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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
DESCRIPTION
The H11L1 (UL Approval) and H11L1V (UL and VDE
Approvals) devices each consist of a GaAs infrared
emitting diode optically coupled to a high speed output
integrated Microprocessor Compatible Schmitt trigger
detector, which provides hysteresis for noise immunity
and pulse shaping.
FEATURES
• High Data Rate, 1MHz typical (NRZ)
• Free from Latch Up and Oscillation
• Microprocessor Compatible Drive
• Logical Compatible Output sinks 16mA
at 0.4V maximum
• Guaranteed On/Off Threshold Hysteresis
• Wide Supply Voltage Capability, compatible with
all popular Logic Systems
• Operating Voltage Range
VCC 3V to 16V
• Operating Temperature Range
- 55°C to +100°C
• High AC Isolation voltage 5000VRMS
• Lead Free and RoHS Compliant
• UL Approval Certificate E91231
• VDE Approval Certificate 40044376
APPLICATIONS
• Logic to Logic isolator
• Line Receiver - eliminate noise and transient
problems
• Programmable Current Level Sensor
• AC to TTL Conversion - Square Wave Shaping
• Power Supply Digital Programming
• Computer Peripherals Interface
ORDER INFORMATION
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office,
Block A, 8/F, Wah Hing Industrial mansion,
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
1 Anode
2 Cathode
3 NC
4 VO
5 GND
6 VCC
Forward Current 60mA
Reverse Voltage 6V
Power Dissipation 120mW
Input
Output Current 50mA
Output Voltage 16V
Supply Voltage 16V
Power Dissipation 150mW
Output
Isolation Voltage 5000VRMS
Total Power Dissipation 250mW
Operating Temperature -55 to 100 °C
Storage Temperature -55 to 150 °C
Lead Soldering Temperature (10s) 260°C
Total Package
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
Truth Table
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified. Typical Values at TA = 25°C)
LED VO
ON LOW
OFF HIGH
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 10mA 1.15 1.5 V
Reverse Current IR V
R = 5V 10 µA
Terminal Capacitance CIN V = 0V, f = 1MHz 33 pF
INPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Operating Voltage VCC 3 15 V
Supply Current ICC(off) V
CC = 5V, IF = 0mA 1.6 5 mA
High Level
Output Current
IOH I
F = 0mA, VCC = VO = 15V 100 µA
OUTPUT
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified, Typical Values at TA = 25°C)
Note 1 : Measured with input leads shorted together and output leads shorted together.
Parameter Symbol Test Condition Min Typ. Max Unit
Supply Current ICC(on) VCC = 5V, IF = 10mA 1.6 5 mA
Low Level
Output Voltage
VOL V
CC = 5V, IF = IF(on) (max),
RL = 270Ω
0.4 V
Turn-On
Threshold Current
IF(on) VCC = 5V, RL = 270Ω
1.6 mA
Turn-Off
Threshold Current
IF(off) VCC = 5V, RL = 270Ω 1 mA
Hysteresis Rtio
IF(off)/IF(on)
VCC = 5V, RL = 270Ω 0.5 0.9
Turn-On Time t(on) V
CC = 5V,
IF = IF(on) (max),
RL = 270Ω
4 µs
Fall Time tf 0.1
Turn-Off Time t(off) 4
Rise Time tr 0.1
COUPLED
Parameter Symbol Test Condition Min Typ. Max Unit
Isolation Voltage VISO R.H. = 40% to 60%, t = 1 min,
Note 1
5000 VRMS
Input - Output
Resistance
RI-O V
I-O = 500VDC
R.H. = 40% to 60%
1011 Ω
ISOLATION
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
Fig 1 Forward Current vs Forward Voltage Fig 2 Transfer Characteristics
Fig 3 Normalized Turn-On Current vs
Supply Voltage
Fig 4 Normalized Turn-On Current vs
Ambient temperature
Fig 5 Low Level Output Voltage vs Load Current
Fig 6 Supply Current vs Supply Voltage
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
Switching Time Test Circuit and Waveform
0.1µF
Vo Monitor
VIN
tr = tf = 0.01µs
Z = 50Ω
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
ORDER INFORMATION
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
H11L1 (UL Approval)
PN
H11L1
H11L1G
H11L1SM
H11L1SMT&R
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
H11L1V (UL Approval and VDE Approvals)
PN
H11L1V
H11L1VG
H11L1VSM
H11L1VSMT&R
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
DEVICE MARKING
H11L1 denotes Device Part Number (H11L1 as example)
I denotes Isocom
Y denotes 1 digit Year code
WW denotes 2 digit Week code
H11L1
IYWW
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
DIP
G Form
SMD
PACKAGE DIMENSIONS in mm (inch)
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
RECOMMENDED PAD LAYPUT FOR SMD (mm)
TAPE AND REEL PACKAGING
Direction of feed from reel
Dimension No. A B Do D1 E F
Dimension( mm) 10.4±0.1 7.5±0.1 1.5±0.1 1.5+0.1/-0 1.75±0.1 7.5±0.1
Dimension No. Po P1 P2 t W K
Dimension (mm) 4.0±0.15 12.0±0.1 2.0±0.1 0.35±0.03 16.0±0.2 4.5±0.1
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
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H11L1, H11L1V
DD93224
ISOCOM
COMPONENTS
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make
changes without further notices.
- The products shown in this publication are designed for the general use in electronic applications such as
office automation equipment, communications devices, audio/visual equipment, electrical application and
instrumentation.
- For equipment/application where high reliability or safety is required, such as space applications, nuclear power
control equipment, medical equipment, etc., please contact our sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
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DISCLAIMER
DD93224
ISOCOM
COMPONENTS
ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
