HIGH FREQUENCY DEVICES MICROWAVE ISOLATOR-SURFACE MOUNT CE073 Series FEATURES 800 ~ 2000MHz frequency is available Miniature, low profile and light weight, low IL Reflow solderable Low price by reducing the parts APPLICATIONS Hand held telephone Cordless telephone Interstage matching in microwave circuits DIMENSIONS: mm PART NUMBERING CE 073 R836 D C B 001 - TA1 7 0.4 4.5 1 Series Name A 5.0 Model Number 7 1 0.1 4.75 B 1.5 0.1 Center Frequency (In GHz, R : Decimal point) Band Width Rated Power H : Input or Output : GROUND H: CE073 2.3mm CE074 1.8 mm Signal Direction (Specify A or B in Fig. 1. B is standard.) Standard type has no number. (Additional numbers for special specification) Packaging Type TA1 : 178mm Dia. reel taping (250 pcs/reel) TA2 : 330mm Dia. reel taping (1000 pcs/reel) nothing : bulk Signal Direction Marking: IN ON 0.45 Fig. 1. Terminal Location and Signal Direction (A or B) SPECIFICATIONS - CE073 Series Application Part Number Frequency Range (MHz) Insertion Loss (dB) Isolation (dB) VSWR Rated Power (W) Reflection Power (W) PDC CE073R950CCB 940 ~ 960 0.7 max. 13 min. 1.6 max. 2.5 0.6 EPDC CE073R942DCB 925 ~ 960 0.7 max. 13 min. 1.6 max. 2.5 0.6 CDMA CE073R836DCB 824 ~ 849 0.65 max. 15 min. 1.5 max. 2.5 0.6 PDC CE0731R44CCB 1429 ~ 1453 0.6 max. 15 min. 1.5 max. 2.5 0.6 PCS CE0731R88DCB 1850 ~ 1910 0.6 max. 15 min. 1.6 max. 2.5 0.6 Note: Operating temperature range : -35C ~ +85C. At this temperature the isolator shall satisfy the above specification. INSERTION LOSS 0 0 10 10 Isolation (dB) Isolation (dB) ISOLATION 20 30 836 Frequency (MHz) 306 30 40 40 736 20 936 736 836 936 Frequency (MHz) CG01-J HIGH FREQUENCY DEVICES MICROWAVE ISOLATOR-SURFACE MOUNT DIMENSIONS 4.5 3.4 2.8 3.9 0 3.9 5.00 All slot width 0.3mm Di 3.45 3.00 2.50 2.05 2.8 CE073 Series Land Pattern 0.00 a. 0.5 0T /H 2.50 CE052 Series Land Pattern 4.5 LAND DIMENSIONS: mm 3.4 LAND DIMENSIONS: mm 6.00 Slit width 0.25 5 4.50 4.25 3.75 4.00 0.70 3.50 2.50 1.75 3.9 0 1.00 4.5 4.94 5 0 1.8 2.5 2.8 4.94 2.8 2.5 1.8 0.70 0.70 0.00 2.05 4.65 2.65 4.65 2.65 CE073 Solder Resist CE052 Series Solder Resist 0 3.45 0.70 5 4.5 0.54 (Z0=50 Ohm) 2.5 2.00 0.70 2.5 1.6 1.16 0.6 0.16 2.00 0.00 0.00 5.6 4.5 4.60 5.75 3.40 2.60 3.75 1.50 HIGH FREQUENCY DEVICES 0.60 0.00 0.60 Note: 1. PCB Material; FR-4 Glass-Epoxy, h=0.30mm (or 0.10mmx3 Layers). 2. Hatched sections show the circuit patterns or the solder-masking pattern. 3. The bottom surface is a ground plane. 4. To place a ground plane at 0.3mm from the top surface is recommended. Less distance may result in variation of the operating frequency due to stray capacitance. 4.5 2.8 0 TAPE DIMENSIONS: mm PO T T DO P2 B W B W Max 7 F F Max 7 Max 7 E DO Max 7 PO P2 Note: Impedance of both input and output lines should be 50 ohms including land pattern. This is the land pattern which applies t=0.2mm glass epoxy board (dielectric constant=4.8, copper metalized on both surfaces). The stray capacitance should be reduced as much as possible by removing the ground layer under the I/O land to secure the isolator performance. E TAPE DIMENSIONS: mm 2.8 4.5 3.55 1.95 0.00 1.95 3.55 0.6 0 0.6 D1 A P1 K CE052 SERIES A 5.8 0.1 F 7.5 0.1 B 5.4 0.1 K 2.0 +0.2 -0 A P1 K CE073 SERIES W 16 0.2 P0 4 0.1 D0 1.55 0.05 P1 12 0.1 P2 2 0.1 E 1.75 0.1 A 7.4 0.1 B 7.4 0.1 W 16 0.2 D0 1.55 0.05 D1 1.5 min. E 1.75 0.1 T 0.3 0.05 F 7.5 0.1 K 2.5 +0.2 -0 P0 4 0.1 P1 12 0.1 P2 2 0.1 T 0.3 0.05 Note: A and B are the bottom of dimensions of the cavity. CG01-J 307 HIGH FREQUENCY DEVICES MICROWAVE ISOLATOR-SURFACE MOUNT SOLDERING AND MOUNTING SOLDERING 1. Reflow Soldering Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area in Fig. 1. When soldering is repeated, the allowed time should be taken for the accumulated time. The standard soldering conditions are shown in Fig. 2. 2. Soldering with soldering iron Soldering with soldering iron should be carried out according to the following conditions. Pre-heating Temperature: 150C Time: 60 to 120 sec. Soldering Temperature (at the tip of the soldering iron): less than 280C. Time: less than 10 sec. 260 MOUNTING When mounting the CE073 series isolator with a component placement machine, a non-magnetic tool should be used since there is some magnetic leakage from the isolator. Temperature (C) 250 240 230 220 TERMINAL DIRECTION 210 200 190 180 10 20 30 Time (sec.) 40 50 60 70 80 Solder: Sn60%-Pb40% 90 GND GND GND Fig. 1. Allowable temperature and time of reflow soldering M Note: It is allowed to be reflow soldered up to two times with this condition. M I/O I/O I/O Temperature (C) Peak temperature 225 5C Direction of Feed 220 200 150 100 Pre-heating 150 10C REEL DIMENSIONS: mm W1 25 0 D BB Time (sec.) within 60 ~ 120 sec. A 10 sec. max. N C 20 ~ 40 sec. max. W2 Measuring point of temperature in-out terminals of the device. Reflow Soldering: Both convection and infrared rays Hot air Hot plate Part No. TA1 TA2 Tolerance Fig. 2. Reflow soldering standard condition A 178 330 2.0 B 13 13 0.5 C 21 21 0.8 D 2 2 0.5 N min. 50 50 -- W1 W2 max. 17.5 23 17.5 23 1.5 -- TAPING CONDITION Trailer Tape Components Empty Cavities Leader Without Sticking Material Plastic Tape No Components 130 20 308 Components 30 10 Cover Tape Only No Components 240 25 260 20 CG01-J