HTMS8001FTB/AF,115 - NXP Semiconductors

1. General description

The HITAG product line is well known and established in the contactless identification

market.

Due to the open mark eting strategy of NXP Sem icon d uc to rs th er e ar e var io us

manufacturers well established for both the transponders/cards as well as the read/write

devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.

With the new HITAG µ family, this existing infrastructure is extended with the next

generation of ICs being substantially smaller in mechanical size, lower in cost, offering

more operation distance and speed, but still being operated with the same reader

infrastructure and transponder manufacturing equipment.

The protocol and command structure for HITAG µ is design to support Reader Talks First

(RTF) operation, including anti-collision algorithm.

Different memory sizes are offered and can be operated using exactly the same protocol.

1.1 Target markets

1.1.1 Animal identification

The ISO standards ISO 11784 and ISO 11785 are well established in this market and

HITAG µ is especially designed to deliver the optimum performance compliant to these

standards. The HITAG µ advanced ICs are offering additional memory for storage of

customized offline data like further breeding details.

1.1.2 Laundry automation

•Identify 200 pcs of garment with one read/write device

•Long operation distance with typical small shaped laundry button transponders

•Insensitive to harsh conditions like pressure, heat and water

HTMS1x01; HTMS8x01

HITAG µ transponder IC

Rev. 3.2 — 3 July 2012

152932 Product data sheet

COMPANY PUBLIC

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 2 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

1.1.3 Beer keg and gas cylinder logistic

•Recognizing a complete pallet of gas cylinders at one time

•Long writing distance

•Voluntarily change between TTF Mode with user defined data length and read/write

modes without changing the configuration on the transponder

•Authenticity check at the beer pubs - between beer bumper and supplied beer keg,

provides a safe pr otection of the beer bra n d

1.1.4 Brand protection

•Authenticity check for high level brands or for original refilling e.g. toner for fax

machines.

1.2 Customer application support and training

Within the dedicated CAS team within the BU Identification.

Accompanying data sheets and application notes:

http://www.nxp.com/products/identification/HITAG

2. Features and benefits

2.1 Features

Integrated circuit for contactless identification transponders and cards

Integrated resonance capacitor of 210 pF with 3 % tolerance or 280 pF with 5 %

tolerance over full production

Frequency range 100 kHz to 150 kHz

2.2 Protocol

Modulation read/write device  transponder: 100 % ASK and binary pulse length

coding

Modulation transponder  read/write device: Strong ASK modulation with

anti-collision, Manchester and Biphase coding

Fast anti-collision protocol

Cyclic Redundancy Check (CRC)

Transponder Talks First (TTF) mode

Temporary switch from Transponder Talks First into Reader Talks First (RTF) Mode

Data rate read/write device to transponder: 5.2 kbit/s

Data rates transponder to read/write device: 2 kbit/s, 4 kbit/s, 8 kbit/s

2.3 Memory

Different memory options

Up to 10000 erase/write cycles

10 years non-volatile data retention

Memory Lock functionality

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 3 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

32-bit password featur e

2.4 Supported standards

Full compliant to ISO 11784 and ISO 11785 Animal ID

Designed to support ISO/IEC 14223 Animal ID with anticollision and read/w rite

functionality

2.5 Security features

48-bit Unique Identification Number (UID)

2.6 Delivery types

Sawn, gold-bumped 8” wafer

HVSON2

SOT-1122

3. Applications

Animal identification

Laundry automation

Beer keg and gas cylinder logistic

Brand protec tion

4. Quick reference data

[1] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C); V IN1-IN2 = 0.5 V (RMS)

[2] Integrated Resonance Capacitor: 210 pF  3 %

[3] Integrated Resonance Capacitor: 280 pF  5 %

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Wafer EEPROM characteristics

tret retention time Tamb  55 C10--year

Nendu(W) write endurance 100000 - - cycle

Interface characteristics

Ciinput capacitance between LA and LB

HTMS1x01 [1][2] 203.7 210 216.3 pF

HTMS8x01 [1][3] 266 280 294 pF

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 4 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

5. Ordering information

Tabl e 2. Orderi ng information

Type number Package

Name Description Type Version

HTMS1001FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 210 pF -

HTMS1101FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG  Advanced,

210 pF -

HTMS1201FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG  Advanced+,

210 pF -

HTMS8001FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 280pF -

HTMS8101FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG  Advanced,

280 pF -

HTMS8201FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG  Advanced+,

280 pF -

HTMS1001FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG , 210 pF SOT1122

HTMS1101FTB/AF XSON3 plast ic extre mely th in smal l outlin e p ackag e; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG  Advanced,

210 pF SOT1122

HTMS1201FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG  Advanced+,

210 pF SOT1122

HTMS8001FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG , 280 pF SOT1122

HTMS8101FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG  Advanced,

280 pF SOT1122

HTMS8201FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1  1.45  0.5 mm HITAG  Advanced+,

280 pF SOT1122

HTMS1001FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG , 210 pF SOT899-1

HTMS1101FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG  Advanced,

210 pF SOT899-1

HTMS1201FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG  Advanced+,

210 pF SOT899-1

HTMS8001FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG , 280 pF SOT899-1

HTMS8101FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG  Advanced,

280 pF SOT899-1

HTMS8201FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3  2 

0.85 mm

HITAG  Advanced+,

280 pF SOT899-1

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 5 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

6. Block diagram

The HITAG µ transponder ICs require no external power supply. The contactless interface

generates the power supply and the system clock via the resonant circuitry by inductive

coupling to the Read /Write Device (RWD). The interface also demodulates data

transmitted from the RWD to the HITAG µ transponder IC, and modulates the magnetic

field for data transmission from the HITAG µ transponder IC to the RWD.

Data are stored in a non-volatile memory (EEPROM). The EEPROM has a cap acity of up

to 1760 bit and is organized in blocks.

Fig 1. Block diag ram of HITAG µ transpon de r IC

001aai334

CLK

MOD

DEMOD

VREG

VDD

data

out

clock

R/W

ANALOGUE

RF INTERFACE

PAD

RECT

Cres

DIGITAL CONTROL

TRANSPONDER

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

EEPROM

SEQUENCER

CHARGE PUMP

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 6 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

7. Pinning information

Fig 2. HITAG µ - Mega bumps bondpad locations

Table 3. HITAG µ - Mega bumps dimensions

Description Dimension

(X) chip size 550 µm

(Y) chip size 550 µm

(1) pad center to chip edge 100.5 µm

(2) pad center to chip edge 48.708 µm

(3) pad center to chip edge 180.5 µm

(4) pad cent er to chip edge 55.5 µm

(5) pad center to chip edge 48.508 µm

001aaj823

(4) (4)

(3)

(Y)

(X)

(2) (5)

(6) (6)

(1) (1)

LA LB

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 7 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

Note: All pads except LA and LB are electrically disconnected after dicing.

(6) pad center to chip edge 165.5 µm

Bump Size:

LA, LB 294 x 164 µm

Remaining pads 60 x 60 µm

Table 3. HITAG µ - Mega bumps dimensions

Description Dimension

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 8 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

8. Mechanical specification

8.1 Wafer specification

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

8.1.1 Wafer

•Designation: each wafer is scribed with batch number and

wafer number

•Diameter: 200 mm (8”)

•Thickness: 150 m ± 15 m

•Process: CMOS 0.14 µm

•Batch size: 25 wafers

•PGDW: 91981

8.1.2 Wafer backside

•Material: Si

•Treatment: ground and stress release

•Roughness: Ra max. 0.5 m, Rt max. 5 m

8.1.3 Chip dimensions

•Die size without scribe: 550 m x 550 m = 302500 m2

•Scribe line width:

X-dimension: 15 m (scribe line width is measured between

nitride edges)

Y-dimension: 15 m (scribe line width is measured between

nitride edges)

•Number of pads: 5

8.1.4 Passivation on front

•Type: sandwich structure

•Material: PE-Nitride (on top)

•Thickness: 1.75 m total thickness of passivation

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 9 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

8.1.5 Au bump

•Bump material: > 99.9% pure Au

•Bump hardness: 35 – 80 HV 0.005

•Bump shear strength: > 70 MPa

•Bump height: 18 m

•Bump height uniformity:

–within a die: ± 2 m

–within a wafer: ± 3 m

–wafer to wafer: ± 4 m

•Bump flatness: ± 1.5 m

•Bump size:

–LA, LB 294 x 164 m

–TEST, GND, VDD 60 x 60 m

–Bump size variation:  5 m

•Under bump metallization: sputtered TiW

8.1.6 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

8.1.7 Map file distribution

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 10 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

9. Functional description

9.1 Memory organization

The EEPROM has a capacity of up to 1760 bit and is organized in blocks of 4 bytes each

(1 block = 32 bits). A block is the smallest access unit.

The HITAG µ transponder IC is available with different memory size s as shown in Table 4

“Memory organization HITAG m (128-bit)”, Table 5 “Memory organization HITAG µ

Advanced (512 bit)” and Table 6 “Memory organization HITAG µ Advanced+ (1760 bit)”.

For permanent lock of blocks please refer to Section 14.9 “LOCK BLOCK”.

9.1.1 Memory organization HITAG  transponder ICs

[1] RO: Read without password, write with password

[2] R/W: Read and write without password

Table 4. Memory organization HITAG  (128-bit)

Block address Content Password Access

FFh User Config

FEh PWD

03h

ISO 11784/ISO 11785 128 bit TTF data bit3=0 R/W[2]

bit3=1 RO[1]

02h

01h

00h

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 11 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

9.1.2 Memory organization HITAG µ Advanced

[1] RO: Read without password, write with password

[2] R/W: Read and write without password

Table 5. Memory organization HITAG µ Advanced (512 bi t)

Block address Content Password Access

FFh User Config

FEh PWD

0Fh

User Memory bit4=0 R/W[2]

bit4=1 RO[1]

0Eh

0Dh

0Ch

0Bh

0Ah

09h

08h

07h

06h

05h

04h

03h

ISO 11784/ISO 11785 128-bit TTF data bit3=0 R/W[2]

bit3=1 RO[1]

02h

01h

00h

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 12 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

9.1.3 Memory organization HITAG µ Advanced +

[1] RO: Read without password, write with password

[2] R/W: Read and write without password

[3] R/W(P): Read and write with password

Table 6. Memory organization HITAG µ Advanced+ (1760 bit)

Block address Content Password Access

FFh User Config

FEh PWD

36h

User Memory bit6=0 bit5=0 R/W[2]

bit6=0 bit5=1 RO[1]

bit6=1 bit5 =0 R/W(P)[3]

bit6=1 bit5 =1 R/W(P)[3]

35h

...

14h

13h

12h

11h

10h

0Fh

User Memory bit4=0 R/W[2]

bit4=1 RO[1]

0Eh

0Dh

0Ch

0Bh

0Ah

09h

08h

07h

06h

05h

04h

03h

ISO 11784/ISO 11785 128-bit TTF data bit3=0 R/W[2]

bit3=1 RO[1]

02h

01h

00h

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 13 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

9.2 Memory configuration

The user configuration block co nsists of on e configurable byte (Byte0 ) and three rese rved

bytes (Byte1 to Byte3)

The bit s in the use r configur ation block enable a customized configuration of the HITAG µ

transponder ICs. In TTF mode the user can choose Bi-phase or Man chester encoding and

also the data rate for the return link (bit0 to bit2). In RTF mode data rate and coding are

fixed with 4 kbit/s Manchester encoding.

Fitting to ISO 11785 standard the default values are set for 4 kbit/s Bi-Phase encoding.

The next four bits (bit 3 to bit 6) are used for password settings.

Three areas (TTF area(128bit), lower 512 bits and upper memory) can be restricted to

read/write access.

The user configuration block (User Config) is programmable by using WRITE SINGLE

BLOCK command at address FFh. Bits 7 to 31 (Byte1 to Byte3) are reserved for further

usage.

The user configuration block (block address FFh) and the password block (block address

FEh) can be locked w ith th e LO CK BLO CK com m a nd .

Attention:

•Pre-programmed default values are not locked !

•Configuration block has to be locked to make data unalterable!

•The lock of the block s is perm a nen tly an d th er ef or e irr ev er sib le!

[1] PWD(w)=1: read without password and write with password

[2] PWD(r/w)=1: read and write with password

Table 7. User configuration block to Byte0

Byte0 Description

bit6 bit5 bit4 bit3 bit2 bit1 ... 0 Bit-no.

PWD (r/w) [2]

Bit512… Max PWD (w) [1]

Bit128… 511 PWD (w) [1]

Bit0… 127 Encoding Data rate

0… MCH

1… Bi-Ph. ’00’… 2kbit/s

’01’… 4kbit/s

’10’… 8kbit/s

Value/meaning

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 14 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

10. General requirements

The HITAG  transponder ICs are compatible with ISO 11785. At the time a HITAG 

transponder IC is in the interrogator field it will respond according to ISO 11785.

A HITAG  advanced/advanced+ can be identified as a transponder being in the data

exchange mode (advanced mode) by the type information in the reserved bit field sent to

the RWD.

•Bit 15 of the ISO 11784 frame shall be set to ’1’ indicating that this is an HITAG µ

advanced/advanced+ in data exchange mode.

•Bit 16 of the ISO 11784 frame (additional data flag set to ’1’, indicating that the

HITAG µ advanced/advanced+ in dat a exchange mode cont ains additional dat a in the

user memory area.

To bring the HITAG µ transponder ICs into the data exchange mode, the RWD needs to

send a valid request or a valid switch command within the defined listening window.

A HITAG µ transponder IC in data exchange mode onl y responds when requested by the

RWD (RTF mode).

The identification code, all communication from reader to HITAG µ transponder ICs and

vice versa and the CRC error detection bits (if applicable) are trans mitted starting with

LSB first.

In the case that multiple HITAG µ advanced/advanced+ in dat a exchang e mode are in the

interrogation field which cause collisions the RWD has to start the anticollision procedure

as described in this document. Depending in which p art of the ISO 11785 timing frame the

collision is detected the RWD will start with the anticollision request.

The HITAG  transponder IC in data exchange mode switches back to the standard

ISO 11785 mode when it :

•is no longer in the interrogation field

•has terminated the data exchange mode operations and the interrogation field was

switched off for at least 5 ms afterwards

11. HITAG  transponder IC air interface

11.1 Downlink description

To transfer the HITAG µ transponder ICs into the data exchange mode, the RWD's

interrogation field needs be switched off. After this off-period, the interrogation fiel d is

switched on again, an d eithe r the SOF at th e start of a valid requ e st or the sp ec ial switch

command needs to be sent to the HITAG µ transponder IC within the specified switch time

window. The HITAG µ transponder IC switches itself into the data exchange mode upon

reception of any of the switch commands. In this mode, the HITAG µ transponder IC

respond when requested by the RWD (reader driven protocol).

The HITAG µ transponder IC in data exchange mode switches back to the ISO 11785

mode after the interrogation field has b een switched off for at least 5 ms.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 15 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

The steps necessary to transfer the HITAG  transponder IC into the data exchange mode

are shown in Figure 3. The downlink communica tion takes place in period C and D. The

example in Figure 3 shows two data blocks (#1 and #2) being selected by the R WD, which

then are transmitted by the HITAG µ transponder IC.

Fig 3. RF interface for HITAG µ

Cycle A: The RWD reads the ISO 11785 frame.

Cycle B: The RWD switches off the interrogation field for at least 5 ms in order to reset the

HITAG µ transponder IC.

Cycle C: The RWD sends either the SOF at the start of a valid reque st or the SWITCH

command to the HITAG µ transponder IC in order to put it into the data exchange

mode. Any of these has to be issued within the switch window after reset - as

defined in Section 11.2 “Mode switching protocol”

Cycle D: Read /Write (for HITAG µ transponder ICs) or Inventory (HITAG µ

advanced/advanced+ transponder ICs) operation in the data exchange mode.

Cycle E: Af te r all op e r a ti o ns are finished or the HITAG µ transponder IC left the anten na

field, the RWD switches off the field for at least 5 ms in order to poll for new

incoming HITAG µ or HITAG µ advanced/advanced+.

001aaj824

5 .. 20 ms 5 .. 20 ms

time

min 5 ms

ISO11785 ISO11785

HITAG μ

reader

field

HITAG μ

response

ABC D DEABA

ISO11785ISO11785 #1 #2

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 16 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.2 Mode switching protocol

After powering the HITAG µ transponder IC switches to the data exchange mode after

receiving one of the two possible switch commands from the RWD during the specified

switch window (see Table 8 and Figure 4 for details).

[1] TC...Carrier period time (kHz = 7.45 s nominal)

Fig 4. Switching window timing

Table 8. HITAG µ transponder IC air interface parameters [1]

Parameter Description

Interrogation field modulation Amplitude modulation (ASK), 90 - 100%

Encoding Pulse Interval Encoding; Least Significa nt Bit (LSB) first

Bit rate 5. 2 kbit/s typically

Mode switching Either a specific 5 bit switch command or the detection of the

SOF as p ar t of a va li d HITAG µ transponder IC command,

transmitted after the interruption of the interrogation field for at

least 5 ms

Mode switch timing HITAG µ transponder IC s ettling time: 312.5 TC switch

command window after HITAG µ transponder IC settling:

232.5  TC

All within cycle C in Figure 3.

Mode switch command 00011 or SOF sequence

001aak278

312.5 × Tc232 × Tc

TTF operation in case

of no command

during switching window

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 17 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

The RWD sends either the SOF at the start of a valid request or a special switch

command to the HITAG µ (as shown in Figure 5) in or der to transfer it into the data

exchange mode.

11.2.1 SWITCH

Setting the transponder into data exchange mode (advanced mode) is done by sending

SOF pattern or the switch command within the listening window (232.5 x TC). The

SWITCH command itself does not contain SOF and EOF.

Fig 5. Reader downlink modulation for SWITCH command

001aaj825

carrier on 0

0 0 0 1 1 stop condition

time

code violation

SOF FDX ADV command

carrier off

transceiver

carrier on

carrier off

0switch command

Table 9. SWITCH Command

Command Description

5 No. of bits

00011

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 18 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.3 Downlink communication signal interface - RWD to HITAG µ

transponder IC

11.3.1 Modulation parameters

Communications between RWD and HITAG µ transponder IC takes place using ASK

modulation with a modulation index of m > 90%.

[1] TF3 shall not exceed TFd0 - TF1 - 3  Tc

[2] TC...Carrier period time (kHz = 7.45 s nominal)

Fig 6. Modulation details of data transmission from RWD to HITAG µ transponder IC

Table 10. Modulation coding times[1][2]

Symbol Min Max

m = (a-b)/(a+b) 90% 100%

TF1 4 Tc10  Tc

TF2 00.5  TF1

TF3 00.5  TFd0

x00.05  a

y00.05  a

001aaj826

envelope of transceiver field

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 19 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.3.2 Data rate and data coding

The RWD to HITAG µ transponder IC communication uses Pulse Interval Encoding. The

RWD creates pulses by switching the carrier off as described in Figure 7. The time

between the falling edges of the pulses determines either the value of the data bit ’0’, the

data bit ’1’, a code violation or a stop condition.

Assuming equal distributed data bits ’0’ and ’1’, the data rate is in the ra nge of about

5.2 kbit/s.

[1] TC...Carrier period time (kHz = 7.45 s nominal)

Fig 7. Reader to HITAG µ transponder IC: Pulse Interval Encoding

Table 11. Data coding times [1]

Meaning Symbol Min Max

Carrier off time TF1 4  Tc10  Tc

Data “0” time TFd0 18  Tc22  Tc

Data “1” time TFd1 26  Tc30  Tc

Code violation time TFcv 34  Tc38  Tc

Stop condition time TFsc  42  Tcn/a

001aaj827

carrier on

TF1

carrier off

TFsc

"stop condition''

carrier on

TF1

carrier off

TF1

TFcv

"code violation''

carrier on

TF1

carrier off

TF1

TFd1

data "1''

carrier on

TF1

carrier off

TF1

TFd0

data "0''

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 20 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.3.3 RWD - Start of frame pattern

The RWD requ ests in th e data exchan ge mode always a st art with a SOF p attern for ease

of synchronization. The SOF pattern consists of an encoded data bit ’0’ and a ’code

violation’.

The HITAG µ advanced/advanced+ is ready to receive a SOF from the RWD within

1.2 ms after having sent a response to the RWD.

The HITAG µ advanced/advanced+ is ready to receive a SOF or switch command from

the RWD within 2.33 ms after the RWD has established the powering field.

11.3.4 RWD - End of frame pattern

For slot switching during a multi-slot anticollision sequence, the RWD request is an EOF

pattern. The EOF pattern is represented by a RWD ’Stop condition’.

Fig 8. Start of frame pattern

001aaj828

carrier on

TFd0

TFpSOF

TF1

carrier off

TF1 TF1

TFcv

data "0" "code violation"

Fig 9. End of frame pattern

001aaj829

carrier on

TFpEOF

TF1

carrier off

TFsc

"stop condition''

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 21 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.4 Communication signal interface - HITAG µ transponder IC to RWD

11.4.1 Data rate and data coding

The HITAG µ tran spo n der IC accepts the following data rates and encodin g sche m es :

•1/TFd Differential bi-phase cod ed data signal in the ISO 1 1785 mo de, without SOF and

EOF

•1/TFd Manchester coded data signal on the response to the HITAG µ

advanced/advanced+ commands in data exchange mode

•1/(2 TFd) dual pattern data coding when responding within the inventory process

•TTF mode (not ISO 11785 compliant): 1/(2 TFd), 2/TFd Manchester or bi-phase

coded

TFd = 32 / fc = 32  Tc

Remark: The slower dat a ra te used durin g the inventory process allo ws for improvin g the

collision detection when several HITAG µ transponder ICs are present in the RWD field,

especially if some HITAG µ transponder ICs are in the near field and o thers in the far field.

Differential Bi-phase (or FM0 respectively) contains a transition in the center of bit

conversion representing Data ’0’ and no one for Data ’1’. At the beginning of every bit

modulation a level transition must be performed.

Fig 10. HITAG µ transponder IC - Load modulation coding

Fig 11. HITAG µ transponder IC - Differential Bi-Phase Modulation

001aaj830

load offdata "0"

load on

load off

load on

load offdata "1"

load on

load off

load on

response encoding in

INVENTORY mode

response encoding to a RWD

request in data exchange mode

data

element

001aaj831

data

Bi-phase

10 1 1 1100

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 22 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

11.4.2 Start of frame pattern

The HITAG µ transponder IC response - if not in ISO 11785 compliant mode - always

starts with a SOF pattern. The SOF is a Manchester encoded bit sequence of ’110’.

11.4.3 End of frame pattern

A specific EOF pattern is neither used nor specified for the HITAG µ transponder IC

response. An EOF is detected by the reader if there is no load modulation for more than

two data bit periods (TFd).

Fig 12. Start of fame pattern

001aaj832

load off

data "1" data "1" data "0"

load on

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 23 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

12. General protocol timing specification

For requests where an EEPROM erase and/or programming operation is required, the

transponder IC returns its response when it has completed the write/lock operation. This

will be after 20 ms upon detection of the last falling edge of the interrogator request or

after the interrogator has switched off the field.

12.1 Waiting ti me before transmitting a response after an EOF from the

RWD

When the HITAG advanced/advanced+ in dat a exchange mode has detected an EOF of a

valid RWD reque st or when this EOF is in the no rmal sequence o f a valid R WD request, it

waits for TFp1 before st arting to tr ansmit it s r esponse to a R WD request or whe n switching

to the next slot in an inventory process.

TFp1 starts from the detection of the falling edge of the EOF received from the RWD.

Remark: The synchro nization o n the fa lling ed ge fro m the RW D to the EOF of the HITAG

µ transponder ICs is necessary to ensure the required synchronization of the HITAG µ

transponder IC responses.

The minimum value of TFp1 is TFp1min = 204 TC

The typical value of TFp1 is TFp1typ = 209 TC

The maximum value of T Fp1 is TFp1max = 213 TC

If the HITAG µ transponder IC detects a carrier modulation during this time (TFp1), it shall

reset its TFp1-timer and wait for a further time (TFp1) before starting to transmit its

response to a RWD request or to switch to the next slot when in an inventor y process.

Fig 13. General protoc ol timin g di ag ram

001aaj833

carrier on request

response

request (or EOF)

carrier off

load off

load on

HITAG μ

transceiver

TNRT

TFp1 TFp2

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 24 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

12.2 RWD waiting time before sending a subsequent request

•When the R WD has received a HITAG µ advanced/advan ced+ response to a previou s

request other than inventory and quiet, it needs to wait TFp2 before sending a

subsequent request. TFp2 starts from the time the last bit has be en rec eiv ed fro m the

HITAG µ advanced/advanced+.

•When the RWD has sent a quiet request, it needs to wait TFp2 before sending a

subsequent request. TFp2 starts from the end of the quiet request's EOF (falling edge

of EOF pulse + 42 TC). This results in awaiting time of (150 TC + 42 TC) before

the next request.

The minimum value of TFp2 is TFp2min = 150 TC ensures that the HITAG µ

advanced/advanced+ICs are ready to receive a subsequent request.

Remark: The RWD needs to wa it at least 2.33 ms after it has activated the

electromagnetic field before sending the first request, to ensure that the HITAG µ

transponder ICs are ready to receive a request.

•When the RWD has sent an inventory request, it is in an inventory process.

12.3 RWD waiting time before switching to next inventory slot

An inventory process is st arted when the R WD sends an inventory request. For a det ailed

explanation of the inventory process refer to Section 14.3 and Section 14.4.

To switch to the next slot, the RWD sends an EOF after waiting a time period specified in

the following sub-clauses.

12.3.1 RWD started to receive one or more HITAG µ transponder IC responses

During an inventory process, when the RWD has started to receive one or more HITAG µ

advanced/advanced+ transponder IC responses (i.e. it has detected a HITAG µ

advanced/advanced+ transponder IC SOF and/or a collision), it shall

•wait for the complete reception of the HITAG µ advanced/advanced+ transponder IC

responses (i.e. when a last bit has been received or when the nominal response time

TNRT has elapsed),

•wait an additional time TFp2 and then send an EOF to switch to the next slot, if a 16

slot anticollision request is processed, or send a subsequent request (which could be

again an inventory request).

TFp2 start s from the time the last bit has been received from the HITAG µ

advanced/advanced+ transponder IC.

The minimum value of TFp2 is TFp2min = 150 TC.

TNRT is dependant on the anticollisions current mask value and on the setting of the CRCT

flag.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 25 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

12.3.2 RWD receives no HITAG µ transponder IC response

During an inventory process, when the RWD has received no HITAG µ

advanced/advanced+ transponder IC response, it needs to wait TFp3 before sending a

subsequent EOF to switch to the next slot, if a 16 slot anticollision request is processed, or

sending a subsequent request (which could be again an inventory request).

TFp3 starts from the time the RWD has generated the falling edge of the last sent EOF.

The minimum value of TFp3 is TFp3min = TFp1max + TFpSOF.

TFpSOF is the time duration for a HITAG µ advanced/advanced+ transponder to transmit

an SOF to the reader.

[1] TC...Carrier period time (kHz = 7.45 s nominal)

Fig 14. Protocol timing diagram without HITAG µ transponder IC response

Table 12. Overview timing parameters [1]

Symbol Min Max

TFpSOF 3TFd 3 TFd

TFp1 204 TC213 TC

TFp2 150 TC-

TFp3 TFp1max + TFpSOF -

001aaj834

carrier on request

no response

request (or EOF)

carrier off

load off

load on

HITAG μ

reader

TFpSOF

TFp3

TFp1MAX

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 26 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

13. State diagram

13.1 General description of states

RF Off

The powering magnetic field is switched off or the HITAG µ transponder IC is out of the

field.

WAIT

After start up phase, the HITAG µ transponder IC is ready to receive the first command.

READY

The HITAG µ transponder IC enters this state after a valid command, except of the STAY

QUIET, SELECT or WRITE-ISO11785 command. If there are several HITAG µ

transponder ICs at the same time in the field of the RWD antenna, the anticollision

sequence can be started to determine the UID of every HITAG µ transponder IC.

SELECTED

The HITAG µ transponder IC enters the Selected state after receiving the SELECT

command with a matching UID. In the Selected state the respective commands with

SEL=1 are valid only for selected transponder.

Only one HITAG µ transponder IC can be selected at one time. If one transponder is

selected and a seco nd transponder receives the SELECT Command, the first transponder

will automatically change to Quiet state.

QUIET

The HITAG µ transponder IC enters this st a te after receiving a STAY QUIET command or

when he was in selected state and receives a SELECT command addressed to another

transponder.

In this state, the HITAG µ transponder IC reacts to any request commandos where the

ADR flag is set.

ISO 11785 STATE

In this state the HITAG µ transponder IC replies according to the ISO 11785 protocol.

Remark:

In case of an invalid command the transponder will remain in his actual state.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 27 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

13.2 State diagram HITAG  advanced/advanced+

Fig 15. State diagram of HITAG µ advanced/advanced+ transponder ICs

aaa-000326

READY

RF Off

Invalid Request

(reset time-out)

out of field

or RF off

WAIT

for time-out

No request

and RF on

RF on

valid

request

„read UID“ or

any other request

with SEL flag not set

QUIET SELECTED

„STAY QUIET“

(UID) „SELECT“ (UID)

„STAY QUIET“ or

„SELECT“ (non-matching-UID)

any other request

with ADR flag set any other request

with ADR flag set or

SEL flag set

Anticollision

„INVENTORY“

„INVENTORY ISO-11785“

„READ MULTIPLE BLOCK

in inventory mode“

RF-off:

„go to RF-off state“

„SELECT“ (UID)

ISO 11785

FDX-B out of field

or RF off

out of field

or RF off

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 28 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

13.3 State diagram HITAG 

Fig 16. State diagram of HITAG µ transponder IC

aaa-000325

out of field

or RF off

READY

RF Off

Invalid Request

(reset time-out)

out of field

or RF off

WAIT

for time-out

ISO 11785

FDX-B

No request

and RF on

RF on

valid

request

„read UID“ or

any other request

with SEL flag not set

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 29 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

13.4 Modes

13.4.1 ISO 11785 Mode

This mode is also named TTF (Transponder Talks First).

Every time a transponder IC is activated by the field it starts executing this mode. After

waiting the maximum listening window time (see Section 11.2) the transponder IC sends

continuously its TTF data (128-bit).

The TTF data stored in the memory will be not checked for ISO compliance, therefore

data will be sent as stored in the EEPROM.

Receiving a valid command or a switch command within the listening window sets the

transponder IC into RTF (Reader Talks First) mode.

13.4.2 RTF Mode

In this mode the transponder IC reacts only to RWD request commands as presented in

Section 14. A valid request consists of a command sent to the transp onder IC being in

matching state (therefore see tables in Section 14 and transponder ICs state machine in

Section 13).

13.4.3 Anticollision

The RWD is the master of the communication with one or multiple transponder ICs. It

starts the anticollision sequence by issuing the inventory request (see Section 14.3).

Within the RWD command the NOS flag must be set to the desired setting (1 or 16 slots)

and add the mask length and the mask value after the command field.

The mask length n indicates the number of significant bits of the mask value. It can have

any value between 0 and 44 when 16 slots are used and any value between 0 and 48

when 1 slot is used.

The next two subsections summarize the actions done by the tr ansponder IC during an

inventory round.

13.4.3.1 Anticollision with 1 slot

The transponder IC will receive one ore more inventory comma nds with NOS = '1'. Every

time the transponder ICs fractional or whole UID matches the mask value of RWD's

request it responses with remaining UID without mask value.

Transponder ICs responses are modulated by dual pattern data coding as described in

Section 11.4.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 30 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

13.4.3.2 Anticollision with 16 slots

The transponder IC will receive several inventory commands with NOS = '0' defining an

amount of 16 slots. Within the request there is the mask specified by length and value

(sent LSB first).

In case of mask length = '0' the four least significant bits of transponder ICs UID become

the starting value of transponder IC's slot counter.

In case of mask length  '0' the received fractional mask is compared to transponder IC's

UID. If it matches the starting value for transponder IC's slot number will be calculated.

Starting at last significant bit of the sent mask the next four less significant bits of UID are

used for this value. At the same time transponder IC's slot counter is reset to '0'.

Now the RWD begins its anticollision algorithm. Every time the transponder IC receives an

EOF it increments slot-counter. Now if mask value and slot-counter value are matching

the transponder IC responses with the remaining UID without mask value but with slot

number

In case of collision within one slot the RWD changes the mask value and starts again

running its algorithm.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 31 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14. Command set

The first part of this section (Section 14.1) describes the flag s used in every R WD

command. The following subsections (Section 14.3 until Section 14.13) explain all

implemented commands a nd their suit able transponder IC responses which are done with

tables showing the comma nd itself and suitable respon se s.

Within tables flags, parameter bits and parts of a response written in braces are optional.

That means if the suitable flag is set resulting transponder IC's action will be performed

according to Section 14.1.

Every command except the Switch command is embedded in SOF and EOF pattern. As

described in Table 13 and Table 14 sending and receiving data is done with the least

significant bit of every field on first position.

Important information:

In this document the fields (i.e. command codes) are written with most significant

bit first.

[1] values in braces are optional

[2] data is sent with least significant bit first

[1] values in braces are optional

[2] data is sent with least significant bit first

Table 13. Reader - Transponder IC transmis sion [1][2]

SOF Flags Commands Parameters Data CRC-16 EOF

- 5 6 var. var. (16) -

- LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB -

Table 14. Transponder IC - Reader transmission [1][2]

SOF Error flag Data/Error code CRC-16 EOF

- 1 var. (16) -

- - LSB ... MSB LSB ... MSB -

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 32 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.1 Flags

Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5

(MSB). The specific meaning depends on the context.

Note:

For HITAG µ inventory (INV) flag and select (SEL) flag must be set to ’0’

Table 15. Command Flags

Bit Flag Full name Value Description

1 PEXT Protocol EXTension 0

1No protocol format extension

RFU

2 INV INVentory 0

1Flag 4 and Flag 5 are ’SEL’ and ’ADR’ Flag

Flag 4 and Flag 5 are ’RFU’ and ’NOS’ Flag

3 CRCT CRC-Transponder 0

1Transponder IC respond without CRC

Tr ansponder IC respond contains CRC

4SEL

(INV==0) SELect in combination with ADR (see Table 17)

5ADR

(INV==0) ADdRess in combination with SEL (see Table 17)

4RFU

(INV==1) Reserved for future

use 0 this flag is not used and set to '0'

5NOS

(INV==1) 0

116 slots while performing anti-collision

1 slot while performing anti-collision

Table 16. Command Flags - Bit order

MSB

bit5 bit4 bit3 bit2 LSB

bit1

INV==0 ADR SEL CRCT INV PEXT

INV==1 NOS RFU CRCT INV PEXT

Table 17. Meaning of ADR and SEL flag

ADR SEL Meaning

0 0 Request without UID, all transponder ICs in READY state shall respond

1 0 Request contains UID, one transponder IC (with corresponding UID) shall

respond

0 1 Request without UID, the transponder IC in SELECTED state shall respond

1 1 Reserved for future use

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 33 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.2 Error handling

In case an error has be en occ ur re d the tra n s ponder IC responses with the set error flag

and the three bit code ’111’ (meaning ’unknown error’).

The general response format in case of an error response is shown in Table 18 whereas

commands not supporting error responses are excluded. In case of an unsupported

command there will be no response. The format is embedded into SOF and EOF.

Table 18. Response format in error case

Error flag Error code CRC-16 Description

1 3 (16) No. of bits

1111

Fig 17. HITAG µ transponder IC response - in case of no error

Fig 18. HITAG µ transponder IC response - in error case

001aak260

SOF Error Flag

''0'' Data (CRC) EOF

001aak262

SOF Error Flag

''1'' Error Code

''111'' (CRC) EOF

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 34 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.3 INVENTORY

[Advanced, Advanced+]

Upon reception of this command withou t erro r, all transponder ICs in th e rea dy state shall

perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS

flag determines whether 1 or 16 slots are used.

If a transponder IC detects any error, it shall remain silent.

[1] Error and CRC are Manchester coded, UID is dual pattern coded

[2] Response within the according time slot

Error Flag set to ’0’ indicates no error.

Table 19. INVENTORY - Request format (00h)

Flags Command Mask length Mask value CRC-16 Description

5 6 6 n (16) No. of bits

10(1)10 000000 0 n UID length UID Mask AC with 1

timeslot

00(1)10 000000 0 n UID length UID Mask AC with 16

timeslot

Table 20. Response to a successful INVENTORY request [1][2]

Error Flag Data CRC-16 Description

1 48 - n (16) No. of bits

0 Remaining UID without mask value

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 35 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.4 INVENTORY ISO 11785

[Advanced, Advanced+]

Upon reception of this command without error, all transponder ICs in the ready state are

performing the anticollision sequence. The inventory (INV) flag is set to '1'. The NOS flag

determines whether 1 or 16 slots are used.

In contrast to INVENTORY command the transponder IC (holding requested slot) sends

the 64-bit ISO 11785 number in addition to remaining UID. The 64-bit number is taken

from a fixed area of EEPROM. It will not be checked on ISO 11785 compliance before

sending.

If a transponder IC detects any error, it remains silent.

[1] Error, CRC and ISO 11785 number are Manchester coded, UID is dual pattern coded

14.5 STAY QUIET

[Advanced, Advanced+]

Upon reception of this command without error, a transponder IC in either ready state or

selected state enters the quiet state and shall not send back a response.

The STAY QUIET command with both SEL and ADR flag set to '0' or both set to '1' is not

allowed.

There is no response to the STAY QUIET request, even if the transponder detect s an err or

Table 21. INVENTORY ISO 11785 - request format (23h)

Flags Command Mask length Mask value CRC-16 Description

5 6 6 n (16) No. of bits

10(1)10 100011 0 n UID length UID Mask AC with 1

timeslot

00(1)10 100011 0 n UID length UID Mask AC with 16

timeslot

Table 22. Response to a successful INVENTORY ISO 11785 request[1]

Error Flag Data 1 Data 2 CRC-16 Description

1 48 - n 64 (16) No. of bits

0 Remaining UID without mask value ISO 11785 number

Table 23. STAY QUIET - request format(01h )

Flags Command Data CRC-16 Description

5 6 (48) (16) No. of bits:

00(1)00 000001 - without UID

11(1)00 000001 UID with UID

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 36 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.6 READ UID

[, Advanced, Advanced+]

Upon reception of this command without error all transponder ICs in the ready state are

sending their UID.

The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to

'0'.

Error flag set to ’0’ indicates no error.

Table 24. READ UID - request format (02h)

Flags Command CRC-16 Description

5 6 (16) No. of bits

00(1)00 000010

Table 25. Response to a successful READ UID request

Error flag Data CRC-16 Description

1 48 (16) No. of bits

0UID

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 37 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.7 READ MULTIPLE BLOCK

[, Advanced, Advanced+]

Upon reception of this command without error, the transponder reads the requested

block(s) and sends back their value in the response. The blocks are numbered from 0 to

255.

The number of blocks in the request is one less than the number of blocks that the

transponder returns in its response i.e. a value of '6' in the ’Number of blocks’ field

requests to read 7 blocks. A value '0' requests to read a single block.

Error Flag set to ’0’ indicates no error.

Table 26. READ MULTIPLE BLOCKS (advanc ed/advan ce d+) - request format (12h)

Flags Command Data 1 Data 2 Data 3 CRC-16 Description

5 6 (48) 8 8 (16) No. of bits

00(1)00 010010 - First block

number Number of

blocks without UID

in READY

state

10(1)00 010010 UID First block

number Number of

blocks with UID in

READY

state

01(1)00 010010 - First block

number Number of

blocks without UID

SELECTED

state

Table 27. READ MULT IPLE BLOCKS (µ) - request format (12h)

Flags Command Data 1 Data 2 Data 3 CRC-16 Description

5 6 (48) 8 8 (16) No. of bits

00(1)00 010010 - First block

number Number of

blocks without UID

in READY

state

10(1)00 010010 UID First block

number Number of

blocks with UID in

READY

state

Table 28. Response to a successful READ MULTIPLE BLOCKS request

Error Flag Data CRC-16 Description

1 32 x Number of blocks (16) No. of bits

0 User memory block data

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 38 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.7.1 READ MULTIPLE BLOCKS in INVENTORY mode

[Advanced, Advanced+]

The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is

marked by INV-Flag = '1' within the request). Here request and response will change as

shown in following tables.

If the transponder detects an error during the inventory sequence, it shall remain silent.

After r eceiving R WD's comman d without er ror th e transp onder IC tran smit s the rem aining

section of the UID in dual pattern code. The following data (Error Flag, Data 2, optional

CRC in no error case; Error Flag, Error Code, optional CRC in error case) is transmitted in

Manchester Code.

[1] Error, CRC and Data are Manchester coded, UID is dual pattern coded

Table 29. READ MULTIPLE BLOCKS - request format (12h)

Flags Command Mask

length Mask

value Parameter 1 Parameter 2 CRC-16 Description

5 6 6 n 8 8 (16) No. of bits

10(1)10 010010 0 n UID

length First block

number Number of

blocks AC with 1

timeslot

00(1)10 010010 0 n UID

length First block

number Number of

blocks AC with 16

timeslot

Table 30. READ MULTIPLE BLOCKS in INVENTORY mode Response format [1]

Error Flag Data 1 Data 2 CRC-16 Description

1 48 - n 32 x number of blocks (16) No.of bits

0 Remaining section of UID

(without mask value) User memory block data

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 39 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.8 WRITE SINGLE BLOCK

[, Advanced, Advanced+]

Upon reception of this comman d without error , the transp onder IC writes 32-bit of dat a into

the requested user memory block an d report the success of the opera tion in the response.

Error Flag set to ’0’ indicates no error.

Table 31. WRITE SINGLE BLOCK (advanced/ad v an ced+) - request form at (14h)

Flags Command Dat a 1 Data 2 Dat a 3 CRC-16 Description

5 6 (48) 8 32 (16) No. of bits

(1)0(1)00 010100 - block number b lock data without UID

in READY

state

0(1)(1)00 010100 UID block number block data with UID in

READY

state

01(1)00 010100 - block number block data without UID

SELECTED

state

Table 32. WRITE SINGLE BLOCK (µ) - request format (14h)

Flags Command Dat a 1 Data 2 Dat a 3 CRC-16 Description

5 6 (48) 8 32 (16) No. of bits

00(1)00 010100 - block number block data w ithout UID

in READY

state

10(1)00 010100 UID block number block data with UID in

READY

state

Table 33. Response to a successful WRITE SINGLE BLOCK request

Error Flag CRC-16 Description

1 (16) No. of bits

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 40 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.9 LOCK BLOCK

[, Advanced, Advanced+]

Upon reception of this command without error, the transponder IC is write locking the

requested block (block size = 32-bit) permanently.

Blocks within the block address range from 00h to 17h as well as FEh and FFh can be

locked individually.

For HITAG µ advanced+ transponder IC a LOCK BLOCK command with a block number

value between 18h to 36h will lock all blocks within the block address range 18h to 36h.

In case a password is applied to the memory a lock is only possible after a successful

Error Flag set to ’0’ indicates no error.

Table 34. LOCK BLOCK (advanced/advanced+) - request format (16h)

Flags Command Data 1 Data 2 CRC-16 Description

5 6 (48) 8 (16) No. of bits

00(1)00 010110 - block number without UID

in READY

state

10(1)00 010110 U ID block number with UID in

READY

state

01(1)00 010110 - block number without UID

SELECTED

state

Table 35. LOCK BLOCK (µ) - request format (16h)

Flags Command Data 1 Data 2 CRC-16 Description

5 6 (48) 8 (16) No. of bits

00(1)00 010110 UID block number without UID

in READY

state

10(1)00 010110 - block number with UID in

READY

state

Table 36. Response to a successful LOCK BLOCK request

Error flag CRC-16 Description

1 (16) No. of bits

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 41 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.10 SELECT

[Advanced, Advanced+]

The SELECT command is always be executed with SEL flag set to '0' an d ADR flag set to

'1'. There are several possibilities upon reception of this command without error:

•If the UID, received by the tran sponder IC, is equal to it s own UID, the transpon der IC

enters the Selected state and shall send a response.

•If the received UID is different there are two possibilities

–A transponder IC in a non-selected state (QUIET or READY) is keeping its state

and not sendi ng a res po nse.

–The transp ond er IC in the Se lected state enters the Quiet state and do es no t send

a response.

Error Flag set to ’0’ indicates no error.

Table 37. SELECT - request form at (18h)

Flags Command Data 1 CRC-16 Description

5 6 48 (16) No. of bits

10(1)00 011000 UID

Table 38. Response to a successful SELECT request

Error flag CRC-16 Description

1 (16-bit) No. of bits

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 42 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.11 WRITE ISO 11785 (custom command)

[, Advanced, Advanced+]

Upon reception of this command without error, the transponder IC (in Ready state) writes

128-bit of ISO 11785 TTF data into suitable reserved memory block and report the

success of the operation in the response. The user does not have to attend whether the

data is compliant to ISO 11785 or not. The command data block is sent exactly the same

way as it is sent by the transponder IC in TTF mode (Header, 64-bit ID, CRC…) after

entering the field again.

There are two different command codes one for locking the TTF are a after successful

write command and one without locking.

The command must be completed by a reset of the IC. After entering the RF field the

ISO 11785 data is sent when the transponder is in ISO 11785 state.

Error Flag set to ’0’ indicates no error.

The minimum value of TFp1 is 20 ms.

Table 39. WRITE ISO 11785 - request format (38h, 39h)

Flags Command Data 1 CRC-16 Description

5 6 128 (16) No. of bits

00(1)00 111000 ISO 11785 TTF data

00(1)00 111001 ISO 11785 TTF data inc. LOCK

Table 40. Response to a successful WRITE ISO 11785 request

Error flag CRC-16 Description

1 (16) No. of bits

Fig 19. Waiting time before a response for WRITE ISO 11785 command

001aaj833

carrier on request

response

request (or EOF)

carrier off

load off

load on

HITAG μ

transceiver

TNRT

TFp1 TFp2

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 43 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.12 GET SYSTEM INFORMATION

[Advanced, Advanced+]

Upon reception of this command without error, the transponder IC reads the requested

system memory block(s) and sends back their values in the response.

Error Flag set to ’0’ indicates no error.

Table 41. GET SYSTEM INFORMATION - request format (17h)

Flags Command Data 1 CRC-16 Description

5 6 (48) (16) No. of bits

00(1)00 010111 without UID

10(1)00 010111 UID with UID

Table 42. GET SYSTEM INFORMATION - response format

Error

flag Data CRC-16 Description

1 40 8 8 8 8 8 8 8 8 (16) No. of bits

0 system memory block data

MSN MFC ICR 0 0 0 0 0 0

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 44 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

14.13 LOGIN

[, Advanced, Advanced+]

Upon reception of this command without error, the transponder IC compares received

password with PWD in memory block (FEh) and if correct it permits write (op t. read)

access to the protected memory area (defined in User config, see Table 7) and report s the

success of the operation in the respon se. In case a wron g p a sswor d is issued in a further

Default password: FFFFFFFFh

Table 43. LOGIN (advanced/advanced+) - request format

Flags Command IC MFC Parameter 1 Password CRC-16 Description

5 6 8 (48) 32 (16) No. of bits

00(1)00 101000 MFC - password without UID

in READY

state

10(1)00 101000 MFC UID password with UID in

READY state

01(1)00 101000 MFC - password without UID

SELECTED

state

Table 44. LOGIN (µ) - request format

Flags Command IC MFC Parameter 1 Password CRC-16 Description

5 6 8 (48) 32 (16) No. of bits

00(1)00 101000 MFC - password without UID

in READY

state

10(1)00 101000 MFC UID password with UID in

READY state

Table 45. Response to a successful LOGIN request

Error flag CRC-16 Description

1 (16) No. of bits

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 45 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

15. Transponder Talks First (TTF) mode

This mode of the HITAG µ transponder enables data transmission to a RWD without

sending any command. Every time the transponder IC is activated by the field it starts

executing this mode.

The transponder in TTF mode sends the data stored in the EEPROM independent if the

data is ISO compliant or not.

If the transpond er IC is co nfigur ed in TTF mod e a SWITCH command o r SOF sent b y the

RWD within the defined listening window sets the transponder into RTF mode.

16. Data integrity/calculation of CRC

The following explana tio ns show the fe atur es of the HITAG µ protocol to protect read and

write access to transponders from undetected errors. The CRC is an 16-bit CRC

according to ISO 11785.

16.1 Data transmission: RWD to HITAG µ transponder IC

Data stre am transmitted by the R WD to the HITAG µ transponder may inclu de an optional

16-bit Cyclic Redundancy Check (CRC-16).

The data stream is first verified for data errors by the HITAG µ transponder IC and then

executed.

The generator polynomial for the CRC-16 is:

u16 + u12 + u5+ 1 = 1021h

The CRC pre set value is: 0000h

16.2 Data transmission: HITAG µ transponder IC to RWD

The HITAG µ transponder calculates the CRC on all received bit s of the request. Whether

the HITAG µ transponder IC calcu lated CRC is append ed to the re sponse dep ends on th e

setting of the CRCT flag.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 46 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

17. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive st atic

charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated

maxima

18. Characteristics

[1] Typical ratings are not guaranteed. Values are at 25 C.

[2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C); VIN1-IN2 = 0.5 V (RMS)

[3] Integrated Resonance Capacitor: 210pF 3%

[4] Integrated Resonance Capacitor: 280pF 5%

Table 46. Limiting values[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature 55 +125 C

VESD electrostatic discharge voltage JEDEC JESD 22-A114-AB

Human Body Model 2- kV

Ii(max) maximum input current IN1-IN2 20 mA

Tj junction temperature 40 +85 C

Table 47. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

foper operating frequency 100 125 150 kHz

VIinput voltage IN1-IN2 456V

IIinput current IN1-IN2 - - 10 mA

Ciinput capacitance between IN1-IN2

HTMS1x01 [2][3] 203.7 210 216.3 pF

HTMS8x01 [2][4] 266 280 294 pF

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 47 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

19. Marking

19.1 Marking SOT1122

Table 48. Marking SOT1122

Type Type code

HTMS1001FTB/AF 10

HTMS1101FTB/AF 11

HTMS1201FTB/AF 12

HTMS8001FTB/AF 80

HTMS8101FTB/AF 81

HTMS8201FTB/AF 82

Table 49. Pin des cription SOT1122

Pin Description

1IN 1

2IN 2

3 n.c not connected

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 48 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

19.2 Marking HVSON2

Only two lines are available for marking (Figure 20).

First line consist s on five d igits and cont ains the diff usion lot number. Second line consist s

on four digits and describes the product type, HTSH5601ETK or HTSH4801ETK (see

example in Table 50).

Fig 20. Marking overview

Table 50. Markin g example

Line Marking Description

A 70960 5 digits, Diffusion Lot Number, First lette r truncated

B HM10 4 digits, Type: Table 51 “Marking HVSON2”

Table 51. Markin g HVSON2

Type Type code

HTMS1001FTK/AF HM10

HTMS1101FTK/AF HM11

HTMS1201FTK/AF HM12

HTMS8001FTK/AF HM80

HTMS8101FTK/AF HM81

HTMS8201FTK/AF HM82

aaa-004170

A : 5

B : 4

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 49 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

20. Package outline

Fig 21. Package outline SOT1 122

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT1122 MO-252

sot1122_po

Unit

mm max

nom

min

0.50 0.04 0.55 0.425 0.30

0.25

0.22

0.35

0.30

0.27

A(1)

Dimensions

Notes

1. Dimension A is including plating thickness.

2. Can be visible in some manufacturing processes.

SOT1122

A1D

1.50

1.45

1.40

1.05

1.00

0.95

Eee

0.55

0.50

0.47

0.45

0.40

0.37

1LL

09-10-09

XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm

0 1 2 mm

scale

4×

(2)

4×

(2)

pin 1 indication

type code

terminal 1

index area

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 50 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

Fig 22. Package outline HVSON2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT899-1

05-02-25

05-05-09

Note

1. Plastic or metal protrusions of 0.75 mm maximum per side are not included

UNIT A

max

mm 1 0.05

02.1

1.9 1.35

1.05 3.1

2.9 1.35

1.05 0.5

0.3

DIMENSIONS (mm are the original dimensions)

HVSON2: plastic thermal enhanced very thin small outline package; no leads;

2 terminals; body 3 × 2 × 0.85 mm

0.9

0.7

b DhE Ehe

2.5

L y1

0.1

0.05

0 1 2 mm

scale

detail X

terminal 1

index area

AC B

∅ vMC∅ wM

terminal 1

index area

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 51 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

21. Abbreviations

Table 52. Abbre viations

Abbreviation Definition

AC Anticollision Code

ASK Amplitude Shift Keying

BC Bi-phase Code

BPLC Binary Pulse Length Coding

CRC Cyclic Redundancy Check

DSFID Data Storage F ormat Identifier

EEPROM Electrically Erasable Programmable Read-Only Memory

EOF End Of Frame

IC Integrated Circuit

ICR Integrated Circuit Reference number

LSB Least Significa nt Bit

LSByte Least Significant Byte

m Modulation Index

MC Manchester Code

MFC integrated circuit Manufacturer Code

MSB Most Significant Bit

MSByte Most Significant Byte

MSN Manufacturer Serial Number

NA No Access

NOB Number Of Block

NOP Number Of Page s

NOS Number Of Slots

NSS Number Of Sen s o rs

OTP One Time Programmable

PID Product Identifier

PWD Password

RF Radio Frequency

RFU Reserved for Future Use

RND Random Number

RO Read On ly

RTF Reader Talks First

R/W Read/Write

RWD Read Write Device

SOF Start of Frame

TTF Transponder Talks First

UID Unique IDentifier

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 52 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

22. References

[1] Application note — AN10214, HITAG Coil Design Guide, T ransponder IC

BU-ID Doc.No.: 0814**1

[2] General specification for 8” wafer on UV-tape with electronic fail die

marking — Delivery type description, BU-ID Doc.No.: 1093**1

1. ** ... document version number

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 53 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

23. Revision history

Table 53: Revision history

Document ID Release date Data sheet status Change notice Supersedes

HTMS1x01_8x01 20120703 Product data sheet - H152931_HITAGµ

Modifications: •Section 9.2 “Memory configuration”: up dated

•Section 14.9 “LOCK BLOCK”: updated

•Some modifications done to comply with HTMS1x01_HTSMS8x01 short data sheet

152931 20100114 Product data sheet 152930

Modifications: •Section 6 “Ordering information”: updated

•Section 10 “Mechanical specification”, Section 21 “Marking” and Section 22

“Package outline”: added

•A number of tables have been redesigned.

152930 20090716 Product data sheet 152912

Modifications: •Section 3.6 “Delivery types”: remove delivery types

•Section 6 “Ordering information”: remove delivery types SOT1122 and

SOT732-1

•Section 15.2 “State diagram HITAG m advanced/advanced+”: Note added

•Section 19 “Limiting values”: move input current to table 42

•Section 17 “Package outline”: removed

•Section 20 “Legal information”: update

152912 20090619 Objective data sheet 152911

Modifications: •General update

•The drawings have been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

152911 20090225 Objective data sheet - 152910

Modifications: •General update

152910 2009011 4 Objective data sheet - -

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 54 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

24. Legal information

24.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

24.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

24.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors doe s not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data fro m the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 55 of 57

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifi ca tions, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive appl ications beyond NXP Semiconductors’

standard warrant y and NXP Semiconductors’ product specifications.

24.4 Licenses

24.5 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

HITAG — is a trademark of NXP B.V.

25. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

ICs with HITAG functionality

NXP Semiconductors owns a worldwide perpetual license for the patents

US 5214409, US 5499017, US 5235326 and for any foreign counterpart s

or equivalents of t hese patents. The license is granted for the Field-of-U se

covering: (a) all non-animal applicat ions, and (b) any application for animals

raised for human consumption (includin g but not limited to dairy animals),

including without limitation livestock and fish.

Please note that the license doe s not include rights outside the specified

Field-of-Use, and that NXP Semiconduc tors does not provide i ndemnity for

the foregoing patents outside the Field-of-Use.

Product data sheet

COMPANY PUBLIC Rev. 3.2 — 3 July 2012

152932 56 of 57

continued >>

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

26. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.1 Target markets . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.1 Animal identification . . . . . . . . . . . . . . . . . . . . . 1

1.1.2 Laundry automation . . . . . . . . . . . . . . . . . . . . . 1

1.1.3 Beer keg and gas cylinder logistic . . . . . . . . . . 2

1.1.4 Brand protection . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Cu stomer application support and training. . . . 2

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2

2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.3 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.4 Supported standards . . . . . . . . . . . . . . . . . . . . 3

2.5 Security features. . . . . . . . . . . . . . . . . . . . . . . . 3

2.6 Delivery types. . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 4

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

8 Mechanical specification . . . . . . . . . . . . . . . . . 8

8.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8

8.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.1.2 Wafer backside. . . . . . . . . . . . . . . . . . . . . . . . . 8

8.1.3 Chip dimensions. . . . . . . . . . . . . . . . . . . . . . . . 8

8.1.4 Passivation on front . . . . . . . . . . . . . . . . . . . . . 8

8.1.5 Au bump. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.1.6 Fail die identification . . . . . . . . . . . . . . . . . . . . 9

8.1.7 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9

9 Functional description . . . . . . . . . . . . . . . . . . 10

9.1 Memory organization . . . . . . . . . . . . . . . . . . . 10

9.1.1 Memory organization HITAG  transponder

ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

9.1.2 Memory organization HITAG µ Advanced . . . 11

9.1.3 Memory organization HITAG µ Advanced + . . 12

9.2 Memory configuration. . . . . . . . . . . . . . . . . . . 13

10 General requirements . . . . . . . . . . . . . . . . . . . 14

11 HITAG m transponder IC air interface . . . . . . 14

11.1 Downlink description. . . . . . . . . . . . . . . . . . . . 14

11.2 Mode switching protocol. . . . . . . . . . . . . . . . . 16

11.2.1 SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

11.3 Downlink communication signal interface -

RWD to HITAG µ transponder IC . . . . . . . . . . 18

11.3.1 Modulation parameters. . . . . . . . . . . . . . . . . . 18

11.3.2 Data rate and data coding . . . . . . . . . . . . . . . 19

11.3.3 RWD - Start of frame pattern . . . . . . . . . . . . . 20

11.3.4 RWD - End of frame pattern. . . . . . . . . . . . . . 20

11.4 Communication signal interface -

HITAG µ transponder IC to RWD. . . . . . . . . . 21

11.4.1 Data rate and data coding . . . . . . . . . . . . . . . 21

11.4.2 Start of frame pattern . . . . . . . . . . . . . . . . . . . 22

11.4.3 End of frame pattern . . . . . . . . . . . . . . . . . . . 22

12 General protocol timing specification. . . . . . 23

12.1 Waiting time before transmitting a response

after an EOF from the RWD. . . . . . . . . . . . . . 23

12.2 RWD waiting time before sending a

subsequent request . . . . . . . . . . . . . . . . . . . . 24

12.3 RWD waiting time be fore switching to next

inventory slot . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.3.1 RWD started to receive one or more

HITAG µ transponder IC respo nses. . . . . . . . 24

12.3.2 RWD receives no HITAG µ transponder

IC response . . . . . . . . . . . . . . . . . . . . . . . . . . 25

13 State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.1 General description of states. . . . . . . . . . . . . 26

13.2 State diagram HITAG  advanced/advanced+ 27

13.3 State diagram HITAG  . . . . . . . . . . . . . . . . . 28

13.4 Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

13.4.1 ISO 11785 Mode . . . . . . . . . . . . . . . . . . . . . . 29

13.4.2 RTF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

13.4.3 Anticollision . . . . . . . . . . . . . . . . . . . . . . . . . . 29

13.4.3.1 Anticollision with 1 slot. . . . . . . . . . . . . . . . . . 29

13.4.3.2 Anticollision with 16 slots . . . . . . . . . . . . . . . . 30

14 Command set . . . . . . . . . . . . . . . . . . . . . . . . . 31

14.1 Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

14.2 Error handling . . . . . . . . . . . . . . . . . . . . . . . . 33

14.3 INVENTORY . . . . . . . . . . . . . . . . . . . . . . . . . 34

[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 34

14.4 INVENTORY ISO 11785 . . . . . . . . . . . . . . . . 35

[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 35

14.5 STAY QUIET . . . . . . . . . . . . . . . . . . . . . . . . . 35

[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 35

14.6 READ UID . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 36

14.7 READ MULTIPLE BLOCK . . . . . . . . . . . . . . . 37

[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 37

14.7.1 READ MULTIPLE BLOCKS in INVENTORY

mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 38

14.8 WRITE SINGLE BLOCK . . . . . . . . . . . . . . . . 39

[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 39

14.9 LOCK BLOCK . . . . . . . . . . . . . . . . . . . . . . . . 40

[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 40

14.10 SELECT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

NXP Semiconductors HTMS1x01; HTMS8x01

HITAG µ transponder IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 3 July 2012

152932

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

[Advanced, Advanced+] . . . . . . . . . . . . . . . . . .41

14.11 WRITE ISO 11785 (custom command) . . . . . 42

[, Advanced, Advanced+] . . . . . . . . . . . . . . . .42

14.12 GET SYSTEM INFORMATION. . . . . . . . . . . . 43

[Advanced, Advanced+] . . . . . . . . . . . . . . . . . .43

14.13 LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

[, Advanced, Advanced+] . . . . . . . . . . . . . . . .44

15 Transponder Talks First (TTF) mode . . . . . . . 45

16 Data integrity/calculation of CRC. . . . . . . . . . 45

16.1 Data transmission: RWD to HITAG µ transponder

IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

16.2 Data transmission: HITAG µ transponder IC

to RWD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

17 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 46

18 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 46

19 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

19.1 Marking SOT1122. . . . . . . . . . . . . . . . . . . . . . 47

19.2 Marking HVSON2. . . . . . . . . . . . . . . . . . . . . . 48

20 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 49

21 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 51

22 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

23 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 53

24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 54

24.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 54

24.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

24.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 54

24.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

24.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 55

25 Contact information. . . . . . . . . . . . . . . . . . . . . 55

26 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56