40 | 9 8 7 | 6 | 5 4 3 2 Bo! stac NOTES Sy p20.1, |. WAE: 51067 YU-X 3.9) ASS ERB MATE WITH : 51067 SERIES NON-ACCUM. 2. tie ~-j--L- ~~~ LL Ty MATERIAL [ OL/\-?PBTP CADAZA15%AU) . UL94VO0 | WAFER :PBTP (G.F 15%), UL94V-0 ' _ rf Cy RR STIRS YE Ct 0.254) | ~ PIN: BRASS ; TIN OVER NICKEL PLATING (t=0.254) L 3. ABR 53258-**20 ONTU-BRCHS. secret or ror ror THIS PRODUCT IS LEAD FREE OF 53258-##20. A. xy XR TERMINAL PLATING RHXyx : A2XXyx 1m MIN. SREUHITUBEA GS) (t=1. 6) SURFACE PLATE: TIN 1em MIN. Fits % 2 =yvowry% 1m MIN. RECOMMENDED P.C. BOARD HOLE DIM. (REF.) UNDER PLATE NICKEL tum MIN. A - 10.5 3.50 8.7|53.2 | 49.0 [54.6 | 53258-1529 15 ry 49.7 [45.5 | 5h -1429| 14 C 4 . . . [60.8]8]C| rt PIN 1% [46.2 [42.0 | 47.6 % -1329| 13 1: 1 42.7 | 38.5 | 44.1 -1229| 2 39.2 | 35.0 | 40.6 -129 | 1 v 35.7 | 315 | 37.1 -1029| 10 S| la 32.2 | 28.0 | 33.6 -0929| 9 SY < 28.7 | 24.5 | 30. -0823| 8 k i ' _____! 25.2 | 21.0 | 26.6 -0729| 7 s 3 + [an7 [17.5 | 23.1 -0629] 6 | 3 \_|_ owes gr / |(3.2) : Sc ~pe091 = 35) | CIRCUIT NO. WAFER 18.2 | 14.0 : of : 8.7 | 14.7 | 10.5 | 16.1 4 -0429] 4 ite SECT-X-X 6.1 | 12 | 7.0 | 12.6 -0329| 3 c 6.1 | 7.7 | 3.5 | 91 | 53258-0229] 2 l CKT. (D) | Cc B A |MATERIAL NO.| dx Lx MODEL NO. | 53258-*#29 =a a GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD ANGLE S33 (UNLESS SPECIFIED) MM ONLY 4A METRIC | Cl pRovECTION 23s Ss DRAWN BY DATE TITLE a SEE] 2/79 UNDER +02 IT.UENO 2004/04/22 3.5 WIRE 19 BOARD CONN st E CHECKED BY DATE - - 25H [EO SOUNFR | +025 M.sasao 2004/04/22 2 Ww APPROVED BY DATE Ak sz2e (30% +03 MSASAO 2004/04/22 Kale MOLEX INCORPORATED MATERIAL _ S = =| | ANGULAR +3? MATERIAL NO. DOCUMENT NO. SHEET NO, Hac RR no 2=t DRAFT WHERE APPLICABLE SEE CHART _ | SD-53258-005 1 OF 1 SEE NOTES RW ou < MUST REMAIN SIZE! THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX A iw WITHIN DIMENSIONS AS INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION Rev 0 2004/04/03 9 8 7 6 | 5 | 4 | 3 | 2 EN-02JA(021)