message Cueing

Message cueing (MC) allows the user to skip through messages, without knowing the actual physical

location of the messages. It will stop when an EOM marker is reached. Then, the internal address

counter will point to the next message. Also, it will enter into OVF condition when it reaches the end of

memory. In this mode, the messages are skipped 1,600 times faster than the normal playback

mode.

Power-Up Sequence

The ISD4003 will be ready for an operation after power-up command is sent and followed by the TPUD

timing (25 ms for 8 KHz sampling rate). Refer to the AC timing table for other TPUD values with respect

to different sampling rates.

The following sequences are recommended for optimized Record and Playback operations.

Record Mode

1. Send POWERUP command.

2. Wait TPUD (power-up delay).

3. Send POWERUP command.

4. Wait 2 x TPUD (power-up delay).

5. a). Send SETREC command with address xx, or

b). Send REC command (recording from current location).

6. Send STOP command to stop recording.

7. Wait TSTOP/PAUSE.

For 3 & 4), please refer to Apps Brief 39A: recorded pop elimination in the ISD4000 series.

For 5.a), the device will start recording at address xx and will generate an interrupt when an overflow

(end of memory array) is reached, if no STOP command is sent before that. Then, it will automatic

stop recording operation.

Playback Mode

1. Send POWERUP command

2. Wait TPUD (power-up delay)

3. a). Send SETPLAY command with address xx, or

b). Send PLAY command (playback from current location).

4. a). Send STOP command to halt the playback operation, or

b). Wait for playback operation to stop automatically, when an EOM or OVF is reached.

5. Wait TSTOP/PAUSE.

For 3.a), the device will start playback at address xx and it will generate an interrupt when an EOM or

OVF is reached. It will then stop playback operation.

ISD4003 SERIES

- 18 -

8. TIMING DIAGRAMS

TSSH

TSSmin

TSCKhi

TSSS

TDIS

TDIH TSCKlow

TPD TPD TDF

(TRISTATE)

LSB

SCLK

MOSI

MISO

FIGURE 5: TIMING DIAGRAM

SCLK

MOSI

MISO

A8 A9 A10 C0 C1 C2 C3 C4

OVF EOM P0 P1 P2 P3 P4 P5

LSB

FIGURE 6: 8-BIT COMMAND FORMAT

ISD4003 SERIES

Publication Release Date: January 2004

- 19 - Revision 1.0

SCLK

MOSI

MISO

LSB

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 C0 C1 C2 C3 C4

XXXP10P9P8P7P6P5P4P3P2P1P0EOMOVF

FIGURE 7: 16-BIT COMMAND FORMAT

SCLK

MOSI

MISO

ANA IN

ANA OUT

Data

Play/Record Stop

Data

(Rec)

(Play)

TSTOP/PAUSE

FIGURE 8: PLAYBACK/RECORD AND STOP CYCLE

≈ ≈ ≈ ≈ ≈ ≈ ≈ ≈

≈ ≈ ≈ ≈ ≈

≈

≈ ≈ ≈

≈

ISD4003 SERIES

- 20 -

9. ABSOLUTE MAXIMUM RATINGS

TABLE 5: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pin (VSS –0.3V) to (VCC +0.3V)

Voltage applied to any pin (Input current limited to ±20mA) (VSS –1.0V) to (VCC +1.0V)

Voltage applied to MOSI, SCLK, and SS pins

(Input current limited to ±20mA)

(VSS –1.0V) to 5.5V

Lead temperature (soldering – 10 seconds) 300°C

VCC – VSS -0.3V to +7.0V

TABLE 6: ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pad (VSS –0.3V) to (VCC +0.3V)

Voltage applied to any pad (Input current limited to ±20 mA) (VSS –1.0V) to (VCC +1.0V)

Voltage applied to MOSI, SCLK, and SS pins

(Input current limited to ±20mA)

(VSS –1.0V) to 5.5V

VCC – VSS -0.3V to +7.0V

Note: Stresses above those listed may cause permanent damage to the device. Exposure to the absolute

maximum ratings may affect device reliability and performance. Functional operation is not implied at these

conditions.

ISD4003 SERIES

Publication Release Date: January 2004

- 21 - Revision 1.0

9.1. OPERATING CONDITIONS

TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

Commercial operating temperature range (Case temperature) 0°C to +70°C

Extended operating temperature (Case temperature) -20°C to +70°C

Industrial operating temperature (Case temperature) -40°C to +85°C

Supply voltage (VCC) [1] +2.7V to +3.3V

Ground voltage (VSS) [2] 0V

TABLE 8: OPERATING CONDITIONS (DIE)

CONDITIONS VALUES

Commercial operating temperature range 0°C to +50°C

Supply voltage (VCC) [1] +2.7V to +3.3V

Ground voltage (VSS) [2] 0V

[1] VCC = VCCA = VCCD

[2] VSS = VSSA = VSSD

ISD4003 SERIES

- 22 -

10. ELECTRICAL CHARACTERISTICS

10.1. PARAMETERS FOR PACKAGED PARTS

TABLE 9: DC PARAMETERS

PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Input Low Voltage VIL V

CC x 0.2 V

Input High Voltage VIH V

CC x 0.8 V

Output Low Voltage VOL 0.4 V IOL = 10 µA

RAC, INT Output Low

Voltage

VOL1 0.4 V IOL = 1 mA

Output High Voltage VOH V

CC - 0.4 V IOH = -10 µA

VCC Current (Operating)

- Playback

- Record

ICC

REXT = ∞ [3]

VCC Current (Standby) ISB 1 10 µA

[3] [4]

Input Leakage Current IIL

±1 µA

MISO Tristate Current IHZ 1 10 µA

Output Load Impedance REXT 5 KΩ

ANA IN+ Input Resistance RANA IN+ 2.2 3.0 3.8 KΩ

ANA IN- Input Resistance RANA IN- 40 56 71 KΩ

ANA IN+ or ANA IN- to AUD

OUT Gain

AARP 23 dB 32 mVpp 1 KHz

sinewave input [5]

Notes:

[1] Typical values @ TA = 25°C and VCC = 3.0V.

[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all

specifications are 100 percent tested.

[3] V

CCA and VCCD connected together.

[4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.

[5] Measured with AutoMute feature disabled.

ISD4003 SERIES

Publication Release Date: January 2004

- 23 - Revision 1.0

TABLE 10: AC PARAMETERS (Packaged Parts)

CHARACTERISTIC SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Sampling Frequency

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

8.0

6.4

5.3

4.0

KHz

[5]

Filter Pass Band

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

FCF

3.4

2.7

2.3

1.7

KHz

3 dB Roll-Off Point[3][7]

Record Duration

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TREC

min

[6]

Playback Duration

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TPLAY

min

[6]

Power-Up Delay

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TPUD

31.25

37.5

msec

Stop or Pause in Record or Play

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TSTOP or TPAUSE

62.5

100

msec

RAC Clock Period

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TRAC

200

250

300

400

msec

[10]

RAC Clock Low Time

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TRACL

31.25

37.5

msec

RAC Clock Period in Message

Cueing Mode

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TRACM

125

156.3

187.5

250

µsec

RAC Clock Low Time in

Message Cueing Mode

ISD4003-04M

ISD4003-05M

ISD4003-06M

ISD4003-08M

TRACML

15.63

19.53

23.44

31.25

µsec

Total Harmonic Distortion THD 1 2 % 32 mVpp 1 KHz

sinewave input [11]

ANA IN Input Voltage VIN 32 mV Peak-to-Peak

[4] [8] [9]

ISD4003 SERIES

- 24 -

Notes:

[1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)

[4] Single-ended input mode. In the differential input mode, VIN maximum for ANA IN+ and ANA IN- is 16

mVp-p.

[5] Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage

ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage ranges.

For greater stability, an external clock can be utilized (see Pin Descriptions)

[6] Playback and Record Duration can vary as much as ±2.25 percent over the commercial temperature and

voltage ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage

ranges. For greater stability, an external clock can be utilized (see Pin Descriptions)

[7] Filter specification applies to the antialiasing filter and the smoothing filter. Therefore, from input to

output, expect a 6 dB drop by nature of passing through both filters.

[8] The typical output voltage will be approximately 450 mVp-p with VIN at 32 mVp-p.

[9] For optimal signal quality, this maximum limit is recommended.

[10] When a record command is sent, TRAC = TRAC + TRACL on the first row address.

[11] Measured with AutoMute feature disabled.

ISD4003 SERIES

Publication Release Date: January 2004

- 25 - Revision 1.0

10.2. PARAMETERS FOR DIE

TABLE 11: DC PARAMETERS

PARAMETERS [6] SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Input Low Voltage VIL V

CC x 0.2 V

Input High Voltage VIH V

CC x 0.8 V

Output Low Voltage VOL 0.4 V IOL = 10 µA

RAC, INT Output Low

Voltage

VOL1 0.4 V IOL = 1 mA

Output High Voltage VOH V

CC - 0.4 V IOH = -10 µA

Operating Current

-Playback

-Record

ICC

REXT = ∞ [3]

Standby Current ISB 1 10 µA

[3] [4]

Total Harmonic Distortion THD 1 2 % 32 mVpp 1 KHz

sinewave input [5]

ANA IN+ or ANA IN- to AUD

OUT Gain

AARP 23 dB

32 mVpp 1 KHz

sinewave input [5]

Notes:

[1] Typical values @ TA = 25°C and VCC = 3.0V. Sampling Frequency can vary as much as ±2.25 percent

over the commercial temperature and voltage ranges

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] V

CCA and VCCD connected together.

[4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.

[5] Measured with AutoMute feature disabled.

[6] The test coverage for die is limited to room temperature testing. The test conditions may differ from that

of packaged parts.

ISD4003 SERIES

- 26 -

10.3. SPI AC PARAMETERS

TABLE 12: AC PARAMETERS[1]

PARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONS

SS Setup Time TSSS 500 nsec

SS Hold Time TSSH 500 nsec

Data in Setup Time TDIS 200 nsec

Data in Hold Time TDIH 200 nsec

Output Delay TPD 500 nsec

Output Delay to HighZ [2] T

DF 500 nsec

SS HIGH TSSmin 1 µsec

SCLK High Time TSCKhi 400 nsec

SCLK Low Time TSCKlow 400 nsec

CLK Frequency F0 1,000 KHz

Notes:

[1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.

[2] Tri-state test condition.

MISO

VCC

6.32K

10.91K

50pF (Includes scope and fixture capacitance)

Ω

ISD4003 SERIES

Publication Release Date: January 2004

- 27 - Revision 1.0

11. TYPICAL APPLICATION CIRCUIT

These application examples are for illustration purposes only. Winbond makes no representation or

warranty that such application will be suitable for production.

Make sure all bypass capacitors are as close as possible to the package.

68HC705C8P

ISD4003

15-30 pF

15-25 pF

10 K

Ω

47 K

Ω

47 K

Ω

29 3

C11

0.1 F

C10

0.1 F

1 F

C3 0.22 F

C2 0.22 F

47 F

VCC

10K

R3 100

100K POT

LINE OUT

EXT

SPEAKER

1 F

.1 F

LM4860M

OCS1

OCS2

RESET

IRQ

TCAP

TCMP

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PD7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PD0/RDI

PD1/TD0

PD2/MISO

PD3/MOSI

PD4/SCK

PD5/SS

MISO

MOSI

SCLK

ANA IN-

ANA IN+

RAC

INT

XCLK

AM CAP

VCCD

VSSD

VCCA

VSSA

AUD OUT

-IN

+IN

BYPASS

HP-IN1

HP-IN2

HPSENSE

SHUTDOWN

GAIN-OUT

V01

V02

VDD

GND

PDIP / SOIC

VCC

FIGURE 9: APPLICATION EXAMPLE USING SPI

ISD4003 SERIES

- 28 -

COP 820C ISD4003

22 3

0.1 F

1 F

C3 0.22 F

C2 0.22 F

47 F

VCC

10K

R3 100 R4

100K POT

LINE OUT

EXT

SPEAKER

1 F

.1 F

LM4860M

GND

RESET

VCC

CLI

MISO

MOSI

SCLK

ANA IN-

ANA IN+

RAC

INT

XCLK

AM CAP

VCCD

VSSD

VCCA

VSSA

AUD OUT

-IN

+IN

BYPASS

HP-IN1

HP-IN2

HPSENSE

SHUTDOWN

GAIN-OUT

V01

V02

VDD

GND

PDIP / SOIC

C10

4.7 K

Ω

4.7 K

Ω

3.3 KΩ

82 pF

INT

L0 11

VCC

VCC VCC

FIGURE 10: APPLICATION EXAMPLE USING MICROWIRE

ISD4003 SERIES

Publication Release Date: January 2004

- 29 - Revision 1.0

COP 820C ISD4003

22 3

0.1 F

1 F

C3 0.22 F

C2 0.22 F

47 F

VCC

10K

R3 100 R4

100K POT

LINE OUT

EXT

SPEAKER

1 F

.1 F

LM4860M

GND

RESET

VCC

CLI

MISO

MOSI

SCLK

ANA IN-

ANA IN+

RAC

INT

XCLK

AM CAP

VCCD

VSSD

VCCA

VSSA

AUD OUT

-IN

+IN

BYPASS

HP-IN1

HP-IN2

HPSENSE

SHUTDOWN

GAIN-OUT

V01

V02

VDD

GND

PDIP / SOIC

C10

4.7 K

Ω

4.7 K

Ω

3.3 KΩ

82 pF

INT

L0 11

VCC

VCC VCC

FIGURE 11: APPLICATION EXAMPLE USING SPI PORT ON MICROCONTROLLER

ISD4003 SERIES

- 30 -

12. PACKAGING AND DIE INFORMATION

12.1. 28-LEAD 300-MIL PLASTIC SMALL OUTLINE IC (SOIC)

28 27 26 25 24 23 22 21 20 19 18 17 16 15

12345 67891011 12 13 14

INCHES MILLIMETERS

Min Nom Max Min Nom Max

A 0.701 0.706 0.711 17.81 17.93 18.06

B 0.097 0.101 0.104 2.46 2.56 2.64

C 0.292 0.296 0.299 7.42 7.52 7.59

D 0.005 0.009 0.0115 0.127 0.22 0.29

E 0.014 0.016 0.019 0.35 0.41 0.48

F 0.050 1.27

G 0.400 0.406 0.410 10.16 10.31 10.41

H 0.024 0.032 0.040 0.61 0.81 1.02

Note: Lead coplanarity to be within 0.004 inches.

ISD4003 SERIES

Publication Release Date: January 2004

- 31 - Revision 1.0

12.2. 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)

INCHES MILLIMETERS

Min Nom Max Min Nom Max

A 1.445 1.450 1.455 36.70 36.83 36.96

B1 0.150 3.81

B2 0.065 0.070 0.075 1.65 1.78 1.91

C1 0.600 0.625 15.24 15.88

C2 0.530 0.540 0.550 13.46 13.72 13.97

D 0.19 4.83

D1 0.015 0.38

E 0.125 0.135 3.18 3.43

F 0.015 0.018 0.022 0.38 0.46 0.56

G 0.055 0.060 0.065 1.40 1.52 1.62

H 0.100 2.54

J 0.008 0.010 0.012 0.20 0.25 0.30

S 0.070 0.075 0.080 1.78 1.91 2.03

q 0° 15° 0° 15°

ISD4003 SERIES

- 32 -

12.3. 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1

INCHES MILLIMETERS

Min Nom Max Min Nom Max

A 0.520 0.528 0.535 13.20 13.40 13.60

B 0.461 0.465 0.469 11.70 11.80 11.90

C 0.311 0.315 0.319 7.90 8.00 8.10

D 0.002 0.006 0.05 0.15

E 0.007 0.009 0.011 0.17 0.22 0.27

F 0.0217 0.55

G 0.037 0.039 0.041 0.95 1.00 1.05

H 0° 3° 6° 0° 3° 6°

I 0.020 0.022 0.028 0.50 0.55 0.70

J 0.004 0.008 0.10 0.21

Note: Lead coplanarity to be within 0.004 inches.

ISD4003 SERIES

Publication Release Date: January 2004

- 33 - Revision 1.0

12.4. DIE INFORMATION

ISD4003 Series

o Die Dimensions (with scribe line) [1]

X: 166.6 ± 1 mils

Y: 274.9 ± 1 mils

o Die Thickness [2]

11.5 ± 0.5 mils

o Pad Opening

Single pad: 90 x 90 microns

Double pad: 180 x 90 microns

Notes:

[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or

damage may occur.

[2] Die thickness is subject to change, please contact Winbond as this thickness may change in the future.

[3] Double bond is recommended if treated as one pad.

MISO

MOSI

SS VCCD

SCLK INT RAC

VSSA

VSSD

VCCD

XCLK

≈ISD4003 ≈

VCCA

[3]

ANA IN+

AM CAP

AUD OUT

VSSA

[3]

VSSA

ANA IN-

VSSA

[3]

VCCA

[3]

ISD4003 SERIES

- 34 -

ISD4003 SERIES PAD COORDINATIONS

(with respect to die center)

Pad Pad Description X Axis (µm) Y Axis (µm)

VSSA Analog Ground 1885.2 3273.7

RAC Row Address Clock 1483.8 3273.7

INT Interrupt 794.8 3273.7

XCLK External Clock Input 564.8 3273.7

VCCD Digital Power Supply 384.9 3273.7

VCCD Digital Power Supply 169.5 3273.7

SCLK Slave Clock -14.7 3273.7

SS Slave Select -198.1 3273.7

MOSI Master Out Slave In -1063.7 3273.7

MISO Master In Slave Out -1325.6 3273.7

VSSD Digital Ground -1665.3 3273.7

VSSD Digital Ground -1836.9 3273.7

VSSA

[1] Analog Ground -1943.1 -3272.4

VSSA

[1] Analog Ground -1853.1 -3272.4

VSSA Analog Ground -1599.9 -3272.4

AUD OUT Audio Output 281.9 -3272.4

AM CAP AutoMute 577.3 -3272.4

ANA IN- Inverting Analog Input 1449.3 -3272.4

ANA IN+ Noninverting Analog Input 1603.5 -3272.4

VCCA

[1] Analog Power Supply 1853.7 -3272.4

VCCA

[1] Analog Power Supply 1943.7 -3272.4

Note:

[1] Double bond recommended if treated as one pad.

ISD4003 SERIES

Publication Release Date: January 2004

- 35 - Revision 1.0

13. ORDERING INFORMATION

When ordering ISD4003 Series devices, please refer to the following valid part numbers.

Die / Package Part Number

Die ISD4003-04MX ISD4003-05MX ISD4003-06MX ISD4003-08MX

PDIP ISD4003-04MP ISD4003-05MP ISD4003-06MP ISD4003-08MP

ISD4003-04MS ISD4003-05MS ISD4003-06MS ISD4003-08MS

SOIC

ISD4003-04MSI ISD4003-05MSI ISD4003-06MSI ISD4003-08MSI

ISD4003-04ME ISD4003-05ME ISD4003-06ME ISD4003-08ME

ISD4003-04MED ISD4003-05MED ISD4003-06MED ISD4003-08MED

TSOP

ISD4003-04MEI ISD4003-05MEI ISD4003-06MEI ISD4003-08MEI

For the latest product information, access Winbond worldwide website at http://www.winbond-usa.com

ISD4003-

Product Family :

Product Series :

ISD4000 Family

03 = Third Series (4-8 min)

Duration :

Special Temperature Field :

Packaged Units / Die :

04M = 4 minutes

05M = 5 minutes

06M = 6 minutes

08M = 8 minutes

Blank = Commercial Package (0°C to + 70°C)

or Commercial Die (0°C to + 50°C)

D = Extended (-20°C to + 70°C)

I = Industrial (-40°C to + 85°C)

X = Die

P = 28-Lead 600-mil Plastic Dual Inline

Package (PDIP)

S = 28-Lead 300-mil Plastic Small Outline

Package (SOIC)

E = 28-Lead 8x13.4mm Plastic Thin Small

Outline Package (TSOP) Type 1

ISD4003 SERIES

- 36 -

14. VERSION HISTORY

VERSION DATE DESCRIPTION

0 June 2000 Initial version

1.0 Jan. 2004 Reformat the document.

Add note for typical filter pass band.

Add memory architecture description.

Remove all CSP info.

Revise RAC timing parameter for MC.

Revise AutoMute: playback only.

Revise SPI, opcodes sections, record & playback steps.

Rename TRACLO to TRACL.

Revise AARP parameter.

Revise DC & AC parameters tables for die.

Revise die: (x,y) coordinates.

Figures 9-11: revise VCCA and VCCD pin #.

Revise Ordering Information.

ISD4003 SERIES

Publication Release Date: January 2004

- 37 - Revision 1.0

Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,

Science-Based Industrial Park, CA 95134, U.S.A. 200336 China

Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999

TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998

FAX: 886-3-5665577 http://www.winbond-usa.com/

http://www.winbond.com.tw/

Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.

9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,

Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,

Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong

TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100

FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.

All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond

makes no representation or warranties with respect to the accuracy or completeness of the contents of this

publication and reserves the right to discontinue or make changes to specifications and product descriptions at

any time without notice. No license, whether express or implied, to any intellectual property or other right o

Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and

Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty o

merchantability, fitness for a particular purpose or infringement of any Intellectual property.

Winbond products are not designed, intended, authorized or warranted for use as components in systems o

equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for othe

applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications

wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe

property or environmental injury could occur.

pplication examples and alternative uses of any integrated circuit contained in this publication are for illustration

only and Winbond makes no representation or warranty that such applications shall be suitable for the use

specified.

ISD® and ChipCorder® are trademarks of Winbond Electronics Corporation.

The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published

in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product

incorporates SuperFlash® technology licensed from SST.

Information contained in this ISD® ChipCorder®data sheet supersedes all data for the ISD ChipCorder products

published by ISD® prior to August, 1998.

This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD® ChipCorder

product specifications. In the event any inconsistencies exist between the information in this and other product

documentation, or in the event that other product documentation contains information in addition to the information

in this, the information contained herein supersedes and governs such other information in its entirety.

trademark of Winbond. All other trademarks are properties of their respective owners.