RMB2S and RMB4S Vishay Semiconductors formerly General Semiconductor Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifier Reverse Voltage 200 to 400 V Forward Current 0.5 A Reverse Recovery time 150 ns TO-269AA (MBS) 0.029 (0.74) 0.017 (0.43) Mounting Pad Layout 0.161 (4.10) 0.144 (3.65) 0.272 (6.90) 0.252 (6.40) 0.023 MIN. (0.58 MIN.) Dimensions in inches and (millimeters) 0.105 (2.67) 0.095 (2.41) 0.195 (4.95) 0.179 (4.55) 0-8 o 0.272 MAX. (6.91 MAX.) 0.205 (5.21) 0.195 (4.95) 0.030 MIN. (0.76 MIN.) 0.049 (1.24) 0.039 (0.99) 0.062 (1.57) 0.058 (1.47) 0.106 (2.70) 0.090 (2.30) 0.114 (2.90) 0.094 (2.40) 0.0075 (0.19) 0.0065 (0.16) 0.038 (0.96) 0.019 (0.48) Mechanical Data 0.008 (0.20) 0.004 (0.10) 0.114 (2.90) 0.110 (2.80) 0.058 (1.47) 0.054 (1.37) 0.016 (0.41) 0.006 (0.15) 0.018 (0.46) 0.014 (0.36) Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.0078 oz., 0.22 g Packaging Codes-Options (Antistatic): 80/ 3K per 13" Paper Reel, 36K/carton 0.105(2.67) 0.095(2.41) Features * Plastic package has UL Flammability Classification 94V-0 * This series is UL recognized under Component Index, file number E54214 * Glass passivated chip junctions * Saves space on printed circuit boards * Fast recovery, low switching loss * High temperature soldering guaranteed: 260C/10 seconds at 5 lbs. (2.3kg) tension Maximum Ratings and Thermal Characteristics (T Parameter Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified - on glass-epoxy P.C.B. current at TA=30C - on aluminum substrate Peak forward surge current 8.3msec single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t<8.3ms) Typical thermal resistance per leg Operating junction and storage temperature range Symbol VRRM VRMS VDC A = 25C unless otherwise noted) RMB2S 2R 200 140 200 RMB4S 4R 400 280 400 Unit V V V IF(AV) 0.5(1) 0.8(2) IFSM 30 A It RJA RJA RJL TJ, TSTG 5.0 85(1) 70(2) 20(1) 55 to +150 A sec 1.25 5.0 100 150 13 V 2 A 2 C/W C Electrical Characteristics (TA = 25C unless otherwise noted) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at TA=25C rated DC blocking voltage per leg TA=125C Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Typical junction capacitance per leg at 4.0V, 1MHz VF IR trr CJ A ns pF Notes: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads (2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad Document Number 88705 29-Jul-03 www.vishay.com 1 RMB2S thru RMB4S Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current Per Leg 35 0.8 Peak Forward Surge Current (A) Average Forward Rectified Current (A) Fig. 1 - Maximum Forward Current Derating Curve 0.7 Aluminum Substrate 0.6 0.5 0.4 Glass Epoxy P.C.B. 0.3 0.2 0.1 25 20 f = 60Hz f = 50Hz 15 10 5.0 1.0 Cycle Resistive or Inductive Load 0 0 0 20 40 60 80 100 120 1 160 140 100 10 Ambient Temperature (C) Number of Cycles Fig. 3 - Typical Instantaneous Forward Characteristics Per Leg Fig. 4 - Typical Reverse Leakage Characteristics Per Leg 100 Instantaneous Reverse Leakage Current (A) 10 Instantaneous Forward Current (A) TA = 40C Single Half Sine-Wave (JEDEC Method) 30 Pulse Width = 300s 1% Duty Cycle TJ = 125C 10 1 TJ = 150C TJ = 25C 0.1 1 0.1 TJ = 25C 0.01 0.01 0.2 0.4 0.6 0.8 1.2 1.0 1.4 Instantaneous Forward Voltage (V) 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig. 5 - Typical Junction Capacitance Per Leg Junction Capacitance (pF) 30 TJ = 25C f = 1.0 MHz Vsig = 50mVp-p 25 20 15 10 5.0 0 0.1 1 10 100 200 Reverse Voltage (V) www.vishay.com 2 Document Number 88705 29-Jul-03