BAT54XV2T1 Preferred Device Schottky Barrier Diodes These Schottky barrier diodes are designed for high-speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand-held and portable applications where space is limited. http://onsemi.com Features * Extremely Fast Switching Speed * Low Forward Voltage - 0.35 V (Typ) @ IF = 10 mAdc * Pb-Free Package is Available 30 VOLT SILICON HOT-CARRIER DETECTOR AND SWITCHING DIODES MAXIMUM RATINGS (TJ = 125C unless otherwise noted) Rating Reverse Voltage Symbol Value Unit VR 30 V Symbol Max Unit PD 200 mW 1.57 mW/C RJA 635 C/W TJ, Tstg -55 to 125 C 1 CATHODE 2 ANODE THERMAL CHARACTERISTICS 2 Characteristic Total Device Dissipation FR-5 Board, (Note 1) TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature 1 SOD-523 CASE 502 PLASTIC MARKING DIAGRAM Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR-4 Minimum Pad. 1 JVM G G JV = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping BAT54XV2T1 SOD-523 3000 / Tape & Reel BAT54XV2T1G SOD-523 (Pb-Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2005 October, 2005 - Rev. 3 1 Publication Order Number: BAT54XV2T1/D BAT54XV2T1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BR)R 30 - - V Total Capacitance (VR = 1.0 V, f = 1.0 MHz) CT - 7.6 10 pF Reverse Leakage (VR = 25 V) IR - 0.5 2.0 Adc Forward Voltage (IF = 0.1 mAdc) VF - 0.22 0.24 Vdc Forward Voltage (IF = 30 mAdc) VF - 0.41 0.5 Vdc Forward Voltage (IF = 100 mAdc) VF - 0.52 0.8 Vdc Reverse Recovery Time (IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) Figure 1 trr - - 5.0 ns Forward Voltage (IF = 1.0 mAdc) VF - 0.29 0.32 Vdc Forward Voltage (IF = 10 mAdc) VF - 0.35 0.40 Vdc Forward Current (DC) IF - - 200 mAdc Repetitive Peak Forward Current IFRM - - 300 mAdc Non-Repetitive Peak Forward Current (t < 1.0 s) IFSM - - 600 mAdc trr t Reverse Breakdown Voltage (IR = 10 A) 820 +10 V 2k 100 H 0.1 F IF t tp r 0.1 F t IF 10% DUT 50 Output Pulse Generator 50 Input Sampling Oscilloscope 90% iR(REC) = 1 mA IR VR INPUT SIGNAL OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 BAT54XV2T1 IF, FORWARD CURRENT (mA) 100 10 1 50C 1 25C 1.0 85C 25C 0.1 0.0 0.2 0.1 -40C 0.3 -55C 0.4 0.5 0.6 VF, FORWARD VOLTAGE (VOLTS) Figure 2. Forward Voltage 1000 IR, REVERSE CURRENT (A) TA = 150C 100 TA = 125C 10 1.0 TA = 85C 0.1 0.01 0.001 TA = 25C 0 5 10 15 25 20 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Leakage Current CT, TOTAL CAPACITANCE (pF) 14 12 10 8 6 4 2 0 0 5 10 15 20 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Total Capacitance http://onsemi.com 3 25 30 BAT54XV2T1 PACKAGE DIMENSIONS SOD-523 CASE 502-01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. -X- A -Y- B 1 2 DIM A B C D J K S D 2 PL 0.08 (0.003) M T X Y MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM MAX 0.047 0.051 0.032 0.035 0.024 0.028 0.012 0.014 0.0055 0.0079 0.008 0.010 0.063 0.067 C -T- K J SEATING PLANE S SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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