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FEATURES
DESCRIPTION
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
OC-48/24/12/3 SONET/SDH MULTIRATE TRANSCEIVER
Optical Modules•Fully Integrated SONET/SDH Transceiver to •Hot Plug ProtectionSupport Clock/Data Recovery and
•Low Jitter PECL Compatible Differential SerialMultiplexer/Demultiplexer Functions
Interface With Programmable De-Emphasis for•Supports OC-48, OC-24, OC-12, Gigabit the Serial OutputEthernet, and OC-3 Data Rate With Autorate
•On-Chip Termination for LVDS and PECLDetection
Compatible Interface•Supports Transmit Only, Receiver Only,
•Receiver Differential Input Thresholds 150 mVTransceiver and Repeater Functions in a
MinSingle Chip Through Configuration Pins
•Supports SONET Loop Timing•Supports SONET/SDH Frame Detection
•Low Power CMOS•On-Chip PRBS Generation and Verification
•ESD Protection >2 kV•Supports 4-Bit LVDS (OIF99.102) Electrical
•155-MHz or 622-MHz Reference ClockInterface
•Maintains Clock Output in Absence of Data•Parity Checking and Generation for the LVDS
•Local and Remote LoopbackInterface
•100-Pin PZP Package With PowerPAD™•Single 2.5-V Power Supply
Design With 5-mm ×5-mm (Typ) Heatsink•Interfaces to Back Plane, Copper Cables, or
The SLK2511B is a single chip multirate transceiver IC used to derive high-speed timing signals forSONET/SDH based equipment. The chip performs clock and data recovery, serial-to-parallel/parallel-to-serialconversion and frame detection function conforming to the SONET/SDH standards.
The device can be configured to operate under OC-48, OC-24, OC-12, or OC-3 data rates through the rateselection pins or the autorate detection function. An external reference clock operating at 155.52 MHz or 622.08MHz is required for the recovery loop, and it also provides a stable clock source in the absence of serial datatransitions.
The SLK2511B accepts 4-bit LVDS parallel data/clock and generates a NRZ SONET/SDH-compliant signal atOC-3, OC-12, OC-24, or OC-48 rates. It also recovers the data and clock from the serial SONET stream anddemultiplexes it into 4-bit LVDS parallel data for full duplex operation. TXDATA0 and RXDATA0 are the first bitsthat are transmitted and received in time, respectively. The serial interface is a low jitter, PECL compatibledifferential interface.
The SLK2511B provides a comprehensive suite of built-in tests for self-test purposes including local and remoteloopback and PRBS (2
7
-1) generation and verification.
The device comes in a 100-pin VQFP package that requires a single 2.5-V supply with 3.3-V tolerant inputs onthe control pins. The SLK2511B is power efficient, dissipating less than 900 mW at 2.488 Gbps, the OC-48 datarate, and it is characterised for operation from –40 °C to 85 °C.
AVAILABLE PACKAGE OPTIONS
(1)
T
A
PowerPAD QUAD (PZP)
–40 °C to 85 °C SLK2511BPZP
(1) For the most current package and ordering information, see the Package Option Addendum at the endof this document, or see the TI website at www.ti.com
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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BLOCK DIAGRAM
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
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SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
Table 1. TERMINAL FUNCTIONSTERMINAL
TYPE DESCRIPTIONNAME NO.
CLOCK PINS
REFCLKP, 94 LVDS/PECL Differential reference input clock. There is an on-chip 100- Ωtermination resistor differentiallyREFCLKN 95 compatible input placed between REFCLKP and REFCLKN. The dc bias is also provided on-chip for ac-coupledcase.
RXCLKP, 67 LVDS output Receive data clock. The data on RXDATA(0:3) is on the falling edges of RXCLKP. The interface ofRXCLKN 68 RXDATA(0:3) and RXCLKP is source synchronous (see Figure 7 ).
TXCLKP, 79 LVDS input Transmit data clock. The data on TXDATA(0:3) is latched on the rising edge of TXCLKP.TXCLKN 80
TXCLKSRCP, 70 LVDS output Transmit clock source. A clock source generated from the SLK2511B to the downstream deviceTXCLKSRCN 71 (i.e., framer) that could be used by the downstream device to transmit data back to the SLK2511B.This clock is frequency-locked to the local reference clock.
SERIAL SIDE DATA PINS
SRXDIP, 14 PECL compatible Receive differential pairs; high-speed serial inputs.SRXDIN 15 input
STXDOP, 9 PECL compatible Transmit differential pairs; high-speed serial outputs.STXDON 8 input
PARALLEL SIDE DATA PINS
FSYNCP, 73 LVDS output Frame sync pulse. This signal indicates the frame boundaries of the incoming data stream. If theFSYNCN 74 frame-detect circuit is enabled, FSYNC pulses for four RXCLKP and RXCLKN clock cycles when itdetects the framing patterns.
RXDATA[0:3] 66–63, LVDS output Receive data pins. Parallel data on this bus is valid on the falling edge of RXCLKP (seeFigure 7 ).P/N 60–57 RXDATA0 is the first bit received in time.
RXPARP, 56 LVDS output Receive data parity outputRXPARN 55
TXDATA[0:3] 88–81 LVDS input Transmit data pins. Parallel data on this bus is clocked on the rising edge of TXCLKP. TXDATA0 isP/N the first bit transmitted in time.
TXPARP, 99 LVDS input Transmit data parity inputTXPARN 98
CONTROL/STATUS PINS
AUTO_DETECT 34 TTL input (with Data rate autodetect enable. Enable the auto-detection function for different data rates. Whenpulldown) AUTO_DETECT is high, the autodetection circuit generates RATEOUT0 and RATEOUT1 toindicate the data rates for the downstream device.
CONFIG0, 17 TTL input (with Configuration pins. Put the device under one of the four operation modes: TX only, RX only,CONFIG1 18 pulldown) transceiver, or repeater mode. (See Table 4 )
ENABLE 44 TTL input (with Standby enable. When this pin is held low, the device is disabled for IDDQ testing. When high, thepullup) device operates normally.
FRAME_EN 27 TTL input (with Frame sync enable. When this pin is asserted high, the frame synchronization circuit for bytepullup) alignment is turned on.
LCKREFN 24 TTL input (with Lock to reference. When low, RXCLKP/N output is forced to lock to REFCLK. When high,pullup) RXCLKP/N is the divided down clock extracted from the receive serial data.
LLOOP 53 TTL input (with Local loopback enable. When high, the serial output is internally looped back to its serial input.pulldown)
LOL 45 TTL output Loss of lock. When the clock recovery loop has locked to the input data stream and the phasediffers by less than 100 ppm from REFCLK then LOL is high. When the phase of the input datastream differs by more than 100 ppm from REFCLK, then LOL is low. If the difference is too big (>500 ppm), the LOL output is not valid.
LOOPTIME 51 TTL input (with Loop timing mode. When high, the PLL for clock synthesizer is bypassed. The recovered clockpulldown) timing is used to send the transmit data.
LOS 46 TTL output Loss of signal. When no transitions appear on the input data stream for more than 2.3 µs, a loss ofsignal occurs and LOS goes high. The device also transmits all zeroes downstream using REFCLKas its clock source. When a valid SONET signal received the LOS signal goes low.
PRBSEN 41 TTL input (with PRBS testing enable. When this pin is asserted high, the device is put into the PRBS testing mode.pulldown)
PRE1, PRE2 4 and 5 TTL input (with Programmable de-emphasis control. Combinations of these two bits can be used to optimize serialpulldown) data transmission.
PS 21 TTL input (with Polarity select. This pin, used with the SIGDET pin, sets the polarity of SIGDET. When high,pulldown) SIGDET is an active low signal. When low, SIGDET is an active high signal.
RATEOUT0, 37 TTL output Autorate detection outputs. When AUTO_DETECT is high, the autodetection circuit generatesRATEOUT1 36 these two bits to indicate the data rates for the downstream device.
RESET 48 TTL input TXFIFO and LOL reset pin. Low is reset and high is normal operation.
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SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
Table 1. TERMINAL FUNCTIONS (continued)TERMINAL
TYPE DESCRIPTIONNAME NO.
RLOOP 54 TTL input (with Remote loopback enable. When high, the serial input is internally looped back to its serial outputpulldown) with the timing extracted from the serial data.
RSEL0, 39 TTL input (with Data rate configuration pins. Puts the device under one of the four data rate operations: OC-48,RSEL1 38 pulldown) OC-24, OC-12, or OC-3.
RX_MONITOR 47 TTL input (with RX parallel data monitor in repeater mode. This pin is only used when the device is put under thepulldown) repeater mode. When high, the RX demux circuit is enabled and the parallel data is presented.When low, the demux is shut down to save power.
SIGDET 20 TTL input (with Signal detect. This pin is generally connected to the output of an optical receiver. This signal maypulldown) be active high or active low depending on the optical receiver. The SIGDET input is XORed withthe PS pin to select the active state. When SIGDET is in the inactive state, data is processednormally. When activated, indicating a loss of signal event, the transmitter transmits all zeroes andforce the LOS signal to go high.
TESTEN 43 TTL input (with Production test mode enable. This pin should be left unconnected or tied low.pulldown)
PAR_VALID 2 TTL output Parity checker output. The internal parity checker on the parallel side of the transmitter checks foreven parity. If there is a parity error, the pin is pulsed low for 2 clock cycles.
PRBSPASS 42 TTL output PRBS test result. This pin reports the status of the PRBS test results (high = pass). WhenPRBSEN is disabled, the PRBSPASS pin is set low. When PRBSEN is enabled and a valid PRBSis received, then the PRBSPASS pin is set high.
REFCLKSEL 40 TTL input (with Reference clock select. The device can accept a clock frequency of 155.52 MHz or 622.08 MHz,pulldown) which is selected by this pin (0 = 622.08-MHz mode and 1 = 155.52-MHz mode).
SPILL 49 TTL output TX FIFO collision output
VOLTAGE SUPPLY AND RESERVED PINS
GND 1, 6, 19, 23, Ground Digital logic ground26, 28, 30,31, 33
GNDA 10, 13 Ground Analog ground
GNDLVDS 61, 69, 76, Ground LVDS ground77, 89, 93,96, 100
GNDPLL 12 Supply PLL ground
RSVD 52 Reserved This pin needs to be tied to ground or left floating for normal operation.
VDD 3, 22, 25, Supply Digital logic supply voltage (2.5 V)29, 32, 35,50
VDDA 7, 16 Supply Analog voltage supply (2.5 V)
VDDLVDS 62, 72, 75, Supply LVDS supply voltage (2.5 V)78, 90, 91,92, 97
VDDPLL 11 Supply PLL voltage supply (2.5 V)
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DETAILED DESCRIPTION
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
The SLK2511B is designed to support OC-48/24/12. The operating data speed can be configured through theRSEL0 and RSEL1 pins as indicated in Table 2 .
Table 2. Data Rate Select
SERIAL DATA RATE RSEL0 RSEL1 PARALLEL LVDS DATA RATE TXCLK/RXCLK
OC-48:2.488 Gb/s 0 0 622.08 Mbps 622.08 MHzOC-24:1.244 Gb/s 1 0 311.04 Mbps 311.04 MHzOC-12:622 Mb/s 0 1 155.52 Mbps 155.52 MHzOC-3:155 Mb/s 1 1 38.88 Mbp 38.88 MHz
The user can also enable the autorate detection circuitry through the AUTO_DETECT pin. The deviceautomatically detects the OC-N of the data line rate and generates two bits of output to indicate the data rate toother devices in the system. When using AUTO_DETECT, RSEL0 and RSEL1 need to be set to 00 or beunconnected.
Table 3. Data Rate Reporting Under Autorate Detection Mode
SERIAL DATA RATE RATEOUT0 RATEOUT1 PARALLEL LVDS DATA RATE TXCLK/RXCLK
OC-48:2.488 Gb/s 0 0 622.08 Mbps 622.08 MHzOC-24:1.244 Gb/s 1 0 311.04 Mbps 311.04 MHzOC-12:622 Mb/s 0 1 155.52 Mbps 155.52 MHzOC-3:155 Mb/s 1 1 38.88 Mbp 38.88 MHz
The SLK2511B has four operational modes controlled by two configuration pins. These operational modes arelisted in Table 4 . When the device is put in a certain mode, unused circuit blocks are powered down to conservethe system power.a
While the transceiver mode, transmit only mode, and receive only mode are straightforward, the repeater modeof operation is shown in Figure 4 . The receive serial data is recovered by the extracted clock and it is then sentback out on the transmit serial outputs. The data eye is open both vertically and horizontally in this process. Inthe repeater mode, the user can select to turn on the RX demux function through the RX_MONITOR pin andallow the parallel data to be presented. This feature enables the repeater device not only to repeat but also tolisten in.
Table 4. Operational Modes
MODE CONFIG0 CONFIG1 DESCRIPTION
1 0 0 Full duplex transceiver mode2 0 1 Transmit only mode3 1 0 Receive only mode4 1 1 Repeater mode
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HIGH-SPEED ELECTRICAL INTERFACE
LVDS PARALLEL DATA INTERFACE
REFERENCE CLOCK
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
The high-speed serial I/O uses a PECL compatible interface. The line could be directly coupled or ac-coupled.See Figure 10 and Figure 11 for configuration details. As shown in the figures, an on-chip 100- Ωterminationresistor is placed differentially at the receive end.
The PECL output also provide de-emphasis for compensating ac loss when driving a cable or PCB backplaneover long distance. The level of the de-emphasis is programmable via PRE1 and PRE2 pins. Users can usesoftware to control the strength of the de-emphasis to optimize the device for a specific system requirement.
Table 5. Programmable De-Emphasis
PRE1 PRE2 DE-EMPHASIS LEVEL(V
(ODp)
d/V
(ODd)
(1)
– 1)
0 0 De-emphasis disabled1 0 10%0 1 20%1 1 30%
(1) V
(ODp)
: Differential voltage swing when there is a transition in the data stream.V
(ODd)
: Differential voltage swing when there is no transition in the data stream.
Figure 1. Output Differential Voltage Under De-Emphasis
The parallel data interface consists of a 4-bit parallel LVDS data and clock. The device conforms to OIF99.102specification when operating at the OC-48 rate. When operating at lower serial rates the clock and datafrequency are scaled down accordingly, as indicated in Table 2 . The parallel data TXDATA[0:3] is latched on therising edge of the TXCLK and then is sent to a data FIFO to resolve any phase difference between TXCLK andREFCLK. If there is a FIFO overflow condition, the SPILL pin is set high. The FIFO resets itself to realignbetween two clocks. The internal PLL for the clock synthesizer is locked to the REFCLK and it is used as thetiming to serialize the parallel data (except for the loop timing mode where the recovered clock is used). On thereceive side, RXDATA[0:3] is updated on the rising edge of RXCLK. Figure 7 and Figure 8 show the timingdiagram for the parallel interface.
The SLK2511B also has a built-in parity checker and generator for error detection of the LVDS interface. On thetransmit side, it accepts the parity bit, TXPARP/N, and performs the parity checking function for even parity. If anerror is detected, it pulses the PAR_VALID pin low for two clock cycles. On the receive side, the parity bitRXPARP/N is generated for the downstream device for parity error checking.
Differential termination 100- Ωresistors are included on-chip between TXDATAP/N.
The device accepts either a 155.52-MHz or a 622.08-MHz clock. A clock select pin (REFCLKSEL) allows theselection of the external reference clock frequency. The REFCLK input is compatible with the LVDS level andalso the 3.3-V LVPECL level using ac-coupling. A 100- Ωdifferential termination resistor is included on-chip, aswell as a dc biasing circuit (3 k Ωto VDD and 4.5 k Ωto GND) for the ac-coupled case. A high quality REFCLKmust be used on systems required to meet SONET/SDH standards. For non-SONET/SDH compliant systems,loose tolerances may be used.
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CLOCK AND DATA RECOVERY
MINIMUM TRANSITION DENSITY
JITTER TOLERANCE
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
Table 6. Reference Clock Frequency
REFCLKSEL REFERENCE CLOCK FREQUENCY
0 622.08 MHz1 155.52 MHz
The CDR unit of SLK2511B recovers the clock and data from the incoming data streams.
In the event of receive data loss, the PLL automatically locks to the local REFCLK to maintain frequencystability. If the frequency of the data differs by more that 100 ppm with respect to the REFCLK frequency, theLOL pin is asserted as a warning. Actual loss of lock occurs if the data frequency differs by more than 170 ppm.
The loop filter transfer function is optimized to enable the CDR to track ppm difference in the clocking andtolerate the minimum transition density that can be received in a SONET data signal ( ±20 ppm). The transferfunction yields a typical capture time of 3500 bit times for random incoming NRZ data after the device ispowered up and achieves frequency locking.
The device tolerates up to 72 consecutive digits (CID) without sustaining an error.
Input jitter tolerance is defined as the peak-to-peak amplitude of sinusoidal jitter applied on the input signal thatcauses the equivalent 1-dB optical/electrical power penalty. This refers to the ability of the device to withstandinput jitter without causing a recovered data error. The device has a jitter tolerance that exceeds the maskshown in Figure 2 (GR-253 Figure 5-28)
(1)
. This jitter tolerance is measured using a pseudorandom data patternof 2
31
–1.
OC-N/STS-N f0 F1 F2 F3 F4 A1 A2 A3LEVEL (Hz) (Hz) (Hz) (kHz) (kHz) (Ulpp) (Ulpp) (Ulpp)
3 10 30 300 6.5 65 0.15 1.5 1512 10 30 300 25 250 0.15 1.5 1524 Not Specified48 10 600 6000 100 1000 0.15 1.5 15
(1) The tolerance margin is 20% or more at all modulating frequencies when measured using the HP 7150A jitter analysis system on theTexas Instruments provided EVM.
Figure 2. Input Jitter Tolerance
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JITTER GENERATION
LOOP TIMING MODE
LOSS OF LOCK INDICATOR
LOSS OF SIGNAL
SIGNAL DETECT
MULTIPLEXER OPERATION
DEMULTIPLEXER OPERATION
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
The jitter of a serial clock and serial data outputs must not exceed 0.01 UI
rms
/0.1 UI
p-p
when a serial data with nojitter is presented to the inputs. The measurement bandwidth for intrinsic jitter is 12 kHz to 20 MHz.
When LOOPTIME is high, the clock synthesizer used to serialize the transmit data is bypassed and the timing isprovided by the recovered clock. However, REFCLK is still needed for the recovery loop operation.
The SLK2511B has a lock detection circuit to monitor the integrity of the data input. When the clock recoveryloop is locked to the input serial data stream, the LOL signal goes high. If the recovered clock frequencydeviates from the reference clock frequency by more than 100 ppm, LOL goes low. If the data stream clock ratedeviates by more than 170 ppm, loss of lock occurs. If the data streams clock rate deviates more than 500 ppmfrom the local reference clock, the LOL output status might be unstable. Upon power up, the LOL goes low untilthe PLL is close to phase lock with the local reference clock.
The loss of signal (LOS) alarm is set high when no transitions appear in the input data path for more than 2.3 µs.The LOS signal becomes active when the above condition occurs. If the serial inputs of the device areac-coupled to its source, the ac-couple capacitor needs to be big enough to maintain a signal level above thethreshold of the receiver for the 2.3 µs no transition period. Once activated, the LOS alarm pin is latched highuntil the receiver detects an A1A2 pattern. The recovered clock (RXCLK) is automatically locked to the localreference when LOS occurs. The parallel data (RXDATAx) may still be processed even when LOS is activated.
The SLK2511B has an input SIGDET pin to force the device into the loss of signal state. This pin is generallyconnected to the signal detect output of the optical receiver. Depending on the optics manufacturer, this signalcan be either active high or active low. To accommodate the differences, a polarity select (PS) pin is used. Foran active low, SIGDET input sets the PS pin high. For an active high, SIGDET input sets the PS pin low. Whenthe PS signal pin and SIGDET are of opposite polarities, the loss of signal state is generated and the devicetransmits all zeroes downstream.
The 4-bit parallel LVDS data is clocked into an input buffer by a clock derived from the synthesized clock. Thedata is then clocked into a 4:1 multiplexer. The D0 bit is the most significant bit and is shifted out first in theserial output stream.
The serial 2.5 Gbps data is clocked into a 1:4 demultiplexer by the recovered clock. The D0 bit is the first bit thatis received in time from the input serial stream. The 4-bit parallel data is then sent to the LVDS driver along withthe divided down recovered clock.
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FRAME SYNCHRONIZATION
TESTABILITY
IDDQ FUNCTION
LOCAL LOOPBACK
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
The SLK2511B has a SONET/SDH-compatible frame detection circuit that can be enabled or disabled by theuser. Frame detection is enabled when the FRAMEN pin is high. When enabled it detects the A1, A2 framingpattern, which is used to locate and align the byte and frame boundaries of the incoming data stream. WhenFRAMEN is low the frame detection circuitry is disabled and the byte boundary is frozen to the location foundwhen detection was previously enabled.
The frame detect circuit searches the incoming data for three consecutive A1 bytes followed immediately by oneA2 byte. The data alignment circuit then aligns the parallel output data to the byte and frame boundaries of theincoming data stream. During the framing process the parallel data bus does not contain valid and aligned data.Upon detecting the third A1, A2 framing patterns that are separated by 125 µs from each other, the FSYNCsignal goes high for 4 RXCLK cycles, indicating frame synchronization has been achieved.
The probability that random data in a SONET/SDH data stream mimics the framing pattern in the data payload isextremely low. However, there is a state machine built in to prevent false reframing if a framing pattern doesshow up in the data payload.
The SLK2511B has a comprehensive suite of built-in self-tests. The loopback function provides for at-speedtesting of the transmit/receive portions of the circuitry. The enable pin allows for all circuitry to be disabled sothat an Iddq test can be performed. The PRBS function allows for a BIST (built-in self-test).
When held low, the ENABLE pin disables all quiescent power in both the analog and digital circuitry. This allowsfor IDDQ testing on all power supplies and can also be used to conserve power when the link is inactive.
The LLOOP signal pin controls the local loopback. When LLOOP is high, the loopback mode is activated andthe parallel transmit data is selected and presented on the parallel receive data output pins. The parallel transmitdata is also multiplexed and presented on the high-speed serial transmit pins. Local loopback can only beenabled when the device is under the transceiver mode.
Figure 3. Local Loopback Data Path
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REMOTE LOOPBACK
PRBS
POWER-ON RESET
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
The RLOOP signal pin controls the remote loopback. When RLOOP is high, the serial receive data is selectedand presented on the serial transmit data output pins. The serial received data is also demultiplexed andpresented on the parallel receive data pins. The remote loop can be enabled only when the device is undertransceiver mode. When the device is put under the repeater mode with RX_MONITOR high, it performs thesame function as the remote loopback.
Figure 4. Remote Loopback Data Path/Repeater Mode Operation
The SLK2511B has two built-in pseudorandom bit stream (PRBS) functions. The PRBS generator is used totransmit a PRBS signal. The PRBS verifier is used to check and verify a received PRBS signal.
When the PRBSEN pin is high, the PRBS generator and verifier are both enabled. A PRBS is generated and fedinto the parallel transmitter input bus. Data from the normal input source is ignored in PRBS mode. The PBRSpattern is then fed through the transmitter circuitry as if it was normal data and sent out by the transmitter. Theoutput can be sent to a bit error rate tester (BERT) or to the receiver of another SLK2511B. If an error occurs inthe PRBS pattern, the PRBSPASS pin is set low for 2 RXCLKP/N cycles.
Upon application of minimum valid power, the SLK2511B generates a power-on reset. During the power-onreset the PRXDATA[0:3] signal pins goes to 3-state. RXCLKP and RXCLKN are held low. The length of thepower-on reset cycle is dependent upon the REFCLKP and REFCLKN frequency but is less than 1ms induration.
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ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
START-UP SEQUENCE
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
DD
Supply voltage –0.3 to 3 VTTL input terminals –0.3 to 4 VVoltage range LVDS terminals –0.3 to 3 VAny other terminal except aboven –0.3 to V
DD
+ 0.3 VP
D
Package power dissipation See Dissipation Rating TableT
stg
Storage temperature –65 to 150 °CElectrostatic discharge HBM: 2 kvT
A
Characterized free-air operating temperature range –40 to 85 °CLead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
A
≤25 °C DERATING FACTOR
(1)
T
A
= 85 °CPACKAGE
POWER RATING ABOVE T
A
= 25 °C POWER RATING
PZP
(2)
3.4 W 33.78 mW/ °C 1.3 WPZP
(3)
2.27 W 22.78 mW/ °C 0.911 W
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
).(2) 2 oz trace and copper pad with solder.(3) 2 oz trace and copper pad without solder.
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Supply voltage 2.375 2.5 2.625 VP
D
Power dissipation Frequency = 2.488 Gb/sec, PRBS pattern 900 1100 mWShutdown current Enable = 0, VDDA, VDD pins, VDD = max 20 µAT
A
Operating free-air temperature – 40 85 °C
To ensure proper start up, follow one of the following steps when powering up the SLK2511B.1. Keep ENABLE (pin 44) low until power supplies and reference clock have become stable.2. Drive ENABLE (pin 44) low for at least 30 ns after power supplies and reference clock have becomestable.
The following step is recommended with either of the above two sequences.3. Drive RESET low for at least 10 ns after link has become stable to center the TXFIFO.
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ELECTRICAL CHARACTERISTICS
0
50
100
150
200
250
40 42 44 46 48 50 52 54 56 58 60
InputDuty-Cycle-%
LVDSV -Input-mV
ID
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TTL
V
IH
High-level input voltage 2 3.6 VV
IL
Low-level input voltage 0.80 VI
IH
Input high current V
DD
= MAX, V
IN
= 2 V 40 µAI
IL
Input low current V
DD
= MAX, V
IN
=0.4 V –40 µAV
OH
High-level output voltage I
OH
= –1 mA 2.10 2.3 VV
OL
Low-level output voltage I
OH
= 1 mA 0.25 0.5 VC
I
Input capacitance 4 pF
LVDS INPUT SIGNALS
V
I
Input voltage 825 1575 mVAssumes 60% / 40% duty cycle 250Input differential threshold voltageV
ID(th)
mVSee Figure 5
Assumes 55% / 45% duty cycle 200t
r
/t
f
Input transition time 20% to 80% 375 psC
I
Input capacitance 3 pFR
I
Input differential impedance On-chip termination 80 100 120 Ωt
su
Input setup time requirement See Figure 8 300 pst
h
Input hold time requirement See Figure 8 300 psT
(duty)
Input clock duty cycle 40% 60%
LVDS OUTPUT SIGNALS
V
OD
Output differential voltage 300 800V
OS
Output common mode voltage 1070 1375R
L
= 100 ±1% mVV
OD
Change VOD between 1 and 0 25V
OS
Change VOS between 1 and 0 25I
(SP)
, I
(SN)
,
Output short circuit current Outputs shorted to ground or shorted together 24 mAI
(SPN)
I
off
Power-off current V
DD
= 0 V 10 µAt
(cq_min)
100Clock-output time See Figure 7 pst
(cq_max)
100t
r
/t
f
Output transition time 20% to 80% 100 300 psOutput clock duty cycle 45% 55%Data output to FRAME_SYNC delay 4 7 Bit times
(OC-48 = 622.08 MHz, Clock Rates With t
r
/t
f
≤500 ps)
Figure 5. LVDS Differential Input Voltage vs Input Duty Cycle
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TIMING REQUIREMENTS
SERIAL DIFFERENTIAL SWITCHING CHARACTERISTICS
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
REFERENCE CLOCK (REFCLK)
Frequency tolerance
(1)
–20 20 ppmDuty cycle 40% 50% 60%Jitter 12 kHz to 20 MHz 3 ps rms
PLL PERFORMANCE SPECIFICATIONS
PLL startup lock time V
DD
, V
DDC
= 2.3 V, after REFCLK is stable 1 msAcquisition lock time Valid SONET signal or PRBS OC-48 2031 Bit Times
SERIAL TRANSMITTER/RECEIVER CHARACTERISTICS
PRE1 = 0, PRE2 = 0, Rt = 50,
650 850 1000See Table 5 and Figure 1V
(ODD)
= |STXDOP-STXDON|, transmit
PRE1 = 1, PRE2 = 0 550 750 900differential output voltage under mVde-emphasis
PRE1 = 0, PRE2 = 1 540 700 860PRE1 = 1, PRE2 = 1 500 650 800V
(CMT)
Transmit common mode voltage range Rt = 50 Ω1100 1250 1400 mVReceiver Input voltage requirement, 150 mVV
ID
=|SRXDIP–SRXDIN|
V
(CMR)
Receiver common mode voltage range 1100 1250 2250 mVI
l
Receiver input leakage -550 550 µAR
l
Receiver differential impedance 80 100 120 ΩC
I
Receiver input capacitance 1 pFt
d(TX_Latency)
50
Bit Timest
d(RX_Latency)
50
(1) The ±20 ppm tolerance is required to meet SONET/SDH requirements. For non-SONET/SDH compliant systems, looser tolerances mayapply.
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
t
Differential signal rise time (20% to 80%) R
L
= 50 Ω80 100 140 pst
j
Output jitter Jitter-free data, 12 kHz to 20 MHz, RLOOP = 1 0.05 0.1 UI
(pp)
Jitter tolerance RLOOP = 1, See Figure 2Jitter transfer RLOOP = 1, See Figure 2
14
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DESIGNING WITH THE PowerPAD PACKAGE
SLK2511B
SLLS763B – JANUARY 2007 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)
The SLK2511B is housed in high-performance, thermally enhanced, 100-pin PZP PowerPAD packages. Use ofa PowerPAD package does not require any special considerations except to note that the PowerPAD, which isan exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Correct deviceoperation requires that the PowerPAD be soldered to the thermal land. Do not run any etches or signal viasunder the device, but have only a grounded thermal land, as explained below. Although the actual size of theexposed die pad may vary, the minimum size required for the keepout area for the 100-pin PZP PowerPADpackage is 12 mm ×12 mm.
A thermal land, which is an area of solder-tinned-copper, is required underneath the PowerPAD package. Thethermal land varies in size depending on the PowerPAD package being used, the PCB construction, and theamount of heat that needs to be removed. In addition, the thermal land may or may not contain numerousthermal vias, depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD™Thermally Enhanced Package Application Report, TI literature number SLMA002 , available via the TI Webpages beginning at URL http://www.ti.com .
Figure 12. Example of a Thermal Land
For the SLK2511B, this thermal land should be grounded to the low-impedance ground plane of the device. Thisimproves not only thermal performance but also the electrical grounding of the device. It is also recommendedthat the device ground terminal landing pads be connected directly to the grounded thermal land. The land sizeshould be as large as possible without shorting device signal terminals. The thermal land may be soldered to theexposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it isrecommended that the thermal land be connected to the low-impedance ground plane of the device. Moreinformation may be obtained from the TI application note PHY Layout, TI literature number SLLA020 .
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SLK2511BPZP ACTIVE HTQFP PZP 100 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
SLK2511BPZPG4 ACTIVE HTQFP PZP 100 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Mar-2007
Addendum-Page 1
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