OCU08050B1505JPW00 - Vishay Presicion Group

www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28709

163 Revision: 23-Nov-09

OCT 0603, OCU 0805

Vishay Beyschlag

High Ohmic Flat Chip Resistors

OCT 0603 and OCU 0805 high ohmic flat chip resistors are

best suited where high resistance, high stability and high

reliability are required. Typical applications include any kind

of battery driven electronics, particularly low consumption

CMOS circuitry.

FEATURES

•Unique very high ohmic chip resistor product

•Standard TCR: ± 100 ppm/K

•Excellent overall stability

•Low voltage coefficient: 0.05 %/V

•Wide high ohmic range: > 10 MΩ to 130 MΩ

•Lead (Pb)-free solder contacts

•Compliant to RoHS directive 2002/95/EC

APPLICATIONS

•Any kind of battery driven electronics

•Low consumption CMOS circuitry

•Small signal measurement

Note

(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.

METRIC SIZE

INCH: 0603 0805

METRIC: RR 1608M RR 2012M

TECHNICAL SPECIFICATIONS

DESCRIPTION OCT 0603 OCU 0805

Metric size RR 1608M RR 2012M

Resistance range 11 MΩto 130 MΩ11 MΩto 130 MΩ

Resistance tolerance ± 5 %

Temperature coefficient ± 250 ppm/K; ± 100 ppm/K

Operation mode Standard Power Standard Power

Climatic category (LCT/UCT/days) 55/125/56 55/155/56 55/125/56 55/155/56

Rated dissipation, P70 (1) Limited by Umax.

Operating voltage, Umax. AC/DC 75 V 150 V 150 V 200 V

Film temperature 125 °C 155 °C 125 °C 155 °C

Max. resistance change at P70

for resistance range,

|ΔR/R| max., after:

11 MΩto 47 MΩ11 MΩto 47 MΩ

1000 h ≤ 1 % ≤ 2 % ≤ 1 % ≤ 2 %

8000 h ≤ 2 % ≤ 4 % ≤ 2 % ≤ 4 %

Specified lifetime 8000 h

Insulation voltage:

1 min; Uins 100 V 200 V

Continuous 75 V 75 V

Failure rate: FITobserved ≤ 0.1 x 10-9/h

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Revision: 23-Nov-09 164

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High Ohmic Flat Chip Resistors Vishay Beyschlag

Notes

(1) Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER

(2) Please refer to table PACKAGING, below

Note

(3) Resistance values to be selected from E24 series

PART NUMBER AND PRODUCT DESCRIPTION (1)

PART NUMBER: OCT06030B5106JP500

MODEL/SIZE SPECIAL CHARACTER TCR VALUE TOLERANCE PACKAGING (2) SPECIAL

OCT0603

OCU0805

0 = Neutral B = ± 100 ppm/K

W = ± 250 ppm/K

3 digit value

1 digit multiplier

MULTIPLIER

5 = *105

6 = *106

J = ± 5 % P5

Up to 2 digits

00 = Standard

PRODUCT DESCRIPTION: OCT 0603 -100 5% P5 51M

OCT 0603 -100 5 % P5 51M

MODEL SIZE TCR TOLERANCE PACKAGI N G (2) RESISTANCE VALUE

OCT

OCU

0603

0805

± 100 ppm/K

± 250 ppm/K

± 5 % P5

47M = 47 MΩ

220M = 220 MΩ

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

DESCRIPTION RESISTANCE VALUE (3)

TCR TOLERANCE OCT 0603 OCU 0805

± 250 ppm/K ± 5 % 51 MΩto 130 MΩ51 MΩto 130 MΩ

± 100 ppm/K ± 5 % 11 MΩto 47 MΩ11 MΩto 47 MΩ

PACKAGING

MODEL

REEL

PIECES/

PAPER TAPE ON REEL CODE

OCT 0603

5000 P5

20 000 PW

OCU 0805

5000 P5

20 000 PW

CT06030B5O06JP5001

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165 Revision: 23-Nov-09

OCT 0603, OCU 0805

Vishay Beyschlag High Ohmic Flat Chip Resistors

DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of

power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the

reliability of the assembly.

Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials.

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in

publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other

parameters.

Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.

Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent

conductor areas.

DIMENSIONS AND MASS

TYPE H

(mm)

MASS

(mg)

OCT 0603 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9

OCU 0805 0.45 + 0.1/- 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

WAVE SOLDERING REFLOW SOLDERING

(mm)

OCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05

OCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70

WWT

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Revision: 23-Nov-09 166

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High Ohmic Flat Chip Resistors Vishay Beyschlag

DESCRIPTION

Production is strictly controlled and follows an extensive set

of instructions established for reproducibility. A newly

developed cermet layer is deposited on a high grade (Al2O3)

ceramic substrate and conditioned to achieve the desired

temperature coefficient. Inner contacts are built on both

sides of the substrate. A special laser is used to achieve the

target value by smoothly cutting the resistive layer without

damaging the ceramics. The resistor elements are covered

by a protective coating designed for electrical, mechanical

and climatic protection. The terminations receive a final pure

tin on nickel plating.

The result of the determined production is verified by an

extensive testing procedure and optical inspection

performed on 100 % of the individual chip resistors. Only

accepted products are laid directly into the paper tape in

accordance with IEC 60286-3 (3).

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic soldering

using wave, reflow or vapour phase as shown in

IEC 61760-1 (3). The encapsulation is resistant to all cleaning

solvents commonly used in the electronics industry,

including alcohols, esters and aqueous solutions. The

suitability of conformal coatings, if applied, shall be qualified

by appropriate means to ensure the long-term stability of the

whole system.

The resistors are RoHS compliant; the pure tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. Solderability is

specified for 2 years after production or requalification. The

permitted storage time is 20 years. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

All products comply with the GADSL (1) and the

CEFIC-EECA-EICTA (2) list of legal restrictions on

hazardous substances. This includes full compliance with

the following directives:

•2000/53/EC End of Vehicle life Directive (ELV) and

Annex II (ELV II)

•2002/95/EC Restriction of the use of Hazardous

Substances directive (RoHS)

•2002/96/EC Waste Electrical and Electronic Equipment

Directive (WEEE)

APPROVALS

The resistors are tested in accordance with EN 140401-802

which refers to EN 60115-1 and EN 140400. The detail

specification refers to the climatic category 55/125/56, which

relates to the “Standard operation mode” of this datasheet.

Vishay BEYSCHLAG has achieved “Approval of

Manufacturer” in accordance with EN 100114-1.

Notes

(1) Global Automotive Declarable Substance List, see www.gadsl.org

(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade

organisation representing the information and communications technology and consumer electronics), see www.eicta.org/index.php?id=995

→ issue → environment policy → chemicals → chemicals for electronics

(3) The quoted IEC standards are also released as EN standards with the same number and identical contents

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167 Revision: 23-Nov-09

OCT 0603, OCU 0805

Vishay Beyschlag High Ohmic Flat Chip Resistors

TESTS AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, generic specification (includes tests)

EN 140400, sectional specification (includes schedule for

qualification approval)

EN 140401-802, detail specification (includes schedule for

conformance inspection)

The components are approved in accordance with the

European CECC-system, where applicable. The following

table contains only the most important tests. For the full test

schedule refer to the documents listed above. The testing

also covers most of the requirements specified by

EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068 and

under standard atmospheric conditions in accordance with

IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower category temperature, upper

category temperature; damp heat, long term, 56 days) is

valid.

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on boards in

accordance with EN 60115-1, 4.31 unless otherwise

specified.

The requirements stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140401-802. However, some

additional tests and a number of improvements against those

minimum requirements have been included.

TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE

(ΔR/R)

Stability for product types:

OCT 0603 11 MΩto 130 MΩ

OCU 0805 11 MΩto 130 MΩ

4.5 - Resistance U = 100 V ± 5 %

4.8.4.2 - Temperature coefficient At (20/- 55/20) °C and (20/125/20) °C ± 250 ppm/K; ± 100 ppm/K

4.25.1 -

Endurance at 70 °C:

Standard operation mode

U = Umax.;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± 1 %

70 °C; 8000 h ± 2 %

4.25.3 - Endurance at upper

category temperature

125 °C; 1000 h ± 2 %

155 °C; 1000 h ± 3 %

4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± 1 %

4.23 Climatic sequence:

4.23.2 2 (Ba) dry heat UCT; 16 h

4.23.3 30 (Db) damp heat, cyclic 55 °C; 24 h; > 90 % RH;

1 cycle

4.23.4 1 (Aa) cold LCT; 2 h

4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C

4.23.6 30 (Db) damp heat, cyclic 55 °C; 5 days; > 95 to 100 % RH; 5 cycles

LCT = - 55 °C; UCT = 125 °C

± 1 %

no visible damage

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Revision: 23-Nov-09 168

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High Ohmic Flat Chip Resistors Vishay Beyschlag

- 1 (Aa) Cold - 55 °C; 2 h ± 0.5 %

4.19 14 (Na) Rapid change of

temperature

30 min at LCT and 30 min at UCT;

LCT = - 55 °C; UCT = 125 °C; 5 cycles ± 0.5 %

no visible damage

LCT = - 55 °C; UCT = 125 °C; 1000 cycles ± 1 %

no visible damage

4.13 - Short time overload U = 2 x Umax.; 5 s ± 0.5 %

4.27 -

Single pulse high voltage

overload; standard

operation mode

Severity no. 4, U = 2 x Umax.; 10 pulses

10 µs/700 µs

± 1 %

no visible damage

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz; no resonance;

amplitude ≤ 1.5 mm or ≤ 200 m/s2; 6 h

± 0.5 %

no visible damage

4.17.2 58 (Td) Solderability

Solder bath method;

SnPb40; non-activated flux (215 ± 3) °C;

(3 ± 0.3) s Good tinning (> 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5; non-activated flux

(235 ± 3) °C; (2 ± 0.2) s

4.18.2 58 (Td) Resistance to

soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± 0.5 %

no visible damage

4.29 45 (XA) Component solvent

resistance Isopropyl alcohol + 50 °C; method 2 No visible damage

4.32 21 (Ue3) Shear (adhesion)

RR 1608M; 9 N

No visible damage

RR 2012M; 45 N

4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± 0.5 % no visible damage,

no open circuit in bent position

4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown

4.35 - Flammability IEC 60695-2-2, needle flame test; 10 s No burning after 30 s

TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE

(ΔR/R)

Stability for product types:

OCT 0603 11 MΩto 130 MΩ

OCU 0805 11 MΩto 130 MΩ

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169 Revision: 23-Nov-09

OCT 0603, OCU 0805

Vishay Beyschlag High Ohmic Flat Chip Resistors

12NC INFORMATION FOR HISTORICAL CODING REFERENCE ONLY

•

The resistors have a 12 digit numeric code starting with 2312.

•The subsequent 4 digits indicate the resistor type,

specification and packaging; see the 12NC table.

•The remaining 4 digits indicate the resistance value:

- The first 3 digits indicate the resistance value.

-The last digit indicates the resistance decade in

accordance with the 12NC indicating resistance decade

table.

Last digit of 12NC indicating resistance decade

Last Two Digits Indicating Sequential Code Number

12NC example

The 12NC of a OCT 0603 resistor, value 51 MΩ and TC 250

with ± 5 % tolerance, supplied in cardboard tape of

20000 units per reel is: 2312 209 35106.

The 12 NC of a OCT 0603 resistor, value 130 MΩ and

TC 250 with ± 5 % tolerance, supplied in cardboard tape of

5000 units per reel is: 2312 219 90104.

Note

(1) Readable coding of resistance values is restricted to values below 100 MΩ. For resistance values from 100 MΩ onwards, refer to the

pre-defined table of non-readable sequential numbers above.

RESISTANCE DECADE LAST DIGIT

10 MΩ to 99.9 MΩ6

RESISTANCE VALUE LAST DIGITS

100 MΩ01

110 MΩ02

120 MΩ03

130 MΩ04

12NC - Resistor type and packaging

DESCRIPTION

CODE 2312 ... .....

CARDBOARD TAPE ON REEL

TYPE TCR TOL. RESISTANCE VALUE P5 5000 UNITS PW 20 000 UNITS

OCT 0603

± 250 ppm/K ± 5 %

51 MΩ to 91 MΩ219 3.... 209 3....

≥ 100 MΩ (1) 219 901.. 209 901..

± 100 ppm/K ± 5 % 11 MΩ to 47 MΩ219 3.... 209 3....

OCU 0805

± 250 ppm/K ± 5 %

51 MΩ to 91 MΩ259 3.... 249 3....

≥ 100 MΩ (1) 259 901.. 249 901..

± 100 ppm/K ± 5 % 11 MΩ to 47 MΩ259 3.... 249 3....

Document Number: 91000 www.vishay.com

Revision: 18-Jul-08 1

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