SN54F32, SN74F32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SDFS044B - MARCH 1987 - REVISED MAY 1999 D SN54F32 . . . J PACKAGE SN74F32 . . . D OR N PACKAGE (TOP VIEW) Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs 1A 1B 1Y 2A 2B 2Y GND description These devices contain four independent 2-input OR gates. They perform the Boolean functions Y = A + B or Y = A * B in positive logic. The SN54F32 is characterized for operation over the full military temperature range of -55C to 125C. The SN74F32 is characterized for operation from 0C to 70C. 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 1B 1A NC VCC 4B SN54F32 . . . FK PACKAGE (TOP VIEW) FUNCTION TABLE (each gate) INPUTS 1 B H X H X H H L L L 1Y NC 2A NC 2B 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A A OUTPUT Y NC - No internal connection logic symbol 1A 1B 2A 2B 3A 3B 4A 4B 1 1 2 4 3 6 5 1Y 2Y 9 8 10 3Y 12 11 13 4Y This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the D, J, and N packages. logic diagram, each gate (positive logic) A Y B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54F32, SN74F32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SDFS044B - MARCH 1987 - REVISED MAY 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30 mA to 5 mA Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input voltage ratings may be exceeded provided the input current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions (see Note 3) SN54F32 SN74F32 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.8 V Input clamp current -18 -18 mA IOH IOL High-level output current -1 -1 mA Low-level output current 20 20 mA High-level input voltage 2 2 V V TA Operating free-air temperature -55 125 0 70 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL II IIH IIL TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = -18 mA IOH = -1 mA VCC = 4.75 V, VCC = 4.5 V, IOH = -1 mA IOL = 20 mA VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V VCC = 5.5 V, VCC = 5.5 V, VI = 0.5 V VO = 0 MIN SN54F32 TYP MAX MIN SN74F32 TYP MAX -1.2 2.5 3.4 -1.2 2.5 3.4 0.5 0.3 V V 2.7 0.3 UNIT 0.5 V 0.1 0.1 mA 20 20 A -0.6 mA -150 mA 6.1 9.2 mA ICCL VI = 0 10.3 15.5 10.3 All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. ICCH is measured with one input per gate at 4.5 V and all others grounded. 15.5 mA IOS ICCH 2 -0.6 -60 VCC = 5.5 V VCC = 5.5 V, -150 6.1 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9.2 -60 SN54F32, SN74F32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SDFS044B - MARCH 1987 - REVISED MAY 1999 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A or B Y POST OFFICE BOX 655303 VCC = 5 V, TA = 25C SN54F32 SN74F32 MIN TYP MAX MIN MAX MIN MAX 2.2 3.8 5.6 2.2 7.5 2.2 6.6 2.2 3.6 5.3 1.7 7.5 2.2 6.3 * DALLAS, TEXAS 75265 UNIT ns 3 SN54F32, SN74F32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SDFS044B - MARCH 1987 - REVISED MAY 1999 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL (see Note A) Test Point From Output Under Test CL (see Note A) 500 7V Open 500 S1 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Collector Open 7V Open 7V LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output VOH Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOH 1.5 V VOL 1.5 V 0V tPZL tPLZ 3.5 V 1.5 V tPZH tPLH 1.5 V 3V Output Control Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns, duty cycle = 50%. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9758801QCA ACTIVE CDIP J 14 1 TBD Call TI Call TI 5962-9758801QDA ACTIVE CFP W 14 1 TBD Call TI Call TI SN54F32J ACTIVE CDIP J 14 1 TBD A42 SN74F32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Pb-Free (RoHS) N / A for Pkg Type SN74F32N ACTIVE PDIP N 14 SN74F32N3 OBSOLETE PDIP N 14 SN74F32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74F32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54F32FK ACTIVE LCCC FK 20 1 TBD SNJ54F32J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54F32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) CU NIPDAU N / A for Pkg Type Call TI Call TI CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1 Samples (Requires Login) 5962-9758801Q2A TBD (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54F32, SN74F32 : * Catalog: SN74F32 * Military: SN54F32 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74F32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F32DR SN74F32NSR SOIC D 14 2500 367.0 367.0 38.0 SO NS 14 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated