0
10
20
30
40
736 836 936
Frequency (MHz)
Isolation (dB)
0
10
20
30
40
736 836 936
Frequency (MHz)
Isolation (dB)
HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR– SURFACE MOUNT
CE073 Series
FEATURES
■800 ~ 2000MHz frequency is available
■Miniature, low profile
and light weight, low IL
■Reflow solderable
■Low price by reducing the parts
APPLICATIONS
■Hand held telephone
■Cordless telephone
■Interstage matching in microwave circuits
PART NUMBERING
SPECIFICATIONS – CE073 Series
CE 073 R836 D C B 001 – TA1
Series Name
Model Number
Center Frequency (In GHz, R : Decimal point)
Band Width
Rated Power
Signal Direction (Specify A or B in Fig. 1. B is standard.)
Standard type has no number. (Additional numbers for special specification)
Packaging Type TA1 : 178mm Dia. reel taping (250 pcs/reel)
TA2 : 330mm Dia. reel taping (1000 pcs/reel)
nothing : bulk
4.5
5.0
1.5 ± 0.1
1 ± 0.1
0.4
7
7
H
0.45
4.75
1
A
B
Application Part Number Frequency Insertion Loss Isolation VSWR Rated Power Reflection Power
Range (MHz) (dB) (dB) (W) (W)
PDC CE073R950CCB 940 ~ 960 0.7 max. 13 min. 1.6 max. 2.5 0.6
EPDC CE073R942DCB 925 ~ 960 0.7 max. 13 min. 1.6 max. 2.5 0.6
CDMA CE073R836DCB 824 ~ 849 0.65 max. 15 min. 1.5 max. 2.5 0.6
PDC CE0731R44CCB 1429 ~ 1453 0.6 max. 15 min. 1.5 max. 2.5 0.6
PCS CE0731R88DCB 1850 ~ 1910 0.6 max. 15 min. 1.6 max. 2.5 0.6
Note: Operating temperature range : –35°C ~ +85°C. At this temperature the isolator shall satisfy the above specification.
Fig. 1. Terminal Location and Signal Direction (A or B)
ISOLATION INSERTION LOSS
DIMENSIONS: mm
306 CG01-J
: Input or Output
: GROUND
H: CE073 2.3mm
CE074 1.8 mm
Signal Direction Marking: IN ON
Dia. 0.50 T/H
2.00
0.00
2.00
4.00
6.00
0.70
0.70
0.00
2.05
3.45
0.00
2.05
2.50
3.00
3.45
4.50
4.25
3.75 3.50
2.50
1.75
0.00
2.50
5.00
1.00
0.54 (Z0=50 Ohm)
0.70
0.70
0.70
Slit width 0.25
HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR – SURFACE MOUNT
DIMENSIONS
CG01-J 307
LAND DIMENSIONS: mm
CE052 Series Land Pattern
Note: A and B are the bottom of dimensions of the cavity.
LAND DIMENSIONS: mm
All slot
width 0.3mm
0
4.5
2.8
3.9 3.4
4.5
2.8
3.9
3.4
0
4.5
2.8
4.5
4.94 5
5
4.94
1.8
2.8
1.8
2.5
2.5
1.6
0.6
00.16
1.16
2.5
4.5
5.6
3.9
5
2.5
CE073 Series
Land Pattern
CE073 Solder Resist
Note: Impedance of both input and output lines should be 50 ohms including land
pattern. This is the land pattern which applies t=0.2mm glass epoxy board (dielectric
constant=4.8, copper metalized on both surfaces). The stray capacitance should be
reduced as much as possible by removing the ground layer under the I/O land to secure
the isolator performance.
P2
PO DO
P1 A
Max 7°Max 7°
K
B
T
W
FE
TAPE DIMENSIONS: mm
CE052 SERIES
AB W D0 E
5.8 ± 0.1 5.4 ± 0.1 16 ± 0.2 1.55 ± 0.05 1.75 ± 0.1
F K P0 P1 P2 T
7.5 ± 0.1 2.0 4 ± 0.1 12 ± 0.1 2 ± 0.1 0.3 ± 0.05
+0.2
–0
P2
PO DO
D1
P1 A
Max 7°Max 7°
K
B
T
W
FE
TAPE DIMENSIONS: mm
CE073 SERIES
ABW D0 D1E
7.4 ± 0.1 7.4 ± 0.1 16 ± 0.2 1.55 ± 0.05 1.5 min. 1.75 ± 0.1
F K P0 P1 P2 T
7.5 ± 0.1 2.5 4 ± 0.1 12 ± 0.1 2 ± 0.1 0.3 ± 0.05
+0.2
–0
5.75
3.75
0.6
0.6
0
4.5
2.8
0
4.5
2.8
4.65
2.65
0
4.65
2.65
3.55
1.95
0.00
3.55
1.95
4.60
3.40
2.60
0.60
0.60
0.00
1.50
CE052 Series Solder Resist
Note:
1. PCB Material; FR-4 Glass-Epoxy, h=0.30mm (or 0.10mmx3 Layers).
2. Hatched sections show the circuit patterns or the solder-masking pattern.
3. The bottom surface is a ground plane.
4. To place a ground plane at 0.3mm from the top surface is recommended.
Less distance may result in variation of the operating frequency due to stray capacitance.
HIGH FREQUENCY
DEVICES
HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR – SURFACE MOUNT
SOLDERING AND MOUNTING
308 CG01-J
TAPING CONDITION
TERMINAL DIRECTION
REEL DIMENSIONS: mm
B
A
D
C
B
N
W2
W1
SOLDERING
1. Reflow Soldering
Soldering must be carried out without exceeding the
approved soldering temperature and time shown within
the shaded area in Fig. 1. When soldering is repeated,
the allowed time should be taken for the accumulated time.
The standard soldering conditions are shown in Fig. 2.
2. Soldering with soldering iron
Soldering with soldering iron should be carried out according
to the following conditions.
Pre-heating
Temperature: 150°C
Time: 60 to 120 sec.
Soldering
Temperature (at the tip of the soldering iron): less than 280°C.
Time: less than 10 sec.
MOUNTING
When mounting the CE073 series isolator with a component
placement machine, a non-magnetic tool should be used since
there is some magnetic leakage from the isolator.
10 20 30 40 50 60 70 80 90
Time (sec.) Solder: Sn60%–Pb40%
Fig. 1. Allowable temperature and time of reflow soldering
Temperature (°C)
260
250
240
230
220
210
200
190
180
within 60 ~ 120 sec.
Pre-heating 150 ± 10°C
Peak temperature 225 ± 5°C
20 ~ 40 sec. max.
Time (sec.)
10 sec.
max.
Fig. 2. Reflow soldering standard condition
Temperature (°C)
220
200
150
100
25
0
Note: It is allowed to be reflow soldered up to two times with this condition.
Measuring point of temperature in-out terminals of the device.
Reflow Soldering:
Both convection and infrared rays
Hot air
Hot plate
Part No. A B C D N min. W1 W2 max.
TA1 178 13 21 2 50 17.5 23
TA2 330 13 21 2 50 17.5 23
Tolerance ±2.0 ±0.5 ±0.8 ±0.5 — ±1.5 —
M M
GND
I/O
GND
I/O
GND
I/O
Direction of Feed
Trailer Tape Components Empty Cavities Leader
Plastic Tape
Cover Tape Only
240 ± 25
No Components
130 ± 20 Components No Components
260 ± 20
Without Sticking
Material
30 ± 10
