T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 1 of 5
1N6638, 1N6642, 1N6643
Availa ble on
commercial
versions
VOIDLESS HERMETICALLY SEALED
SWITCHING DIODES
Qualified per MIL-PRF-19500/578
Qualified Levels:
JAN, JANTX,
JANTXV and JANS
DESCRIPTION
These popular JEDEC registered switching/signal diodes are military qualified and available
with inter na l metallur g ical b onde d c ons truc t ion . T hese sm all low capac itanc e diodes with very
fast s witching s peeds are h ermeticall y sealed and bonded int o a “D” package. They may be
used in a variet y of fast swi tching ap plications includin g computer s and perip heral equi pment
such as magnetic cores, thin-film memories, plated-wire memories, as well as decoding or
encoding applications, etc. Microsemi also offers a variety of other switching/signal diodes.
“D” Package
Also available in:
“B” SQ MELF or
D-5B Package
(surface mount)
1N6638US_42US_43US
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• JEDEC registered 1N6638, 1N 6642, and 1N664 3.
• Ultra fast recovery time.
• Very low capacitance.
• Metallurgically bonded.
• Non-cavity glass package.
• JAN, JANTX, JANTXV and JANS qualifications are availa ble per MIL-PRF-19500/578.
• Replacements for 1N4148, 1N4148-1 , 1N41 50, 1N4150-1, and 1N91 4.
• RoHS compliant devices available (commercial grade only).
APPLICATIONS / BENEFITS
• Small size for high density mounting using flexible thru-hole leads (see pack age ill ustration).
• Ideal for:
High frequency data lines
RS-232 & RS–422 Interface Networks
Ethernet 10 Base T
Switching core driv er s
LAN
Computers
MAXIMUM RATINGS @ TA = +25 oC unless otherwise noted.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
Tel: (978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Junction and Storage Temp
TJ and TSTG
-65 to +175
Thermal Resi stan ce Jun cti on-to-Lead = 0.375 in ch (1)
RӨJL
150
Thermal Resi stan ce Jun cti on-to-Ambient (1)
RӨJA
250
Peak Forward Surge Current @ TA = +25
o
C
(Test pulse = 8.3 ms, half-sine wave.)
IFSM 2.5 A
Average Rectified Forward Current @ TA = +75
o
C
(Derate at 3.0 mA/
o
C above TL = +75
o
C @ L = 3/8”)
IO 300 mA
Breakdown Voltage: 1N6638
1N6642
1N6643
VBR 150
100
75
V
Working Peak Reverse Voltage: 1N6638
1N6642
1N6643
VRWM 125
75
50
V
NOTES: 1. TA = +75 °C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu,
horizontal, i n still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, lead length L ≤ .187 inch (≤ 4.75 mm); RΘJA with a defined PCB thermal resistance
conditi on included, is meas ured at IO = 300 mA.
T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 2 of 5
1N6638, 1N6642, 1N6643
MECHANICAL and PACKAGING
• CASE: Voidless hermetically sealed hard glass.
• TERMINALS: Tin-lead plate with >3% lead. Solder dip is available upon request.
• MARKING: Body painted and alpha numeric.
• POLARITY: Cathode indicated by band.
• Tape & Reel option: Standard per EIA-296. Consult factory for quantities.
• See Package Dimensions on last page.
PART NOMENCLATURE
JAN 1N6638 (e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JANS Level
Blank = commercial
RoHS Compli ance
e3 = RoHS compliant (available
in commercial grade only)
Blank = non-RoHS compliant
JEDEC type number
See Electr ical Charac teristics
table
SYMBOLS & DEFINITIONS
Symbol
Definition
VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VRWM
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature
range.
VF Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IF Forward Current: The forward current dc value, no alternating component.
IR
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage.
trr
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is
reached.
ELECTRICAL CHARACTERISTICS @ 25oC unless otherwise noted.
TYPE
NUMBER
MAXIMUM
FORWARD
VOLTAGE
VF @ IF
MAXIMUM DC REVERSE CURRE NT
IR1 IR2 IR3 IR4
REVERSE
RECOVERY
TIME
trr
(Note 1)
MAXIMUM
FORWARD
RECOVERY
V OLTAGE AND
TIME
IF=200mA, tr=1ns
MAXIMUM
JUNCTION
CAPACITANCE
f = 1 MHz
Vsig = 50 mV
(p-p)
V
R
=
20 V
V
R
=V
RWM
V
R
=20 V
TA=
+150 oC
V
R
=V
RWM
TA=
+150 oC VFRM tfr VR=0 V VR=1.5 V
V @ mA
V @ mA
nA
nA
µA
µA
ns
V
ns
pf
pf
1N6638
0.8 V @ 10 mA
1.1 V @ 200 mA
35
500
50
100
4.5
5.0
20
2.5
2.0
1N6642
0.8 V @ 10 mA
1.2 V @ 100 mA
25
500
50
100
5.0
5.0
20
5.0
2.8
1N6643
0.8 V @ 10 mA
1.2 V @ 100 mA
50
500
75
100
6.0
5.0
20
5.0
2.8
NOTE: 1. Reverse Recovery Time Test Conditions – IF=IR=10 mA, IR(REC) = 1. 0 mA, C=3 pF, R L = 100 ohms.
T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 3 of 5
1N6638, 1N6642, 1N6643
GRAPHS
TA (oC) Ambient Temperature
FIGURE 1
Temperature – Current Derating
Time (s)
FIGURE 2
Maximum Thermal Impedance at TA = 55 oC
Thermal Impedance (oC/W)
Sinewave Operation Maximum IO Rating (mA)
T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 4 of 5
1N6638, 1N6642, 1N6643
GRAPHS (continued)
Time (s)
FIGURE 3
Maximum Thermal Impedance at TL = 25 oC
Thermal Impedance (oC/W)
T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 5 of 5
1N6638, 1N6642, 1N6643
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Dimension BD shall be measured at the largest diameter.
3. The specified lead diameter applies in the zone between .050 inch (1.27 mm) from the diode body to the end of the lead. Outside of
this zone lead shall not exceed BD.
4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
DIM
INCH
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
BD
0.056
0.080
1.42
2.03
2
BL
0.130
0.180
3.30
4.57
LD
0.018
0.022
0.46
0.56
3
LL 1.00 1.50 25.40 38.10