AFBR-5710Z and AFBR-5715Z
Families of Multi-Mode Small Form Factor Pluggable (SFP) Optical
Transceivers with Optional DMI for Gigabit Ethernet (1.25 GBd)
Data Sheet
Features
ROHS-6 Compliant
Compliant to IEEE 802.3 Gigabit Ethernet (1.25GBd)
1000BaseSX
Optional Digital Diagnostic Monitoring available
- AFBR-5710Z family: without DMI
- AFBR-5715Z family: with DMI
Per SFF-8472, diagnostic features on AFBR-5715Z
family enable Diagnostic Monitoring Interface for
optical transceivers with real-time monitoring of:
- Transmitted optical power
- Received optical power
- Laser bias current
- Temperature
- Supply voltage
Transceiver specifications according to SFP Multi-
Source Agreement (SFF-8074i) and SFF-8472, Revision
9.3
Manufactured in an ISO 9001 compliant facility
Hot-pluggable
Temperature options
- (Extended) -10°C to +85°C
- (Industrial) -40°C to +85°C
+3.3 V DC power supply
Industry leading EMI performance for high port den-
sity
850 nm Vertical Cavity Surface Emitting Laser (VCSEL)
Eye safety certi ed
LC-Duplex ber connector compliant
Applications
Ethernet Switch
Enterprise Router
Broadband aggregation and wireless infrastructure
Metro Ethernet multi-service access & provisioning
platforms
Description
The AFBR-571xZ family of SFP optical transceivers o ers
the customer a wide range of design options, includ-
ing optional DMI features (further described later), two
temperature ranges (extended or industrial), and choice
of standard or bail delatch. The AFBR-5715Z family
targets those applications requiring DMI features. The
AFBR-5710Z family is a streamlined product designed for
those applications where DMI features are not needed.
Throughout this document, AFBR-571xZ will be used to
refer collectively to the product family encompassing this
entire range of product options.
Part Number Options
The AFBR-571xZ SFP family includes the following prod-
ucts:
Part Number DMI Temperature Latch
AFBR-5710LZ No Extended Standard
AFBR-5710PZ No Extended Bail
AFBR-5710ALZ No Industrial Standard
AFBR-5710APZ No Industrial Bail
AFBR-5715LZ Yes Extended Standard
AFBR-5715PZ Yes Extended Bail
AFBR-5715ALZ Yes Industrial Standard
AFBR-5715APZ Yes Industrial Bail
* Extended Temperature Range is -10 to 85 °C
Industrial Temperature Range is -40 to 85 ° C
Related Products
AFBR-5705Z family: Dual-Rate 1.25 GBd Ethernet
(1000BASE-SX) & 1.0625 GBd Fiber Channel SFP with
DMI
ABCU-5710RZ family : 1.25 GBd Ethernet (1000BASE-T)
SFP for Cat5 cable
AFCT-5705Z family: 1.25 GBd Ethernet (1000BASE-LX)
& 1.0265 GBd Fiber-Channel SFP with DMI
2
Figure 1. SFP Block Diagram
LIGHT FROM FIBER
LIGHT TO FIBER
PHOTO-DETECTOR
RECEIVER
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RDÐ (RECEIVE DATA)
Rx LOSS OF SIGNAL
VCSEL
TRANSMITTER
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TDÐ (TRANSMIT DATA)
TX_FAULT
ELECTRICAL INTERFACE
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
CONTROLLER & MEMORY
OPTICAL INTERFACE
VEET20
TD–
19
TD+
18
VEET17
VCCT16
VCCR15
VEER14
RD+
13
RD–
12
VEER11
TOP OF BOARD
VEET1
TX FAULT
2
TX DISABLE
3
MOD-DEF(2)4
MOD-DEF(1)
5
MOD-DEF(0)
6
RATE SELECT7
LOS
8
VEER9
VEER10
BOTTOM OF BOARD
(AS VIEWED THROUGH TOP OF BOARD)
ENGAGEMENT
SEQUENCE
3 2 1 3 2 1
Figure 2. Pin description of the SFP electrical interface.
Overview
The AFBR-571xZ family of optical transceivers are com-
pliant with the speci cations set forth in the IEEE802.3
(1000BASE-SX) and the Small Form-Factor Pluggable (SFP)
Multi-Source Agreement (MSA). This family of transceivers
is quali ed in accordance with Telcordia GR-468-CORE.
Its primary application is servicing Gigabit Ethernet links
between optical networking equipment.
The AFBR-571xZ o ers maxi mum exibility to designers,
manufacturers, and operators of Gigabit Ethernet net-
working equipment. A pluggable architec ture allows the
module to be installed into MSA standard SFP ports at
any time – even with the host equipment operating and
online. This facilitates the rapid con guration of equip-
ment to precisely the user’s needs – reducing inventory
costs and network downtime. Compared with traditional
transceivers, the size of the Small Form Factor package
enables higher port densities.
Module Diagrams
Figure 1 illustrates the major functional components of the
AFBR-571xZ. The external con guration of the module is
depicted in Figure 7. Figure 8 depicts the panel and host
board footprints.
3
Installation
The AFBR-571xZ can be installed in or removed from any
MSA-compliant Pluggable Small Form Factor port regard-
less of whether the host equipment is operating or not.
The module is simply inserted, electrical-interface rst,
under nger-pressure. Controlled hot-plugging is ensured
by 3-stage pin sequencing at the electrical interface. This
printed circuit board card-edge connector is depicted in
Figure 2.
As the module is inserted, rst contact is made by the
housing ground shield, discharging any potentially com-
ponent-damaging static electricity. Ground pins engage
next and are followed by Tx and Rx power supplies. Finally,
signal lines are connected. Pin functions and sequencing
are listed in Table 2.
Transmitter Section
The transmitter section includes the Transmitter Optical
Sub assembly (TOSA) and laser driver circuitry. The TOSA,
containing an 850 nm VCSEL (Vertical Cavity Surface Emit-
ting Laser) light source, is located at the optical interface and
mates with the LC optical connector. The TOSA is driven by
a custom IC, which converts di erential logic signals into an
analog laser diode drive current. This Tx driver circuit regu-
lates the optical power at a constant level provided the data
pattern is DC balanced (8B10B code for example).
Transmit Disable (Tx_Disable)
The AFBR-571xZ accepts a TTL and CMOS compatible
transmit disable control signal input (pin 3) which shuts
down the transmitter optical output. A high signal imple-
ments this function while a low signal allows normal
transceiver operation. In the event of a fault (e.g. eye
safety circuit activated), cycling this control signal resets
the module as depicted in Figure 6. An internal pull-up
resistor disables the transceiver transmitter until the host
pulls the input low. Host systems should allow a 10ms
interval between successive assertions of this control
signal. Tx_Disable can also be asserted via the 2-wire serial
interface (address A2h, byte 110, bit 6) and monitored
(address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware Tx_Disable (pin 3) to control transmitter opera-
tion.
Transmit Fault (Tx_Fault)
A catastrophic laser fault will activate the transmitter signal,
TX_FAULT, and disable the laser. This signal is an open collec-
tor output (pull-up required on the host board). A low signal
indicates normal laser operation and a high signal indicates
a fault. The TX_FAULT will be latched high when a laser fault
occurs and is cleared by toggling the TX_DISABLE input or
power cycling the transceiver. The transmitter fault condition
can also be monitored via the 2-wire serial interface (address
A2, byte 110, bit 2).
Eye Safety Circuit
The AFBR-571xZ provides Class 1 eye safety by design and
has been tested for compliance with the requirements
listed in Table 1. The eye safety circuit continu ously moni-
tors optical output power levels and will disable the trans-
mitter and assert a TX_FAULT signal upon detecting an
unsafe condition. Such unsafe conditions can be created
by inputs from the host board (Vcc uxuation, unbalanced
code) or faults within the module.
Receiver Section
The receiver section includes the Receiver Optical Subas-
sembly (ROSA) and ampli cation/quantization circuitry. The
ROSA, containing a PIN photodiode and custom trans-im-
pedance preampli er, is located at the optical interface and
mates with the LC optical connector. The ROSA is mated to
a custom IC that provides post-ampli cation and quantiza-
tion. Also included is a Loss Of Signal (LOS) detection circuit.
Receiver Loss of Signal (Rx_LOS)
The Loss Of Signal (LOS) output indicates an unusable
optical input power level. The Loss Of Signal thresholds
are set to indicate a de nite optical fault has occurred
(e.g., disconnected or broken ber connection to receiver,
failed transmitter, etc.).
The post-ampli cation IC includes transition detection
circuitry which monitors the ac level of incoming optical
signals and provides a TTL/CMOS compatible status signal
to the host (pin 8). An adequate optical input results in a
low Rx_LOS output while a high Rx_LOS output indicates
an unusable optical input. The Rx_LOS thresholds are fac-
tory-set so that a high output indicates a de nite optical
fault has occurred. For the AFBR-5715Z family, Rx_LOS can
also be monitored via the 2-wire serial interface (address
A2h, byte 110, bit 1).
4
Functional I/O
The AFBR-571xZ accepts industry standard di erential
signals such as LVPECL and CML within the scope of the
SFP MSA. To simplify board requirements, transmitter bias
resistors and ac coupling capacitors are incorporated, per
SFF-8074i, and hence are not required on the host board.
The module is AC-coupled and internally terminated.
Figure 3 illustrates a recommended interface circuit to
link the AFBR-571xZ to the supporting Physical Layer
integrated circuits.
Timing diagrams for the MSA compliant control signals
implemented in this module are depicted in Figure 6.
The AFBR-571xZ interfaces with the host circuit board
through twenty I/O pins (SFP electrical connector)
identi ed by function in Table 2. The AFBR-571xZ high
speed transmit and receive interfaces require SFP MSA
compliant signal lines on the host board. The Tx_Disable,
Tx_Fault, and Rx_LOS lines require TTL lines on the host
board (per SFF-8074i) if used. If an application chooses
not to take advantage of the functionality of these pins,
care must be taken to ground Tx_Disable (for normal
operation).
Figure 3. Typical application con guration.
LASER DRIVER
& EYE SAFETY
CIRCUITRY
50 Ω
50 Ω
SO1+
SO1–
AMPLIFICATION
&
QUANTIZATION
50 Ω
50 Ω
SI1+
SI1–
VREFR
TBC
EWRAP
RBC
RX_RATE
RX_LOS
GPIO(X)
GPIO(X)
GP14
TX_FAULT
GP04
SYNC
LOOP
SYN1
RC1(0:1)
RFCT
TX[0:9]
RX[0:9]
TX_FAULT
TX_DISABLE
VEET
RD+
RD–
RX_LOS
MOD_DEF2
EEPROM
MOD_DEF1
MOD_DEF0
REF_RATE
NOTE: * 4.7 k Ω < RES < 10 kΩ
VCCT,R
125 MHz
AVAGO
AFBR-571xZ
VCCT
1 µH
1 µH
10 µF 0.1 µF
VCCT,R
VCCR
10
µF
0.1
µF
0.1
µF
AVAGO
HDMP-1687
R
RCM0
C
C
REFCLK
MAC
ASIC
*RES *RES *RES *RES
VEER
TD+
TD–
C
CR
*RES
HOUSING
GROUND
*RES
Digital Diagnostic Interface and Serial Identi cation
(EEPROM)
The entire AFBR-571xZ family complies with the SFF-
8074i SFP speci cation. The AFBR-5715Z family further
complies with SFF-8472, the SFP speci cation for Digital
Diagnostic Monitoring Interface. Both speci cations can
be found at http://www.s committee.org.
The AFBR-571xZ features an EEPROM for Serial ID, which
contains the product data stored for retrieval by host
equipment. This data is accessed via the 2-wire serial
EEPROM protocol of the ATMEL AT24C01A or similar, in
compliance with the industry standard SFP Multi-Source
Agreement. The base EEPROM memory, bytes 0-255 at
memory address 0xA0, is organized in compliance with
SFF-8074i. Contents of this serial ID memory are shown
in Table 10.
The I2C accessible memory page address 0xB0 is used
internally by SFP for the test and diagnostic purposes
and it is reserved.
5
As an enhancement to the conventional SFP interface
de ned in SFF-8074i, the AFBR-5715Z family is compliant
to SFF-8472 (digital diagnostic interface for optical trans-
ceivers). This new digital diagnostic information is stored
in bytes 0-255 at memory address 0xA2.Using the 2-wire
serial interface de ned in the MSA, the AFBR-5715Z
provides real time temperature, supply voltage, laser
bias current, laser average output power and received
input power. These parameters are internally calibrated,
per the MSA.
The digital diagnostic interface also adds the ability to
disable the transmitter (TX_DISABLE), monitor for Trans-
mitter Faults (TX_FAULT), and monitor for Receiver Loss
of Signal (RX_LOS).
The new diagnostic information provides the oppor-
tunity for Predictive Failure Identi cation, Compliance
Prediction, Fault Isolation and Component Monitoring.
Predictive Failure Identi cation
The predictive failure feature allows a host to identify
potential link problems before system performance is
impacted. Prior identi cation of link problems enables
a host to service an application via “fail over” to a redun-
dant link or replace a suspect device, maintaining system
uptime in the process. For applications where ultra-high
system uptime is required, a digital SFP provides a means
to monitor two real-time laser metrics associated with ob-
serving laser degradation and predicting failure: average
laser bias current (Tx_Bias) and average laser optical power
(Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-5715Z devices provide
real-time access to transceiver internal supply voltage
and temperature, allowing a host to identify potential
component compliance issues. Received optical power is
also available to assess compliance of a cable plant and
remote transmitter. When operating out of requirements,
the link cannot guarantee error free transmission.
Fault Isolation
The fault isolation feature allows a host to quickly pin-
point the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speeding
service of an installation. AFBR-5715Z real-time monitors
of Tx_Bias, Tx_Power, Vcc, Temperature and Rx_Power
can be used to assess local transceiver current operating
conditions. In addition, status ags Tx_Disable and Rx Loss
of Signal (LOS) are mirrored in memory and available via
the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFBR-
5715Z real-time monitors of Tx_Bias, Tx_Power, Vcc, Tem-
perature and Rx_Power. Potential uses are as debugging
aids for system installation and design, and transceiver
parametric evaluation for factory or eld quali cation.
For example, temperature per module can be observed in
high density applications to facilitate thermal evaluation
of blades, PCI cards and systems.
Required Host Board Components
The MSA power supply noise rejection lter is required on
the host PCB to meet data sheet performance. The MSA
lter incorporates an inductor which should be rated 400
mADC and 1 series resistance or better. It should not
be replaced with a ferrite. The required lter is illustrated
in Figure 4.
The MSA also speci es that 4.7 K to 10 K pull-up resis-
tors for TX_FAULT, LOS, and MOD_DEF0,1,2 are required
on the host PCB.
1 µH
1 µH
0.1 µF
VCCR
SFP MODULE
10 µF
VCCT
0.1 µF 10 µF
3.3 V
HOST BOARD
0.1 µF
Figure 4. MSA required power supply lter.
6
Fiber Compatibility
The AFBR-571xZ transciever is capable of transmission
at 2 to 550 meters with 50/125 μm ber, and at 2 to 275
meters with 62.5 125 μm ber, for 1.25 GBd Ethernet. It
is capable of transmission up to 500m with 50/125 μm
ber and up to 300m with 62.5/125 μm ber, for 1.0625
GBd Fiber Channel.
Application Support
To assist in the transceiver evaluation process, Agilent
o ers a 1.25 Gbd Gigabit Ethernet evaluation board
which facilitates testing of the AFBR-571xZ. It can be
obtained through the Agilent Field Organization by ref-
erencing Agilent part number HFBR-0571.
A Reference Design including the AFBR-571xZ and the
HDMP-1687 GigaBit Quad SerDes is available. It may be
obtained through the Agilent Field Sales organization.
Regulatory Compliance
See Table 1 for transceiver Regulatory Compliance. Certi-
cation level is dependent on the overall con guration
of the host equipment. The transceiver performance is
o ered as a gure of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-571xZ exceeds typical industry standards and is
compatible with ESD levels found in typical manufactur-
ing and operating environments as described in Table 1.
There are two design cases in which immunity to ESD
damage is important.
The rst case is during handling of the transceiver prior
to insertion into the transceiver port. To protect the trans-
ceiver, it’s important to use normal ESD handling precau-
tions. These precautions include using grounded wrist
straps, work benches, and oor mats in ESD controlled
areas. The ESD sensitivity of the AFBR-571xZ is compat-
ible with typical industry production environments.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
To the extent that the optical interface is exposed to the
outside of the host equipment chassis, it may be subject
to system-level ESD requirements.
Electromagnetic Interference (EMI)
Equipment using the AFBR-571xZ family of transceivers
is typically required to meet the require ments of the
FCC in the United States, CENELEC EN55022 (CISPR 22)
in Europe, and VCCI in Japan.
The metal housing and shielded design of the AFBR-
571xZ minimize the EMI challenge facing the host equip-
ment designer.
EMI Immunity
Equipment hosting AFBR-571xZ modules will be sub-
jected to radio-frequency electromagnetic elds in some
environments. The transceiver has excellent immunity to
such elds due to its shielded design.
Flammability
The AFBR-571xZ transceiver is made of metal and high
strength, heat resistant, chemically resistant, and UL
94V-0 ame retardant plastic.
Customer Manufacturing Processes
This module is pluggable and is not designed for aqueous
wash, IR re ow, or wave soldering processes.
7
Table 1. Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge
(ESD)to the Electrical Pins
JEDEC/EIAJESD22-A114-A Class 2 (> +2000 Volts)
Electrostatic Discharge
(ESD) to the Duplex LC
Reseptacle
Variation of IEC 6100-4-2 Typically withstands at least 25 kV without
damage when the duplex LC connector receptacle
is contacted by a Human Body Model probe
Electromagnetic
Interference(EMI)
FCC Class B CENELEC EN55022
Class B (CISPR 22A) VCCI Class 1
Applications with high SFP port counts are
expected to be compliant; however, margins are
dependent on customer board and chassis design.
Immunity Variation of IEC 61000-4-3 Typically shows a negligible e ect from a 10 V/m
eld swept from 80 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Eye Safety US FDA CDRH AEL Class 1
EN(IEC)60825-1,2, EN60950 Class 1
CDRH certi cation #9720151-57
TUV le RR72102090.01
Component Recognition Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL File #E173874
ROHS Compliance Less than 1000ppm of: cadmium, lead, mercury,
hexavalent chromium, polybrominated biphenyls,
and polybrominated biphenyl ethers.
Caution
There are no user serviceable parts nor any maintenance
required for the AFBR-571xZ. All adjustments are made at
the factory before shipment to our customers. Tampering
with, modifying, misusing or improp erly handling the
AFBR-571xZ will void the product warranty. It may also
result in improper operation of the AFBR-571xZ circuitry,
and possible overstress of the laser source. Device deg-
radation or product failure may result. Connection of the
AFBR-571xZ to a non-Gigabit Ethernet compliant or non-
Fiber Channel compliant optical source, operating above
the recommended absolute maximum conditions or
operating the AFBR-571xZ in a manner inconsistent with
its design and function may result in hazardous radiation
exposure and may be considered an act of modifying or
manufacturing a laser product. The person(s) performing
such an act is required by law to re-certify and re-identify
the laser product under the provisions of U.S. 21 CFR
(Subchapter J).
8
Table 2. Pin Description
Pin Name Function/Description
Engagement
Order(insertion) Notes
1 VeeT Transmitter Ground 1
2 TX Fault Transmitter Fault Indication 3 1
3 TX Disable Transmitter Disable - Module disables on high or open 3 2
4 MOD-DEF2 Module De nition 2 - Two wire serial ID interface 3 3
5 MOD-DEF1 Module De nition 1 - Two wire serial ID interface 3 3
6 MOD-DEF0 Module De nition 0 - Grounded in module 3 3
7 Rate Selection Not Connected 3
8 LOS Loss of Signal 3 4
9 VeeR Receiver Ground 1
10 VeeR Receiver Ground 1
11 VeeR Receiver Ground 1
12 RD- Inverse Received Data Out 3 5
13 RD+ Received Data Out 3 5
14 VeeR Reciver Ground 1
15 VccR Receiver Power -3.3 V ±5% 2 6
16 VccT Transmitter Power -3.3 V ±5% 2 6
17 VeeT Transmitter Ground 1
18 TD+ Transmitter Data In 3 7
19 TD- Inverse Transmitter Data In 3 7
20 VeeT Transmitter Ground 1
Notes:
1. TX Fault is an open collector/drain output which should be pulled up externally with a 4.7K – 10 K resistor on the host board to a supply
<VccT+0.3 V or VccR+0.3 V. When high, this output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the
output will be pulled to < 0.8 V.
2. TX disable input is used to shut down the laser output per the state table below. It is pulled up within the module with a 4.7-10 K resistor.
Low (0 – 0.8 V): Transmitter on
Between (0.8 V and 2.0 V): Unde ned
High (2.0 – 3.465 V): Transmitter Disabled
Open: Transmitter Disabled
3. Mod-Def 0,1,2. These are the module de nition pins. They should be pulled up with a 4.7-10 K resistor on the host board to a supply less
than VccT +0.3 V or VccR+0.3 V.
Mod-Def 0 is grounded by the module to indicate that the module is present
Mod-Def 1 is clock line of two wire serial interface for optional serial ID
Mod-Def 2 is data line of two wire serial interface for optional serial ID
4. LOS (Loss of Signal) is an open collector/drain output which should be pulled up externally with a 4.7 K – 10 K resistor on the host board to a
supply < VccT,R+0.3 V. When high, this output indicates the received optical power is below the worst case receiver sensitivity (as de ned by
the standard in use). Low indicates normal operatio0n. In the low state, the output will be pulled to < 0.8 V.
5. RD-/+: These are the di erential receiver outputs. They are AC coupled 100 di erential lines which should be terminated with 100 di erential
at the user SERDES. The AC coupling is done inside the module and is thus not required on the host board. The voltage swing on these lines
must be between 370 and 2000 mV di erential (185 – 1000 mV single ended) according to the MSA. Typically it will be 1500mv di erential.
6. VccR and VccT are the receiver and transmitter power supplies. They are de ned as 3.135 – 3.465 V at the SFP connector pin. The in-rush current
will typically be no more than 30 mA above steady state supply current after 500 nanoseconds.
7. TD-/+: These are the di erential transmitter inputs. They are AC coupled di erential lines with 100 di erential termination inside the module.
The AC coupling is done inside the module and is thus not required on the host board. The inputs will accept di erential swings of 500 – 2400
mV (250 – 1200 mV single ended). However, the applicable recommended di erential voltage swing is found in Table 5.
9
Table 3. Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Unit Notes
Ambient Storage Temperature
(Non-operating)
Ts -40 +100 °C 1, 2
Case Temperature TC-40 +85 °C 1, 2
Relative Humidity RH 5 95 % 1
Supply Voltage VCCT,R -0.5 3.8 V 1, 2, 3
Low Speed Input Voltage VIN -0.5 VCC+0.5 V 1
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded. See Reliability Data
Sheet for speci c reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur.
3. The module supply voltages, VCCT and VCCR, must not di er by more than 0.5V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Unit Notes
Case Temperature
AFBR-571xLZ/PZ
AFBR-571xALZ/APZ
TC
TC
-10
-40
25
25
85
85
°C
°C
1, 2
1, 2
Supply Voltage VCC 3.135 3.3 3.465 V 1
Notes:
1. Recommended Operating Conditions are those within which functional performance within data sheet characteristics is intended.
2. Refer to the Reliability Data Sheet for speci c reliability performance predictions.
Table 5. Transceiver Electrical Characteristics
Parameter Symbol Minimum Typical Maximum Unit Notes
Module Supply Current ICC 160 220 mA
Power Dissipation PDISS 530 765 mW
Power Supply Noise
Rejection(peak-peak)
PSNR 100 mVPP 1
Data input:
Transmitter Di erential
Input Voltage (TD +/-)
VI500 2400 mVPP 2
Data Output:
Receiver Di erential
Output Voltage (RD +/-)
VO370 1500 2000 mVPP 3
Receive Data Rise & Fall Times TRF 220 ps
Low Speed Outputs:
Transmit Fault (TX_FAULT)
Loss of Signal (LOS), MOD_DEF2
VOH 2.0 VCCT,R+0.3 V 4
VOL 0 0.8 V
Low Speed Inputs:
Transmitter Disable(TX_DISABLE),
MOD_DEF 1, MOD_DEF 2
VIH 2.0 VCC V5
VIL 0 0.8 V
Notes:
1. Measured at the input of the required MSA Filter on host board.
2. Internally AC coupled and terminated to 100 di erential load.
3. Internally AC coupled, but requires a 100 di erential termination at or internal to Serializer/Deserializer.
4. Pulled up externally with a 4.7-10 K resistor on the host board to VCCT,R.
5. Mod_Def1 and Mod_Def2 must be pulled up externally with a 4.7-10 K resistor on the host board to VCCT,R.
10
Table 7. Receiver Optical Characteristics
Parameter Symbol Minimum Typical Maximum Unit Notes
Optical Input Power PR-17 0 dBm
Receiver Sensitivity
(Optical Input Power)
PRMIN -21 -17 dBm
Stressed Receiver Sensitivity -12.5 dBm 62.5/125 m ber
-13.5 dBm 50/125 m ber
Total Jitter
(TP3 to TP4 Contribution 1.25GBd)
TJ 266 ps
0.332 UI
Return Loss -12 dB
LOS De-Asserted PD- -17 dBm
LOS Asserted PA-30 dBm
LOS Hysterisis PD-PA3dB
Table 6. Transmitter Optical Characteristics
Parameter Symbol Minimum Typical Maximum Unit Notes
Output Optical Power (Average) POUT -9.5 -6.5 -3 dBm 1
Optical Extinction Ratio ER 9 12 dB
Center Wavelength C830 850 860 nm
Spectral Width - rms 0.85 nm
Optical Rise/Fall Time TRISE/FALL 150 260 ps
Relative Intensity Noise RIN -117 dB/Hz
Total Jitter (TP1 to TP2 Contribution TJ 227 ps
0.284 UI
Pout TX_DISABLE Assorted POFF -35 dBm
Notes:
1. 50/125 μm ber with NA = 0.2, 62.5/125 μm ber with NA = 0.275.
Figure 5a. Gigabit Ethernet transmitter eye mask diagram Figure 5b. Typical AFBR-571xZ eye mask diagram
80
50
20
0 22 37.5 78
NORMALIZED TIME (% OF UNIT INTERVAL)
NORMALIZED AMPLITUDE (%)
100
100
0
130
62.5
–20
0.80
0.50
0.20
1.00
0
1.30
–0.20
NORMALIZED AMPLITUDE
0 0.22 0.375 0.78 1.00.625
NORMALIZED TIME (UNIT INTERVAL)
11
Table 8. Transceiver SOFT DIAGNOSTIC Timing Characteristics
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
8. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
9. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
10. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
11. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
12. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
13. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
14. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
15. Time from stop bit to completion of a 1-8 byte write command.
Parameter Symbol Minimum Maximum Unit Notes
Hardware TX_DISABLE Assert Time t_o 10 ms Note 1
Hardware TX_DISABLE Negate Time t_on 1 ms Note 2
Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3
Hardware TX_FAULT Assert Time t_fault 100 ms Note 4
Hardware TX_DISABLE to Reset t_reset 10 ms Note 5
Hardware RX_LOS Assert Time t_loss_on 100 ms Note 6
Hardware RX_LOS De-Assert Time t_loss_o 100 ms Note 7
Software TX_DISABLE Assert Time t_o_soft 100 ms Note 8
Software TX_DISABLE Negate Time t_on_soft 100 ms Note 9
Software Tx_FAULT Assert Time t_fault_soft 100 ms Note 10
Software Rx_LOS Assert Time t_loss_on_soft 100 ms Note 11
Software Rx_LOS De-Assert Time t_loss_o_soft 100 ms Note 12
Analog parameter data ready t_data 1000 ms Note 13
Serial bus hardware ready t_serial 300 ms Note 14
Write Cycle Time t_write 10 ms Note 15
Serial ID Clock Rate f_serial_clock 400 kHz
12
Table 9. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
Parameter Symbol Min. Units Notes
Transceiver Internal Temperature TINT ±3.0 °C Temperature is measured internal to the transceiver.
Accuracy Valid from = -40°C to 85 °C case temperature.
Transceiver Internal Supply VINT ±0.1 V Supply voltage is measured internal to the transceiver
Voltage Accuracy and can, with less accuracy, be correlated to
voltage at the SFP Vcc pin. Valid over 3.3 V ±5%.
Transmitter Laser DC Bias Current IINT ±10 % IINT is better than ±10% of the nominal value.
Accuracy
Transmitted Average Optical PT±3.0 dB Coupled into 50/125 mm multi-mode ber.
Valid from100 mW to 500 mW, avg.
Output Power Accuracy
Received Average Optical Input PR±3.0 dB Coupled from 50/125 mm multi-mode ber.
Valid from 31 mW to 500 mW, avg.
Power Accuracy
Figure 6. Transceiver timing diagrams (Module installed except where noted).
TX_FAULT
VCC > 3.15 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_init
TX_FAULT
VCC > 3.15 V
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
TX_FAULT
VCC > 3.15 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL t_off
TX_FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
INSERTION
t_on
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
TX_FAULT
OCCURANCE OF FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* SFP SHALL CLEAR TX_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
TX_FAULT
OCCURANCE OF FAULT
t_fault2
TX_DISABLE
TRANSMITTED SIGNAL
OCCURANCE OF LOSS
LOS
t-fault2: TX DISABLE ASSERTED THEN NEGATED,
TX SIGNAL NOT RECOVERED
NOTE: t_fault2 timing is typically 1.7 to 2 ms.
t-loss-on & t-loss-off
t_loss_on
t_init*
t_reset
* SFP SHALL CLEAR Tx_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t_loss_off
OPTICAL SIGNAL
13
Table 10. EEPROM Serial ID Memory Contents, Page A0h
Byte
Decimal
#
Hex
Data
Notes
Byte
Decimal
#
Hex
Data
Notes
0 03 SFP physical device 37 00 Vendor OUI (Note 4)
1 04 SFP function de ned by serial ID only 38 17 Vendor OUI (Note 4)
2 07 LC optical connector 39 6A Vendor OUI (Note 4)
3 00 40 41 "A" - Vendor Part Number ASCII character
4 00 41 46 "F" - Vendor Part Number ASCII character
5 00 42 42 "B" - Vendor Part Number ASCII character
6 01 1000BaseSX 43 52 "R" - Vendor Part Number ASCII character
7 00 44 2D "-" - Vendor Part Number ASCII character
8 00 45 35 "5" - Vendor Part Number ASCII character
9 00 46 37 "7" - Vendor Part Number ASCII character
10 00 47 31 "1" - Vendor Part Number ASCII character
11 01 Compatible with 8B/10B encoded data 48 Note 5
12 0C 1200Mbps nominal bit rate (1.25Gbps) 49 Note 5
13 00 50 Note 5
14 00 51 Note 5
15 00 52 20 “ “ - Vendor Part Number ASCII character
16 37 550m of 50/125mm ber @ 1.25Gbps
(Note 2)
53 20 " " - Vendor Part Number ASCII character
17 1B 275m of 62.5/125mm ber @ 1.25Gbps
(Note 3)
54 20 " " - Vendor Part Number ASCII character
18 00 55 20 " " - Vendor Part Number ASCII character
19 00 56 20 " " - Vendor Revision Number ASCII character
20 41 'A' - Vendor Name ASCII character 57 20 " " - Vendor Revision Number ASCII character
21 56 "V" - Vendor Name ASCII character 58 20 “ “ - Vendor Revision Number ASCII character
22 41 "A" - Vendor Name ASCII character 59 20 “ “ - Vendor Revision Number ASCII character
23 47 "G"- - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength (Note 6)
24 4F "O" - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength (Note 6)
25 20 " " - Vendor Name ASCII character 62 00
26 20 “ “ - Vendor Name ASCII character 63 Checksum for bytes 0-62 (Note 7)
27 20 “ “ - Vendor Name ASCII character 64 00
28 20 “ “ - Vendor Name ASCII character 65 1A Hardware SFP TX_DISABLE, TX_FAULT, & RX_LOS
29 20 “ “ - Vendor Name ASCIIcharacter 66 00
30 20 “ “ - Vendor Name ASCIIcharacter 67 00
31 20 “ “ - Vendor Name ASCIIcharacter 68-83 Vendor Serial Number, ASCII (Note 8)
32 20 “ “ - Vendor Name ASCIIcharacter 84-91 Vendor Date Code, ASCII (Note 9)
33 20 “ “ - Vendor Name ASCIIcharacter 92 Note 5
34 20 “ “ - Vendor Name ASCIIcharacter 93 Note 5
35 20 “ “ - Vendor Name ASCIIcharacter 94 Note 5
36 00 95 Checksum for bytes 64-94 (Note 7)
96 - 255 00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec.
2. Link distance with 50/125μm cable at 1.25Gbps is 550m.
3. Link distance with 62.5/125μm cable at 1.25Gbps is 275m.
4. The IEEE Organizationally Unique Identi er (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
5. See Table 11 for part number extensions and data- elds.
6. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850nm is 0352.
7. Addresses 63 and 95 are checksums calculated per SFF-8472 and SFF-8074, and stored prior to product shipment.
8. Addresses 68-83 specify the module’s ASCII serial number and will vary by unit.
9. Addresses 84-91 specify the module’s ASCII date code and will vary according to manufactured date-code.
14
Table 11. Part Number Extensions
AFBR-5710ALZ AFBR-5710APZ AFBR-5710LZ AFBR-5710PZ
Address Hex ASCII Address Hex ASCII Address Hex ASCII Address Hex ASCII
48 30 0 48 30 0 48 30 0 48 30 0
49 41 A 49 41 A 49 4C L 49 50 P
50 4C L 50 50 P 50 5A Z 50 5A Z
51 5A Z 51 5A Z 51 20 51 20
92 00 92 00 92 00 92 00
93 00 93 00 93 00 93 00
94 00 94 00 94 00 94 00
AFBR-5715ALZ AFBR-5715APZ AFBR-5715LZ AFBR-5715PZ
Address Hex ASCII Address Hex ASCII Address Hex ASCII Address Hex ASCII
48 35 5 48 35 5 48 35 5 48 35 5
49 41 A 49 41 A 49 4C L 49 50 P
50 4C L 50 50 P 50 5A Z 50 5A Z
51 5A Z 51 5A Z 51 20 51 20
92 68 92 68 92 68 92 68
93 F0 93 F0 93 F0 93 F0
94 01 94 01 94 01 94 01
15
Table 12. EEPROM Serial ID Memory Contents - Address A2h (AFBR-5715Z family only)
Byte
#Decimal Notes
Byte
#Decimal Notes
Byte
#Decimal Notes
0 Temp H Alarm MSB126 Tx Pwr L Alarm MSB4104 Real Time Rx PAV MSB5
1 Temp H Alarm LSB127 Tx Pwr L Alarm LSB4105 Real Time Rx PAV LSB5
2 Temp L Alarm MSB128 Tx Pwr H Warning MSB4106 Reserved
3 Temp L Alarm LSB129 Tx Pwr H Warning LSB4107 Reserved
4 Temp H Warning MSB130 Tx Pwr L Warning MSB4108 Reserved
5 Temp H Warning LSB131 Tx Pwr L Warning LSB4109 Reserved
6 Temp L Warning MSB132 Rx Pwr H Alarm MSB5110 Status/Control - see Table 13
7 Temp L Warning LSB133 Rx Pwr H Alarm LSB5111 Reserved
8V
CC H Alarm MSB234 Rx Pwr L Alarm MSB5112 Flag Bits - see Table 14
9V
CC H Alarm LSB235 Rx Pwr L Alarm LSB5113 Flag Bit - see Table 14
10 VCC L Alarm MSB236 Rx Pwr H Warning MSB5114 Reserved
11 VCC L Alarm LSB237 Rx Pwr H Warning LSB5115 Reserved
12 VCC H Warning MSB238 Rx Pwr L Warning MSB5116 Flag Bits - see Table 14
13 VCC H Warning LSB239 Rx Pwr L Warning LSB5117 Flag Bits - see Table 14
14 VCC L Warning MSB240-55 Reserved 118 Reserved
15 VCC L Warning LSB256-94 External Calibration Constants6119 Reserved
16 Tx Bias H Alarm MSB395 Checksum for Bytes 0-947120-122 Reserved
17 Tx Bias H Alarm LSB396 Real Time Temperature MSB1123
18 Tx Bias L Alarm MSB397 Real Time Temperature LSB1124
19 Tx Bias L Alarm LSB398 Real Time Vcc MSB2125
20 Tx Bias H Warning MSB399 Real Time Vcc LSB2126
21 Tx Bias H Warning LSB3100 Real Time Tx Bias MSB3127 Reserved8
22 Tx Bias L Warning MSB3101 Real Time Tx Bias LSB3128-247 Customer Writable9
23 Tx Bias L Warning LSB3102 Real Time Tx Power MSB4248-255 Vendor Speci c
24 Tx Pwr H Alarm MSB4103 Real Time Tx Power LSB4
25 Tx Pwr H Alarm LSB4
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 °C.
2. Supply voltage (VCC) is decoded as a 16 bit unsigned integer in increments of 100 μV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 μA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 μW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 μW.
6. Bytes 55-94 are not intended from use with AFBR-5715Z, but have been set to default values per SFF-8472.
7. Bytes 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
8. Byte 127 accepts a write but performs no action (reserved legacy byte).
9. Bytes 128-247 are write enabled (customer writable).
16
Table 13. EEPROM Serial ID Memory Contents - Address A2h, Byte 110 (AFBR-5715Z family only)
Bit # Status/Control Name Description
7 Tx Disable State Digital state of SFP Tx Disable Input Pin (1 = Tx_ Disable asserted)
6 Soft Tx Disable Read/write bit for changing digital state of SFP Tx_Disable function1
5 Reserved
4 Rx Rate Select State Digital state of SFP Rate Select Input Pin (1 = full bandwidth of 155 Mbit)2
3 Reserved
2 Tx Fault State Digital state of the SFP Tx Fault Output Pin (1 = Tx Fault asserted)
1 Rx LOS State Digital state of the SFP LOS Output Pin (1 = LOS asserted)
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready (0 = Ready)
Notes:
1. Bit 6 is logic OR’d with the SFP Tx_Disable input pin 3 ... either asserted will disable the SFP transmitter.
2. AFBR-5715Z does not respond to state changes on Rate Select Input Pin. It is internally hardwired to full bandwidth.
Table 14. EEPROM Serial ID Memory Contents - Address A2h, Bytes 112, 113, 116, 117 (AFBR-5715Z family only)
Byte Bit # Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver nternal temperature exceeds high alarm threshold.
6 Temp Low Alarm Set when transceiver internal temperature exceeds alarm threshold.
5V
CC High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold.
4V
CC Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold.
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold.
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold.
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold.
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold.
113 7 Rx Power High Alarm Set when received P_Avg optical power exceeds high alarm threshold.
6 Rx Power Low Alarm Set when received P_Avg optical power exceeds low alarm threshold.
0-5 Reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold.
6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold.
5V
CC High Warning Set when transceiver internal supply voltage exceeds high warning threshold.
4V
CC Low Warning Set when transceiver internal supply voltage exceeds low warning threshold.
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold.
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold.
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold.
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold.
117 7 Rx Power High Warning Set when received P_Avg optical power exceeds high warning threshold.
9 Rx Power Low Warning Set when received P_Avg optical power exceeds low warning threshold.
0-5 Reserved
17
Figure 7. Module drawing
13.8±0.1
[0.541±0.004]
2.60
[0.10] 55.2±0.2
[2.17±0.01]
13.4±0.1
[0.528±0.004]
DEVICE SHOWN WITH
DUST CAP AND BAIL
WIRE DELATCH
6.25±0.05
[0.246±0.002]
TX RX
DIMENSIONS ARE IN MILLIMETERS (INCHES)
8.5±0.1
[0.335±0.004]
FRONT EDGE OF SFP
TRANSCEIVER CAGE 0.7 MAX. UNCOMPRESSED
[0.028]
13.0±0.2
[0.512±0.008]
STANDARD DELATCH
6.6
[0.261]
13.50
[0.53]
AREA
FOR
PROCESS
PLUG
14.8 MAX. UNCOMPRESSED
[0.583]
12.1±0.2
[0.48±0.01]
AVAGO AFBR-571xZ
850 nm LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TUV XXXXXX
UL
18
Figure 8. SFP host board mechanical layout
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.05 TYP.
0.06 L A S B S
10.53 11.93
20
10 11
PIN 1
20
10 11
PIN 1
0.8
TYP.
10.93
9.6
2x 1.55 ± 0.05
3.2 5
4
3
2
1
1
26.8 5
11x 2.0
3x 10
41.3
42.3
10x 1.05 ± 0.01
16.25
REF. 14.25
11.088.58 5.68
11x 2.0
11.93
9.6
4.8
8.48
A
3.68
SEE DET AIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
34.5
16.25
MIN. PITCH
YX
DETAIL 1
Æ 0.85 ± 0.05
PCB
EDGE
0.06 S A S B S
Æ 0.1 L A S B S
Æ 0.1 L X A S
Æ 0.1 S X A S
Æ 0.1 S X Y
3x 10
B
NOTES
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL.
3. HATCHED AREA DENOTES COMPONENT AND
TRACE KEEPOUT (EXCEPT CHASSIS GROUND).
4. AREA DENOTES COMPONENT KEEPOUT
(TRACES ALLOWED).
DIMENSIONS IN MILLIMETERS
19
Figure 9. Assembly drawing.
15
(0.59)
41.73 ± 0.5
(1.64 ± 0.02)
3.5 ± 0.3
(0.14 ± 0.01)
1.7 ± 0.9
(0.07 ± 0.04)
BEZEL
PCB
AREA
FOR
PROCESS
PLUG
10
(0.39)
TO PCB
REF
0.4 ± 0.1
(0.02 ± 0.004)
BELOW PCB
10.4 ± 0.1
(0.41 ± 0.004)
15.25 ± 0.1
(0.60 ± 0.004)
MSA-SPECIFIED BEZEL
16.25 ± 0.1
(0.64 ± 0.004)MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS (INCHES).
11
(0.43)
1.5
(0.06)
BELOW PCB
REF.
9.8
(0.39)
CAGE ASSEMBLY
REF.
MAX.
MAX.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes AV01-0181EN
AV02-3012EN - September 12, 2012
Ordering Information
Please contact your local eld sales engineer or one of Avago Technologies franchised distributors for ordering infor-
mation. For technical information, please visit Avago Technologies’ web-page at www.avagotech.com or contact one of
Avago Technologies’ regional Technical Response Centers. For information related to SFF Committee documentation
visit www.s committee.org.
