Specification For E-paper display 1.54" Product VER:A0 Customer approval Customer Approval by Date of approval It will be agreed by the receiver,if not sign back the Specification within 15days. Page 1 of 32 2015-01-08 Version Content Date A/0 New release 2017/06/20 Page 2 of 32 Producer 2017-06-20 CONTENTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 General Description ............................................................................................................4 Features ................................................................................................................................4 Application ...........................................................................................................................4 Mechanical Specification.....................................................................................................4 Mechanical Drawing of EPD module.................................................................................5 Input/Output Terminals .......................................................................................................6 6.1 Pin out List ....................................................................................................................6 6.2 MCU Interface.......................................................................... ..........................8 6.2.4 MCU Serial Peripheral Interface (4-wire SPI)........................................8 6.2.5 MCU Serial Peripheral Interface (3-wire SPI).........................................9 6.3 External Temperature Sensor operation.............. ..................................10 Command Table..........................................................................................................11 Reference Circuit.......................................................................................................16 MAXIMUM RATINGS ..........................................................................................18 DC CHARACTERISTICS .................................................................................18 Serial Peripheral Interface Timing............................................................................19 Power Consumption...................................................................................................19 Typical Operating Sequence..............................................................................20 13.1 Normal Operation Flow.........................................................................20 13.2 Reference Program Code.......................................................................21 Optical characteristics...........................................................................................22 14.1 Specifications.........................................................................................22 14.2 Definition of contrast ratio.....................................................................23 14.3 Reflection Ratio.....................................................................................23 Handling, Safety, and Environment Requirements ........................................................24 Reliability test......................................................................................................26 Block Diagram.....................................................................................................27 PartA/PartBspecification....................................................................................27 Point and line standard ........................................................................................28 Barcode ...............................................................................................................30 Packing ..............................................................................................................31 Page 3 of 32 2017-06-20 1 General Description E-Paper 1.54" display is an Active Matrix Electrophoretic Display(AMEPD) , with interface and a reference system design. The 1.54'' active area contains 200x200pixels, and has 1-bit B/W full display capabilities. An ntegrated circuit contains gate buffer, source buffer, interface, timing control logic, oscillator, DC-DC. SRAM. LUT ,VCOM,and border are supplied with each panel. 2 Features z 200x200 pixels display z White reflectance above 35% z Contrast ratio 10:1 z Ultra wide viewing angle z Ultra low power consumption z Pure reflective mode z Bi-stable display Commercial temperature range z Landscape, portrait modes z Hard-coat antiglare display surface z Ultra Low current deep sleep mode z On chip display RAM z Low voltage detect for supply voltage z High voltage ready detect for driving voltage z Internal temperature sensor z Serial peripheral interface available z On-chip oscillator z On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage z I2C signal master interface to read external temperature sensor 3 Application Electronic Shelf Label System 4 Mechanical Specifications Parameter Screen Size Display Resolution Active Area Pixel Pitch Pixel Configuration Outline Dimension Weight Specifications 1.54 200(H)x200(V) 27.6x27.6 0.138x0.138 Square 31.8(H)x36.32 (V) x1.05(D) 2.1 0.2 Page 4 of 32 Unit Inch Pixel mm mm Remark dpi:183 mm g 2017-06-20 5 Mechanical Drawing of EPD module A2 confirmed Signature Date 3.500.2 9.60 Silicon-Glue Edge Sealing Total 1.050.1 SIDE VIEW 2.10 IC FPC 0.100.03 : DESCRIPTION PI stiffener T=0.2 MODEL NUMBER : E-Papaer Display 1.54" PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 PROJECTION Bending Area, soft process BOTTOM VIEW FPC+PI stiffener Total Tickness 0.30 0.03 DATE P/N CUSTOMER NO.: DATE SIGNAL NC GDR RESE VGL VGH TSCL TSDA BS1 BUSY RES# D/C# CS# D0 D1 VDDIO VCI VSS VDD VPP VSH PREVGH VSL PREVGL VCOM 2017-06-20 Page 5 of 32 TFT OD 31.800.1 13.40 TFT AA 27.600.1 1 24 0.150.03 0.500.03 11.500.05 12.500.2 : ALL UNITS: mm APP: CHK: 16.77 15.28 5.80 2.10 TFT AA 27.600.1 NOTES 1.DISPALY MODE 1.54" ARREY FOR EPD; 2.DRIVE IC: SSD1608; 3.RESOLUTION:200gate X 200source; 4.pixel pitch:0.138mm X 0.138mm; 5.Unspecified Tolerance:0.20; 6.Material conform to the ROHS standard TFT OD 36.320.1 6 Input/Output Terminals 6.1 Pin out List Pin # Single Description Remark 1 NC No connection and do not connect with other NC pins Keep Open 2 GDR N-Channel MOSFET Gate Drive Control 3 RESE Current Sense Input for the Control Loop 4 VGL Negative Gate driving voltage 5 VGH Positive Gate driving voltage 6 TSCL I2C Interface to digital temperature sensor Clock pin 7 TSDA I2C Interface to digital temperature sensor Date pin 8 BS1 Bus selection pin Note 6-5 9 BUSY Busy state output pin Note 6-4 10 RES # Reset Note 6-3 11 D/C # 12 CS # Chip Select input pin 13 D0 serial clock pin (SPI) 14 D1 serial data pin (SPI) 15 VDDIO Power for interface logic pins 16 VCI Power Supply pin for the chip 17 VSS Ground 18 VDD Core logic power pin 19 VPP Power Supply for OTP Programming 20 VSH Positive Source driving voltage 21 PREVGH Power Supply pin for VGH and VSH 22 VSL Negative Source driving voltage 23 PREVGL Power Supply pin for VCOM, VGL and VSL 24 VCOM VCOM driving voltage Data /Command control pin Note 6-2 Note 6-1 Note 6-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU Page 6 of 32 2017-06-20 communication:only when CS# is pulled LOW. Note 6-2: This pin (D/C#) is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH,the data will be interpreted as data. When the pin is pulled LOW, the data will be interpreted as command. Note 6-3: This pin (RES#) is reset signal input. The Reset is active low. Note 6-4: This pin (BUSY) is Busy state output pin. When Busy is high the operation of chip should not be interrupted and any commands should not be issued to the module. The driver IC will put Busy pin high when the driver IC is working such as: - Outputting display waveform; or - Communicating with digital temperature sensor Note 6-5: This pin (BS1) is for 3-line SPI or 4-line SPI selection. When it is "High", 3-line SPI (9 bits SPI) is selected. When it is "Low", 4-line SPI is selected. Please refer to below Table. Table: Bus interface selection BS1 MPU Interface L 4-lines serial peripheral interface (SPI) H 3-lines serial peripheral interface (SPI) - 9 bits SPI Page 7 of 32 2017-06-20 6.2 MCU Interface 6.2.1 MCU Serial Peripheral Interface (4-wire SPI) The 4-wire SPI consists of SCLK (serial clock), SDIN (serial data), D/C# and CS#. D0 acts as SCLK and D1 acts as SDIN. Table -1 : Control pins of 4-wire Serial Peripheral interface Function CS# pin D/C# pin SCLK pin Write command L L Write data L H Note: stands for rising edge of signal SDIN is shifted into an 8-bit shift register in the order of D7, D6, ... D0. The data byte in the shift register is written to the Graphic Display Data RAM (RAM) or command register in the same clock. Under serial mode, only write operations are allowed. Figure 6-1 : Write procedure in 4-wire Serial Peripheral Interface mode CS# D/C# SDIN/ SCLK DB1 DB2 DBn SCLK(D0) SDIN(D1) D7 D6 D5 D4 Page 8 of 32 D3 D2 D1 D0 2017-06-20 6.2.2 MCU Serial Peripheral Interface (3-wire SPI) The 3-wire serial interface consists of SCLK (serial clock), SDIN (serial data) and CS#. In SPI mode, D0 acts as SCLK and D1 acts as SDIN. The operation is similar to 4-wire serial interface while D/C# pin is not used. There are altogether 9-bits will be shifted into the shift register in sequence: D/C# bit, D7 to D0 bit. The D/C# bit (first bit of the sequential data) will determine the following data byte in the shift register is written to the Display Data RAM (D/C# bit = 1) or the command register (D/C# bit = 0). Under serial mode, only write operations are allowed. Table 6-2 : Control pins of 3-wire Serial Peripheral interface Function CS# pin D/C# pin SCLK pin Write command L Tie LOW Write data L Tie LOW Note: stands for rising edge of signal Figure 6-1 : Write procedure in 3-wire Serial Peripheral Interface mode CS# SDIN/ SCLK DB1 DB2 DBn SCLK SDIN(D1) D/C# D7 D6 D5 D4 Page 9 of 32 D3 D2 D1 D0 2017-06-20 6.3 External Temperature Sensor operation There are two ways to let the module get the ambient temperature, 1) use the external temperature sensor interface, The module provides two I/O lines [TSDA and TSCL] for connecting digital temperature sensor for temperature reading sensing. TSDA will be treated as SDA line and TSCL will be treated as SCL line. They are required connecting with the external pull-up resistors when they are used to connect to the temperature sensor,then the module will check the temperature automatically. 2) use any kinds of external temperature sensor to get the temperature value then converted to hex format,then use the spi interface send command 0x1A and the temperature value into the module.The temperature value how to converted to hex as the follow: 1. When the Temperature value MSByte bit D11 = 0, the temperature is positive and value (DegC) = + (Temperature value)/16 2. When the Temperature value MSByte bit D11 = 1, the temperature is negative and value (DegC) = ~ (2's complement of Temperature value)/16 12-bit binary (2's complement) Hexadecimal Value Decimal Value Value [DegC] 0111 1111 0000 7F0 2032 127 0111 1110 1110 7EE 2030 126.875 0111 1110 0010 7E2 2018 126.125 0111 1101 0000 7D0 2000 125 0001 1001 0000 190 400 25 0000 0000 0010 002 2 0.125 0000 0000 0000 000 0 0 1111 1111 1110 FFE -2 -0.125 1110 0111 0000 E70 -400 -25 1100 1001 0010 C92 -878 -54.875 1100 1001 0000 C90 -880 -55 Page 10 of 32 2017-06-20 7 Command Table R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command 0 0 01 0 0 0 0 0 0 0 1 Driver Output control 0 1 A7 A6 A5 A4 A3 A2 A1 A0 0 1 0 0 0 0 0 0 0 A8 0 1 0 0 0 0 0 B2 B1 B0 0 0 0 0 0 1 1 1 0C 0 0 0 1 10 0 0 0 1 11 Description Set the number of gate. Setting for 152 gates is: Set A[8:0] = 0C7h Set B[2:0] = 00h 0 1 1 1 0 A6 B6 C6 0 A5 B5 C5 0 A4 B4 C4 1 A3 B3 C3 1 A2 B2 C2 0 A1 B1 C1 0 Booster Soft start A0 Control B0 C0 Set A[7:0] = CFh[POR] 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 Deep Sleep mode A0 Deep Sleep mode Control 0 0 0 0 0 0 1 0 0 0 0 A2 0 A1 1 Data Entry mode setting Define data entry sequence A [1:0] = ID[1:0] A0 Address automatic increment / decrement setting The setting of incrementing or decrementing of the address counter can be made independently in each upper and lower bit of the address. Set B[7:0] = CEh[POR] Set C[7:0] = 8Dh[POR] A[0] : 0 1 Description Normal Mode [POR] Enter Deep Sleep Mode 00 -Y decrement, X decrement, 01 -Y decrement, X increment, 10 -Y increment, X decrement, 11 -Y increment, X increment [POR] A[2] = AM Set the direction in which the address counter is updated automatically after data are written to the RAM. AM= 0, the address counter is updated in the X direction. [POR] AM = 1, the address counter is updated in the Y direction. 0 0 12 0 0 0 1 0 0 1 0 SWRESET Page 11 of 32 It resets the commands and parameters to their S/W Reset default values except R10h-Deep Sleep Mode Note: RAM are unaffected by this command. 2017-06-20 R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description 0 0 1A 0 0 0 1 1 0 1 0 Temperature Sensor Write to temperature register. (Write to 0 1 A7 A6 A5 A4 A3 A2 A1 A0 Control temperature register) A[7:0] - MSByte 01111111[POR] 0 1 B7 B6 B5 B4 0 0 0 0 B[7:0] - LSByte 11110000[POR] 0 0 20 0 0 1 0 0 0 0 0 Master Activation Activate Display Update Sequence The Display Update Sequence Option is located at R22h 0 0 0 1 21 0 A7 0 0 1 0 0 A4 0 A3 0 A2 0 A1 User should not interrupt this operation to avoid corruption of panel images. 1 Display Update Control Option for Display Update Bypass Option used for Pattern A0 1 Display, which is used for display the RAM content into the Display OLD RAM Bypass option A [7] A[7] = 1: Enable bypass A[7] = 0: Disable bypass [POR] A[4] value will be used as for bypass. A[4] = 0 [POR] A[1:0] Initial Update Option - Source Control A[1:0] 01 [POR] Page 12 of 32 GSC GS0 2017-06-20 GSD GS1 R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command 0 0 22 0 0 1 0 0 0 1 0 Display Update 0 1 A7 A6 A5 A4 A3 A2 A1 A0 Control 2 Description Display Update Sequence Option: Enable the stage for Master Activation Parameter (in Hex) 0 0 24 0 0 1 0 0 1 0 0 Write RAM 0 0 0 1 2C 0 A7 0 A6 1 A5 0 A4 1 A3 0 A2 1 A1 1 Write VCOM register A0 Page 13 of 32 Enable Clock Signal, Then Enable CP Then Load Temperature value FF Then Load LUT [POR] Then INIITIAL DISPLAY Then PATTERN DISPLAY Then Disable CP Then Disable OSC To Enable Clock Signal 80 (CLKEN=1) To Enable Clock Signal, then Enable CP C0 (CLKEN=1, CPEN=1) To INITIAL DISPLAY + 0C PATTEN DISPLAY To INITIAL DISPLAY 08 To DISPLAY PATTEN 04 To Disable CP, then Disable Clock Signal 03 (CLKEN=1, CPEN=1) To Disable Clock Signal 01 (CLKEN=1) Remark: CLKEN=1: If CLS=VDDIO then Enable OSC If CLS=VSS then Enable External Clock CLKEN=0: If CLS=VDDIO then Disable OSC AND INTERNAL CLOCK Signal = VSS, After this command, data entries will be written into the RAM until another command is written. Address pointers will advance accordingly. Write VCOM register from MCU interface 2017-06-20 R/W# D/C# Hex 0 0 32 0 1 0 1 0 1 ... ... 0 1 0 1 0 0 3A 0 1 0 0 0 1 0 0 0 1 3B 3C D7 D6 D5 D4 D3 D2 D1 D0 Command 0 0 1 1 0 0 1 0 Write LUT register LUT [30 bytes] Description Write LUT register from MCU [240 bits], (excluding the VSH/VSL and Dummy bit) 0 0 0 A6 1 A5 1 A4 1 A3 0 A2 1 A1 0 0 1 1 1 0 1 0 Set dummy line period Set A[7:0] = 1Bh A0 Set B[3:0] = Bh 1 Set Gate line width 0 0 0 0 A3 A2 A1 A0 0 A7 0 A6 1 A5 1 A4 1 0 1 0 0 A1 0 Border Waveform A0 Control Select border waveform for VBD A [7] Follow Source at Initial Update Display A [7]=0: [POR] A [7]=1: Follow Source at Initial Update Display for VBD, A [6:0] setting are being overridden at Initial Display STAGE. A [6] Select GS Transition/ Fix Level for VBD A [6]=0: Select GS Transition A[3:0] for VBD A [6]=1: Select FIX level Setting A[5:4] for VBD [POR] A [5:4] Fix Level Setting for VBD A[5:4] VBD level 00 VSS 01 VSH 10 VSL 11[POR] HiZ A [1:0] GS transition setting for VBD (Select waveform like data A[3:2] to data A[1:0]) A[1:0] GSA GSB 01 [POR] GS0 GS1 Page 14 of 32 2017-06-20 R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command 0 0 44 0 1 0 0 0 1 0 0 Set RAM X - address 0 1 0 0 0 A4 A3 A2 A1 A0 Start / End position 0 1 0 0 0 B4 B3 B2 B1 B0 Description Specify the start/end positions of the window address in the X direction by an address unit A[4:0] = 00h B[4:0] = 18h 0 0 0 0 0 0 1 1 1 1 45 0 A7 0 B7 0 1 A6 0 B6 0 0 A5 0 B5 0 0 A4 0 B4 0 0 A3 0 B3 0 1 A2 0 B2 0 0 A1 0 B1 0 1 Set Ram Y- address A0 Start / End position A8 B0 B8 Specify the start/end positions of the window address in the Y direction by an address unit A[8:0] = 0C7h B[8:0] = 0000h 0 0 0 1 4E 0 0 1 0 0 0 0 A4 1 A3 1 A2 1 A1 0 Set RAM X address A0 counter 0 0 0 0 0 1 1 1 4F 0 A7 0 1 1 A6 0 1 0 A5 0 1 0 A4 0 1 1 A3 0 1 1 A2 0 1 1 A1 0 1 1 Set RAM Y address A0 counter A8 1 NOP FF Page 15 of 32 Make initial settings for the RAM X address in the address counter (AC) A[4:0] = 00h Make initial settings for the RAM Y address in the address counter (AC) A[8:0] = 0C7h This command is an empty command; it does not have any effect on the display module. However it can be used to terminate Frame Memory Write or Read Commands. 2017-06-20 8 Reference Circuit Figure . 8-1 Page 16 of 32 2017-06-20 Figure . 8-2 Page 17 of 32 2017-06-20 9 MAXIMUM RATINGS Table 9-1: Maximum Ratings Rating Symbol Parameter Unit VCI Logic supply voltage -0.5 to +4.0 V TOPR Operation temperature range 0~50 C TSTG Storage temperature range -25~60 C 10 DC CHARACTERISTICS The following specifications apply for: VSS=0V, VCI=3.3V, TOPR=25. Table 10-1: DC Characteristics Symbol Parameter Test Condition Applicable pin Min. Typ. Max. Unit 2.4 3.3 3.7 V - V VCI VCI operation voltage - VCI VIH High level input voltage - 0.8VDDIO - VIL Low level input voltage - D1 (SDIN), D0 (SCLK), CS#, D/C#, RES#, BS1, - - VOH High level output voltage IOH = -100uA BUSY, TSDA, TSCL 0.9VDDIO - VOL Low level output voltage - - Iupdate Module operating current - - 4 - mA - - 0.6 1 uA Isleep Deep sleep mode IOL = 100uA VCI=3.3V 0.2VDDI V O - 0.1VDDI V O - The Typical power consumption is measured using associated 25 waveform with following pattern transition: from horizontal scan pattern to vertical scan pattern. (Note 10-1) - The listed electrical/optical characteristics are only guaranteed under the controller & waveform provided by XingTai. - Vcom value will be provided by XingTai. Note 10-1 The Typical power consumption Page 18 of 32 V 2017-06-20 11 Serial Peripheral Interface Timing The following specifications apply for: VSS=0V, VCI=2.4V to 3.7V, TOPR=25 Symbol Parameter Min Clock Cycle Time tcycle 250 Typ - Max - Unit ns tAS Address Setup Time 150 - - ns tAH 150 - - ns tCSS Address Hold Time Chip Select Setup Time 120 - - ns tCSH Chip Select Hold Time 60 - - ns tDSW Write Data Setup Time 50 - - ns tDHW Write Data Hold Time 15 - - ns tCLKL Clock Low Time 100 - - ns tCLKH Clock High Time 100 - - ns tR Rise Time [20% ~ 80%] - - 15 ns tF Fall Time [20% ~ 80%] - - 15 ns D/C# t AS t AH t CSS CS# t CSH t cycle t CLKL t CLKH SCLK(D 0 ) tF tR t DS SDIN(D 1 ) t DHW Valid Data CS# SCLK(D0) SDIN(D1) 12 D7 D D5 D4 D3 D2 D1 D Power Consumption Parameter Panel power consumption during update Deep sleep mode Symbol Conditions TYP Max Unit Remark - 25 23 - mAs - - 25 0.6 - uA - Page 19 of 32 2017-06-20 13 13.1 Typical Operating Sequence Normal Operation Flow Power On (Apply VCI) Reset the EPD driver IC Define the display size and the RAM address Turn on oscillator clock and DC/DC & regulator to generate the driving voltage Read temperature from external temperature sensor, then, load a waveform from OTP to LUT. Clear the EPD Load image data and Display the image on EPD Turn off oscillator clock and DC/DC & regulator Enter into deep sleep mode Power down Page 20 of 32 2017-06-20 13.2 Reference Program Code VCOM Setting SPI(0x2c,value) Note1 Power On (Apply VCI) Waveform Setting SPI(0x32,30 byte data) Init all the pin D/C#,CS#,D0,D1, RES# to high level, BS1 High 3-wire spi communication mode Note2 Set RAMX address counter SPI(0x4e,0x00) Set RAMY address counter SPI(0x4f,0xc7,0x00) BS1 Low 4-wire spi communication mode Image data download SPI(0x24, 5000byte data) Panel Reset RES# =LOW 10ms RES#=HIGH 10ms Display update sequence setting: Use Waveform from Ram, SPI(0x22, 0xc7) Gate Number and scan order setting SPI(0x01,0xc7,0x00) Image update SPI(0x20) Busy High Busy Low Enter Deepsleep SPI(0x10,0x01) Scan frequence setting (50hz) SPI(0x3A,0x1b) SPI(0x3b,0x0b) Dara entry sequence setting (Y+,X-) SPI(0x11,0x01) Set RAMX Start/end position SPI(0x44,0x00,0X18) Set RAMY Start/end position SPI(0x45,0xc7,0x00,0x00,0x00) The Vcom for different batches EPD is different.XingTai will provide different vcom value for different batches of EPD. Note2: The waveform for different batches EPD is different. XingTai will provide different waveform for different batchs of EPD. Note1: Page 21 of 32 2017-06-20 14 Optical characteristics 14.1 Specifications Measurements are made with that the illumination is under an angle of 45 degrees, the detection is perpendicular unless otherwise specified. T=25 SYMBOL PARAMETER CONDITIO NS MIN TYPE MAX UNIT Note R Reflectance White 30 35 - % Note 14-1 Gn 2Grey Level - - DS+(WS-DS)xn(m-1) - L* - CR Contrast Ratio indoor - 10 - - - Panel's life - 050 5years or 1000000 times - - Note 14-2 WS: White state, DS : Dark state m: 2 Note 14-1: Luminance meter : Eye - One Pro Spectrophotometer Note 14-2: We guarantee display quality from 1030 generally,If operation ambient temperature from 050will add external temperature sensor. Page 22 of 32 2017-06-20 14.2 Definition of contrast ratio The contrast ratio (CR) is the ratio between the reflectance in a full white area (R1) and the reflectance in a dark area (Rd)() : R1: white reflectance Rd: dark reflectance CR = R1/Rd 14.3 Reflection Ratio The reflection ratio is expressed as : R = Reflectance Factor white board x (L center / L white board ) L center is the luminance measured at center in a white area (R=G =B=1) . L white board is the luminance of a standard white board . Both are measured with equivalent illumination source . The viewing angle shall be no more than 2 degrees . Page 23 of 32 2017-06-20 15 HANDLINGSAFETY AND ENVIROMENTAL REQUIREMENTS WARNING The display glass may break when it is dropped or bumped on a hard surface. Handle with care. Should the display break, do not touch the electrophoretic material. In case of contact with electrophoretic material, wash with water and soap. CAUTION The display module should not be exposed to harmful gases, such as acid and alkali gases, which corrode electronic components. Disassembling the display module can cause permanent damage and invalidate the warranty agreements. IPA solvent can only be applied on active area and the back of a glass. For the rest part, it is not allowed. Observe general precautions that are common to handling delicate electronic components. The glass can break and front surfaces can easily be damaged . Moreover the display is sensitive to static electricity and other rough environmental conditions. Mounting Precautions (1) Its recommended that you consider the mounting structure so that uneven force (ex. Twisted stress) is not applied to the module. (2) Its recommended that you attach a transparent protective plate to the surface in order to protect the EPD. Transparent protective plate should have sufficient strength in order to resist external force. (3) You should adopt radiation structure to satisfy the temperature specification. (4) Acetic acid type and chlorine type materials for the cover case are not desirable because the former generates corrosive gas of attacking the PS at high temperature and the latter causes circuit break by electro-chemical reaction. (5) Do not touch, push or rub the exposed PS with glass, tweezers or anything harder than HB pencil lead. And please do not rub with dust clothes with chemical treatment. Do not touch the surface of PS for bare hand or greasy cloth. (Some cosmetics deteriorate the PS) (6) When the surface becomes dusty, please wipe gently with absorbent cotton or other soft materials like chamois soaks with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach the PS. Do not use acetone, toluene and alcohol because they cause chemical damage to the PS. (7) Wipe off saliva or water drops as soon as possible. Their long time contact with PS causes deformations and color fading. Product specification The data sheet contains final product specifications. Page 24 of 32 2017-06-20 Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and dose not form part of the specification. Product Environmental certification ROHS REMARK All The specifications listed in this document are guaranteed for module only. Post-assembled operation or component(s) may impact module performance or cause unexpected effect or damage and therefore listed specifications is not warranted after any Post-assembled operation. Page 25 of 32 2017-06-20 16. Reliability test TEST CONDITION METHOD 1 High-Temperature Operation T=50RH=30%RHFor 240Hr IEC 60 068-2-2Bb 2 Low-Temperature Operation T = 0 for 240 hrs IEC 60 068-2-2Ab High-Temperature Storage T=70 RH=40%RH For 240Hr IEC 60 068-2-2Bb 3 REMARK Test in white pattern 4 5 6 7 Low-Temperature Storage High Temperature, HighHumidity Operation High Temperature, HighHumidity Storage Temperature Cycle T = -25 for 240 hrs Test in white pattern T=40RH=90%RHFor 168Hr T=60RH=80%RHFor 480Hr Package Vibration 9 Package Drop Impact 10 11 UV exposure -25(30min)~70(30min) 50 Cycle Duration:1hours in each direction Drop from height of 122 cm on Concrete surface Drop sequence:1 corner, 3edges, 6face One drop for each. discharge IEC 60 068-2-3CA IEC 60 068-2-14NB Full packed for shipment Full packed for shipment 765 W/ for 168hrs,40 IEC 60068-2-5 Sa Machine model: +/-250V,0,200pF IEC61000-4-2 Resistance Electrostatic IEC 60 068-2-3CA Test in white pattern Test in white pattern 1.04G,Frequency : 10~500Hz Direction : X,Y,Z 8 IEC 60 068-2-2Ab Actual EMC level to be measured on customer application. Note1: The protective film must be removed before temperature test. Note2Stay white pattern for storage and non-operation test. Page 26 of 32 2017-06-20 17 Block Diagram 18 PartA/PartB specification BORDER TFT AA Part A TFT AA BORDER Part B is fulfilled area Page 27 of 32 2017-06-20 19 Point and line standard Shipment Inspection Standard EquipmentElectrical test fixture, Point gauge Outline dimension 36.32(H) x 31.8(V)x1.05(D) Unit Part-A Active area Part-B Border area Temperature Humidity Illuminance Distance Time Angle 1925 55%5%RH 800 1300Lux 300 35Sec Environment Defet type Spot Inspection method Electric Display Standard Part-A Part-B D0.25 Ignore Ignore 0.25 D0.4 N4 Ignore D0.4 Not Allow Ignore Display unwork Electric Display Not Allow Not Allow Ignore Display error Electric Display Not Allow Not Allow Ignore L2 W0.2 Ignore Ignore 2.0mmL5.0mm0.2W 0.3mm, N2 Ignore L5 W0.3 Not Allow Ignore D0.2mm Ignore Ignore 0.2mmD0.35mmN4 N4 Ignore D0.35 mm Not Allow Ignore Scratch or line defect(include dirt) PS Bubble Visual/Film card Visual/Film card X5mmY0.5mm, Do not affect the electrode circuit , Ignore Side Fragment Remark Visual/Film card 1.Cannot be defect & failure cause by appearance defect 2.Cannot be larger size cause by appearance defect L=long W=wide D=point size Page 28 of 32 N=Defects NO 2017-06-20 L=long W=wide D=point size Page 29 of 32 2017-06-20 20.Barcode AAAAAAA B CCCC DD EEE FFF GGG HH III AAAAAAA B CCCC DD EEE FFF GGG HH III AAAAAAA----Module of EPD B---- Normal Lot CCCC----Date of production DD----Production lot EEE---- FPL FFF----TFT GGG----PS HH----Edge sealing Adhesive III----NO. 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