RMB2S and RMB4S
Vishay Semiconductors
formerly General Semiconductor
Document Number 88705 www.vishay.com
29-Jul-03 1
Miniature Glass Passivated Fast Recovery
Surface Mount Bridge Rectifier Reverse Voltage 200 to 400 V
Forward Current 0.5 A
Reverse Recovery time 150 ns
0.029 (0.74)
0.017 (0.43)
0-8o0.049 (1.24)
0.039 (0.99)
0.062 (1.57)
0.058 (1.47)
0.016 (0.41)
0.006 (0.15)
0.018 (0.46)
0.014 (0.36)
0.008 (0.20)
0.004 (0.10)
0.114 (2.90)
0.110 (2.80)
0.058 (1.47)
0.054 (1.37)
0.252 (6.40)
0.272 (6.90)
0.106 (2.70)
0.090 (2.30)
0.0075 (0.19)
0.0065 (0.16)
0.105 (2.67)
0.095 (2.41)
0.195 (4.95)
0.179 (4.55)
0.144 (3.65)
0.161 (4.10)
0.205 (5.21)
0.195 (4.95)
0.114 (2.90)
0.094 (2.40) 0.038 (0.96)
0.019 (0.48)
Dimensions in inches
and (millimeters)
0.272 MAX.
(6.91 MAX.)
0.105(2.67)
0.095(2.41)
0.030 MIN.
(0.76 MIN.)
0.023 MIN.
(0.58 MIN.)
Mounting Pad Layout
Maximum Ratings and Thermal Characteristics(TA= 25°C unless otherwise noted)
Parameter Symbol RMB2S RMB4S Unit
Device marking code 2R 4R
Maximum repetitive peak reverse voltage VRRM 200 400 V
Maximum RMS voltage VRMS 140 280 V
Maximum DC blocking voltage VDC 200 400 V
Maximum average forward output rectified
current at TA=30°C - on glass-epoxy P.C.B. IF(AV) 0.5(1) A
- on aluminum substrate 0.8(2)
Peak forward surge current 8.3msec single half sine-wave
superimposed on rated load (JEDEC Method) IFSM 30 A
Rating for fusing (t<8.3ms) I2t 5.0 A2sec
RΘJA 85(1)
Typical thermal resistance per leg RΘJA 70(2) °C/W
RΘJL 20(1)
Operating junction and storage temperature range TJ, TSTG 55 to +150 °C
Electrical Characteristics(TA= 25°C unless otherwise noted)
Maximum instantaneous forward voltage drop per leg at 0.4A VF1.25 V
Maximum DC reverse current at TA=25°C 5.0
rated DC blocking voltage per leg TA=125°CIR100 µA
Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A trr 150 ns
Typical junction capacitance per leg at 4.0V, 1MHz CJ13 pF
Notes: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
Features
• Plastic package has UL Flammability Classification 94V-0
• This series is UL recognized under Component Index,
file number E54214
• Glass passivated chip junctions
• Saves space on printed circuit boards
• Fast recovery, low switching loss
• High temperature soldering guaranteed:
260°C/10 seconds at 5 lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any Weight: 0.0078 oz., 0.22 g
Packaging Codes-Options (Antistatic):
80/3K per 13" Paper Reel, 36K/carton
TO-269AA (MBS)
RMB2S thru RMB4S
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88705
229-Jul-03
110 100
0
5.0
10
15
20
25
30
35
020 40 60 80 100
0.01
0.1
1
10
100
0.2 0.4 0.6 0.8 1.0 1.2 1.4
0.01
0.1
1
10
0.1 110 100
0
5.0
10
15
20
25
30
200
020 40 60 80 100 120 140 160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current Per Leg
Peak Forward Surge Current (A)
Number of Cycles
Fig. 1 – Maximum Forward Current
Derating Curve
Average Forward Rectified Current (A)
Ambient Temperature (°C)
Instantaneous Forward Voltage (V)
Fig. 3 – Typical Instantaneous
Forward Characteristics Per Leg Fig. 4 – Typical Reverse Leakage
Characteristics Per Leg
Instantaneous Reverse Leakage Current
(µA)
Percent of Rated Peak Reverse Voltage (%)
Resistive or Inductive Load
Aluminum Substrate
Glass Epoxy P.C.B.
TA = 40°C
Single Half Sine-Wave
(JEDEC Method)
Pulse Width = 300µs
1% Duty Cycle
Instantaneous Forward Current (A)
TJ = 125°C
TJ = 25°C
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 – Typical Junction Capacitance
P er Leg
1.0 Cycle
f = 60Hz
f = 50Hz
TJ = 150°C
TJ = 25°C
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
