OCT 0603, OCU 0805 Vishay Beyschlag High Ohmic Flat Chip Resistors FEATURES * Unique very high ohmic chip resistor product * * * * * * Standard TCR: 100 ppm/K Excellent overall stability Low voltage coefficient: 0.05 %/V Wide high ohmic range: > 10 M to 130 M Lead (Pb)-free solder contacts Compliant to RoHS directive 2002/95/EC APPLICATIONS OCT 0603 and OCU 0805 high ohmic flat chip resistors are best suited where high resistance, high stability and high reliability are required. Typical applications include any kind of battery driven electronics, particularly low consumption CMOS circuitry. * Any kind of battery driven electronics * Low consumption CMOS circuitry * Small signal measurement METRIC SIZE INCH: METRIC: 0603 0805 RR 1608M RR 2012M TECHNICAL SPECIFICATIONS DESCRIPTION OCT 0603 OCU 0805 RR 1608M RR 2012M 11 M to 130 M 11 M to 130 M Metric size Resistance range Resistance tolerance 5% Temperature coefficient 250 ppm/K; 100 ppm/K Operation mode Climatic category (LCT/UCT/days) Rated dissipation, P70 Standard Power Standard Power 55/125/56 55/155/56 55/125/56 55/155/56 75 V 150 V 150 V 200 V 125 C 155 C 125 C 155 C Limited by Umax. (1) Operating voltage, Umax. AC/DC Film temperature Max. resistance change at P70 for resistance range, 11 M to 47 M 11 M to 47 M |R/R| max., after: 1000 h 1% 2% 1% 2% 8000 h 2% 4% 2% 4% Specified lifetime 8000 h Insulation voltage: Failure rate: FITobserved 1 min; Uins 100 V 200 V Continuous 75 V 75 V 0.1 x 10-9/h Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. www.vishay.com 163 For technical questions, contact: thinfilmchip@vishay.com Document Number: 28709 Revision: 23-Nov-09 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors Vishay Beyschlag PART NUMBER AND PRODUCT DESCRIPTION (1) PART NUMBER: OCT06030B5106JP500 O C T 0 6 0 3 0 B 5 1 0 6 J P 5 0 0 TOLERANCE PACKAGING (2) MODEL/SIZE SPECIAL CHARACTER TCR VALUE OCT0603 OCU0805 0 = Neutral B = 100 ppm/K W = 250 ppm/K 3 digit value 1 digit multiplier MULTIPLIER 5 = *105 6 = *106 J=5% P5 PW SPECIAL Up to 2 digits 00 = Standard PRODUCT DESCRIPTION: OCT 0603 -100 5% P5 51M OCT 0603 -100 5% P5 51M MODEL SIZE TCR TOLERANCE PACKAGING (2) RESISTANCE VALUE OCT OCU 0603 0805 100 ppm/K 250 ppm/K 5% P5 PW 47M = 47 M 220M = 220 M Notes (1) Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER (2) Please refer to table PACKAGING, below TEMPERATURE COEFFICIENT AND RESISTANCE RANGE RESISTANCE VALUE (3) DESCRIPTION TCR TOLERANCE OCT 0603 OCU 0805 250 ppm/K 5% 51 M to 130 M 51 M to 130 M 100 ppm/K 5% 11 M to 47 M 11 M to 47 M Note (3) Resistance values to be selected from E24 series PACKAGING REEL MODEL PIECES/ PAPER TAPE ON REEL CODE 5000 P5 20 000 PW 5000 P5 20 000 PW OCT 0603 OCU 0805 Document Number: 28709 Revision: 23-Nov-09 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com 164 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors Vishay Beyschlag DIMENSIONS T1 W WT H T2 L DIMENSIONS AND MASS H (mm) L (mm) W (mm) WT (mm) T1 (mm) T2 (mm) MASS (mg) OCT 0603 0.45 + 0.1/- 0.05 1.55 0.05 0.85 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9 OCU 0805 0.45 + 0.1/- 0.05 2.0 0.1 1.25 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6 TYPE SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) OCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05 OCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70 Note * The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. Specified power rating above 125 C requires dedicated heat-sink pads, which depend on board materials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to "standard operation mode". Please note however that applications for "power operation mode" require special considerations for the design of solder pads and adjacent conductor areas. www.vishay.com 165 For technical questions, contact: thinfilmchip@vishay.com Document Number: 28709 Revision: 23-Nov-09 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A newly developed cermet layer is deposited on a high grade (Al2O3) ceramic substrate and conditioned to achieve the desired temperature coefficient. Inner contacts are built on both sides of the substrate. A special laser is used to achieve the target value by smoothly cutting the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 (3). Vishay Beyschlag All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: * 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) * 2002/95/EC Restriction of Substances directive (RoHS) the use of Hazardous * 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) APPROVALS The resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1 and EN 140400. The detail specification refers to the climatic category 55/125/56, which relates to the "Standard operation mode" of this datasheet. Vishay BEYSCHLAG has achieved "Approval Manufacturer" in accordance with EN 100114-1. ASSEMBLY of The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1 (3). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. Notes (1) Global Automotive Declarable Substance List, see www.gadsl.org (2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org/index.php?id=995 issue environment policy chemicals chemicals for electronics The quoted IEC standards are also released as EN standards with the same number and identical contents (3) Document Number: 28709 Revision: 23-Nov-09 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com 166 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors Vishay Beyschlag TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification (includes tests) EN 140400, sectional specification (includes schedule for qualification approval) EN 140401-802, detail specification (includes schedule for conformance inspection) The components are approved in accordance with the European CECC-system, where applicable. The following table contains only the most important tests. For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified the following values apply: Temperature: 15 C to 35 C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on boards in accordance with EN 60115-1, 4.31 unless otherwise specified. The requirements stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. However, some additional tests and a number of improvements against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST REQUIREMENTS PERMISSIBLE CHANGE (R/R) PROCEDURE Stability for product types: OCT 0603 11 M to 130 M OCU 0805 11 M to 130 M 4.5 - Resistance U = 100 V 5% 4.8.4.2 - Temperature coefficient At (20/- 55/20) C and (20/125/20) C 250 ppm/K; 100 ppm/K 4.25.1 - U = Umax.; Endurance at 70 C: Standard operation mode 4.25.3 4.24 78 (Cab) 4.23 1.5 h on; 0.5 h off; 70 C; 1000 h 1% 70 C; 8000 h 2% Endurance at upper 125 C; 1000 h 2% category temperature 155 C; 1000 h 3% Damp heat, steady state (40 2) C; 56 days; (93 3) % RH 1% Climatic sequence: 4.23.2 2 (Ba) dry heat 4.23.3 30 (Db) damp heat, cyclic 4.23.4 1 (Aa) cold LCT; 2 h 4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 10) C 4.23.6 30 (Db) damp heat, cyclic www.vishay.com 167 UCT; 16 h 55 C; 24 h; > 90 % RH; 1 cycle 55 C; 5 days; > 95 to 100 % RH; 5 cycles 1% LCT = - 55 C; UCT = 125 C no visible damage For technical questions, contact: thinfilmchip@vishay.com Document Number: 28709 Revision: 23-Nov-09 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST REQUIREMENTS PERMISSIBLE CHANGE (R/R) PROCEDURE Stability for product types: - 1 (Aa) Cold OCT 0603 11 M to 130 M OCU 0805 11 M to 130 M - 55 C; 2 h 0.5 % 30 min at LCT and 30 min at UCT; 4.19 14 (Na) Rapid change of LCT = - 55 C; UCT = 125 C; 5 cycles 0.5 % no visible damage temperature LCT = - 55 C; UCT = 125 C; 1000 cycles 1% no visible damage 4.13 - 4.27 - Short time overload Single pulse high voltage overload; standard operation mode U = 2 x Umax.; 5 s Severity no. 4, U = 2 x Umax.; 10 pulses 1% 10 s/700 s no visible damage Endurance by sweeping; 4.22 6 (Fc) Vibration 0.5 % 10 Hz to 2000 Hz; no resonance; amplitude 1.5 mm or 200 m/s2; 6 h 0.5 % no visible damage Solder bath method; SnPb40; non-activated flux (215 3) C; (3 0.3) s 4.17.2 58 (Td) Solderability Solder bath method; Good tinning (> 95 % covered); no visible damage SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 3) C; (2 0.2) s 4.18.2 58 (Td) 4.29 45 (XA) 4.32 21 (Ue3) Resistance to soldering heat Component solvent resistance Solder bath method; (260 5) C; (10 1) s Isopropyl alcohol + 50 C; method 2 0.5 % no visible damage No visible damage RR 1608M; 9 N Shear (adhesion) No visible damage RR 2012M; 45 N 0.5 % no visible damage, 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times 4.7 - Voltage proof URMS = Uins; (60 5) s No flashover or breakdown 4.35 - Flammability IEC 60695-2-2, needle flame test; 10 s No burning after 30 s Document Number: 28709 Revision: 23-Nov-09 For technical questions, contact: thinfilmchip@vishay.com no open circuit in bent position www.vishay.com 168 OCT 0603, OCU 0805 High Ohmic Flat Chip Resistors Vishay Beyschlag 12NC INFORMATION FOR HISTORICAL CODING REFERENCE ONLY * The resistors have a 12 digit numeric code starting with 2312. * The subsequent 4 digits indicate the resistor type, specification and packaging; see the 12NC table. Last digit of 12NC indicating resistance decade RESISTANCE DECADE LAST DIGIT 10 M to 99.9 M 6 * The remaining 4 digits indicate the resistance value: Last Two Digits Indicating Sequential Code Number - The first 3 digits indicate the resistance value. RESISTANCE VALUE LAST DIGITS accordance with the 12NC indicating resistance decade 100 M 01 table. 110 M 02 120 M 03 130 M 04 - The last digit indicates the resistance decade in 12NC example The 12NC of a OCT 0603 resistor, value 51 M and TC 250 with 5 % tolerance, supplied in cardboard tape of 20000 units per reel is: 2312 209 35106. The 12 NC of a OCT 0603 resistor, value 130 M and TC 250 with 5 % tolerance, supplied in cardboard tape of 5000 units per reel is: 2312 219 90104. 12NC - Resistor type and packaging CODE 2312 ... ..... DESCRIPTION CARDBOARD TAPE ON REEL TYPE TCR TOL. 250 ppm/K 5% OCT 0603 100 ppm/K 5% 250 ppm/K 5% OCU 0805 100 ppm/K 5% RESISTANCE VALUE P5 5000 UNITS PW 20 000 UNITS 51 M to 91 M 219 3.... 209 3.... 100 M (1) 219 901.. 209 901.. 11 M to 47 M 219 3.... 209 3.... 51 M to 91 M 259 3.... 249 3.... 100 M (1) 259 901.. 249 901.. 11 M to 47 M 259 3.... 249 3.... Note (1) Readable coding of resistance values is restricted to values below 100 M. For resistance values from 100 M onwards, refer to the pre-defined table of non-readable sequential numbers above. www.vishay.com 169 For technical questions, contact: thinfilmchip@vishay.com Document Number: 28709 Revision: 23-Nov-09 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1