Specification For E-paper display 1.54"
Product VER:A0
Page 1 of 32 2015-01-08
Customer approval
Customer
Approval by
Date of approval
It will be agreed by the receiver,if not sign back the Specification within 15days.
Page 2 of 32 2017-06-20
Version Content Date Producer
A/0 New release 2017/06/20
Page 3 of 32 2017-06-20
CONTENTS
1 General Description ............................................................................................................4
2 Features ................................................................................................................................4
3 Application ...........................................................................................................................4
4 Mechanical Specification.....................................................................................................4
5 Mechanical Drawing of EPD module.................................................................................5
6 Input/Output Terminals .......................................................................................................6
6.1 Pin out List ....................................................................................................................6
6.2 MCU Interface.......................................................................... ..........................8
6.2.4 MCU Serial Peripheral Interface (4-wire SPI)........................................8
6.2.5 MCU Serial Peripheral Interface (3-wire SPI).........................................9
6.3 External Temperature Sensor operation.............. ………………….............10
7 Command Table..........................................................................................................11
8 Reference Circuit.......................................................................................................16
9 MAXIMUM RATINGS ..........................................................................................18
10 DC CHARACTERISTICS .................................................................................18
11 Serial Peripheral Interface Timing............................................................................19
12 Power Consumption...................................................................................................19
13 Typical Operating Sequence..............................................................................20
13.1 Normal Operation Flow.........................................................................20
13.2 Reference Program Code.......................................................................21
14 Optical
characteristics...........................................................................................22
14.1 Specifications.........................................................................................22
14.2 Definition of contrast ratio.....................................................................23
14.3 Reflection Ratio.....................................................................................23
15 Handling, Safety, and Environment Requirements ........................................................24
16 Reliability test......................................................................................................26
17 Block Diagram.....................................................................................................27
18 PartA/PartBspecification....................................................................................27
19 Point and line standard ........................................................................................28
20 Barcode ...............................................................................................................30
21 Packing ..............................................................................................................31
Page 4 of 32 2017-06-20
1
General Description
E-Paper 1.54" display is an Active Matrix Electrophoretic Display(AMEPD) , with interface and a
reference system design. The 1.54'' active area contains 200×200pixels, and has 1-bit B/W full display
capabilities. An ntegrated circuit contains gate buffer, source buffer, interface, timing control logic,
oscillator, DC-DC. SRAM. LUT ,VCOM,and border are supplied with each panel.
2 Features
z 200×200 pixels display
z White reflectance above 35%
z Contrast ratio 10:1
z Ultra wide viewing angle
z Ultra low power consumption
z Pure reflective mode
z Bi-stable display Commercial temperature range
z Landscape, portrait modes
z Hard-coat antiglare display surface
z Ultra Low current deep sleep mode
z On chip display RAM
z Low voltage detect for supply voltage
z High voltage ready detect for driving voltage
z Internal temperature sensor
z Serial peripheral interface available
z On-chip oscillator
z On-chip booster and regulator control for generating VCOM, Gate and Source driving voltage
z I2C signal master interface to read external temperature sensor
3 Application
Electronic Shelf Label System
4 Mechanical Specifications
Parameter Specifications Unit Remark
Screen Size 1.54 Inch
Display Resolution 200(H)×200(V) Pixel dpi:183
Active Area 27.6×27.6 mm
Pixel Pitch 0.138×0.138 mm
Pixel Configuration Square
Outline Dimension 31.8(H)×36.32 (V) ×1.05(D) mm
Weight 2.1 ±0.2 g
Page 5 of 32 2017-06-20
5 Mechanical Drawing of EPD module
B OTTO M VIEWSIDE VIEW
DATE ALL U NIT S : m m
:
CHK:
APP: PROJECTION
MOD EL N UMBER :
CU S TO M ER NO.:
To tal 1 .05±0.1
FPC 0. 10±0.03
5.80
16.77
IC
P/N
0.15±0.03
0.50±0.03
11.50±0.05
12.50±0.2
3.50±0.2
124
NOTES：
1.DISPALY MODE 1.54" ARREY FOR EPD;
2.DRIVE IC: SSD1608;
3.RESOLUTION:200gate X 200source;
4.pixel pitch:0.138mm X 0.138mm;
5.Unspecified Tolerance:±0.20;
6.Material conform to the ROHS standard
VCOM
PREVGL
VSL
PREVGH
VSH
VPP
VDD
VSS
VCI
VDDIO
D1
D0
CS#
D/C#
RES#
BUSY
BS1
TSDA
PIN SIGNAL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
NC
GDR
RESE
VGL
VGH
TSCL
9.60
13.40
15.28
TFT AA 27.60±0.1
TFT AA 27.60±0.1
TF T OD 3 6.32±0 .1
TF T OD 31.80±0.1
2.10
2.10
DESCRIPTION:DATE
Silicon-Glue
Edge Sealing
FPC+PI
stiffener
Total Tickness
0.30± 0. 03
Bending Area,
soft process
PI
stiffener T=0.2
Date
Signature
A2 confirmed
E-Papaer Display 1.54"
Page 6 of 32 2017-06-20
6 Input/Output Terminals
6.1 Pin out List
Pin # Single Description Remark
1 NC No connection and do not connect with other NC pins Keep Open
2 GDR N-Channel MOSFET Gate Drive Control
3 RESE Current Sense Input for the Control Loop
4 VGL Negative Gate driving voltage
5 VGH Positive Gate driving voltage
6 TSCL I2C Interface to digital temperature sensor Clock pin
7 TSDA I2C Interface to digital temperature sensor Date pin
8 BS1 Bus selection pin Note 6-5
9 BUSY Busy state output pin Note 6-4
10 RES # Reset Note 6-3
11 D/C # Data /Command control pin Note 6-2
12 CS # Chip Select input pin Note 6-1
13 D0 serial clock pin (SPI)
14 D1 serial data pin (SPI)
15 VDDIO Power for interface logic pins
16 VCI Power Supply pin for the chip
17 VSS Ground
18 VDD Core logic power pin
19 VPP Power Supply for OTP Programming
20 VSH Positive Source driving voltage
21 PREVGH Power Supply pin for VGH and VSH
22 VSL Negative Source driving voltage
23 PREVGL Power Supply pin for VCOM, VGL and VSL
24 VCOM VCOM driving voltage
Note 6-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU
Page 7 of 32 2017-06-20
communication:only when CS# is pulled LOW.
Note 6-2: This pin (D/C#) is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH,the
data will be interpreted as data. When the pin is pulled LOW, the data will be interpreted as command.
Note 6-3: This pin (RES#) is reset signal input. The Reset is active low.
Note 6-4: This pin (BUSY) is Busy state output pin. When Busy is high the operation of chip should not be
interrupted and any commands should not be issued to the module. The driver IC will put Busy pin high when the
driver IC is working such as:
- Outputting display waveform; or
- Communicating with digital temperature sensor
Note 6-5: This pin (BS1) is for 3-line SPI or 4-line SPI selection. When it is “Low”, 4-line SPI is selected.
When it is “High”, 3-line SPI (9 bits SPI) is selected. Please refer to below Table.
Table: Bus interfac e sele ctio n
BS1 MPU Interface
L 4-lines serial peripheral interface (SPI)
H 3-lines serial peripheral interface (SPI) - 9 bits SPI
Page 8 of 32 2017-06-20
6.2 MCU Interface
6.2.1 MCU Serial Peripheral Interface (4-wire SPI)
The 4-wire SPI consists of SCLK (serial clock), SDIN (serial data), D/C# and CS#. D0 acts as SCLK and D1 acts as
SDIN.
Table -1 : Control pins of 4-wire Serial Peripheral interface
Function CS# pin D/C# pin SCLK pin
Write command L L ↑
Write data L H ↑
Note: ↑ stands for rising edge of signal
SDIN is shifted into an 8-bit shift register in the order of D7, D6, ... D0. The data byte in the shift register is written to
the Graphic Display Data RAM (RAM) or command register in the same clock. Under serial mode, only write
operations are allowed.
Figure 6-1 : Write procedure in 4-wire Serial Peripheral Interface mode
D7 D6 D5 D4 D3 D2 D1 D0
SCLK(D0)
SDIN(D1)
DB1 DB2 DBn
CS#
D/C#
SDIN/
SCL
K
Page 9 of 32 2017-06-20
6.2.2 MCU Serial Peripheral Interface (3-wire SPI)
The 3-wire serial interface consists of SCLK (serial clock), SDIN (serial data) and CS#. In SPI mode, D0 acts as
SCLK and D1 acts as SDIN. The operation is similar to 4-wire serial interface while D/C# pin is not used. There are
altogether 9-bits will be shifted into the shift register in sequence: D/C# bit, D7 to D0 bit. The D/C# bit (first bit of the
sequential data) will determine the following data byte in the shift register is written to the Display Data RAM (D/C#
bit = 1) or the command register (D/C# bit = 0). Under serial mode, only write operations are allowed.
Table 6-2 : Control pins of 3-wire Serial Peripheral interface
Function CS# pin D/C# pin SCLK pin
Write command L Tie LOW ↑
Write data L Tie LOW ↑
Note: ↑ stands for rising edge of signal
Figure 6-1 : Write procedure in 3-wire Serial Peripheral Interface mode
D7
D6 D5 D4 D3
D2
D1 D0
SCLK
SDIN(D1)
DB1 DB2 DBn
CS#
D/C#
SDIN/
SCL
K
Page 10 of 32 2017-06-20
6.3 External Temperature Sensor operation
There are two ways to let the module get the ambient temperature,
1) use the external temperature sensor interface, The module provides two I/O lines [TSDA and TSCL] for
connecting digital temperature sensor for temperature reading sensing. TSDA will be treated as SDA line and
TSCL will be treated as SCL line. They are required connecting with the external pull-up resistors when they
are used to connect to the temperature sensor,then the module will check the temperature automatically.
2) use any kinds of external temperature sensor to get the temperature value then converted to hex format,then use the
spi interface send command 0x1A and the temperature value into the module.The temperature value how to
converted to hex as the follow:
1. When the Temperature value MSByte bit D11 = 0, the temperature is positive and value (DegC) = +
(Temperature value)/16
2. When the Temperature value MSByte bit D11 = 1, the temperature is negative and value (DegC) = ~ (2’s
complement of Temperature value)/16
12-bit binary
(2's complement) Hexadecimal
Value Decimal
Value Value
[DegC]
0111 1111 0000 7F0 2032 127
0111 1110 1110 7EE 2030 126.875
0111 1110 0010 7E2 2018 126.125
0111 1101 0000 7D0 2000 125
0001 1001 0000 190 400 25
0000 0000 0010 002 2 0.125
0000 0000 0000 000 0 0
1111 1111 1110 FFE -2 -0.125
1110 0111 0000 E70 -400 -25
1100 1001 0010 C92 -878 -54.875
1100 1001 0000 C90 -880 -55
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7 Command Table
R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 0 01 0 0 0 0 0 0 0 1 Driver Output control
Set the number of gate. Setting for
152 gates is:
Set A[8:0] = 0C7h
Set B[2:0] = 00h
0 1 A7 A6 A5 A4 A3 A2 A1 A0
0 1 0 0 0 0 0 0 0 A8
0 1 0 0 0 0 0 B2 B1 B0
0 0 0C 0 0 0 0 1 1 0 0 Booster Soft start
Control
Set A[7:0] = CFh[POR]
Set B[7:0] = CEh[POR]
Set C[7:0] = 8Dh[POR]
0 1 1 A6 A
5A4 A
3 A
2A1A0
0 1 1 B6 B
5B4 B
3 B
2B1B0
0 1 1 C6 C
5C4 C
3 C
2C1C0
0 0 10 0 0 0 1 0 0 0 0 Deep Sleep mode Deep Sleep mode Control
A[0] : Description
0 Normal Mode [POR]
1 Enter Deep Sleep Mode
0 1 0 0 0 0 0 0 0 A0
0 0 11 0 0 0 1 0 0 0 1 Data Entry mode setting Define data entry sequence
A [1:0] = ID[1:0]
Address automatic increment /
decrement setting
The setting of incrementing or
decrementing of the address counter
can be made independently in each
upper and lower bit of the address.
00 –Y decrement, X decrement,
01 –Y decrement, X increment,
10 –Y increment, X decrement,
11 –Y increment, X increment [POR]
A[2] = AM
Set the direction in which the address
counter is updated automatically after
data are written to the RAM.
AM= 0, the address counter is updated
in the X direction. [POR]
AM = 1, the address counter is updated
in the Y direction.
0 1 0 0 0 0 0 A2A1A0
0 0 12 0 0 0 1 0 0 1 0 SWRESET It resets the commands and parameters
to their S/W Reset default values
except R10h-Deep Sleep Mode
Note: RAM are unaffected by this
command.
Page 12 of 32 2017-06-20
R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 0 1A 0 0 0 1 1 0 1 0 Temperature Sensor
Control (Write to
temperature register)
Write to temperature register.
A[7:0] – MSByte 01111111[POR]
B[7:0] – LSByte 11110000[POR]
0 1 A7 A
6 A
5A4 A
3 A
2A1A0
0 1 B7 B
6 B
5B4 0 0 0 0
0 0 20 0 0 1 0 0 0 0 0 Master Activation Activate Display Update Sequence
The Display Update Sequence Option
is located at R22h
User should not interrupt this operation
to avoid corruption of panel images.
0 0 21 0 0 1 0 0 0 0 1 Display Update Control
1
Option for Display Update
Bypass Option used for Pattern
Display, which is used for display the
RAM content into the Display
OLD RAM Bypass option
A [7]
A[7] = 1: Enable bypass
A[7] = 0: Disable bypass [POR]
A[4] value will be used as for bypass.
A[4] = 0 [POR]
A[1:0] Initial Update Option - Source
Control
A[1:0] GSC GSD
01 [POR] GS0 GS1
0 1 A7 0 0 A4 A
3 A
2A1A0
Page 13 of 32 2017-06-20
R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 0 22 0 0 1 0 0 0 1 0 Display Update
Control 2
Display Update Sequence Option:
Enable the stage for Master Activation
Paramete
r
(in Hex)
Enable Clock Signal,
Then Enable CP
Then Load Temperature
value
Then Load LUT
Then INIITIAL DISPLAY
Then PATTERN DISPLAY
Then Disable CP
Then Disable OSC
FF
[POR]
To Enable Clock Signal
(CLKEN=1) 80
To Enable Clock Signal,
then Enable CP
(CLKEN=1, CPEN=1)
C0
To INITIAL DISPLAY +
PATTEN DISPLAY 0C
To INITIAL DISPLAY 08
To DISPLAY PATTEN 04
To Disable CP,
then Disable Clock Signal
(CLKEN=1, CPEN=1)
03
To Disable Clock Signal
(CLKEN=1) 01
Remark:
CLKEN=1:
If CLS=VDDIO then Enable OSC
If CLS=VSS then Enable External
Clock
CLKEN=0:
If CLS=VDDIO then Disable OSC
AND
INTERNAL CLOCK Signal = VSS,
0 1 A7 A
6 A
5A4 A
3 A
2A1A0
0 0 24 0 0 1 0 0 1 0 0 Write RAM After this command, data entries will
be written into the RAM until another
command is written. Address pointers
will advance accordingly.
0 0 2C 0 0 1 0 1 0 1 1 Write VCOM register Write VCOM register from MCU
interface
0 1 A7 A
6 A
5A4 A
3 A
2A1A0
Page 14 of 32 2017-06-20
R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 0 32 0 0 1 1 0 0 1 0 Write LUT register Write LUT register from MCU [240
bits],
(excluding the VSH/VSL and Dummy
bit)
0
0
0
…
0
0
1
1
1
…
1
1
LUT
[30 bytes]
0 0 3A 0 0 1 1 1 0 1 0 Set dummy line period Set A[7:0] = 1Bh
0 1 0 A6 A
5A4 A
3 A
2A1A0
0 0 3B 0 0 1 1 1 0 1 1 Set Gate line width Set B[3:0] = Bh
0 1 0 0 0 0 A3 A
2A1A0
0 0 3C 0 0 1 1 1 1 0 0 Border Waveform
Control
Select border waveform for VBD
A [7] Follow Source at Initial Update
Display
A [7]=0: [POR]
A [7]=1: Follow Source at Initial
Update Display for VBD, A [6:0]
setting are being overridden at Initial
Display STAGE.
A [6] Select GS Transition/ Fix Level
for VBD
A [6]=0: Select GS Transition A[3:0]
for VBD
A [6]=1: Select FIX level Setting
A[5:4] for VBD [POR]
A [5:4] Fix Level Setting for VBD
A[5:4] VBD level
00 VSS
01 VSH
10 VSL
11[POR] HiZ
A [1:0] GS transition setting for VBD
(Select waveform like data A[3:2] to
data A[1:0])
A[1:0] GSA GSB
01 [POR] GS0 GS1
0 1 A7 A
6 A
5A4 0 0 A1A0
Page 15 of 32 2017-06-20
R/W# D/C# Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 0 44 0 1 0 0 0 1 0 0 Set RAM X - address
Start / End position
Specify the start/end positions of the
window address in the X direction by
an
address unit
A[4:0] = 00h
B[4:0] = 18h
0 1 0 0 0 A4 A
3 A
2 A
1A0
0 1 0 0 0 B4 B
3 B
2 B
1B0
0 0 45 0 1 0 0 0 1 0 1 Set Ram Y- address
Start / End position
Specify the start/end positions of the
window address in the Y direction by
an
address unit
A[8:0] = 0C7h
B[8:0] = 0000h
0 1 A7 A
6 A
5A4 A
3 A
2 A
1A0
0 1 0 0 0 0 0 0 0 A8
0 1 B7 B
6 B
5B4 B
3 B
2 B
1B0
0 1 0 0 0 0 0 0 0 B8
0 0 4E 0 1 0 0 1 1 1 0 Set RAM X address
counter
Make initial settings for the RAM X
address in the address counter (AC)
A[4:0] = 00h
0 1 0 0 0 A4 A
3 A
2 A
1A0
0 0 4F 0 1 0 0 1 1 1 1 Set RAM Y address
counter
Make initial settings for the RAM Y
address in the address counter (AC)
A[8:0] = 0C7h
0 1 A7 A
6 A
5A4 A
3 A
2 A
1A0
0 1 0 0 0 0 0 0 0 A8
0 1 FF 1 1 1 1 1 1 1 1 NOP This command is an empty command;
it does not have any effect on the
display module.
However it can be used to terminate
Frame Memory Write or Read
Commands.
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8 Reference Circuit
Figure . 8-1
Page 17 of 32 2017-06-20
Figure . 8-2
Page 18 of 32 2017-06-20
9 MAXIMUM RATINGS
Table 9-1: Maximum Ratings
Symbol Parameter Rating Unit
VCI Logic supply voltage -0.5 to +4.0 V
TOPR Operation temperature range 0~50 °C
TSTG Storage temperature range -25~60 °C
10 DC CHARACTERISTICS
The following specifications apply for: VSS=0V, VCI=3.3V, TOPR=25℃.
Table 10-1: DC Characteristics
Symbol Parameter Test Condition Applicable pin Min. Typ. Max. Unit
VCI VCI operation voltage - VCI 2.4 3.3 3.7 V
VIH High level input voltage - D1 (SDIN), D0 (SCLK),
CS#, D/C#, RES#, BS1,
0.8VDDIO - - V
VIL Low level input voltage - - - 0.2VDDI
O
V
VOH High level output voltage IOH = -100uA BUSY, TSDA, TSCL 0.9VDDIO - - V
VOL Low level output voltage IOL = 100uA - - 0.1VDDI
O
V
Iupdate Module operating current - - - 4 - mA
Isleep Deep sleep mode VCI=3.3V - - 0.6 1 uA
- The Typical power consumption is measured using associated 25℃ waveform with following
pattern transition: from horizontal scan pattern to vertical scan pattern. (Note 10-1)
- The listed electrical/optical characteristics are only guaranteed under the controller &
waveform provided by XingTai.
- Vcom value will be provided by XingTai.
Note 10-1
The Typical power consumption
Page 19 of 32 2017-06-20
11 Serial Peripheral Interface Timing
The following specifications apply for: VSS=0V, VCI=2.4V to 3.7V, TOPR=25℃
Symbol Parameter Min Typ Max Unit
tcycle Clock Cycle Time 250 - - ns
tAS Address Setup Time 150 - - ns
tAH Address Hold Time 150 - - ns
tCSS Chip Select Setup Time 120 - - ns
tCSH Chip Select Hold Time 60 - - ns
tDSW Write Data Setup Time 50 - - ns
tDHW Write Data Hold Time 15 - - ns
tCLKL Clock Low Time 100 - - ns
tCLKH Clock High Time 100 - - ns
tR Rise Time [20% ~ 80%] - - 15 ns
tF Fall Time [20% ~ 80%] - - 15 ns
12 Power Consumption
Parameter Symbol Conditions TYP Max Unit Remark
Panel power consumption during update - 25℃ 23 - mAs -
Deep sleep mode - 25℃ 0.6 - uA -
tAH
tAS
D/C#
Valid Data
tDHW
t
CLKL
tDS
tCLKH
tcycle
t
CSS tCSH
tF t
R
SDIN(D 1 )
CS#
SCLK(D 0 )
D7
SDIN(D1)
CS#
SCLK(D0)
DD5 D4 D3 D2 D1 D
Page 20 of 32 2017-06-20
13 Typical Operating Sequence
13.1 Normal Operation Flow
Power On
(
A
pp
l
y
VCI
)
Reset the EPD driver IC
Define the display size and
the RAM address
Read temperature from external
temperature sensor, then, load a
waveform from OTP to LUT.
Clear the EPD
Load image data and Display
the image on EPD
Power down Enter into deep
sleep mode
Turn on oscillator clock and
DC/DC & regulator to
generate the driving voltage
Turn off oscillator clock and
DC/DC & regulator
Page 21 of 32 2017-06-20
13.2 Reference Program Code
Note1: The Vcom for different batches EPD is
different.XingTai will provide different
vcom value for different batches of EPD.
Note2: The waveform for different batches EPD
is different. XingTai will provide
different waveform for different
batchs of EPD.
Init all the pin
D/C#,CS#,D0,D1,
RES# to high level,
BS1 High BS1 Low
3-wire spi communication
mode
4-wire spi communication
mode
Panel Reset
RES# =LOW 10ms
RES#=HIGH 10ms
Gate Number and scan
order setting
SPI(0x01,0xc7,0x00)
Scan frequence setting (50hz)
SPI(0x3A,0x1b)
SPI(0x3b,0x0b)
Dara entry sequence setting (Y+,X-)
SPI
(
0x11,0x01
)
Set RAMX Start/end position
SPI(0x44,0x00,0X18)
Set RAMY Start/end position
SPI
(
0x45
,
0xc7
,
0x00
,
0x00
,
0x00
)
Waveform Setting
SPI
(
0x32,30 b
y
te data
)
Note2
Set RAMX address counter
SPI(0x4e,0x00)
Set RAMY address counter
SPI
(
0x4f
,
0xc7
,
0x00
)
Image data download
SPI
(
0x24, 5000
by
te data
)
Display update sequence setting:
Use Waveform from Ram,
SPI(0x22, 0xc7)
Image update
SPI
(
0x20
)
Busy Low
Busy High
Enter Deepsleep
SPI
(
0x10,0x01
)
Power On
(
A
pp
l
y
VCI
)
VCOM Setting
SPI
(
0x2c,value
)
Note1
Page 22 of 32 2017-06-20
14 Optical characteristics
14.1 Specifications
Measurements are made with that the illumination is under an angle of 45 degrees, the detection is
perpendicular unless otherwise specified.
T=25℃
SYMBOL PARAMETER CONDITIO
NS MIN TYPE MAX UNIT Note
R Reflectance White 30 35 - % Note 14-1
Gn 2Grey Level - - DS+(WS-DS)×n(m-1) - L* -
CR Contrast Ratio indoor - 10 - - -
Panel’s life - 0℃～50℃ 5years or 1000000 times - - Note 14-2
WS: White state, DS : Dark state
m: 2
Note 14-1: Luminance meter : Eye - One Pro Spectrophotometer
Note 14-2: We guarantee display quality from 10℃～30℃ generally,If operation ambient temperature from
0℃～50℃，will add external temperature sensor.
Page 23 of 32 2017-06-20
14.2 Definition of contrast ratio
The contrast ratio (CR) is the ratio between the reflectance in a full white area (R1) and the reflectance in a dark
area (Rd)() :
R1: white reflectance Rd: dark reflectance
CR = R1/Rd
14.3 Reflection Ratio
The reflection ratio is expressed as :
R = Reflectance Factor white board x (L center / L white board )
L center is the luminance measured at center in a white area (R=G =B=1) . L white board is the luminance of a
standard white board . Both are measured with equivalent illumination source . The viewing angle shall be no more
than 2 degrees .
Page 24 of 32 2017-06-20
15 HANDLING，SAFETY AND ENVIROMENT AL REQUIREMENTS
WARNING
The display glass may break when it is dropped or bumped on a hard surface. Handle with care. Should the display
break, do not touch the electrophoretic material. In case of contact with electrophoretic material, wash with water and
soap.
CAUTION
The display module should not be exposed to harmful gases, such as acid and alkali gases, which corrode electronic
components.
Disassembling the display module can cause permanent damage and invalidate the warranty agreements.
IPA solvent can only be applied on active area and the back of a glass. For the rest part, it is not allowed.
Observe general precautions that are common to handling delicate electronic components. The glass can break and
front surfaces can easily be damaged . Moreover the display is sensitive to static electricity and
other rough environmental conditions.
Mounting Precautions
(1) It`s recommended that you consider the mounting structure so that uneven force (ex. Twisted stress) is not applied to
the module.
(2) It`s recommended that you attach a transparent protective plate to the surface in order to protect the EPD.
Transparent protective plate should have sufficient strength in order to resist external force.
(3) You should adopt radiation structure to satisfy the temperature specification.
(4) Acetic acid type and chlorine type materials for the cover case are not desirable because the former generates
corrosive gas of attacking the PS at high temperature and the latter causes circuit break by electro-chemical reaction.
(5) Do not touch, push or rub the exposed PS with glass, tweezers or anything harder than HB pencil lead. And please do
not rub with dust clothes with chemical treatment. Do not touch the surface of PS for bare hand or greasy cloth. (Some
cosmetics deteriorate the PS)
(6) When the surface becomes dusty, please wipe gently with absorbent cotton or other soft materials like chamois soaks
with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach the PS. Do not use
acetone, toluene and alcohol because they cause chemical damage to the PS.
(7) Wipe off saliva or water drops as soon as possible. Their long time contact with PS causes deformations and color
fading.
Product specification The data sheet contains final product specifications.
Page 25 of 32 2017-06-20
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more
of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device
at these or any other conditions above those given in the Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may affect device reliability.
Applica tion inf orma tion
Where application information is given, it is advisory and dose not form part of the specification.
Product Envir o nmental certification
ROHS
REMARK
All The specifications listed in this document are guaranteed for module only. Post-assembled operation or
component(s) may impact module performance or cause unexpected effect or damage and therefore listed specifications
is not warranted after any Post-assembled operation.
Page 26 of 32 2017-06-20
16. Reliability test
TEST CONDITION METHOD REMARK
1 High-Temperature Operation T=50℃，RH=30%RH，For
240Hr IEC 60 068-2-2Bb
2 Low-Temperature Operation T = 0℃ for 240 hrs IEC 60 068-2-2Ab
3 High-Temperature Storage
T=70 RH=40%RH ℃For
240Hr
Test in white pattern
IEC 60 068-2-2Bb
4 Low-Temperature Storage
T = -25℃ for 240 hrs
Test in white pattern
IEC 60 068-2-2Ab
5 High Temperature, High-
Humidity Operation
℃， ，
T=40 RH=90%RH For
168Hr IEC 60 068-2-3CA
6 High Temperature, High-
Humidity Storage
℃， ，
T=60 RH=80%RH For
480Hr
Test in white pattern
IEC 60 068-2-3CA
7 Temperature Cycle
-25 (30min)~70 (30min)℃℃
，50 Cycle
Test in white pattern
IEC 60 068-2-14NB
8 Package Vibration
1.04G,Frequency : 10~500Hz
Direction : X,Y,Z
Duration:1hours in each
direction
Full packed for
shipment
9 Package Drop Impact
Drop from height of 122 cm on
Concrete surface
Drop sequence:1 corner,
3edges,
6face
One drop for each.
Full packed for
shipment
10
UV exposure
Resistance
㎡℃
765 W/ for 168hrs,40 IEC 60068-2-5 Sa
11
Electrostatic
discharge
Machine model:
+/-250V,0Ω,200pF IEC61000-4-2
Actual EMC level to be measured on customer application.
Note1: The protective film must be removed before temperature test.
：
Note2 Stay white pattern for storage and non-operation test.
Page 27 of 32 2017-06-20
17 Block Diagram
18 PartA/PartB specification
TFT AA
TFT AA
BORDER
BORDER
Part A
Part B is fulfilled area
Page 28 of 32 2017-06-20
19 Point and line standard
Shipment Inspection Standard
Equipment：Electrical test fixture, Point gauge
Outline dimension 36.32(H) ×
31.8(V)×1.05(D) Unit：㎜ Part-A Active area Part-B Border area
Environment
Temperature Humidity Illuminance Distance Time Angle
19℃～25℃ 55%±5%RH 800～
1300Lux 300 ㎜ 35Sec
Defet type Inspection
method
Standard Part-A Part-B
Spot Electric Display
D≤0.25 ㎜Ignore Ignore
0.25 ㎜＜D≤0.4 ㎜N≤4 Ignore
D＞0.4 ㎜Not Allow Ignore
Display unwork Electric Display Not Allow Not Allow Ignore
Display error Electric Display Not Allow Not Allow Ignore
Scratch or line
defect(include dirt) Visual/Film card
L≤2㎜，W≤0.2 ㎜Ignore Ignore
2.0mm＜L≤5.0mm，0.2＜W
≤0.3mm, N≤2 Ignore
L＞5㎜，W＞0.3 ㎜Not Allow Ignore
PS Bubble Visual/Film card
D≤0.2mm Ignore Ignore
0.2mm≤D≤0.35mm﹠N≤4N≤4 Ignore
D＞0.35 mm Not Allow Ignore
Side Fragment Visual/Film card
X≤5mm，Y≤0.5mm, Do not affect the electrode circuit
, Ignore
Remark
1.Cannot be defect & failure cause by appearance defect；
2.Cannot be larger size cause by appearance defect；
L=long W=wide D=point size N=Defects NO
Page 29 of 32 2017-06-20
L=long W=wide D=point size
Page 30 of 32 2017-06-20
20.Bar code
AAAAAAA B CCCC DD
EEE FFF GGG HH III
AAAAAAA B CCCC DD EEE FFF GGG HH III
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨
① AAAAAAA——Module of EPD
② B—— Normal Lot
③CCCC——Date of production
④ DD——Production lot
⑤ EEE—— FPL
⑥ FFF——TFT
⑦ GGG——PS
⑧ HH——Edge sealing Adhesive
⑨ III——NO.
