FOR CONNECTOR REPAIRABILITY, USE KEEPOUT ZONE, REFER TQ TB-2217 FOR DETAILS. 40TH DIGIT OF PART NUMBER IDENTIFIES PLATING. OS INTERPRET PER ASME Y14.5M UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MM, DECIMAL MARKER IS A PERIOD SEE TABLE 1 NZA CUSTOMER USE DRAW ING CODE IDENT 31413 DRAW ING NO. C950-410A-500 REV ASSEM P1149-CU-ASSY 1.4 DRAWING C950-4170A-500 | B.0 SIZED SCALE 2/1 SHEET 1 OF 1 | 8 7 6 3 DRW NO. SH REV C950-410A-500 B ZONE |REV SCR NUMBER DESCRIPTION BY DATE APPROVED TABLE 1 ALL | A | AASY-8HW JTC.VERO1 NEW RELEASE HCL-RP | 0672172011 | A.ASTBURY ASSEMBLY s} = (1.60) MIN BOARD THICKENESS PLATING DESCRIPTION <9 75 ____+ Ad DIMENSION 2.04 WAS 2.09 PART NUMBER 6) a, | B MSPE-8TVHFZ.VERO1 | QiweNcION S17 WAS 4.29 | HCL-MP | 05/17/2012 | M.SPACONE 950-410A-B1B Ni SULFAMATE, STANDARD GOLD, LEADED 19.2 = (2.1) TAIL LENGTH 950-4.10A-B1C Ni SULFAMATE, HIGH GOLD, LEADED sy = (1.85) @) (2-1) 950-410A-B1D Ni SULFAMATE, STANDARD GOLD, LEAD-FREE 950-4/0A-B1E Ni SULFAMATE, HIGH GOLD, LEAD-FREE 950-4.10A-B1F NANO Ni, STANDARD GOLD, LEADED D 950-410A-B1G NANO Ni, HIGH GOLD, LEADED [ 950-410A-B1H NANO Ni, STANDARD GOLD, LEAD-FREE . 97 _ 950-410A-B1J NANO Ni. HIGH GOLD, LEAD-FREE a KEEPOUT ZONE 9.99 _ . 4.66) a 2.04 Kies er Poe | V3 [_ 0.51 D | ; O Vb O (7 {_ ADJACENT XCede HSD WAFER TT | Do l0-0187] TYP PTH O 5 0 L oO COLUMN 10.10 |x ly _ BO.5710.0225"] TYP DRILL O DP Oo I 0.88 [0.035] TYP PAD O D O | I of ee Oo b O _ m= A O b O OU MODULE OUTLINE -O oO ' Oo O D Oo > = 0 . M%OoO00O0d0d0e FJ | 10X |1.50 |] = (15.00) ROW K 7 [OM OKO O O DO oO 8 ) ) OG : ' fi fi if Ct O Po = fb 0 0 DODO Blo o ( 0 5 OO |} o Cc OID OODQAQO O O Db Oo Oo 0 '1C) ) oO Oo 0 O b oO L a OP 10x [7.50] = (15.00) 0 Of pe i : = : fe he he he (7 | O D Oo = Oo O08 ) ) ) ) ) Oo Oo oO ty Cf fe ft 4 oO O 5b OO S 0 ROW A 0,9 BOEOA O L\ )___ : co PID ODOAEC ?O \L\L\L\VL 4 (1.70) oO: O ry | Tt ytd yy ty yA 0 OOO oO? oO O = = = = = oO O fh fi fi if {fr ' O 9! oO Do o ROW A 7 hy? x q Pa SHROUD REFERENCE ! ' 1.70 MAX ADJACENT XCede HSD WAFER XCede HSD COLUMN (6) WAFER A +} 4X 11.85 | = (7.40) 4 He HF XCede HSD \ 6 WAFER B >x] B 18.0@) Sf DAUGHTERCARD XCede L-SERIES HOLE PATTERN BACKPLANE SIGNAL MODULES REFERENCE =5.17 FROM OUTSIDE OF 5 POSTION BP SHROUD TO TOP OF CONNECTOR SIDE DC PCB 2 2.04 FROM TOP OF 2 DC PCB TO OF oO ROW A ON B/P Cn x] >) . INTENDED FOR LAYOUT PURPOSES ONLY. (24.8) a (2) USE 7.85MM NOMINAL FOR DAUGHTERCARD LAYOUT. S DESIGN 09705/2008 STATED PAD SIZE MAY REQUIRE FILLETING. SEE TB-2149 TOLERANCES M RECEDUTO Amphenol TCS FOR ROUTING GUIDELINES. 0 To - : DRAWN 06/15/2011 A Division of Amphenol Corporation _ (4) NOMINAL DIMENSION FOR FULLY SEATED CONNECTOR. 0.00 120.13 HCL-RP | 200 innovative Way, Nashua, NH 03062 603.879.3000 CHK 06/15/2011 TITLE Zz (S)) ADJACENT XCede HSD WAFER COLUMNS SHOWN FOR REFERENCE. 0.000 |+ - A-ASTBURY DAUGHTERCARD WAFER ASSEMBLY w= lapvp 06/15/2011 4 PAIR, XCede L-SERIES 6. REFER TO TB-2150 FOR XCede PRODUCT SPECIFICATIONS. ANGLES | 3 A.ASTBURY | part no. REV