BU52021HFV-TR - ROHM Co., Ltd. - Datasheet.Directory

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www.rohm.com 2011.12 - Rev.G

Hall ICs

Omnipolar Detection Hall ICs

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

●Description

The omnipolar Hall ICs are magnetic switches that can operate both S-and N-pole, upon which the output goes from Hi to

Low. In addition to regular single-output Hall ICs, We offer a lineup of dual-output units with a reverse output terminal (active

High).

●Features

1) Omnipolar detection

2) Micro power operation (small current using intermittent operation method)(BD7411G is excluded.)

3) Ultra-compact and thin wafer level CSP4 package (BU52054GWZ, BU52055GWZ)

4) Ultra-compact wafer level CSP4 package (BU52015GUL, BU52001GUL)

5) Ultra-Small outline package SSON004X1216 (BU52061NVX, BU52053NVX, BU52056NVX)

6) Ultra-Small outline package HVSOF5 (BU52011HFV, BU52021HFV)

7) Small outline package (BU52025G, BD7411G)

8) Line up of supply voltage

For 1.8V Power supply voltage (BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX,

BU52056NVX, BU52011HFV)

For 3.0V Power supply voltage (BU52001GUL)

For 3.3V Power supply voltage (BU52021HFV, BU52025G)

For 5.0V Power supply voltage (BD7411G)

9) Dual output type (BU52015GUL)

10) High ESD resistance 8kV (HBM) (6kV for BU52056NVX)

●Applications

Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.

●Lineup matrix

Product name

Supply

voltage

Operate

point Hysteresis Period Supply current

(AVG)

Output

type Package

(V) (mT) (mT) (ms) (A)

BU52054GWZ 1.65～3.60 +/-6.3 ※ 0.9 50 5.0µ CMOS UCSP35L1

BU52055GWZ 1.65～3.60 +/-4.1 ※ 0.8 50 5.0µ CMOS UCSP35L1

BU52015GUL 1.65～3.30 +/-3.0 ※ 0.9 50 5.0µ CMOS VCSP50L1

BU52001GUL 2.40～3.30 +/-3.7 ※ 0.8 50 8.0µ CMOS VCSP50L1

BU52061NVX 1.65～3.60 +/-3.3 ※ 0.9 50 4.0µ CMOS SSON004X1216

BU52053NVX 1.65～3.60 +/-3.0 ※ 0.9 50 5.0µ CMOS SSON004X1216

BU52056NVX 1.65～3.60 +/-4.6 ※ 0.8 50 5.0µ CMOS SSON004X1216

BU52011HFV 1.65～3.30 +/-3.0 ※ 0.9 50 5.0µ CMOS HVSOF5

BU52021HFV 2.40～3.60 +/-3.7 ※ 0.8 50 8.0µ CMOS HVSOF5

BU52025G 2.40～3.60 +/-3.7 ※ 0.8 50 8.0µ CMOS SSOP5

BD7411G 4.50～5.50 +/-3.4 ※ 0.4 - 2.0m CMOS SSOP5

※Plus is expressed on the S-pole; minus on the N-pole

No.10045EGT02

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

2/31

www.rohm.com 2011.12 - Rev.G

●Absolute maximum ratings

BU52054GWZ, BU52055GWZ (Ta=25℃) BU52015GUL (Ta=25℃)

Parameter Symbol Ratings Unit Parameter Symbol Ratings Unit

Power Supply Voltage VDD -0.1～+4.5※1V Power Supply Voltage VDD -0.1～+4.5※3V

Output Current IOUT ±0.5 mA Output Current IOUT ±0.5 mA

Power Dissipation Pd 100※2 mW Power Dissipation Pd 420※4 mW

Operating

Temperature Range Topr -40～+85 ℃Operating

Temperature Range Topr -40～+85 ℃

Storage

Temperature Range Tstg -40～+125 ℃Storage

Temperature Range Tstg -40～+125 ℃

※1. Not to exceed Pd

※2. Reduced by 1.00mW for each increase in Ta of 1℃ over 25℃

(mounted on 24mm×20mm Glass-epoxy PCB)

※3. Not to exceed Pd

※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃

(mounted on 50mm×58mm Glass-epoxy PCB)

BU52001GUL (Ta=25℃) BU52061NVX, BU52053NVX, BU52056NVX(Ta=25℃)

Parameter Symbol Ratings Unit Parameter Symbol Ratings Unit

Power Supply Voltage VDD -0.1～+4.5※5V Power Supply Voltage VDD -0.1～+4.5※7V

Output Current IOUT ±1 mA Output Current IOUT ±0.5 mA

Power Dissipation Pd 420※6 mW Power Dissipation Pd 2049※8 mW

Operating

Temperature Range Topr -40～+85 ℃Operating

Temperature Range Topr -40～+85 ℃

Storage

Temperature Range Tstg -40～+125 ℃Storage

Temperature Range Tstg -40～+125 ℃

※5. Not to exceed Pd

※6. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃

(mounted on 50mm×58mm Glass-epoxy PCB)

※7. Not to exceed Pd

※8. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃

(mounted on 50mm×58mm Glass-epoxy PCB)

BU52011HFV (Ta=25℃) BU52021HFV (Ta=25℃)

Parameter Symbol Ratings Unit Parameter Symbol Ratings Unit

Power Supply Voltage VDD -0.1～+4.5※9V Power Supply Voltage VDD -0.1～+4.5※11 V

Output Current IOUT ±0.5 mA Output Current IOUT ±1 mA

Power Dissipation Pd 536※10 mW Power Dissipation Pd 536※12 mW

Operating

Temperature Range Topr -40～+85 ℃Operating

Temperature Range Topr -40～+85 ℃

Storage

Temperature Range Tstg -40～+125 ℃Storage

Temperature Range Tstg -40～+125 ℃

※9. Not to exceed Pd

※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃

(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)

※11 Not to exceed Pd

※12. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃

(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)

BU52025G (Ta=25℃) BD7411G (Ta=25℃)

Parameter Symbol Ratings Unit Parameter Symbol Ratings Unit

Power Supply Voltage VDD -0.1～+4.5※13 V Power Supply Voltage VDD -0.3～+7.0※15 V

Output Current IOUT ±1 mA Output Current IOUT ±1 mA

Power Dissipation Pd 540※14 mW Power Dissipation Pd 540※16 mW

Operating

Temperature Range Topr -40～+85 ℃Operating

Temperature Range Topr -40～+85 ℃

Storage

Temperature Range Tstg -40～+125 ℃Storage

Temperature Range Tstg -55～+150 ℃

※13. Not to exceed Pd

※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃

(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)

※15. Not to exceed Pd

※16. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃

(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

3/31

www.rohm.com 2011.12 - Rev.G

●Magnetic, Electrical characteristics

BU52054GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.60 V

Operate Point

BopS - 6.3 7.9

mT

BopN -7.9 -6.3 -

Release Point

BrpS 3.5 5.4 -

mT

BrpN - -5.4 -3.5

Hysteresis

BhysS - 0.9 -

mT

BhysN - 0.9 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※17

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※17

IOUT =+0.5mA

Supply Current IDD(AVG) - 5 8 µA Average

Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value

※17 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

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www.rohm.com 2011.12 - Rev.G

BU52055GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.60 V

Operate Point

BopS - 4.1 5.5

mT

BopN -5.5 -4.1 -

Release Point

BrpS 1.5 3.3 -

mT

BrpN - -3.3 -1.5

Hysteresis

BhysS - 0.8 -

mT

BhysN - 0.8 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※18

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※18

IOUT =+0.5mA

Supply Current IDD(AVG) - 5 8 µA Average

Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value

※18 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

5/31

www.rohm.com 2011.12 - Rev.G

BU52015GUL (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.30 V

Operate Point

BopS - 3.0 5.0

mT

BopN -5.0 -3.0 -

Release Point

BrpS 0.6 2.1 -

mT

BrpN - -2.1 -0.6

Hysteresis

BhysS - 0.9 -

mT

BhysN - 0.9 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

OUT1: BrpN<B<BrpS ※19

OUT2: B<BopN, BopS<B

IOUT = -0.5mA

Output Low Voltage VOL - - 0.2 V

OUT1: B<BopN, BopS<B ※19

OUT2: BrpN<B<BrpS

IOUT = +0.5mA

Supply Current 1 IDD1(AVG) - 5 8 µA VDD=1.8V, Average

Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA VDD=1.8V,

During Startup Time Value

Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V,

During Standby Time Value

Supply Current 2 IDD2(AVG) - 8 12 µA VDD=2.7V, Average

Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA VDD=2.7V,

During Startup Time Value

Supply Current During Standby Time 2 IDD2(DIS) - 4.0 - µA VDD=2.7V,

During Standby Time Value

※19 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

6/31

www.rohm.com 2011.12 - Rev.G

BU52001GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 2.4 3.0 3.3 V

Operate Point

BopS - 3.7 5.5

mT

BopN -5.5 -3.7 -

Release Point

BrpS 0.8 2.9 -

mT

BrpN - -2.9 -0.8

Hysteresis

BhysS - 0.8 -

mT

BhysN - 0.8 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.4 - - V

BrpN<B<BrpS ※20

IOUT =-1.0mA

Output Low Voltage VOL - - 0.4 V

B<BopN,BopS<B ※20

IOUT =+1.0mA

Supply Current IDD(AVG) - 8 12 µA Average

Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 3.8 - µA During Standby Time Value

※20 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

7/31

www.rohm.com 2011.12 - Rev.G

BU52061NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.60 V

Operate Point

BopS 2.3 3.3 4.7

mT

BopN -4.7 -3.3 -2.3

Release Point

BrpS 1.2 2.4 3.4

mT

BrpN -3.4 -2.4 -1.2

Hysteresis

BhysS - 0.9 -

mT

BhysN - 0.9 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※21

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※21

IOUT =+0.5mA

Supply Current 1 IDD1(AVG) - 4 7 µA VDD=1.8V, Average

Supply Current During Startup Time 1 IDD1(EN) - 5.0 - mA VDD=1.8V,

During Startup Time Value

Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V,

During Standby Time Value

Supply Current 2 IDD2(AVG) - 9 16 µA VDD=3.0V, Average

Supply Current During Startup Time 2 IDD2(EN) - 9.0 - mA VDD=3.0V,

During Startup Time Value

Supply Current During Standby Time 2 IDD2(DIS) - 4.4 - µA VDD=3.0V,

During Standby Time Value

※21 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

8/31

www.rohm.com 2011.12 - Rev.G

BU52053NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.60 V

Operate Point

BopS - 3.0 5.0

mT

BopN -5.0 -3.0 -

Release Point

BrpS 0.6 2.1 -

mT

BrpN - -2.1 -0.6

Hysteresis

BhysS - 0.9 -

mT

BhysN - 0.9 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※22

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※22

IOUT =+0.5mA

Supply Current IDD(AVG) - 5 8 µA Average

Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value

※22 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

9/31

www.rohm.com 2011.12 - Rev.G

BU52011HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.30 V

Operate Point

BopS - 3.0 5.0

mT

BopN -5.0 -3.0 -

Release Point

BrpS 0.6 2.1 -

mT

BrpN - -2.1 -0.6

Hysteresis

BhysS - 0.9 -

mT

BhysN - 0.9 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※23

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※23

IOUT =+0.5mA

Supply Current 1 IDD1(AVG) - 5 8 µA VDD=1.8V, Average

Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA VDD=1.8V,

During Startup Time Value

Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V,

During Standby Time Value

Supply Current 2 IDD2(AVG) - 8 12 µA VDD=2.7V, Average

Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA VDD=2.7V,

During Startup Time Value

Supply Current During Standby Time 2 IDD2(DIS) - 4.0 - µA VDD=2.7V,

During Standby Time Value

※23 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

10/31

www.rohm.com 2011.12 - Rev.G

BU52056NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 1.65 1.80 3.60 V

Operate Point

BopS - 4.6 6.4

mT

BopN -6.4 -4.6 -

Release Point

BrpS 2.0 3.8 -

mT

BrpN - -3.8 -2.0

Hysteresis

BhysS - 0.8 -

mT

BhysN - 0.8 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.2 - - V

BrpN<B<BrpS ※24

IOUT =-0.5mA

Output Low Voltage VOL - - 0.2 V

B<BopN, BopS<B ※24

IOUT =+0.5mA

Supply Current IDD(AVG) - 5 8 µA Average

Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value

※24 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

11/31

www.rohm.com 2011.12 - Rev.G

BU52021HFV,BU52025G (Unless otherwise specified, VDD=3.0V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 2.4 3.0 3.6 V

Operate Point

BopS - 3.7 5.5

mT

BopN -5.5 -3.7 -

Release Point

BrpS 0.8 2.9 -

mT

BrpN - -2.9 -0.8

Hysteresis

BhysS - 0.8 -

mT

BhysN - 0.8 -

Period Tp - 50 100 ms

Output High Voltage VOH V

DD-0.4 - - V

BrpN<B<BrpS ※25

IOUT =-1.0mA

Output Low Voltage VOL - - 0.4 V

B<BopN, BopS<B ※25

IOUT =+1.0mA

Supply Current IDD(AVG) - 8 12 µA Average

Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value

Supply Current During Standby Time IDD(DIS) - 3.8 - µA During Standby Time Value

※25 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

After applying power supply, it takes one cycle of period (TP) to become definite output.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

12/31

www.rohm.com 2011.12 - Rev.G

BD7411G (Unless otherwise specified, VDD=5.0V, Ta=25℃)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Power Supply Voltage VDD 4.5 5.0 5.5 V

Operate Point

BopS - 3.4 5.6

mT

BopN -5.6 -3.4 -

Release Point

BrpS 1.5 3.0 -

mT

BrpN - -3.0 -1.5

Hysteresis

BhysS - 0.4 -

mT

BhysN - 0.4 -

Output High Voltage VOH 4.6 - - V

BrpN<B<BrpS ※26

IOUT =-1.0mA

Output Low Voltage VOL - - 0.4 V

B<BopN, BopS<B ※26

IOUT =+1.0mA

Supply Current IDD - 2 4 mA

※26 B = Magnetic flux density

1mT=10Gauss

Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.

Radiation hardiness is not designed.

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

13/31

www.rohm.com 2011.12 - Rev.G

●Figure of measurement circuit

Product Name IOUT

BU52001GUL, BU52021HFV,

BU52025G, BD7411G 1.0mA

BU52054GWZ, BU52055GWZ,

BU52015GUL, BU52061NVX,

BU52053NVX, BU52056NVX,

BU52011HFV

0.5mA

Product Name IOUT

BU52001GUL, BU52021HFV,

BU52025G, BD7411G 1.0mA

BU52054GWZ, BU52055GWZ,

BU52015GUL, BU52061NVX,

BU52053NVX, BU52056NVX,

BU52011HFV

0.5mA

Product Name C

BU52054GWZ, BU52055GWZ,

BU52015GUL, BU52001GUL,

BU52061NVX, BU52053NVX,

BU52056NVX, BU52011HFV,

BU52021HFV, BU52025G

2200µF

BD7411G 100µF

VDD

GND

OUT

100µF

V

Bop and Brp are measured with applying the magnetic field from the outside.

Tp

200Ω

VDD

GND

OUT

Oscilloscope

The period is monitored by Oscilloscope.

IDD

VDD

GND

OUT

C

A

VOH

VDD

GND

OUT

100µF

V IOUT

VOL

VDD

GND

OUT

100µF

V IOUT

Fig.1 Bop,Brp mesurement circuit Fig.2 Tp mesurement circuit

Fig.3 VOH mesurement circuit

Fig.4 VOL measurement circuit

Fig.5 IDD measurement circuit

BOP/BRP

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

14/31

www.rohm.com 2011.12 - Rev.G

●Technical (Reference) Data

BU52054GWZ(VDD=1.65～3.6V type)

BU52055GWZ(VDD=1.65～3.6V type)

Fig.6 Bop,Brp– Ambient temperature Fig.7 Bop,Brp– Supply voltage

Fig.10 IDD– Ambient temperature Fig.11 I

DD– Supply voltage

Fig.8 TP– Ambient temperature

Fig.9 TP– Supply voltage

Fig.12 Bop,Brp– Ambient temperature Fig.13 Bop,Brp– Supply voltage

Fig.16 IDD– Ambient temperature Fig.17 IDD– Supply voltage

Fig.14 TP – Ambient temperature

Fig.15 TP– Supply voltage

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

0

10

20

30

40

50

60

70

80

90

100

-60 - 40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=1.8V

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEM PERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

VDD=1.8V

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

15/31

www.rohm.com 2011.12 - Rev.G

BU52015GUL, BU52011HFV (VDD=1.65～3.3V type)

BU52001GUL (VDD=2.4～3.3V type)

Fig.24 Bop,Brp–Ambient temperature

Fig.28 IDD– Ambient temperature

Fig.25 Bop,Brp– Supply voltage

Fig.29 IDD – Supply voltage

Fig.26 TP– Ambient temperature

Fig.27 TP– Supply voltage

Fig.18 Bop,Brp– Ambient temperature

Fig.21 TP– Supply voltage

Fig.20 TP – Ambient temperature

Fig.22 IDD– Ambient temperature

Fig.19 Bop,Brp Supply voltage

Fig.23 IDD – Supply voltage

VDD=3.0V

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp S

Brp N

Bop N

VDD=3.0V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

2.02.42.83.23.6

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

0

10

20

30

40

50

60

70

80

90

100

2.0 2.4 2.8 3.2 3.6

SUPPLY VOLTAGE [V]

PERIOD [ms]

Ta = 25°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

VDD=3.0V

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

2.0 2.4 2.8 3.2 3.6

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

Ta = 25°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

VDD=1.8V

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

16/31

www.rohm.com 2011.12 - Rev.G

BU52061NVX(VDD=1.65～3.6V type)

BU52053NVX (VDD=1.65～3.6V type)

Fig.36 Bop,Brp– Ambient temperature

Fig.39 TP– Supply voltage

Fig.38 TP – Ambient temperature

Fig.40 IDD– Ambient temperature

Fig.37 Bop,Brp– Supply voltage

Fig.41 IDD – Supply voltage

Fig.30 Bop,Brp

–

Ambient temperature Fig.31 Bop,Brp

–

Supply voltage

Fig.34 IDD– Ambient temperature Fig.35 IDD – Supply voltage

Fig.32 TP

–

Ambient temperature

Fig.33 TP– Supply voltage

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C Ta = 25°C

VDD=1.8V

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

Ta = 25°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

VDD=1.8V

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=1.8V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

17/31

www.rohm.com 2011.12 - Rev.G

BU52056NVX(VDD=1.65～3.6V type)

BU52021HFV, BU52025G (VDD=2.4～3.6V type)

0

10

20

30

40

50

60

70

80

90

100

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

PERIOD [ms]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

1.4 1.8 2.2 2.6 3.0 3.4

SUPPLY VOLTAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C Ta = 25°C

VDD=1.8V

Fig.48 Bop,Brp–Ambient temperature Fig.49 Bop,Brp– Supply voltage

Fig.52 IDD – Ambient temperature Fig.53 IDD – Supply voltage

Fig.50 TP – Ambient temperature

Fig.51 TP – Supply voltage

Fig.42 Bop,Brp– Ambient temperature Fig.43 Bop,Brp– Supply voltage

Fig.46 IDD– Ambient temperature Fig.47 IDD– Supply voltage

Fig.44 TP – Ambient temperature

Fig.45 TP– Supply voltage

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Ta = 25°C

Bop S

Brp S

Brp N

Bop N

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEM PERATURE [℃]

PERIOD [ms]

VDD=1.8V

Bop S

Brp N

Bop N

Brp S

VDD=1.8V

0

10

20

30

40

50

60

70

80

90

100

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

PERIOD [ms]

VDD=3.0V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

2.0 2.4 2.8 3.2 3.6 4.0

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

Brp S

Ta = 25°C

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp N

Bop N

VDD=3.0V

Brp S

0

10

20

30

40

50

60

70

80

90

100

2.0 2.4 2.8 3.2 3.6 4.0

SUPPLY VOLTAGE [V]

PERIOD [ms]

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

AVERAGE SUPPLY CURRENT [µA]

VDD=3.0V

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

2.0 2.4 2.8 3.2 3.6 4.0

SUPPLY VOLATAGE [V]

AVERAGE SUPPLY CURRENT [µA]

Ta = 25°C

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

18/31

www.rohm.com 2011.12 - Rev.G

BD7411G (VDD=4.5～5.5V type)

Fig.54 Bop,Brp–Ambient temperature Fig.55 Bop,Brp– Supply voltage Fig.56 IDD – Ambient temperature

Fig.57 IDD – Supply voltage

0.0

1.0

2.0

3.0

4.0

5.0

6.0

4.0 4.5 5.0 5.5 6.0

SUPPLY VOLTAGE [V]

SUPPLY CURRENT [mA]

Ta = 25°C

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [℃]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp S

Brp N

Bop N

VDD=5.0V

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

4.0 4.5 5.0 5.5 6.0

SUPPLY VOLTAGE [V]

MAGNETIC FLUX DENSITY [mT]

Bop S

Brp S

Brp N

Bop N

Ta = 25°C

0.0

1.0

2.0

3.0

4.0

5.0

6.0

-60 -40 - 20 0 20 40 60 80 100

AMBIENT TEMPERATURE ［℃］

SUPPLY CURRENT [mA]

VDD=5.0V

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

19/31

www.rohm.com 2011.12 - Rev.G

●Block Diagram

BU52054GWZ, BU52055GWZ

PIN No. PIN NAME FUNCTION COMMENT

A1 GND GROUND

A2 GND GROUND

B1 VDD POWER SUPPLY

B2 OUT OUTPUT

BU52015GUL

Fig.59

PIN No. PIN NAME FUNCTION COMMENT

A1 OUT1 Output pin (Active Low)

A2 OUT2 Output pin (Active High)

B1 GND GROUND

B2 VDD Power Supply Voltage

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

SAMPLE

& HOLD

×

HALL

ELEMENT

B2

B1

Fig.58

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

0.1µF

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

0.1µF

A1

B2 B1

A2

Reverse

A2

B2

B1

A1

Surface

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

Adjust the bypass capacitor value as

necessary, according to voltage noise

conditions, etc.

GND

OUT1

OUT2

LATCH

VDD

GND

VDD

TIMING LOGIC

SAMPLE

& HOLD

×

HALL

ELEMENT

DYNAMIC

OFFSET

CANCELLATION

A1

A2

B1

B2

A1

B2 B1

A2

Reverse

A2

B2

B1

A1

Surface

A

1,A2

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

20/31

www.rohm.com 2011.12 - Rev.G

BU52001GUL

PIN No. PIN NAME FUNCTION COMMENT

A1 VDD POWER SUPPLY

A2 GND GROUND

B1 OUT OUTPUT

B2 N.C. OPEN or Short to GND.

BU52061NVX, BU52053NVX, BU52056NVX

PIN No. PIN NAME FUNCTION COMMENT

1 OUT OUTPUT

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 VDD POWER SUPPLY

Fig.60

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

SAMPLE

& HOLD

×

HALL

ELEMENT

A2

B1

A1

0.1µF

The CMOS output terminals enable direct connection

to the PC, with no external pull-up resistor required.

Adjust the bypass capacitor value as

necessary, according to voltage noise conditions, etc.

B1

A1

B2

A2

Reverse

A2

B2

B1

A1

Surface

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

Adjust the bypass capacitor value as

necessary, according to voltage noise

conditions, etc.

Reverse

Surface

1 2

4 3 3 4

2 1

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

SAMPLE

& HOLD

×

HALL

ELEMENT

2

1

4

Fig.61

0.1µF

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

21/31

www.rohm.com 2011.12 - Rev.G

BU52011HFV, BU52021HFV

PIN No. PIN NAME FUNCTION COMMENT

1 N.C. OPEN or Short to GND.

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 VDD POWER SUPPLY

5 OUT OUTPUT

BU52025G

PIN No. PIN NAME FUNCTION COMMENT

1 N.C. OPEN or Short to GND.

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 VDD POWER SUPPLY

5 OUT OUTPUT

0.1µF

Reverse

Surface 1

2

5

3

1

4

5

2

4

Reverse

1

2

5

3

Surface

1

4

5

2

4

0.1µF

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

SAMPLE

& HOLD

×

HALL

ELEMENT

2

5

4

Fig.62

The CMOS output terminals enable direct connection

to the PC, with no external pull-up resistor required.

Adjust the bypass capacitor value as

necessary, according to voltage noise

conditions, etc.

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

Adjust the bypass capacitor value as

necessary, according to voltage noise

conditions, etc.

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

SAMPLE

& HOLD

×

HALL

ELEMENT

2

5

4

Fig.63

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

22/31

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BD7411G

Fig.64

PIN No. PIN NAME FUNCTION COMMENT

1 N.C. OPEN or Short to GND.

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 OUT OUTPUT

5 VDD POWER SUPPLY Reverse

Surface 1

2

5

3

1

4

5

2

4

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

0.1µF

OUT

GND

VDD

LATCH

TIMING LOGIC

DYNAMIC

OFFSET

CANCELLATION

×

HALL

ELEMENT

2

4

5

SAMPLE

& HOLD

REG

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

23/31

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●Description of Operations

(Micropower Operation)

(Offset Cancelation)

The bipolar detection Hall IC adopts an intermittent operation method

to save energy. At startup, the Hall elements, amp, comparator and

other detection circuits power ON and magnetic detection begins.

During standby, the detection circuits power OFF, thereby reducing

current consumption. The detection results are held while standby is

active, and then output.

Reference period: 50ms (MAX100ms)

Reference startup time: 48µs

※BD7411G don’t adopts an intermittent operation method.

Fig.65

The Hall elements form an equivalent Wheatstone (resistor) bridge

circuit. Offset voltage may be generated by a differential in this bridge

resistance, or can arise from changes in resistance due to package or

bonding stress. A dynamic offset cancellation circuit is employed to

cancel this offset voltage.

When Hall elements are connected as shown in Fig. 66 and a

magnetic field is applied perpendicular to the Hall elements, voltage is

generated at the mid-point terminal of the bridge. This is known as Hall

voltage.

Dynamic cancellation switches the wiring (shown in the figure) to

redirect the current flow to a 90˚ angle from its original path, and

thereby cancels the Hall voltage.

The magnetic signal (only) is maintained in the sample/hold circuit

during the offset cancellation process and then released.

+

GND

VDD

－

I

B

×

Hall Voltage

Fig.66

IDD

Standby time

Startup time

Period

t

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

24/31

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(Magnetic Field Detection Mechanism)

The bipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an

inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance

increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets

closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the

distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output

returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This

detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.

B

Low

Bop N Brp N Brp S Bop S

0

High

N-Pole Magnetic flux density [mT] S-Pole

Fig.68

High

Low

OUT [V]

N

S

N

The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.

Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.

Fig.67

S

N

S N

M

agnet

i

c

Flux

M

agnet

i

c

Flux

M

agnet

i

c

Flux

M

agnet

i

c

Flux

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

25/31

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●Intermittent Operation at Power ON

The bipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as

shown in Fig. 69. It outputs to the appropriate terminal based on the detection result and maintains the output condition

during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it

cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be

programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.

※BD7411G don’t adopts an intermittent operation method.

●Magnet Selection

Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume

than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment

applications. Fig. 70 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The

graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet

(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 71 shows Hall IC detection distance – a good guide for

determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating

point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and

10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.

Magnet material: NMX-44CH

Maker: Hitachi Metals.,LTD

0

1

2

3

4

5

6

7

8

9

10

0 2 4 6 8 10 12 14 16 18 20

Magnet Hall IC distance L [mm]

Magnetic flux density [mT]

Fig.71 Magnet Dimensions and Flux Density Measuring Point

X=Y=4mm

t=1mm,2mm,3mm

X

t

Y

…Flux density measuring point

L: Variable

t

Magnet size

Magnet

VDD

Startup time Standby time Standby time

Startup time

(Intermittentaction)

Indefinite

interval

OUT

(No magnetic

field present)

Indefinite

interval

OUT

(Magnetic

field present) Low

High

Supply current

Fig.69

Power ON

10.4mm

7.6mm

t=3mm

t=1mm t=2mm

9.2mm

Fig.70

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

26/31

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●Position of the Hall Effect IC(Reference)

●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)

UCSP35L1 VCSP50L1 SSON004X1216

HVSOF5 SSOP5

(UNIT:mm)

0.6

0.8

0.2

SSON004X1216

VCSP50L1 HVSOF5 SSOP5

0.8

0.6

1.45

0.6

0.8

0.2

0.55

0.35

0.40

0.25

UCSP35L1

(UNIT:mm)

Please avoid having potential overstress

from PCB material, strength, mounting

positions.

If you had any further questions or

concerns, please contact your Rohm

sales and affiliate.

e

SE

SD

e

b3

0.40

Φ0.20

Reference

Val ue

e

b3

Symbol

SD 0.20

SE 0.20

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

27/31

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●Terminal Equivalent Circuit Diagram

OUT , OUT1, OUT2

Because they are configured for CMOS (inverter) output, the

output pins require no external resistance and allow direct

connection to the PC. This, in turn, enables reduction of the

current that would otherwise flow to the external resistor during

magnetic field detection, and supports overall low current

(micropower) operation.

Fig.72

GND

VDD

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

28/31

www.rohm.com 2011.12 - Rev.G

-10

-8

-6

-4

-2

0

2

4

6

8

10

012345678910

Horizontal distance from the magnet [mm]

Magnetic fux density[mT]

Reverse

Magnetic

Field

●Notes for use

1) Absolute maximum ratings

Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or

destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this

way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in

excess of absolute rating limits.

2) GND voltage

Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower

than the potential of all other pins.

3) Thermal design

Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning

or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted

together, or if shorts occur between the output pin and supply pin or GND.

5) Positioning components in proximity to the Hall IC and magnet

Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore

the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in

the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and

evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.

6) Slide-by position sensing

Fig.73 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet

and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen

in Fig.74, the magnetic field runs in opposite directions at Point A and Point B. Since the bipolar detection Hall IC can

detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the

process of position detection. Fig. 75 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic

field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This

demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and

prevents malfunctions.

7) Operation in strong electromagnetic fields

Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause

the IC to malfunction.

8) Common impedance

Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,

employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or

capacitor.

9) GND wiring pattern

When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set

PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes

due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same

way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.

10) Exposure to strong light

Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such

exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and

fluorescent light sources was shown to have no significant effect on the IC.

11) Power source design

Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under

examine adequate evaluations when designing the power source.

L

Magnet

Hall IC

Slide

Fig.73

Fig.75

Fig.74

B

S

A

N

Magnetic Flux

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

29/31

www.rohm.com 2011.12 - Rev.G

●Ordering part number

B U 5 2 0 0 1 G U L - E 2

Part No.

BU, BD

Part No.

52054, 52055, 52015

52001, 52061, 52053

52056, 52011, 52021

52025, 7411

Package

GWZ : UCSP35L1

GUL : VSCP50L1

NVX : SSON004X1216

HFV : HVSOF5

G : SSOP5

Packaging and forming specification

E2: Embossed tape and reel

(UCSP35L1, VSCP50L1)

TR: Embossed tape and reel

(SSON004X1216,HVSOF5, SSOP5)

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm

)

UCSP35L1

(BU52054GWZ)

0.80±0.05

0.06

S

1PIN MARK

0.4MAX

0.1±0.05

0.4

12

B

A

0.2±0.05

0.4 0.2±0.05

4-φ0.20±0.05

BA

0.05

S

A

B

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm

)

UCSP35L1(BU52055GWZ)

0.80±0.05

0.06 S

1PIN MARK

0.4MAX

0.1±0.05

0.4

12

B

A

0.2±0.05

0.4 0.2±0.05

4-φ0.20±0.05

BA

0.05

S

A

B

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

30/31

www.rohm.com 2011.12 - Rev.G

(Unit : mm)

SSON004X1216

S

0.08 S

3

4

21

1PIN MARK

1.2±0.1

0.65±0.1

0.75±0.1

1.6±0.1

0.2±0.1

0.8±0.1

0.6MAX

(0.12)

0.02+0.03

-

0.02

0.2 +0.05

-

0.04

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

5000pcs

TR

()

Direction of feed

Reel 1pin

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

VCSP50L1

(BU52001GUL)

S

0.08 S

A

B

BA

0.05

1PIN MARK

0.30±0.1

4-φ0.25±0.05

1.10±0.1

21

0.30±0.1

B

0.55MAX

1.10±0.1

A

0.10±0.05

0.50

(Unit : mm)

VCSP50L1(BU52015GUL)

S

0.08 S

A

B

BA

0.05

1PIN MARK

0.30±0.1

4-φ0.25±0.05

1.10±0.1

21

0.30±0.1

B

0.55MAX

1.10±0.1

A

0.10±0.05

0.50

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

E2

()

Direction of feed

Reel 1pin

Technical Note

BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,

BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G

31/31

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Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

TR

()

1pin

(Unit : mm)

HVSOF5

S

0.08

M

0.1 S

4

321

5

(0.05)

1.6±0.05

1.0±0.05

1.6±0.05

1.2±0.05

(MAX 1.28 include BURR)

45

321

(0.8)

(0.91)

(0.3)

(0.41)

0.2MAX

0.13±0.05

0.22±0.05

0.6MAX

0.5

0.02 +0.03

−0.02

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

TR

()

1pin

(Unit : mm)

SSOP5

2.9±0.2

0.13

4°+6°

−4°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42+0.05

−0.04

0.95

54

123

1.25Max.

0.2Min.

0.1 S

S

R1120

A

www.rohm.com

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http://www.rohm.com/contact/

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consent of ROHM Co.,Ltd.

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"Products"). If you wish to use any such Product, please be sure to refer to the specications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

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The Products specied in this document are intended to be used with general-use electronic

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While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, re or any other damage caused in the event of the

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shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

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The Products are not designed or manufactured to be used with any equipment, device or

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