MPXA4100A6T1 - Freescale Semiconductor

MPX4100A

Rev 9, 1/2009

Freescale Semiconductor

Pressure

+Integrated Silicon Pressure Sensor

for Manifold Absolute Pressure

Applications On-Chip Signal

Conditioned, Temperature

Compensated and Calibrated

The MPX4100A series Manifold Absolute Pressure (MAP) sensor for

engine control is designed to sense absolute air pressure within the intake

manifold. This measurement can be used to compute the amount of fuel

required for each cylinder . The small form factor and high reliability of on-chip

integration makes the MAP sensor a logical and economical choice for

automotive system designers.

The MPX4100A series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor . This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output

signal that is proportional to appli ed pressure.

Features

• 1.8% Maximum Error Over 0° to 85°C

• Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems

• Ideally Suited for Microprocessor Interfacing or Microcontroller Based Systems

• Temperature Compensated Over -40°C to +125°C

• Durable Epoxy Unibody Element

• Ideal for Non-Automotive Applications

• Available as Standard Fluorosilicone Gel (MPXA4100A, MPX4100A) or Media Resistant Gel (MPXAZ4100A)

• Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name Package

Options Case

No. # of Ports Pressure Type Device Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX4100A Series)

MPX4100A Trays 867-08 • • MPX4100A

MPX4100AP Trays 867B-04 • • MPX4100AP

MPX4100AS Trays 867E-03 • • MPX4100AS

Small Outline Package (MPXAZ4100A Series) (Media Resistant Gel)

MPXAZ4100A6U Rails 482 • • MPXAZ4100A

MPXAZ4100AC6U Rails 482A • • MPXAZ4100A

Small Outline Package (MPXA4100A Series)

MPXA4100A6T1 Tape and Reel 482 • • MPXA4100A

MPXA4100AC6U Rails 482A • • MPXA4100A

MPXA4100A6U Rails 482 • • MPXA4100A

MPX4100A

20 to 105 kPa (2.9 to 15.2 psi)

0.3 to 4.9 V Output

Series

Application Examples

• Manifold Sen s i n g fo r Automo ti ve

Systems

• Also Ideal for Non-Automotive

Applications

MPX4100A

Sensors

2Freescale Semiconductor

Pressure

MPX4100A

CASE 867-08 MPX4100AP

CASE 867B-04 MPX4100AS

CASE 867E-03

MPXAZ4100A6U

MPXA4100A6U/T1

CASE 482-01

MPXAZ4100AC6U

MPXA4100AC6U

CASE 482A-01

SMALL OUTLINE PACKAGES

UNIBODY PACKAGES

MPX4100A

Sensors

Freescale Semiconductor 3

Pressure

Operating Characteristics

Table 1. Operating Chara cteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

Figure 3 required to meet electrical sp ecifications.)

Characteristic Symbol Min Typ Max Unit

Pressure Range(1)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

POP 20 — 105 kPa

Supply Voltage(2)

2. Device is ratiometric within this specified excitation range.

VS4.85 5.1 5.35 Vdc

Supply Current Io— 7.0 10 mAdc

Minimum Pressure Offset (0 to 85°C)

@ VS = 5.1 Volts(3)

3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

Voff 0.225 0.306 0.388 Vdc

Full Scale Output (0 to 85°C)

@ VS = 5.1 Volts(4)

4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

VFSO 4.816 4.897 4.978 Vdc

Full Scale Span (0 to 85°C)

@ VS = 5.1 Volts(5)

5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFSS —4.59—Vdc

Accuracy(6) (0 to 85°C)

6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycle d to and from the

minimum or maximum rated pressure, at 25°C.

TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C.

TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.

Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

———±1.8 %VFSS

Sensitivity V/P — 54 — mV/kPa

Response Time(7)

7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

tR—1.0—ms

Output Source Current at Full Scale Output Io+ —0.1—mAdc

Warm-Up Time(8)

8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

——20—ms

Offset Stability(9)

9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

——±0.5 — %VFSS

MPX4100A

Sensors

4Freescale Semiconductor

Pressure

Maximum Ratings

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Fully Integrated Pressure Sens or Schematic

for Unibody Package and Small Ou tline Package

Table 2. MAXIMUM RATINGS(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating Symbol Value Unit

Maximum Pressure (P1 > P2) PMAX 400 kPa

Storage Temperature Tstg -40 to +125 °C

Operating Temperature TA-40 to +125 °C

Sensing

Element

GND

VOUT

Pins 4, 5, and 6 are NO CONNECTS

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitr y

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

for small outline pac kage devices.

for unibody package devices.

3 (Unibody)

2 (Small Outline Package)

4 (Small Outline Package)

1 (Unibody)

3 (Small Outline Package)

2 (Unibody)

MPX4100A

Sensors

Freescale Semiconductor 5

Pressure

On-chip Temperature Compensation and Calibration

Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm. The MPX4100A series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller . Proper decoupling of

the power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C using the decoupling circuit shown in Figure 3.

(The output will saturate outside of the specified pressure

range.)

Figure 2. Cross-Sectional Diagram (not to scale)

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For output filtering recomme ndations, refer to Application Note AN1646 .)

Figure 4. Output versus Absolute Pressure

Absolute Element

Lead Frame

Wire Bond

Fluoro Silicone

Gel Die Coat

Bond

Die

Epoxy Plastic

Case

Stainless Steel

Metal Cover

+5 V

1.0 μF0.01 μF470 pFGND

Vout

IPS

Output

Output (Volts)

100

105

110

Transfer Function:

VOUT = VS* (.01059*P-0.1518) ± Error

VS = 5.1 Vdc

Pressure (ref. to sealed vacuu m ) in kPa

MAX TYP

MIN

5.0

4.5

3.5

4.0

3.0

2.5

2.0

1.5

1.0

0.5

TEMP = 0 to 85°C

20 kPa to 105 kPa

MPX4100A

Sensors

6Freescale Semiconductor

Pressure

Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518)

± (Pressure Error x Temp. Factor x 0.01059 x VS)

VS = 5.1 V ± 0.25 Vdc

Transfer Function (MPX4100A)

MPX4100A Series

Temp Multiplier

- 40 3

0 to 85 1

+125 3

Temperature in °C

4.0

3.0

2.0

0.0

1.0

-40 -20 0 20 40 60 14012010080

Temperature

Error

Factor

Temperature Error Band

NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.

Pressure Error (Max)

Error Limits for Pressure

3.0

2.0

1.0

-1.0

-2.0

-3.0

0.0 20 40 60 80 100 120 Pressure (in kPa)

Pressure Error (kPa)

20 to 105 (kPa) ±1.5 (kPa)

Pressure Error Band

MPX4100A

Sensors

Freescale Semiconductor 7

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

The two sides of the pressure sensor are designated as

the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel,

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positi ve differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

INFORMATION FOR USING THE SMALL OUTLIN E PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridgi ng and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Part Number Case Type Pressure (P1) Side Identifier

MPX4100A 867 Stainless Steel Cap

MPX4100AP 867B Side with Part Marking

MPX4100AS 867E Side with Port Attached

MPXAZ4100A6U, MPXA4100A6U/TI 482 Side with Part Marking

MPXAZ4100AC6U, MPXA4100AC6U 482A Side with Port Attached

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm SCALE 2:1

MPX4100A

Sensors

8Freescale Semiconductor

Pressure

D8 PL

0.25 (0.010) A S

-A-

-B-

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C5.380.2300.212 5.84

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.405 0.415 10.29 10.54

S0.709 0.725 18.01 18.41

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C12.700.5200.500 13.21

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.444 0.448 11.28 11.38

S0.709 0.725 18.01 18.41

V0.245 0.255 6.22 6.48

W0.115 0.125 2.92 3.17

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

D8 PL

0.25 (0.010) AT

-A-

-B-

PACKAGE DIMENSIONS

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MPX4100A

Sensors

Freescale Semiconductor 9

Pressure

PACKAGE DIMENSIONS

PIN 1

123456

6 PL

SEATING

PLANE -T-

0.136 (0.005) T

POSITIVE PRESSURE

(P1)

-A-

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

STYLE 3:

PIN 1. OPEN

2. GROUND

3. +VOUT

4. +VSUPPLY

5. -VOUT

6. OPEN

STYLE 2:

PIN 1. OPEN

2. GROUND

3. -VOUT

4. VSUPPLY

5. +VOUT

6. OPEN

MAX

MILLIMETERSINCHES

16.00

13.56

5.59

0.84

1.63

0.100 BSC 2.54 BSC

0.40

18.42

30˚ NOM 30˚ NOM

12.57

11.43

DIM

MIN

0.595

0.514

0.200

0.027

0.048

0.014

0.695

0.475

0.430

0.090

MAX

0.630

0.534

0.220

0.033

0.064

0.016

0.725

0.495

0.450

0.105

MIN

15.11

13.06

5.08

0.68

1.22

0.36

17.65

12.07

10.92

2.29 2.66

NOTES:

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

CASE 867-08

ISSUE N

BASIC ELEMENT

MPX4100A

Sensors

10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

INCHES

0.100 BSC

MILLIMETERS

2.54 BSC

DIM

MIN

0.690

0.245

0.780

0.027

0.178

0.048

0.014

0.345

0.300

0.220

0.182

MAX

0.255

0.820

0.033

0.186

0.064

0.016

0.375

0.310

0.240

0.720

0.194

MIN

17.53

6.22

19.81

0.69

4.52

1.22

0.36

8.76

7.62

5.59

4.62

MAX

18.28

6.48

20.82

0.84

4.72

1.63

0.41

9.53

7.87

6.10

4.93

STYLE 1:

PIN 1. V

OUT

2. GROUND

3. V

4. V1

5. V2

6. V

654321

-B-

PORT #1

POSITIVE

PRESSURE

(P1)

-T-

FD6 PL

PIN 1

0.13 (0.005) T

CASE 867E-O3

ISSUE D

STOVE PIPE PORT (AS)

MPX4100A

Sensors

Freescale Semiconductor 11

Pressure

PACKAGE DIMENSIONS

CASE 867B-04

ISSUE G

PORTED (AP)

PAGE 1 OF 2

MPX4100A

Sensors

12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS

CASE 867B-04

ISSUE G

PORTED (AP)

PAGE 2 OF 2

MPX4100A

Rev. 9

1/2009

How to Reach Us:

Home Page:

www.freescale.com

Web Support:

http://www.freescale.com/support

USA/Europe or Locations Not Listed:

Freescale Semiconductor, Inc.

Technical Information Center, EL516

2100 East Elliot Road

Tempe, Arizona 85284

1-800-521-6274 or +1-480-768-2130

www.freescale.com/support

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH

Technical Information Center

Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English)

+46 8 52200080 (English)

+49 89 92103 559 (German)

+33 1 69 35 48 48 (French)

www.freescale.com/support

Japan:

Freescale Semiconductor Japan Ltd.

Headquarters

ARCO Tower 15F

1-8-1, Shimo-Meguro, Meguro-ku,

Tokyo 153-0064

Japan

0120 191014 or +81 3 5437 9125

support.japan@freescale.com

Asia/Pacific:

Freescale Semiconductor China Ltd.

Exchange Building 23F

No. 118 Jianguo Road

Chaoyang District

Beijing 100022

China

+86 010 5879 8000

support.asia@freescale.com

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center

P.O. Box 5405

Denver, Colorado 80217

1-800-441-2447 or +1-303-675-2140

Fax: +1-303-675-2150

LDCForFreescaleSemiconductor@hibbertgroup.com

Information in this document is provided solely to enable system and software

implementers to use Freescale Semiconduct or products. There are no express or

implied copyright licenses granted hereunder to design or fabricate any integrated

circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the ri ght to make changes without furth er notice to

any products herein. Freescale Semiconductor makes no warranty, representation or

guarantee regarding the suitability of its products for any particular purpose, nor does

Freescale Semiconductor assume any liability arising out of the application or use of any

product or circuit, and specifically disclaims any and all liability, including without

limitation consequen tial or incidental damages. “Typical” parameters that may be

provided in Freescale Se miconductor data sheets and/or specifications can and do vary

in different applications and actual performance may vary over time. All operating

parameters, includin g “Typicals”, must be validated for each customer application by

customer’s technical experts . Freescale Semiconductor does not convey any license

under its patent rights nor the rights of others. Fr eescale Semiconductor products are

not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life,

or for any other application in which th e failure of th e Freescale Semiconductor product

could create a situation where personal injury or death may occur. Should Buyer

purchase or use Freescale Semiconductor products for any such unintended or

unauthorized application, Buyer shall indemn ify and hold Freescale Semiconductor and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable attorney fees arising out of,

directly or indirectly, any claim of personal injury or death associated with such

unintended or unauthorized use, even if such claim alleges that Fr eescale

Semiconductor was negligent regarding the design or manufact ure of the part.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners.