Data Sheet 1 2003-04-28
Ternary PIN Photodiode
with Integrated Preamplifier IC
SRP00264x
SRP00265x
Fiber Optics
Features
• InGaAs/InP PIN photodiode with preamplifier IC
• Designed for SONET OC-24 applications in fiber-
optics communication systems
• Sensitive receiver for 2nd and 3rd optical window
(1300 nm and 1550 nm)
• Suitable for bit rates up to 1.25 Gbit/s
• Module with high optical sensitivity
• Fast switching times
• Low dark current
• Excellent noise immunity
• High reverse current stability from planar structure
• Hermetically sealed TO46 package
SRP00264x
SRP00265x
Pin Configuration
Data Sheet 2 2003-04-28
Pin Configuration
Figure 1 Receiver with Preamp
File: 6309
Receiver with Preamp (bottom view)
1
2
3
4
2.54 mm
1
Out+
VCC
Out−
Pin
Pre-
amp
3
4
2
Pinning
SRP00264x
SRP00265x
Description
Data Sheet 3 2003-04-28
Description
The Infineon optical receiver module has been designed for use in optical networks and
is suitable for bit rates up to max. 2.5 Gbit/s if used without any TIA.
The optical receiver module uses a high-speed PIN photodetector optional coupled with
a hybrid low noise transimpedance amplifier (PIN-TIA). The optical receiver photodiode
can be used for 1310 nm or 1550 nm optical communications.
The PIN photodiode is made of InGaAs/InP and has an active diameter of 75 µm. The
function of the PIN and PIN-TIA optical receiver module is to detect input optical power,
to transduce the incident radiation into current (PIN) and then to convert the current into
a voltage (PIN-TIA).
The low input noise current density of the used transimpedance amplifiers in PIN-TIA’s
provides the optical receiver module, when used with appropriate filtering, with ample
sensitivity for realizing minimum input power requirements. Designers of optical
receivers can use the module in any application that benefits from integration of the
photodiode and TIA into a TO coaxial package. Typical for such applications are
receivers for digital crossconnects, digital loop carriers, add/drop-multiplexers and
optical network units.
Last but not least the fast switching times, low dark currents and the packaging in a
compact and hermetically sealed TO46 make the optical receivers usable in many other
fiber optic receiver applications. One application is the use in a Compact realization of a
transceiver in one module like the so called BIDI® (Figure 2).
Figure 2 Compact Realization of the Transceiver in One Module
TO-Detector
Glass Lens
Fiber
Beam Splitter
TO-
Laser
SRP00264x
SRP00265x
Technical Data
Data Sheet 4 2003-04-28
Technical Data
The electro-optical characteristics described in the following table are only valid for use
within the specified maximum ratings or under the recommended operating conditions.
Characteristics for Pin-Preamp Receivers at TA = 25°C, unless otherwise specified.
Absolute Maximum Ratings
Parameter Symbol Limit Values Unit
min. max.
Module
Operating temperature range at case TC–40 85 °C
Storage temperature range Tstg –40 85 °C
Soldering temperature (tmax = 10 s,
2 mm distance from bottom edge of case)
TS260 °C
Receiver Diode
Reverse voltage VR20 V
Forward current IF10 mA
Optical power into the optical port Pport 1mW
Preamp Characteristics
Parameter Symbol Limit Values Unit
min. typ. max.
DC-Characteristics
Supply voltage VCC 4.5 5 5.5 V
Supply current ICC 35 47 65 mA
AC-Characteristics
Optical sensitivity
(BER 10–9, PN23) S–25 –27 dBm
Linear bandwidth (–3 dB) BW 800 MHz
Optical overload (avg.) Pmax 0dBm
Transimpedance (single ended) RT20 25 30 kW
Output resistance Rout 48 60 72 W
Gain (differential) G 40 V/mW
Return loss, l = 1310 nm RL –27 dB
SRP00264x
SRP00265x
Technical Data
Data Sheet 5 2003-04-28
Some Eye Diagrams
Figure 3 Popt = 2 µW avg. (OC-24)
Figure 4 Popt = 100 µW avg. (OC-24)
Figure 5 Popt = 10 µW avg. (OC-24)
Figure 6 Popt = 500 µW avg. (OC-24)
SRP00264x
SRP00265x
Fiber Data
Data Sheet 6 2003-04-28
Fiber Data
The mechanical fiber characteristics are described in the following table.
Fiber Characteristics
Parameter Limit Values Unit
min. typ. max.
Mode field diameter 50 µm
Cladding diameter 123 125 127 µm
Mode field/cladding concentricity error 1 µm
Cladding non-circularity 2 %
Mode field non-circularity 6 %
Cut off wavelength 1270 nm
Jacket diameter 0.8 1 mm
Bending radius 30 mm
Tensile strength fiber case 5 N
Length 0.8 1.2 m
SRP00264x
SRP00265x
Package Outlines
Data Sheet 7 2003-04-28
Package Outlines
Figure 7
Dimensions in mm
SRP00264x
SRP00265x
SRP00264x
SRP00265x
Package Outlines
Data Sheet 8 2003-04-28
Other connectors on request.
Flange Options
Type Flange
SRP00264x without
SRP00265x with
Connector Options
Model Type
SRP00264H
SRP00265H
MM FC/PC
SRP00264G
SRP00265G
SM FC/PC
SRP00264O
SRP00265O
MM SC/PC 0°
SRP00264N
SRP00265N
SM SC/PC 0°
SRP00264Q
SRP00265Q
MM SC 8° APC
SRP00264P
SRP00265P
SM SC 8° APC
SRP00264W
SRP00265W
MM without connector
SRP00264Z
SRP00265Z
SM without connector
Edition 2003-04-28
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
SRP00264x
SRP00265x
Revision History: 2003-04-28 DS1
Previous Version: 2001-12-01
Page Subjects (major changes since last revision)
2Figure1 changed
