JN5169-001-M03-2Z - NXP SEMICONDUCTORS

1. General description

The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a

ready-made compone nt that provide s a fully inte grated solution for applications, using th e

IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee

3.0 and ZigBee PRO stack with Home Autom ation, Light Link and Smart Energy profiles.

The modules integrate all of the RF components required, removing the need to perform

expensive RF design and test. Products can be designed by simply connecting sensors

and switches to the module IO pins. The modules use NXP’s single chip IEEE802.15.4

wireless microcontroller, allowing designers to make use of the extensive chip

development support material. Hence, this range of modules allows designers to bring

wireless applications to market in the minimum time with significantly reduced

development effort and cost.

3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and

JN5169-001-M06-2. All modules have FCC modular approval. The JN5169-001-M00-2

and JN5169-001-M03-2 are also CE-compliant and subject to a Notified Body Opinion.

The variants available are described in the Table 1.

1.1 Regulatory Approvals

The JN5169-001- M00-2 and JN5169-001-M03-2 have been tested against the

requirements of the following European standards.

•Radio EN 300 328 v 1.9.1

•EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2

•Basic Safety Assessment (BSA) EN 60950-1:2006

A Notified Body statement of opinion for this standard is available on request.

The High-power module with M06 suffix is not approved for use in Europe.

Additionally, both module types have received FCC “Modular Approval”, in compliance

with CFR 47 FCC part 15 r egulations and in accordance to FCC public notice DA00-1 407.

The modular approvals notice and test reports are available on request.

The JN5169-001-M06-2 module is subject to user proximity restrictions under FCC

regulations; more specific information is available in Section 13.1.2.

JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

Rev. 3.0 — 19 September 2016 Product data sheet

Product data sheet Rev. 3.0 — 19 September 2016 2 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

2. Features and benefits

2.1 Benefits

Microminiature module solutions

Ready to use in prod u cts

Minimizes product development time

No RF test required for systems

Compliant with:

FCC 47CFR Part 15C

ETSI EN 300-328 V1.9

EN 301-489-17 V2.2.1

EN60950-1-2006

Temperature range: 40 C to +85 C

Lead-free and RoHS compliant

2.2 Features: modules

2.4 GHz IEEE 802.15.4, ZigBee 3.0 and ZigBee PRO stack with Home Automation,

Light Link and Smart Energy compatible

JN5169-001-M00-2

Dimensions: 16 mm 30 mm

Integrated printed antenna

TX power 8.5 dBm/10 dBm

Receiver sensitivity –96 dBm

TX current 27.2 mA at 10 dBm

TX current 23.6 mA at 8.5 dBm

RX current 17.8 mA at maximum input level 10 dBm

RX current 16.2 mA at maximum input level 0 dBm

2.0 V/3.6 V operation

JN5169-001-M03-2

Dimensions: 16 mm 21 mm

Fl connector

TX power 8.5 dBm/10 dBm

Receiver sensitivity –96 dBm

TX current 27.2 mA at 10 dBm

TX current 23.6 mA at 8.5 dBm

RX current 17.8 mA at maximum input level 10 dBm

RX current 16.2 mA at maximum input level 0 dBm

2.0 V/3.6 V operation

JN5169-001-M06-2

Dimensions: 16 mm 30 mm

Fl connector

TX power 22 dBm

Receiver sensitivity –100 dBm

TX current 181 mA at 22 dBm

Product data sheet Rev. 3.0 — 19 September 2016 3 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

RX current 22.8 mA at maximum input level 10 dBm

2.0 V/3.6 V operation

2.3 Features: microcontroller

32-bit RISC CPU; 1 MHz to 32 MHz clock speed

Variable instruction width for high coding efficiency

Multi-stage instruction pipeline

512 kB Flash

32 kB RAM

4 kB EEPROM

Data EEPROM with guaranteed 100 k write operations

2-wire I2C-bus compatible serial interface; can operate as either master or slave

5PWM (4 timers, 1 timer/counter)

2 low-power sleep counters

2UARTs

SPI-bus Master and Slave port, 3 selects

Supply voltage monitor with 8 programmable thresholds

6-input 10-bit ADC, comparator

Battery and temperature sensors

Watchdog and Supply Voltage Monitor (SVM)

Up to 20 Digital IO (DIO) pins

3. Applications

Robust and secure low-power wireless applications

ZigBee Smart Energy networ ks

ZigBee Home Automation networks

Toys and gaming peripherals

Energy harvesting - for example, self-powered light switch

4. Overview

The JN5169-001- M0x-2 family is a range of ultra-low power, high performance surface

mount modules targeted at IEEE 802.15.4, ZigBee 3.0 and ZigBee Home Automation,

Light Link and Smart Energ y networking applications, enabling users to realize products

with minimum time to market and at th e lowest cost. Th ey remove the need for expen sive

and lengthy development of custom RF board designs and test suites. The modules use

NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large

memory, high CPU and radio performance and all RF components included. All that is

required to develop and manufacture wireless control or sensing products is to connect a

power supply and pe rip h erals such as switches, actuators and sensors, considerably

simplifying product development.

3 module variants are available: JN5169-001-M00-2 with an integrated printed antenna,

JN5169-001-M03-2 and JN5169-001-M06-2 with a FL antenna connector. The

JN5169-001-M06-2 also has a power amplifier and LNA for extended range.

Product data sheet Rev. 3.0 — 19 September 2016 4 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

5. Ordering information

For further details, refer to the Wireless Connectivity area of the NXP web site Ref. 3.

6. Marking

Table 1. Ordering information

Type number Description FCCID

JN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2

JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2

JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2

(1) With x = 0, 3 or 6.

Fig 1. JN5169-001-M0x-2 package marking (top view)

Table 2. Mark ing code

Line number Marking code

Line 1 NXP Logo: B&W outline logo - 2D barcode (internal NXP usage )

Line 2 part ID: JN5169-001-M0x-2, with x the module type, 0, 3 or 6

Line 3 serial number: NNNNN

Line 4 •Z: SSMC

•b: SPIL

•H: halogen free

•Y: year

•WW: week code

Line 5 FFC ID = FCCID: XXMJN5169MxV2, with x the module type 0, 3 or 6

Line 6 IC ID = IC: 8764A-JN5169Mx, with x the module type 0, 3 or 6

aaa-022822

Product data sheet Rev. 3.0 — 19 September 2016 5 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

JN5169-001-M0x-2 modules meet the requirements of Directive 2002/95/EC of the

European Parliament and of the Council on the Restriction of Hazardous Substance

(RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force

on 1 March 2007.

7. Block diagram

Fig 2. Block dia gra m

aaa-022823

MATCHING

2.4 GHz

RADIO

INCLUDING

DIVERSITY

POWER

MANAGEMENT

M00 option

integrated

antenna

external

antenna

external

antenna

MATCHING

µFL

CONNECTOR

M03 option

MATCHING

PA/LNA

SE2431

XTAL

µFL

CONNECTOR

M06 option

WATCHDOG

TIMER RAM

32 kB

32-BIT

RISC CPU

4kB

EEPROM

FLASH

512 kB

VOLTAGE

BROWNOUT

O-QPSK

MODEM

128-BIT AES

ENCRYPTION

ACCELERATOR

IEEE802.15.4

MAC

ACCELERATOR

SPI-BUS

MASTER AND SLA VE

2-WIRE SERIAL

(MASTER/SLAVE)

4 X PWM

PLUS TIMER

2 X UART

20 DIO

PLUS 2 DO

SLEEP

COUNTER

6 CHAN

10 BIT ADC

BA TTERY AND

TEMP SENSORS

POWER

JN5169

Product data sheet Rev. 3.0 — 19 September 2016 6 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

8. Pinning information

8.1 Pinning

8.2 Pin description

The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on

the JN5169-001-M06-2.

(1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.

(2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.

(3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.

(4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.

Fig 3. Pin con fig ura t io n

aaa-022824

DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0

DIO5/RTS0/JTAG_TMS/PWM1/PC1

DIO6/TXD0/JTAG_TDO/PWM2

DIO7/RXD0/JTAG_TDI/PWM3

DIO8/TIM0CK_GT/PC1/PWM4

DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN

DIO10/TIM0OUT/32KXTALOUT

VDD

VSS

VREF/ADC2

DIO17/SPISMISO/SIF_D/COMP1M/PWM4

DIO16/SPISMISO/SIF_CLK/COMP1P

DIO15(4)

DIO14(3)

RESET_N

DIO13(2)

DIO12(1)

DIO11/PWM1/TXD1

ADC1

DO0/SPICLK/PWM2

DO1/SPIMISO/PWM3

DIO18/SPIMOSI

DIO19/SPISEL0

DIO0/ADO/SPISEL1/ADC3

DIO1/ADE/SPISEL2/ADC4/PC0

DIO2/RFRX/TIM0CK_GT/ADC5

DIO3/RFTX/TIM0CAP/ADC6

Transparent top view

Table 3. Pin de scription

Symbol Pin Type[1] Description

ADC1 1 I ADC1 — ADC input

Product data sheet Rev. 3.0 — 19 September 2016 7 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

DO0/SPICLK/PWM2[2] 2O DO0 — DO0

SPICLK — SPI-bus master clock output

PWM2 — PWM2 output

DO1/SPIMISO/PWM3[3] 3I/O DO1 — DO1

SPIMISO — SPI-bus Master In, Slave Out input

PWM3 — PWM3 output

DIO18/SPIMOSI 4 I/O DIO18 — DIO18

SPIMOSI — SPI-bus Master Out Slave In output

DIO19/SPISEL0 5 I/O DIO19 — DIO19

SPISEL0 — SPI-bus Master Select Output 0

DIO0/ADO/SPISEL1/ADC3 6 I/O DIO0 — DIO0

ADO — antenna diversity odd output

SPISEL1 — SPI-bus master select output 1

ADC3 — ADC input: ADC3

DIO1/ADE/SPISEL2/ADC4/PC0 7 I/O DIO1 — DIO1

ADE — antenna diversity even output

SPISEL2 — SPI-bus master select output 2

ADC4 — ADC input: ADC4

PC0 — pulse counter 0 input

DIO2/RFRX/TIM0CK_GT/ADC5[4] 8I/O DIO2 — DIO2

RFRX — radio receives control output

TIM0CK_GT — timer0 clock/gate input

ADC5 — ADC input: ADC5

DIO3/RFTX/TIM0CAP/ADC6[4] 9I/O DIO3 — DIO3

RFTX — radio tran smi t co ntrol output

TIM0CAP — timer0 capture input

ADC6 — ADC input: ADC6

DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4

CTS0 — UART 0 clear to send input

JTAG_TCK — JTAG CLK input

TIM0OUT — timer0 PWM output

PC0 — pulse counter 0 input

DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5

RTS0 — UART 0 request to send output

JTAG_TMS — JTAG mode select input

PWM1 — PWM1 output

PC1 — pulse counter 1 input

DIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6

TXD0 — UART 0 transmit data output

JTAG_TDO — JTAG data output

PWM2 — PWM2 data output

Table 3. Pin de scription …continued

Symbol Pin Type[1] Description

Product data sheet Rev. 3.0 — 19 September 2016 8 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

DIO7/RXD0/JTAG_TDI/PWM3 13 I/O DIO7 — DIO7

RXD0 — UART 0 receive data input

JTAG_TDI — JTAG data input

PWM3 — PWM 3 data output

DIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8

TIM0CK_GT — timer0 clock/gate input

PC1 — pulse counter1 input

PWM4 — PWM 4 output

DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9

TIM0CAP — Timer0 Capture input

32KXTALIN — 32 kHz External Crystal input

RXD1 — UART1 Receive Data input

32KIN — 32 kHz External clock input

DIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10

TIM0OUT — Timer0 PWM Output

32KXTALOUT — 32 kHz External Crystal output

VDD 17 P VDD — supply voltage

VSS 18 GND ground

DIO11/PWM1/TXD1 19 I/O DIO11 — DIO11

PWM1 — PWM1 output

TXD1 — UART1 Transmit Data output

DIO12[5] 20 I/O DIO12 — DIO12

PWM2 — PWM2 output

CTS0 — UART0 clear to send input

JTAG_TCK — JTAG CLK input

ADO — antenna diversity odd output

SPISMOSI — SPI-bus slave Master Out, Slave In input

DIO13[6] 21 I/O DIO13 — DIO13

PWM3 — PWM3 output

RTS0 — UART0 request to send output

JTAG_TMS — JTAG mode select input

ADE — antenna diversity even output

SPISMISO — SPI-bus slave master in slave out output

RESET_N 22 I RESET_N — reset input

DIO14[7] 23 I/O DIO14 — DIO14

SIF_CLK — serial interface clock

TXD0 — UART 0 transmit data output

TXD1 — UART 1 transmit data output

JTAG_TDO — JTAG data output

SPISEL1 — SPI-bus master select output 1

SPISSEL — SPI-bus slave select input

Table 3. Pin de scription …continued

Symbol Pin Type[1] Description

Product data sheet Rev. 3.0 — 19 September 2016 9 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

[1] P = power supply; G = ground; I = input, O = output; I/O = input/output.

[2] JTA G programming mode: must be left floating high during reset to avoid entering JTAG programming mode.

[3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program.

[4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module.

[5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.

[6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.

[7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.

[8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.

9. Functional description

9.1 JN5169 single chip wireless microcontroller

The JN5169-001-M0x-2 series is constru cted around the JN5169-001 single chip wireless

microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and

EEPROM memory and a range of analog and digital peripherals.

The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2).

DIO15[8] 24 I/O DIO15 — DIO15

SIF_D — serial interface data

RXD0 — UART 0 receive data input

RXD1 — UART 1 receive data input

JTAG_TDI — JTAG data input

SPISEL2 — SPI-bus master select output 2

SPISCLK — SPI-bus slave clock input

DIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16

COMP1P — comparator positive input

SIF_CLK — Serial Interface clock

SPISMOSI — SPI-bus Slave Master Out Slave In input

DIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17

COMP1M — COMP1M; comparator negative input

SIF_D — Serial Interface Data

SPISMISO — SPI-bus Slave Master In Slave Out output

PWM4 — PWM 4 output

VREF/ADC2 27 P VREF — ana log peripheral reference voltage

IADC2 — ADC input 2

Table 3. Pin de scription …continued

Symbol Pin Type[1] Description

Product data sheet Rev. 3.0 — 19 September 2016 10 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

9.2 Peripherals

The performance of all periphe rals is defined in the JN5169 Wireless Microcontroller

Datasheet (see Ref. 2).

NXP supplies all the development tools and networking stacks needed to enable

end-product development to occur quickly and efficiently. These are all freely available

from the NXP Wireless Connectivity (see Ref. 3). A range of evaluation/developer kits is

also available, allo win g pr od uc ts to be quickly brea d board ed . Efficient deve lopm en t of

software applications is enabled by the provision of a complete, unlimited, software

developer kit. Together with the available libraries for the IEEE802.15.4 MAC and

ZigBee 3.0 and ZigBee PRO network st acks, this p ackage provides everything required to

develop applic at ion cod e and to trial it wit h hard wa re rep r ese ntative of the final mo d ule.

The modules can be user programmed both in development and in production using

software supplied by NXP. Access to the on-chip peripherals, MAC and network stack

software is pr ovided through specific APIs. This information is available on the NXP

support website, together with many example applications, user guides, re ference

manuals and application notes.

Table 4. Peripherals description

Peripherals JN5169-001-M00-2 JN5169-001-M03-2 JN5169-001-M06-2 Notes

Master SPI-bus port 3 selects 3 selects 3 selects 250 kHz - 16 MHz

Slave SPI-bus port 1 1 1 250 kHz - 4 MHz

UART 2 2 2 16550 compatible

Two-wire serial I/F (compatible with

SMbus and I2C-bus) 111Up to 400 kHz

PWM 16 MHz clock

timer 444

timer/counter 1 1 1

Programmable Sleep Timers22232kHz clock

Digital IO lines (multiplexed with

UARTs, timers and SPI-bus selects) 20 20 18 DIO2 and DIO3 are

not available on

JN5169-001-M06-2

modules

Analog-to-Digital converter 6 6 6 10-bit, up to

100 ks/s

Programmable analog comparator111ultra low-power

mode for sleep

Internal temperature sensor 1 1 1

Internal battery sensor 1 1 1

Product data sheet Rev. 3.0 — 19 September 2016 11 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

10. Limiting values

11. Recommended operating conditions

[1] To reach the maximum TX power, 2.8 V is the minimum.

12. Characteristics

12.1 DC current

[1] To reach the maximum TX power, VDD = 2.8 V is the minimum.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.3 +3.6 V

VVREF/ADC2 voltage on pin VREF/ADC2 0.3 VDD + 0.3

VADC1 voltage on pin ADC1 0.3 VDD + 0.3

VIO(dig) digital input/output voltage 0.3 VDD + 0.3

Tstg storage temperature 40 +150 C

Table 6. Op erating conditions

Symbol Parameter Conditions Min Max Unit

VDD supply voltage [1] 23.6V

Tamb ambient temperature standard range 40 +85 C

Table 7. Ac tive processing

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD supply current M00

radio in receive mode; maximum input level at 10 dBm - 17.8 - mA

radio in receive mode; maximum input level at 0 dBm - 16.1 - mA

radio in transmit mode 10 dBm [1] -25-mA

radio in transmit mode 8.5 dBm [1] - 22.7 - mA

M03

radio in receive mode; maximum input level at 10 dBm - 17.8 - mA

radio in receive mode; maximum input level at 0 dBm - 16.1 - mA

radio in transmit mode 10 dBm [1] -25-mA

radio in transmit mode 8.5 dBm [1] - 22.7 - mA

M06

radio in receive mode - 21.5 - mA

radio in transmit mode [1] - 153 - mA

Product data sheet Rev. 3.0 — 19 September 2016 12 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

[1] Waiting on chip RESET or I/O event.

12.2 AC characteristics

12.2.1 Radio transceiver

These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V

to 3.6 V and offers the improved RF characteristics shown in Table 10. All RF

characteristics are measured single ended.

[1] With external matching inductors and assuming PCB layout.

Table 8. Sleep mode

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD(IO) input/outpu t supply

current in sleep mode; with I/O and RC oscillator

timer wake-up; Tamb =25C-0.73-A

Table 9. Deep sleep mode

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD supply current deep sleep mode; measured at 25 C and

VDD = 3.3 V [1] -70-nA

Table 10. RF port characteristics

Single-ended; Impedance = 50



[1]; VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

frange frequency range 2.4 - 2.485 GHz

Table 11. Radio transceiver characteristics: +25 C

VDD = 2 V to 3.6 V; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Receiver

M00

SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96 - dBm

Pi(RX)(max) maximum receiver input

power 1 % PER, measured as sensitivity; supply

current at 17.8 mA -10-dBm

1 % PER, measured as sensitivity; supply

current at 16.2 mA -0-dBm

RSSI RSSI variation 95 dBm to 10 dBm; available through

JN5169M0x Integrated Peripherals API 4- +4dB

M03

SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96 - dBm

Pi(RX)(max) maximum receiver input

power 1 % PER, measured as sensitivity; supply

current at 17.8 mA -10-dBm

1 % PER, measured as sensitivity; supply

current at 16.2 mA -0-dBm

RSSI RSSI variation 95 dBm to 10 dBm; available through

JN5169M0x Integrated Peripherals API 4- +4dB

M06

JN5169M0x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.0 — 19 September 2016  13 of 27
NXP Semiconductors JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
[1] To reach the maximum TX power, 2.8 V is the minimum on VDD.
[2] Up to an extra 2.5 dB of attenuation is available if required.
13. Application information
13.1 Federal Communication Commission Interference Statement
This equipment has been  tested and found to comply with the limits for a Class B digital 
device, according to Part 15 of the FCC Rules, see Ref. 4. These limits are designed to 
provide reasonable protection against harmful interference in a residential ins tallation. 
This equipment generates, uses, and can radiate radio frequency energy and, if not 
insta lled and used in accord ance with th e instructions, may cause harmful interference to 
radio communications. However, there is no guarantee that interference will not occur in a 
particular installation. If this equipment does cause harmful interference to radio or 
television reception, which can be determined by turning the equipment off and on, the 
user is encouraged to try to correct the interference by one of the following  measures:
•Reorient or reloca te  the re ce iving an te nn a
•Increase the separation between the equipment and receiver
•Connect the equipment into an outlet on a circuit different from that to which the 
receiver is connected
•Consult the dealer or an experienced radio/TV technician for help
This device complies with Part 15 of the FCC Rules, see Ref. 4. Operation is subject to 
the following two conditions:
1. This device may not cause harmful interference
SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 100 - dBm
Pi(RX)(max) maximum receiver input 
power 1 % PER, measured as sensitivity - 5 - dBm
RSSI RSSI variation 100 dBm to 25 dBm; available through 
JN5169M0x Integrated Peripherals API 4- +4dB
Transmitter
M00
Pooutput power IDD = 27.2 mA [1] -10-dBm
IDD = 23.6 mA [1] -8.5-dBm
Po(cr) control range output 
power in 6 major steps and then 4 fine steps [2] -42 - dB
M03
Pooutput power IDD = 27.2 mA [1] -10-dBm
IDD = 23.6 mA [1] -8.5-dBm
Po(cr) control range output 
power in 6 major steps and then 4 fine steps [2] -42 - dB
M06
Pooutput power [1] -22-dBm
Table 11. Radio transceiver characteristics: +25 C …continued
VDD = 2 V to 3.6 V; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 3.0 — 19 September 2016 14 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

2. this device must accept any interference received, including interference that may

cause undesir ed op er at i on

FCC Caution: Any changes or modifications not expressly approved by the party

responsible for compliance could void the user's authority to operate this equipmen t.

Remark: FCC Radiation Exposure Statement:

This portable equipment with its antenna complies with FCC’s RF radiation exposure

limits set forth for an uncontrolled environment. To maint ain compliance, follow the

instructions below;

1. This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter.

2. Avoid direct contact to the an te nn a , or keep it to a minimum while using this

equipment.

This transmitter module is authorized to be used in other devices only by OEM integrator s

under the following condition:

The transmitter module must not be co-located with any other antenna or transmitter.

As long as the above condition is met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end product for any

additional compliance requirements required with this module installed (for example,

digital device emissions, PC peripheral requirements, etc.).

This applies to the JN5169-001-M00-2 and JN5169-001-M03-2 devices, the

JN5169-001-M06-2 is a mobile device (see Section 13.1.2).

13.1.1 Antennas approved by FCC for use with JN5169-001-M0x-2

Table 12. Antennas description (FCC)

Brand Model Number Description Gain (dBi) Connector type

1 Aveslink Technology, Inc E-0005-AC vertical- flying lead 2 RP-SMA

2 Aveslink Technology, Inc E-2411-GC vertical - swivel 2 RP-SMA

3 Aveslink Technology, Inc E-2410-CA vertical - bulkhead- flying lead 2 FL

4 Aveslink Technology, Inc E-2410-HA vertical- flying lead 2 FL

5 Aveslink Technology, Inc E-2410-GC vertical - swivel 2 RP-SMA

6 Aveslink Technology, Inc E-2820-CA vertical - bulkhead- flying lead 2 FL

7 Aveslink Technology, Inc E-2820-GC vertical - swivel 2 RP-SMA

8 Embedded Antenna Design FBKR35068-RS-KR vertical - knuckle antenna 2 RP-SMA

9 Nearson S131CL-L-PX-2450S vertical - knuckle-flying lead 2 FL

10 Laird Technologies WRR2400-IP04 vertical - knuckle-flying lead 1.5 FL

11 Laird Technolog ies WRR2 400-RPSMA vertical - knuckle-flying lead 1.3 RP-SMA

12 Aveslink Technology, Inc E-6170-DA vertical - right angle 1 FL

13 Laird Technologies WCR2400-SMRP vertical - knuckle antenna 1 RP-SMA

Product data sheet Rev. 3.0 — 19 September 2016 15 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

This device has been designed to operate with the antennas listed above, and having a

maximum gain of 2 dBi. Alternative vertical antennas may be used provided that the gain

does not exceed 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohib ited

for use with this device.

The required antenna impedance is 50 .

13.1.2 High-power module usage limitation

The high-power module vari ants are classified as ‘mobile’ device pursuant with FCC §

2.1091 and must not be used at a distance of < 20 cm (8”) from any people. This applies

to the JN5169-001-M06-2 module type (XXMJN5169M6V2).

Remark: In the event that th es e c ond i tio ns ca nn ot be met (fo r certain configurations or

co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID cannot be used on the final product. In these circumstances, the

OEM integrator will be responsible for re-evaluating the end product (including the

transmitter ) an d ob taining a separate FC C aut ho r ization.

The OEM integrator has to be aware not to provide information to the end user regarding

how to install or remove this RF module in the user manual of the end product.

The user manual for the end product mu st include the following information in a prominent

location;

“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this

transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.”

13.1.3 FCC end product labeling

The final ‘end product’ should be labeled in a visible area with the following:

“Contains TX FCC ID: XXMJN5169M0V2, XXMJN51 69M3V2 or XXMJN5169M6V2” to

reflect the version of the module being used inside the pr oduct.

13.2 European R&TTE Directive 1999/5/EC statement

JN5169-001-M00-2 and JN5169-001-M03-2 are compliant with ETSI EN 300 328 V1.9,

EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN

60950-1:2006 (2006-06) and are subject to a Notified Body Opinion.

These modules are approved for use with the antennas listed in the following table. The

JN5169-001-M06-2 module is not approved for use in Europe.

Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi.

Table 13. Antennas description (R&TTE)

Brand Model Number Description Gain (dBi) Connector type

1 Aveslink Technology, Inc E-0005-AC vertical- flying lead 2 RP-SMA

2 Aveslink Technology, Inc E-2411-GC vertical - swivel 2 RP-SMA

3 Aveslink Technology, Inc E-2410-CA vertical - bulkhead- flying lead 2 FL

4 Aveslink Technology, Inc E-2410-HA vertical- flying lead 2 FL

5 Aveslink Technology, Inc E-2410-GC vertical - swivel 2 RP-SMA

Product data sheet Rev. 3.0 — 19 September 2016 16 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

6 Aveslink Technology, Inc E-2820-CA vertical - bulkhead- flying lead 2 FL

7 Aveslink Technology, Inc E-2820-GC vertical - swivel 2 RP-SMA

8 Embedded Antenna Design FBKR35068-RS-KR vertical - knuckle antenna 2 RP-SMA

9 Nearson S131CL-L-PX-2450S vertical - knuckle-flying lead 2 FL

10 Laird Technologies WRR2400-IP04 vertical - knuckle-flying lead 1.5 FL

11 Laird Technolog ies WRR2 400-RPSMA vertical - knuckle-flying lead 1.3 RP-SMA

12 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 FL

13 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA

Table 13. Antennas description (R&TTE) …continued

Brand Model Number Description Gain (dBi) Connector type

Product data sheet Rev. 3.0 — 19 September 2016 17 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

14. Footprint and PCB placement

14.1 Footprint information for reflow soldering

14.2 Optimal PCB placement of the module JN5169-001-M00-2

The JN5169-001-M00-2 module features an optimised, low cost, integrated, inverted F,

printed PCB antenna. The antenna has a vertically polarised near omnidirectional

radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in

order to increase the ground plane area which increases the antenna efficiency. This

allows stan d alone operation without any additional ground plane however care must be

taken when mounting this module onto another PCB. The area around the antenna must

be kept clear of conductors or other metal objects for an absolute minimum of 20 mm.

This is true for all layers of the PCB and not just the top layer. Any conductive objects

close to the antenna could severely disru pt the antenna p attern resulting in deep nulls and

high directivity in some directions.

The Figure 5 shows var ious possible scenarios. The top 3 scenarios are correct;

groundplane may be placed beneath JN5169-001-M00-2 modules a s long as it does not

protrude beyond the edge of the top layer ground plane on the module PCB.

The bottom 3 scena r i os ar e inc or re ct; the left-hand side example because there is

groundplane underneath the antenna, the middle example because there is insufficient

clearance around the antenna (it is best to have no conductors anywhere near the

antenna), finally the right-hand example has a ba ttery’ s meta l casing in the recommend ed

keep out area.

All modules have the same footprint.

Fig 4. Footprint information for reflow sold erin g of modules

aaa-022825Dimensions in mm

2.54

1.27

3.30

1.5

Ø 1

Product data sheet Rev. 3.0 — 19 September 2016 18 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

14.3 Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide,

as well as the p aste manufacturer’s guidelines on peak flow te mperature, soak times, time

above liquid and ramp rates.

Fig 5. PCB placement of the JN5169-001-M00-2 modules

aaa-024222

Fig 6. Guide for reflow profile of JN5169-001-M0x-2

Time (seconds)

aaa-024461

100

150

200

250

020 40 60 80 100 120 140 160 180 200 220 240 260 280

Temperature

(°C)

Product data sheet Rev. 3.0 — 19 September 2016 19 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

14.4 Soldering paste and cleaning

NXP does not recommend use of a solder paste that requires the module and PCB

assembly to be cleaned (rinsed in water) for the following reasons:

•Solder flux residues and water can be tra pped by the PCB, can or components and

result in short circuits

NXP recommends use of a 'no clean' solder paste for all its module products.

Table 14. Recommended solder reflow profile

Temperature range (°C) Target time range (s)

from 25 to ~160 between 90 and ~130

from 160 to ~220 between 30 and ~60

from 220 to ~230 between 20 and ~50

from 230 to ~peak between 10 and ~20

from 25 to ~peak between 150 and ~260

Product data sheet Rev. 3.0 — 19 September 2016 20 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

15. Package outline

Fig 7. Package outline JN5169-001-M00-2

Fig 8. Package outline JN5169-001-M03-2

2.54 3.30

2.54

1.27

aaa-022826

Dimensions in mm

Thickness: 3.5 mm

aaa-022827

Dimensions in mm

Thickness: 3.5 mm

2.54 3.30

2.54

1.27

2.53

10.85

Product data sheet Rev. 3.0 — 19 September 2016 21 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

16. Abbreviations

Fig 9. Package outline JN5169-001-M06-2

aaa-022828

Dimensions in mm

Thickness: 3.5 mm

2.54 3.30

2.54

1.27

2.81

Table 15. Abbreviations

Acronym Description

AC Alternating Current

ADC Analog-to-Digital Converter

API Application Program Interface

CE Conformity European

CPU Central Processing Unit

DC Direct Current

DIO Digital Input Output

EEPROM Electrically Erasable Programmable Read-Only Memory

FCC Federal Communicati on Commission

ID IDentification

IO Input Output

ISM Industrial, Scientific and Medical radio bands

JTAG Joint Test Action Group

LNA Low Noise Amplifier

Product data sheet Rev. 3.0 — 19 September 2016 22 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

17. References

[1] IEEE Std 802.15.4-2003 — IEEE Std 802.15.4-2003 IEEE Standard for Information

Technology – Part 15.4 Wir eless Medium Access Control (MAC) and Physical Laye r

(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).

[2] JN5169 — JN5169 wireless microcontroller data sheet.

[3] Wireless Connectivity —

http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE

LESS-CONNECTIVITY

[4] Part 15 of the FCC Rules —

http://www.ecfr.gov/cgi-bin/text-idx?SID=d01e00935bfcb0d53b914e7c8e63f383&no

de=47:1.0.1.1.16&rgn=div5

MAC Media Access Control

OEM Original Equipment Manufacturer

PC Pulse Counter

PCB Printed-Circuit Board

PER Packet Error Rate

PRO PROtocol

PWM Pulse-Width Modulation

TX Transmit

R&TTE Radio And Terminal Telecommunication Equipment

RAM Random Access Memory

RC Resistance-Capacitance

RF Radio Frequency

RISC Reduced Instruction Set Computing

RoHS Restriction of Hazardous Substance

RSSI Received Signal Strength Indicator

RX Receive

UART Universal Asynchronous Receiver Transmitter

Table 15. Abbreviations …continued

Acronym Description

JN5169M0x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.0 — 19 September 2016  23 of 27
NXP Semiconductors JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
18. Revision history
 
Table 16. Revision history
Document ID Release date Data sheet status Change notice Supersedes
JN5169-001-M0x-2 v3.0 20160919 Product data sheet - JN5169-001-M0x-2 v2.0
Modifications: •Section 1 updated.
•Section 2 updated.
•Section 4 updated.
•Section 6 updated.
•Figure 2 updated.
•Figure 3 updated.
•Table 7 updated.
•Table 9 updated.
•Table 11 updated.
•Table 12 updated.
•Table 13 updated.
•Section 14 updated.
•Section 14.3 added.
•Section 14.4 added.
•Section 17 updated.
JN5169-001-M0x-2 v2.0 20160530 Preliminary data sheet - JN5 169-001-M0x-2 v1.1
JN5169-001-M0x-2 v1.1 20160524 Objective data sheet - JN5169-001-M0x-2 v1.0
JN5169-001-M0x-2 v1.0 20160513 Objective data sheet - -
Modifications: •initial version.

Product data sheet Rev. 3.0 — 19 September 2016 24 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

19.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipme nt, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environment al

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for t he customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contain s data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3.0 — 19 September 2016 25 of 27

NXP Semiconductors JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

Translations — A non-English (translated) versio n of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

19.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

I2C-bus — logo is a trademark of NXP B.V.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

JN5169M0x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.0 — 19 September 2016  26 of 27
NXP Semiconductors JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
21. Tables
Table 1.  Ordering information  . . . . . . . . . . . . . . . . . . . . .4
Table 2.  Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Table 3.  Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 4.  Peripherals description  . . . . . . . . . . . . . . . . . .10
Table 5.  Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 6.  Operating conditions  . . . . . . . . . . . . . . . . . . . .11
Table 7.  Active processing  . . . . . . . . . . . . . . . . . . . . . .11
Table 8.  Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 9.  Deep sleep mode  . . . . . . . . . . . . . . . . . . . . . . 12
Table 10.  RF port characteristics  . . . . . . . . . . . . . . . . . . 12
Table 11.  Ra dio transceiver characteristics: +25 °C . . . . 12
Table 12.  Antennas description (FCC)  . . . . . . . . . . . . . . 14
Table 13.  Antennas description (R&TTE) . . . . . . . . . . . . 15
Table 14.  Recommended solder reflow profile  . . . . . . . . 19
Table 15.  Abbreviations  . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16.  Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23
22. Figures
Fig 1.  JN5169-001-M0x-2 package marking (top view). .4
Fig 2.  Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Fig 3.  Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .6
Fig 4.  Footprint information for reflow soldering of 
modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Fig 5.  PCB placement of the JN5169-001-M00-2 
modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Fig 6.  Guide for reflow profile of JN5169-001-M0x-2. . .18
Fig 7.  Package outline JN5169-001-M00-2 . . . . . . . . . .20
Fig 8.  Package outline JN5169-001-M03-2 . . . . . . . . . .20
Fig 9.  Package outline JN5169-001-M06-2 . . . . . . . . . .21

NXP Semiconductors JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
© NXP Semiconductors N.V. 2016. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 September 2016
Document  identifier: JN5169M0x
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’. 
Contents
General description. . . . . . . . . . . . . . . . . . . . . .  1
1  Regulatory Approvals. . . . . . . . . . . . . . . . . . . .  1
Features and benefits . . . . . . . . . . . . . . . . . . . .  2
1  Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2
2  Features: modules . . . . . . . . . . . . . . . . . . . . . .  2
3  Features: microcontroller . . . . . . . . . . . . . . . . .  3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
Ordering information. . . . . . . . . . . . . . . . . . . . .  4
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .  5
Pinning information. . . . . . . . . . . . . . . . . . . . . .  6
1  Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
2  Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  6
Functional description  . . . . . . . . . . . . . . . . . . .  9
1  JN5169 single chip wireless microcontroller. . .  9
2  Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .  10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .  11
Recommended operating conditions. . . . . . .  11
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . .  11
1  DC current . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
2  AC characteristics. . . . . . . . . . . . . . . . . . . . . .  12
2.1  Radio transceiver . . . . . . . . . . . . . . . . . . . . . .  12
Application information. . . . . . . . . . . . . . . . . .  13
1  Federal Communication Commission Interference 
Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
1.1  Anten nas approved by FCC for use with 
JN5169-001-M0x-2. . . . . . . . . . . . . . . . . . . . .  14
1.2  High-power module usage li mitation. . . . . . . .  15
1.3  FCC end product labeling. . . . . . . . . . . . . . . .  15
2  European R&TTE Directive 1999/5/EC 
statement . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Footprint and PCB placement  . . . . . . . . . . . .  17
1 Footprint information for reflow soldering . . . .  17
2  Optimal PCB placement of the mo dule 
JN5169-001-M00-2. . . . . . . . . . . . . . . . . . . . .  17
3  Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .  18
4  Soldering paste and cleaning . . . . . . . . . . . . .  19
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  20
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . .  21
References . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  23
Legal information. . . . . . . . . . . . . . . . . . . . . . .  24
1  Data sheet status . . . . . . . . . . . . . . . . . . . . . .  24
2  Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .   24
3  Disclaimers  . . . . . . . . . . . . . . . . . . . . . . . . . .   24
4  Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .   25
Contact information . . . . . . . . . . . . . . . . . . . .   25
Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   26
Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   27