AS1113BSSU - AMS - Datasheet.Directory

AS1113

50mA, 16-Channel LED Driver with Diagnostics

Data Sheet

www.austriamicrosystems.com Revision 1.02 1 - 24

1 General Description

The AS1113 is designed to drive up to 16 LEDs through

a fast serial interface and features 16 outp ut constant

current drivers and an on-chip diagnostic read-back

function.

The high clock-frequency (up to 50MHz), adjustable out-

put current, and flexible serial interface makes th e

device perfectly suited for hi gh -vo l ume transmission

applications.

Output current is adjustable (up to 50mA/channel) using

an external resistor (REXT).

The serial interface with Schmitt trigger inputs includes

an integrated shift register. Additionally, an internal data

The device features integrated diagnostics for over-

temperature, open-LED, and shorted-LED conditions.

Integrated registers store glob al fault status information

during load as well as the detailed te mperature/open-

LED/shorted-LED diagnostics results.

The AS1113 also features a low-current diagnostic

mode to minimize display flicker during fault testing.

The AS1113 is available in a 24-pin SSOP and the 28-

pin QFN (5x5mm) package.

If a higher output current is needed, please see the

AS1110 with 100mA drive capability.

Figure 1. Main Diagram and Pin Assi gnments

2 Key Features

! 16 Constant-Current Output Channels

! Excellent Output Current Accuracy

- Between Channels: <±3%

- Between Devices: <±6%

! Output Current Per Channel: 0.5 to 50mA

! Controlled In-Rush Curren t

! Over-Temperature, Open-LED, Shorted-LED

Diagnostic Functions

! Low-Current Test Mode

! Global Fault Monitoring

! Low Shutdown Mode Current: 10µA

! Fast Serial Interface: 50MHz

! Cascaded Configuration

! Extremely Fast Output Drivers Suitable for PWM

! 24-pin SSOP and 28-pin QFN (5x5mm) Package

3 Applications

The device is ideal for fixed- or slow-rolling displays

using static or multiplexed LED matrix and dimming

functions, large LED matrix displays, mixed LED display

and switch monitoring, displays in elevators, public

transports (underground, trains, buses, taxis, airplanes,

etc.), large displays in stadiums and public areas, price

indicators in retail stores, promotional panels, bar-graph

displays, industrial controller displays, white good pan-

els, emergency light indicators, and traffic signs.

AS1113

SDI SDO

CLK LD OEN REXT

+VLED

OUTN3

OUTN4

OUTN5

OUTN6

OUTN7

OUTN8

OUTN9

OUTN10

GND VDD

OUTN0

OUTN1

OUTN2

OUTN11

OUTN12

OUTN13

OUTN14

OUTN15

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AS1113

Data Sheet

Contents

1 General Description ................................................................................................................................ 1

2 Key Features .......................................................................................................................................... 1

3 Applications ............................................................................................................................................ 1

4 Pinout ..................................................................................................................................................... 3

Pin Assignments ..................... ... ................. ................. ............................... ................ ............................................ 3

Pin Descriptions ...................................... ................. ................. ................. ................ ............................................ 3

5 Absolute Maximum Ratings .................................................................................................................... 4

6 Electrical Characteristics ........................................................................................................................ 5

Switching Characteristics ....................................................................................................................................... 6

7 Typical Operating Characteristics ........................................................................................................... 7

8 Detailed Description ............................................................................................................................... 8

Serial Interface ....................................................................................................................................................... 9

Timing Diagrams .................................................................................................................................................... 9

Error-Detection Mode ........................................................................................................................................... 11

Global Error Mode ................................................................................................................................................ 11

Error Detection Functions ..................................................................................................................................... 12

Open-LED Detection ..... .. ................. ............................... ................. ................. ................ ............................ 12

Shorted-LED ................................................................................................................................................. 12

Overtemperature ........................................................................................................................................... 12

Detailed Error Reports .......................................................................................................................................... 13

Detailed Temperature Warning Report .......... ... ... ......................................................................................... 13

Detailed Open-LED Error Report .................................................................................................................. 14

Detailed Shorted-LED Error Report .... ... ... ................ ................. ... ................. ... ................ ............................ 15

Low-Current Diagnostic Mode ....................................................................................................................... 15

Shutdown Mode .................................................................................................................................................... 16

9 Application Information ......................................................................................................................... 17

Error Detection ..................................................................................................................................................... 17

Error Detection On-The-Fly ........................................................................................................................... 17

Error Detection with Low-Current Diagnosis Mode ....................................................................................... 17

Cascading Devices ............................................................................................................................................... 18

Constant Current .................................................................................................................................................. 19

Adjusting Output Current ...................................................................................................................................... 19

Package Power Dissipation .................................................................................................................................. 19

Delayed Outputs ..................... ... ................. ................. ............................... ................ .......................................... 19

Switching-Noise Reduction ........................ ... ................. ................ ... ................. ... ................. .............................. 19

Load Supply Voltage ............................................................................................................................................. 19

10 Package Drawings and Markings ....................................................................................................... 21

11 Ordering Information ........................................................................................................................... 23

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AS1113

Data Sheet - P i n o ut

4 Pinout

Pin Assignments

Figure 2. Pin Assignments (Top View)

Pin Descriptions

Table 1. Pin Descriptions

Pin Number Pin Name Description

SSOP QFN

1 24:27 GND Ground

228 SDI

Serial Data Input

31 CLK

Serial Data Clock. The rising edge of the CLK signal is used to clock data

into and out of the AS1 113 shift register . In error mode, the rising edge of the

CLK signal is used to switch error modes.

42 LD

Serial Data Load

5:20 3:10

12:19 OUTN0:15 Output Current Drivers. These pins are used as LED drivers or for input

sense for diagnostic modes. Data is transferred to the data register at the

rising edge of these pins.

21 20 OEN

Output Enable. The active-low pin OEN signal can always enable output

drivers to sink current independent of the AS1113 mode.

0 = Output drivers are enabled.

1 = Output drivers are disabled.

22 21 SDO

Serial Data Output. In normal mode SDO is latched out 8.5 clock cycles

after SDI is latched in.

In global error detection mode this pin indicates the occurre nce of a global

error.

0 = Global error mode returned an error.

1 = No errors.

23 22 REXT External Resistor Connection. This pin connects through the external

resistor (REXT) to GND, to setup the load current.

24 23 VDD Positive Supply Voltage

-11 N/C

Not connected

GND

AS1113

24-pin SSOP

VDD

SDI

CLK

OUTN0

REXT

SDO

OEN

OUTN12

OUTN3

OUTN2

OUTN1

OUTN15

OUTN14

OUTN13

OUTN4

OUTN8

OUTN7

OUTN6

OUTN5

OUTN11

OUTN10

OUTN9

SDO

OUTN7

OUTN5

OUTN13

CLK 1

OUTN0 3

OUTN4 7

AS1113

28-pin QFN 5x5

OUTN2 5

OUTN8

OUTN10

OUTN11

OUTN15

OEN

OUTN14

OUTN12

LD 2

OUTN1 4

OUTN3 6

OUTN9

N/C

OUTN6

GND

SDI

2628

GND

REXT

VDD

GND

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AS1113

Data Sheet - A b s o lu t e M a xi m u m R a ti n g s

5 Absolute Maximum Ratings

Stresses beyond those li st ed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any othe r conditions beyond those indicated in Section 6 Electrical

Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter Min Max Units Comments

VDD to GND 0 7 V

Input Voltage -0.4 VDD

+0.4 V

Output Voltage -0.4 15 V

GND Pin Current 1000 mA

Thermal Resistance ΘJA 88 ºC/W on PCB, 24-pin SSOP package

23 ºC/W on PCB, 28-pin QFN (5x5mm) package

Ambient Temperature -40 +85 ºC

Storage Temperature -55 150 ºC

Humidity 5 86 % Non-condensing

Electrostatic

Discharge Digital Outputs 2000 VNorm: MIL 833 E method 3015

All Other Pins 2000

Latch-Up Immunity -100 -

(INOM x 0.5) +100 +

INOM mA EIA/JESD78

Package Body Temperature +260 ºC

The reflow peak soldering temperatur e (bo d y

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

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AS1113

Data Sheet - E l e ct r i c a l C h a r a c t er i s t i c s

6 Electrical Characteristics

VDD = +3.0 to +5.5V, TAMB = -40 to +85ºC (unless otherwise specified).

Table 3. Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

VDD Supply Voltage 3.0 5.5 V

VDS Output Voltage OUTN0:15 0 15.0 V

IOUT

Output Current

OUTN0:15 0.5 50

IOH SDO -1.0

IOL SDO 1.0

VIH Input Voltage High Level CLK, OEN, LD, SDI

0.7 x

VDD VDD +

0.3 V

VIL Low Level -0.3 0.3 x

VDD

IDS(OFF) Output Leakage Current OEN = 1, VDS = 15.0V 0.5 µA

VOL Output

Voltage SDO IOL = +1.0mA 0.4 V

VOH IOH = -1.0mA VDD -

0.4V

IAV(LC1) Device-to-Device Average Output

Current from OUTN0 to OUTN15 VDS = 0.5V, VDD = Const.,

REXT = 744Ω25.25 mA

ΔIAV(LC1) Current Skew

(Between Channels) VDS ≥ 0.5V, VDD = Const.,

REXT = 744Ω ±1.5 ±3 %

IAV(LC2) Device-to-Device Average Output

Current from OUTN0 to OUTN15 VDS = 0.6V, VDD > 3.3V,

REXT = 372Ω50.5 mA

ΔIAV(LC2) Current Skew

(Between Channels) VDS ≥ 0.6V, VDD = Const.,

REXT = 372Ω ±1.5 ±3 %

ILC Low-Current Diagnosis Mode VDS = 0.8V, VDD = 5.0V 0.4 0.6 0.8 mA

IPD Power Down Supply Current VDS = 0.8V, VDD = 5.0V,

REXT = 372Ω, OUTN0:15 = On 10 20 µA

%/ΔVDS Output Current vs.

Output Voltage Regulation VDS within 1.0 and 3.0V ±0.1 %/V

%/ΔVDD Output Current vs.

Supply Voltage Regulation VDD within 3.0 and 5.0V ±1 %/V

RIN(UP) Pullup Resistance OEN 250 500 800 kΩ

RIN(DOWN) Pulldown Resistance LD 250 500 800 kΩ

VTHL Error Detection Threshold Vol tage 0.25 0.3 0.45 V

VTHH Error Detection Threshold Voltage VDD = 3.0V 1.2 1.3 1.4 V

VDD = 5.0V 2.0 2.2 2.4

TOV1 Overtemperature Threshold Flag 150 ºC

IDD(OFF)0

Supply

Current

Off

REXT = Open‚ OUTN0:15 = Off 2.7 6

IDD(OFF)1 REXT = 744Ω‚ OUTN0:15 = Off 4.3 8

IDD(OFF)2 REXT = 372Ω‚ OUTN0:15 = Off 5.4 9

IDD(ON)1 On REXT = 744Ω‚ OUTN0:15 = On 6.2 11

IDD(ON)2 REXT = 372Ω‚ OUTN0:15 = On 10.5 15

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AS1113

Data Sheet - E l e ct r i c a l C h a r a c t er i s t i c s

Switching Characteristics

VDD = 3.0 to 5.5V, VDS = 0.8V, VIH = VDD, VIL = GND, REXT = 372Ω, VLOAD = 4.0V, RLOAD = 64Ω, CLOAD = 10pF; guar-

anteed by design.

* If multiple AS1113 devices are cascaded and tr or tf is large, it may be critical to achieve the timing required for data

transfer between two cascaded LED drivers.

Table 4. Switching Characteristics for VDD = 5V

Symbol Parameter Conditions Min Typ Max Unit

tP1 Propagation Delay Time (Without

Staggered Output Delay)

CLK - SDO 5 10 nstP2 LD - OUTNn 100 200

tP3 OEN - OUTNn 100 200

tP4 Propagation Delay Time 10 ns

tW(CLK) Pulse Width CLK 15 nstW(L) LD 15

tW(OE) OEN (@IOUT < 60mA) 200

tR *CLK Rise Time 500 ns

tF *CLK Fall Time 500 ns

tOR Output Rise Time of VOUT (Turn Off) 100 200 ns

tOF Output Fall Time of VOUT (Turn On) 100 300 ns

tSU(D) Setup Time for SDI 5 ns

tH(D) Hold Time for SDI 5 ns

tSU(L) Setup Time for LD 5 ns

tH(L) Hold Time for LD 5 ns

tTESTING OEN Time for Error Detection 2000 ns

tSTAG Staggered Output Delay 20 40 ns

tSU(OE) Output Enable Setup Time 20 ns

tGSW(ERROR) Global Error Switching Setup Time 10 ns

tSU(ERROR) Global Error Detection Setup Time 10 ns

tP(I/O) Prop agation Delay Global Error Flag 5 ns

tSW(ERROR) Switching Time Global Error Flag 10 ns

fCLK Maximum Clock Frequency

(Cascade Operation) 30 50 MHz

tP3,ON Low-Current Test Mode

Propagation Delay Time Turn ON 3 5 µs

tP3,OFF Turn OFF 0.05 0.1 µs

tREXT2,1 External Resistor Reaction Time Change from REXT1 = 372Ω,

IOUT1 = 50.52mA to REXT2 =

37.2kΩ, IOUT2 < 1mA 0.5 1 µs

tREXT2,1 External Resistor Reaction Time Change from REXT1 = 37.2kΩ,

IOUT1 = 0.5mA to REXT2 =

372Ω, IOUT2 > 25mA 0.5 1 µs

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AS1113

Data Sheet - Ty p i ca l O p e r at i n g C ha r a c t e r is t i c s

7 Typical Operating Characteristics

Figure 3. Output Current vs. REXT, Figure 4. Relative Output Current Error vs. VDD,

VDD = 5V; VDS = 0.8V, TAMB = 25°C Iout/Iout@VDD=5V - 1, TAMB = 25°C

Figure 5. Output Current vs. VDS; Figure 6. Output Current vs. VDS;

VDD = 5V, TAMB = 25°C VDD = 5V, TAMB = 25°C

-2

-1.5

-1

-0.5

0.5

1.5

33.544.555.5

VDD (V)

Relat iv e Out put Cur r ent Er ror ( %)

100

100 1000 10000

REXT ( )

IOUT (mA) .

REXT = 744Ω;

VDS = 0.5V

REXT = 372Ω;

VDS = 0.6V

0 0.2 0.4 0.6 0.8 1 1.2

VDS (V)

IOUT (mA) .

03691215

VDS (V)

IOUT (mA) .

REXT = 470Ω

REXT = 627Ω

REXT = 376Ω

REXT = 940Ω

REXT = 470Ω

REXT = 627Ω

REXT = 376Ω

REXT = 940Ω

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

8 Detailed Description

The AS1113 is designed to drive up to 16 LEDs through a fast serial interface and 16 constant-current output drivers.

Furthermore, the AS1113 provides diagnostics for detecting open- or shorted-LEDs, as well as over-temperature con-

ditions for LED display systems, especially LED traffic sign applications.

The AS1113 contains an 16-bit shift register and an 16-bit data register, which convert serial input data into parallel out-

put format. At AS1113 output stages, sixteen regulated current sinks are designed to provide uniform and constant cur-

rent with excellent matching between ports for driving LEDs within a wide range of forward voltage variations. External

output current is adjustable from 0.5 to 50mA using an external resistor for flexibility in controlling the brightness inten-

sity of LEDs. The AS1113 gua rantees to endure 15V maximum at the outputs.

The serial interface is capable of operating at a minimum of 30 MHz, satisfying the requireme nts of high-volume da ta

transmission.

Using a multiplexed input/output technique, the AS11 13 adds additional functionality to pins SDO, LD and OEN. These

pins provide highly useful functions (open- and shorted-LED detection, over-temperature detection), thus reducing pin

count. Over-temperature detection will work on-the-run, whereas the open- and shorted-LED detection can be used

on-the-run or in low-current di agnostic mode (see page 15).

Figure 7. Block Diagram

AS1113

REXT

OEN

CLK

SDI

Current

Generators

Detailed

Error

Detection

16-Bit Data

16-Bit Shift

Temperature

Detection 16-Bit Open

Detection &

Error Register

16-Bit Short

Detection &

Error Register

Global

Error

Detection

SDO

Indicates 16 Bit Path

Control Logic

+VLED

OUTN0

OUTN1

OUTN2

OUTN3

OUTN4

OUTN5

OUTN6

OUTN7

OUTN8

OUTN9

OUTN10

OUTN11

OUTN12

OUTN13

OUTN14

OUTN15

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Serial Interface

Data accesses are made serially via pins SDI and SDO. At each CLK rising edge, th e signal present at pin SDI is

shifted into the first bit of the internal shift register and the other bits are shifted ahead of the first bit. The MSB is the

first bit to be clocked in. In error-detection mode the shift register will latch-in the corresponding erro r data of tempera-

ture-, open-, and short-error register with each falling edge of LD.

The 16-bit data register will latch the data of the shift register at each rising edge of LD. This data is then used to drive

the current generator output drivers to switch on the corresponding LEDs as OEN goes low.

Timing Diagrams

This section contains timing diagrams referenced in other sections of this data sheet.

Figure 8. Normal Mode Timing Diagram

Figure 9. Output Delay Timing Diagram

OEN

OUTNx

SDO

SDI

CLK

tSU(L) tH(L)

tW(L)

tW(CLK)

tP1

tH(D)

50% 50% 50%

50% 50%

50%

tSU(D)

OEN Low = Output Enabled

tP2

OUTNx High = Output Off

OUTNx Low = Output On

50%

50% 50%

tW(OE)

14XtSTAG

tP3

OEN

OUTN0

OUTN1

OUTN15

50% 50%

50%50%

tOF tOR

tSTAG

90% 90%

10% 10%

14XtSTAG

tSTAG

tP3

50% 50%

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Figure 10. Data Input Timing Diagram

Figure 11. Data Input Example Timing Diagram

SDI0

CLK

OEN

SDO0

16 CLK Pulses

tSU(OE)

tW(L)

tSU(L)

tW(OE)

tH(D)

tP1

Data Bit

15 Data Bit

14 Data Bit

13 Data Bit

12 Data Bit

n Data Bit

2Data Bit

1Data Bit

Old Data

Bit 15 Old Data

Bit 14 Old Data

Bit 13 Old Data

Bit 12 Old Data

Bit n Old Data

Bit 2 Old Data

Bit 1 Old Data

Bit 0

Don’t Care

tSU(D)

D6D7 D5 D4 D2 D1 D0

D3D14D1 D13 D12 D10 D9 D8

D11

SDI

OEN

OUTN0

OUTN1

OUTN7

OUTN2

OUTN3

OUTN4

OUTN5

OUTN6

1234567

Time

CLK

OUTN8

OUTN9

OUTN15

OUTN10

OUTN11

OUTN12

OUTN13

OUTN14

Off

8910 11 12 13 14 15

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Figure 12. Switching Global Error Mode Timing Diagram

Error-Detection Mode

Acquisition of the error status occurs at the rising edge of OEN. Error-detection mode is started on the rising edge of

LD when OEN is high. The CLK signal must be low when entering error detection mode. Error detection for open- and

shorted-LEDs can only be performed for LEDs that are switched on during test time. To switch between error-detection

modes clock pulses are needed (see Table 5).

Note: To test all LEDs, a test pattern that turns on all LEDs must be input to the AS1113.

Global Error Mode

Global error mode is entered when error-detection mode is star ted. Clock pulses during this period are used to select

between temperature, open-LED, and shorted-LED tests, as well as low-current diagnostic mode and shutdown mode

(see Tab le 5). In global error mode, an error flag (TFLAG, OFLAG, SFLAG) is delivered to pin SDO if any errors are

encountered.

Note: For a valid result SDI must be 1 for the first device.

Table 5. Global Error Mode Selections

Clock

Pulses Output Port Error-Detection Mode Global Error Flag/Shutdown Condition

0 Don't Care Over-Temperature

Detection TFLAG = SDO = 1: No over-temperature warning.

TFLAG = SDO = 0: Over-temperature warning.

1 Enabled Open-LED Detection OFLAG = SDO = 1: No open-LED error.

OFLAG = SDO = 0: Open-LED error.

2 Enabled Shorted-LED Detection SFLAG = SDO = 1: No shorted-LED error.

SFLAG = SDO = 0: Shorted-LED error.

3 Don't Care Low-Current Diagnostic

Mode

4 Don't Care Shutdown Mode SDI = 1: Wakeup

SDI = 0: Shutdown

tTESTING

tSU(ERROR)

OFLAG(IN) SFLAG(IN)TFLAG(IN)

TFLAG OFLAG SFLAG

tSW(ERROR)

SDI

OEN

CLK

SDO Don’t

Care Don’t

Care

tGSW(ERROR)

tP(I/O)

tP4

tP(I/O) tP(I/O)

tSW(ERROR)

tGSW(ERROR)

Don’t

Care

Acquisition of

Error Status

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

If there are multiple AS1113s in a chain, the error flag will be gated through all devices. To get a valid result at the end

of the chain, a logic 1 must be applied to the SDI input of the first device of the chain. If one device produces an error

this error will show up after n*tP(I/O) + tSW(ERROR) at pin SDO of the last device in the chain. This means it is not possi-

ble to identify which device in the chain produced the error. Therefore, if a global error occurs, the detailed error report

can be run to identify which AS1113, or LED produced the error.

Note: When no error has occurred, the detailed error report can be skipped, setting LD and sub se quently OEN low.

Error Detection Functions

Open-LED Detection

The AS1113 open-LED detection is based on the comparison between VDS and VTHL. The open LED status is aquired

at the rising edge of OEN and stored internally. While detecting open-LEDs the outp ut port must be turned on. Open

LED detection can be started with 1 clock pulse during error detection mode while the output port is turned on.

Note: LEDs which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error

report.

Shorted-LED

The AS1113 shorted-LED detection is based on the comparison between VDS and VTHH. The shortened LED status is

aquired at the rising edge of OEN and stored internally. While detecting shorted-LEDs the output port must be turned

on. Shorted-LED detection can be started with 2 clock pulses during error detection mode while the output port is

turned on.

For valid results, the voltage at OUTN0:OUTN15 must be lower then VTHH under low-current diagnostic mode operat-

ing conditions. This can be achieved by reducing the VLED voltage or by adding additional diod es, resistors or LE D’s.

Note: LEDs which are turned off at test time cannot be tested and will be shown as a logic 1 in the detailed error

report.

Overtemperature

Thermal protection for the AS1113 is provided by continuously monitoring the device’s core temperature. The overtem-

perature status is aquired at the rising edge of OEN and stored internally.

Table 6. Open LED Detection Modes

Output Port State Effective Output

Point Conditions Detected Open-LED

Error Status Code Meaning

On VDS < VTHL 0 Open Circuit

On VDS > VTHL 1 Normal

Table 7. Shorted LED Detection Modes

Output Port State Effective Output

Point Conditions Detected Shorted-LED

Error St atus Code Meaning

On VDS > VTHH 0 Short Circuit

On VDS < VTHH 1 Normal

Table 8. Overtemperature Mo des

Output Port State Effective Output

Point Conditions Detected Overtemperature

Status Co de Meaning

Don’t Care Temperature > TOV1 0Overtemperature

Condition

Don’t Care Temperature < TOV1 1 Normal

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Detailed Error Reports

The detailed error report can be read out after global error mode has been run. At the falling edge of LD, the detailed

error report of the selected test is latched into the shift register and can be clocked out with n*16 clock cycles (n is the

number of AS1113s in a chain) via pin SDO. At the same time new data can be written into th e shift register, which is

loaded on the next rising edge of pin LD. This pattern is shown at the output drivers, at the falling edge of OEN.

Detailed Temperature Warning Report

The detailed temperature warning report can be read out immediately after global error mode has been run. SDI must

be 1 for the first device. Bit0 of the 16bit data word represents the temperature flag of the chip.

Figure 13. Detailed Temperature Warning Report Timing Diagram

Detailed Temperature Warning Report Example

Consider a case where four AS1113s are cascaded in one chain. The detai l e d err or re po rt l ists the temperatures for

each device in the chain: IC1:[70°] IC2:[85°] IC3:[170°] IC4:[60°]

In this case, IC3 is overheated and will generate a global error, and therefore 4*16 clock cycles are needed to write out

the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report

would look like this:

XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX0 XXXXXXXXXXXXXXX1

The 0 in the detailed temperature warning report indicates that IC3 is the device with the over-temperature condition.

Note: In an actual report there are no spaces in the output.

Global Flag Readout Detailed Error Report Readout

tH(L)

tP4

SDI

OEN

CLK

SDO

New Data Input

TFLAG

DBit15

Undefined

Don’t

Care

Don’t

Care

Temperature Error Report Output

DBit14 DBit13 DBit12 DBitn DBit2 DBit1 DBit0

TBit0

t(SU)ERROR

tP1

For detailed timing information see T i ming Diagrams on page 9.

tGSW(ERROR)

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Detailed Open-LED Error Report

The detailed open-LED error report can be read out immediately after global error mode has bee n run. SDI must be 1

for the first device.

Figure 14. Detailed Open-LED Error Report Timing Diagram

Detailed Open-LED Error Report Example

Consider a case where three AS1113s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,

and an X indicates an open LED. Th e open-LED test is only applied to LEDs that are turned on. This test is used with

a test pattern where all LEDs are on at test time.

IC1:[1111111111111111] IC2:[111XX11111111X11] IC3:[1111111111111111]

IC2 has three open LEDs switched on due to input. 3*16 clock cycles are needed to write the entire error code out. The

detailed error report would look like this:

Comparing this report with the input data indicates that IC2 is the device with two open LEDs at position 4 and 5 and

one open LED at positi on 14. For such a te st it is recommended to enter low-curren t di agnostic mode first (see Low-

Current Diagnostic Mode on page 15) to reduce screen flickering.

This test can be used also on-the-fly without using an all 1s test pattern (see Figure 18 on page 17).

Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested and will

show a logic 1 in the detailed error report.

Input Data:1111111111111111 1111111111111111 1111111111111111

LED Status:1111111111111111 111XX11111111X11 1111111111111111

Failure Code:1111111111111111 1110011111111011 1111111111111111

Acquisition of

Error Status

Global Flag Readout Detailed Error Re port Readout

SDI

OEN

CLK

SDO

tH(L)

Open Error Report Output

New Data Input

tP4

tP1

tP4

tSW(ERROR)

tSU(ERROR)

tTESTING

DBit0DBit1DBit2DBitnDBit12DBit13DBit14

OBit0OBit1OBit2OBitnOBit12OBit13OBit14

Don’t

Care

Don’t

Care

OBit15

TFlag OFlag

DBit15

For detailed timing information see Timing Diagrams on page 9.

tGSW(ERROR)

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AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

Detailed Shorted-LED Error Report

The detailed shorted-LED error report can be read out immediately after global error mode has been run (see Global

Error Mode on page 11). SDI must be 1 for the first device.

Figure 15. Detailed Shorted-LED Error Report Timing Diagram

Detailed Shorted-LED Error Report Example

Consider a case where three AS1113s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,

and an X indicates a shorted LED. This test is used on-the-fly.

IC1:[11111XX111111111] IC2:[1111111111111111] IC3:[X100011111111111]

IC1 has two shorted LEDs which are switched on, IC3 has one shorted LED switched off due to input. 3*16 clock

cycles are needed to write the entire error code out. The detailed error report would look like this:

Showing IC1 as the device with two shorted LEDs at position 6 and 7, and IC3 with one shorted LED at position 1. The

shorted LED at position 1 of IC3 cannot be detected, since LEDs turned off at test time are not tested and will show a

logic "1" at the detailed error report. To test all LEDs this test should be run with an all 1s test pattern. For a test with an

all on test pattern, low-current diagnostic mode should be entered first to reduce on-screen flickering.

Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested and will

show a logic 1 in the detailed error report.

Low-Current Diagnostic Mode

To run the open- or shorted-LED test, a test pattern must be used that will turn on each LED to be tested. This test pat-

tern will cause a short flicker on the screen while the test is being performed. The low-current diagnostic mode can be

initiated prior to running a detailed error report to reduce this on-screen flickeri ng.

Note: Normally, displays using such a diagnostic mode require additional cables, resistors, and other components to

reduce the current. The AS1113 has this current-reduction capability built-in, thereby minimizing the number of

external components required.

Low-current diagnostic mode can be initiated via 3 clock pulses during error-detection mode. After the falling edge of

LD, a test pattern displaying all 1s can be written to the shift register which will be used for the next error-detection test.

Input Data: 1111111111111111 1111111111111111 0100011111111111

LED Status: 11111XX111111111 1111111111111111 X111111111111111

Failure Code: 1111100111111111 1111111111111111 1111111111111111

Global Flag Readout Detailed Error Report Readout

SDI

OEN

CLK

SDO

tH(L)

tSU(ERROR)

tP1

tSW(ERROR)

tP4

TFLAG SFLAG

Acquisition of

Error Status

DBit14 DBit13 DBit12 DBitn DBit2 DBit1 DBit0 Don’t

Care

Don’t

Care

SBit14 SBit13 SBit12 SBitn SBit2 SBit1 SBit0SBit15

New Data Input

Shorted-LED Error Report Output

OFLAG

TFLAG

tP4

tTESTING

Global Flag Readout

DBit15

For detailed timin g information see Timing Diagrams on page 9.

tGSW(ERROR)

www.austriamicrosystems.com Revision 1.02 16 - 24

AS1113

Data Sheet - D e ta i l e d D es c r i p t io n

On the next falling edge of OEN, current is reduced to ILC. With the next rising edge of OEN the current will immedi-

ately increase to normal levels and the detailed error report can be read out entering error-detection mode.

Figure 16. Switching into Low-Current Diagnosti c Mode Timing Diagram

Shutdown Mode

The AS1113 features a shutdown mode which can be entered via 4 clock pulses during error-detection mode. To

enable the shutdown mode a 0 must be placed at SDI after the rising edge of the 3rd clock pulse.

To disable shutdown mode a 1 must be placed at SDI after the 3rd clock pulse. The shutdown/wakeup information will

be latched through if multiple AS1113 devices are in a chain. At the rising edge of the 4th clock pulse the shutdown bit

will be read out and the AS1113 will shutdown or wakeup.

Note: In shutdown mode the supply current drops down to <10µA.

Figure 17. Shutdown Mode Timing Diagram

For detailed timing information see Timing Diagrams on page 9.

OFLAGTFLAG SFLAG Don’t

Care

Re-entering Error

Detection Mode

(see Figure 14)

(see Figure 15)

tTESTING

SDI

OEN

CLK

SDO

Load Internal all 1s

Test Pattern

(optional)

tSW(ERROR)

tP1

tSU(ERROR)

Normal Operation Current

tGSW(ERROR)

Low-Current

Diagnosis Mode

tH(L)

SDI

OEN

CLK

SDO

1 = Wakeup

0 = Shutdown

1 = Wakeup

0 = Shutdown

OFLAGTFLAG SFLAG

tP4

tSU(ERROR)

tSU(D)

www.austriamicrosystems.com Revision 1.02 17 - 24

AS1113

Data Sheet - A p p l ic a t i o n I n f o r m at i o n

9 Application Information

Error Detection

The AS1113 features two types of error detection. The error detection ca n be used on-the-fly, for active LEDs, without

any delay, or by entering into low-current diagnosis mode.

Error Detection On- T he-F l y

Error detection on-the-fly will output the status of active LEDs during operation. Without choosin g an error mo de this

will output the temperature flag at every input/output cycle. Triggering one clock pulse for open or two clock pulses for

short detection during error detection mode outputs the detailed open- or short-error report with the next input/output

cycle (see Figure 18). LEDs turned off at test time are not tested and will show a logic "1" at the detailed error report.

Figure 18. Normal Operation with Error Detection During Operation – 64 Cascaded AS1113s

Error Detection with Low-Current Diagnosis Mode

This unique feature of the AS1113 uses an internal all 1s test pattern for a flicker free diagnosis of all LEDs. This error

detection mode can be started at the end of each input cycle (see Figure 19).

Figure 19. Low-Current Diagnosis Mode with Internal All 1s Test Pattern – 64 Cascaded AS1113s

Display

SDI

SDO

CLK

OEN

Current

Data1 Data2 Data3

Data2 Data3 Data4

T/O or S Error Code

Data1

T/O or S Error Code

Data0 T/O or S Error Co de

Data2

1024x 1024x 1024x

Clock for Error

Mode 0x/1x/2x

Rising Edge of OEN

Acquisition of Error Status

Falling Edge of LD; Error Register is

copied into Shift Register

≤ 50mA

GEFGEF

GEF = Global Error Flag

Falling Edge of LD; Error Register is

copied into Shift Register

Clock for Error

Mode 0x/1x/2x

Rising Edge of OEN

Acquisition of Error Status

Clock for Error

Mode 1x/2x

3x Clocks Low-

Current Mode 1024x1024x

Data0

Rising Edge of OEN

Acquisition of Error Status

Falling Edge of LD; Error Register

is copied into Shift Register

GEF

O or S Error Code from

All 1s Test Pattern Temperature Error Code

Use Internal All 1s

Test Pattern

≤ 50mA ≤ 50mA

SDI

SDO

CLK

OEN

≤ 0.8mA GEF = Global Error Flag

1024x

Data1 Data2

Data2 Data3

T/O or S Error Code

Data0 GEF

Display

Current

Low-Current Diagnosis Mode

Data1

www.austriamicrosystems.com Revision 1.02 18 - 24

AS1113

Data Sheet - A p p l ic a t i o n I n f o r m at i o n

The last pattern written into the shift register will be saved before starting low-current diagnosis mode and can be dis-

played immediately after the test has been performed.

Low-current diagnostic mode is started with 3 clock pulses during error detection mode. Then OEN should be enabled

for ≥2µs for testing. With the rising edge of OEN the LED test is stopped, and while LD is high the desired error mode

can be selected with the corresponding clock pulses. After LD and OEN go low again the previously saved pattern can

be displayed at the outputs.

With the next data input the detailed error code will be clocked out at pin SDO.

Note: See Figure 20 for use of an external test pattern.

Figure 20. Low-Current Diagnosis Mode with External Test Pattern – 64 Cascaded AS1113s

Cascading Devices

To cascade multiple AS1113 devices, pin SDO must be connected to pin SDI of the next AS1113 (see Figure 21). At

each rising edge of CLK the LSB of the shift register will be written into the shift register SDI of the next AS1113 in the

chain.

Note: When n*AS1113 devices are in one chain, n*16 clock pulses are needed to latch-in the input data.

Figure 21. Cascading AS1113 Devices

Temperature Error Code

Data2

Data1

Data2 Data3

GEF GEF

T/O or S Err o r C o de

Data0

Rising Edge of OEN

Acquisition of Error Status

Display

SDI

SDO

CLK

OEN

1024x

3x Clocks

Low-Current

Mode Clock for Error

Mode 1x/2x

Falling Edge of LD; Error Register

is copied into Shift Register

O or S Error Code

from Test Pattern

1024x

GEF = Global Error Flag

Low-Current Diagnosis Mode

≤ 50mA ≤ 50mA

Current

≤ 0.8mA

External all 1s Test Pattern

AS1113 #n-1

SDI SDO

CLK LD OEN

SDI

CLK

OEN

AS1113 #1

SDI SDO

CLK LD OEN

AS1113 #2

SDI SDO

CLK LD OEN

www.austriamicrosystems.com Revision 1.02 19 - 24

AS1113

Data Sheet - A p p l ic a t i o n I n f o r m at i o n

Constant Current

In LED display applications, the AS1113 provides virtually no current variations from chan nel-to-channel and from

AS1113-to-AS1113. This is mostly due to 2 factors:

! While IOUT ≥ 10mA, the maximum current skew is less than ±3% between channels and less than ±6% between

AS1113 devices.

! In the saturation region, the characterist ic curve of the output stage is flat (see Figure 5 on page 7). Thus, the out-

put current can be kept constant regardless of the variations of LED forward voltages (VF).

Adjusting Output Current

The AS1113 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each out-

put port. As shown in Figure 3 on page 7 the output curr en t i n th e sa tu rat i on region is extreme ly fl a t so th at it is po ssi -

ble to define it as target current (IOUT TARGET). IOUT TARGET can be calculated by:

VREXT = 1.253V (EQ 1)

IREF = VREXT/REXT (if the other end of REXT is connected to ground) (EQ 2)

IOUT TARGET = IREF*15 = (1.253V/REXT)*15 (EQ 3)

Where:

REXT is the resistance of the external resistor connected to pin REXT.

VREXT is the voltage on pin REXT.

The magnitude of current (as a function of REXT) is around 50.52mA at 372Ω and 25.26mA at 744Ω. Figure 3 on

page 7 shows the relationship curve between the IOUT TARGET of each channel and the corresponding external resistor

(REXT).

Package Power Dissipation

The maximum allowable package power dissipation (PD) is determined as:

PD(MAX) = (TJ-TAMB)/RTH(J-A) (EQ 4)

When 16 output channels are turn ed on simultaneously, the actual package power dissipation is:

PD(ACT) = (IDD*VDD) + (IOUT*Duty*VDS*16) (EQ 5)

Therefore, to keep PD(ACT) ≤ PD(MAX), the maximum allowed output current as a function of duty cycle is:

IOUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/16 (EQ 6)

Where:

TJ = 150ºC

Delayed Outputs

The AS1113 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and

constant current block.

The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ...

OUTN15 has 300ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor

requirements when the outputs turn on (see Figure 10 on page 10)

Switching-Noise Reduction

LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic

inductance on the PCB.

Load Supply Voltage

Considering the package power dissipation limits (see EQ 4:6), the AS1113 should be operated within the range of

VDS = 0.4 to 1.0V.

For example, if VLED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case,

the lowest possible supply voltage or a voltage reducer (VDROP) should be used. The voltage reducer allows

VDS = (VLED -VF) - VDROP.

Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 22.

www.austriamicrosystems.com Revision 1.02 20 - 24

AS1113

Data Sheet - A p p l ic a t i o n I n f o r m at i o n

Figure 22. Voltage Reducer using Resistor (Left) and Zener Diode (Right)

AS1113

VDS

Voltage Supply

}

VLED VDROP

AS1113

VDS

VLED

VDROP

Voltage Supply

{

www.austriamicrosystems.com Revision 1.02 21 - 24

AS1113

Data Sheet - P a c kage Drawings and Markings

10 Package Drawings and Markings

The AS1113 is availab le in a 28-pin QFN (5x5mm) package and a 24-pin SSOP package.

Figure 23. 28-pin QFN (5x5mm) Packagee

Notes:Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.

1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.

2. All dimensions are in millimeters; angles in degrees.

3. N is the total number of terminals.

4. The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95 SPP-012. Details of termi-

nal #1 identifier are optional but must be located within the zone indicated. The terminal #1 identifier may be either

a mold or marked feature.

5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. If one end

of the terminal has the optional radius, the b dimen sion should not be measured in that radius area.

6. Dimensions ND and NE refer to the number of terminals on each D and E side, respectively.

-C-

SIDE VIEW

PLANE

ccc C

0.08 C

NX SEATING

D/2

INDEX AREA

aaa C

TOP VIEW

(D/2 xE/2)

E/2

-B-

-A-

NXL

NXb

D2/2

E2/2

bbb C A B

ddd C

-B-

-A-

NN-1

BTM VIEW

(D/2 xE/2)

INDEX AREA

SEE

DETAIL B

SEE

DETAIL B

Datum A or B

ODD TERMINAL SIDE Terminal Tip

Symbol Min Typ Max Notes

A 0.70 0.75 0.80 1, 2

A1 0.00 0.02 0.05 1, 2

A3 0.20 REF 1, 2

L 0.45 0.55 0.65 1, 2

L1 0.03 0.15 1, 2

aaa0.151, 2

bbb0.101, 2

ccc 0.10 1, 2

ddd0.051, 2

eee0.081, 2

ggg0.101, 2

Symbol Min Typ Max Notes

D BSC 5.00 1, 2

E BSC 5.00 1, 2

D2 3.00 3.15 3.25 1, 2

E2 3.00 3.15 3.25 1, 2

K0.20 1, 2

b 0.18 0.25 0.30 1, 2, 5

e0.50

N281, 2

ND 7 1, 2, 5

NE 7 1, 2, 5

www.austriamicrosystems.com Revision 1.02 22 - 24

AS1113

Data Sheet - P a c kage Drawings and Markings

Figure 24. 24-pin SSOP Package

Symbol Min Max

A1.351.75

A1 0.10 0.25

A2 1.37 1.57

b0.200.30

C0.190.25

D8.558.74

E5.796.20

E1 3.81 3.99

e 0.635 BSC

h0.220.49

L0.401.27

θ0º 8º

www.austriamicrosystems.com Revision 1.02 23 - 24

AS1113

Data Sheet - O r d er i n g I n fo r m a t i o n

11 Ordering Information

The device is available as the standard products shown in Table 9.

All devices are RoHS compliant and free of halogene substances.

Table 9. Ordering Information

Type Description Delivery Form Package

AS1113-BSSU 50mA, 16-Channel LED Driver with Diagnostics Tubes 24-pin SSOP

AS1113-BSST 50mA, 16-Channel LED Driver with Diagnostics Tape and Reel 24-pin SSOP

AS1113-BQFR 50mA, 16-Channel LED Driver with Diagnostics Tray 28-pin QFN (5x5mm)

AS1113-BQFT 50mA, 16-Channel LED Driver with Diagnostics Tape and Reel 28-pin QFN (5x5mm)

www.austriamicrosystems.com Revision 1.02 24 - 24

AS1113

Data Sheet

Copyrights

lated, stored, or used without the prior written consent of the copyright owner.

All products and companies mentioned are trademarks or registered trademarks of their respective companies.

Disclaimer

Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing

in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding

the information set forth herein or rega rd i ng th e freedom of the described devices from patent infringement. austria-

microsystems AG reserves the right to change specificatio ns and prices at any time and without notice . Therefore,

prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current informa-

tion. This product is intended for use in normal commercial applications. Applications requiring extended temperature

range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-

sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for

each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard

production flow, such as test flow or test location.

The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,

austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to

personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or

consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-

nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of

austriamicrosystems AG rendering of technical or other services.

Cont act Information

Headquarters

austriamicrosystems AG

A-8141 Schloss Premstaetten, Austria

Tel: +43 (0) 3136 500 0

Fax: +43 (0) 3136 525 01

For Sales Offices, Distributors and Representatives, please visit:

http://www.austriamicrosystems.com/contact-us