MAX3237E www.ti.com SLLS709B - MAY 2006 - REVISED JANUARY 2010 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER Check for Samples: MAX3237E FEATURES 1 * * * * * * * Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates From 250 kbits/s to 1 Mbit/s Low Standby Current . . . 1 mA Typical External Capacitors . . . 4 x 0.1 mF Accepts 5-V Logic Input With 3.3-V Supply Designed to Be Interchangeable With Maxim MAX3237E Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II * ESD Protection for RS-232 I/O Pins - 15 kV - Human-Body Model (HBM) - 8 kV - IEC61000-4-2, Contact Discharge - 15 kV - IEC61000-4-2, Air-Gap Discharge APPLICATIONS * * * * * Battery-Powered, Hand-Held, and Portable Equipment PDAs and Palmtop PCs Notebooks, Sub-Notebooks, and Laptops Digital Cameras Mobile Phones and Wireless Devices QFN PACKAGE (TOP VIEW) C2 + GND C2- V- DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 DOUT5 EN SHDN 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 C1+ V+ VCC C1- DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B MBAUD V- C2- GND C2+ C1+ V+ VCC NC DB, DW, OR PW PACKAGE (TOP VIEW) 32 31 30 29 28 27 26 25 DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 NC 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 C1- DIN1 IN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 9 10 11 12 13 14 15 16 DOUT5 EN SHDN MBAUD NC ROUT1B DIN5 NC * DESCRIPTION The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode (MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/ms. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2010, Texas Instruments Incorporated MAX3237E SLLS709B - MAY 2006 - REVISED JANUARY 2010 www.ti.com The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 mA. Also, during shutdown, the onboard charge pump is disabled; V+ is lowered to VCC, and V- is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time, regardless of the EN and SHDN condition. The MAX3237EC is characterized for operation from 0C to 70C. The MAX3237EI is characterized for operation from -40C to 85C. AVAILABLE OPTIONS (1) PACKAGED DEVICES (2) TA MAX3237ECDBR 0C to 70C MAX3237ECPWR MAX3237ECRHBR (QFN package) MAX3237ECDWR MAX3237EIDBR -40C to 85C MAX3237EIPWR MAX3237EIRHBR (QFN package) MAX3237EIDWR (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Table 1. FUNCTION TABLE INPUTS (1) 2 OUTPUTS SHDN EN DOUT ROUT ROUT1B 0 0 Z (1) Active Active 0 1 Z (1) Z (1) Active 1 0 Active Active Active 1 1 Active Z (1) Active Z = high impedance (off) Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E MAX3237E www.ti.com SLLS709B - MAY 2006 - REVISED JANUARY 2010 LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 DIN3 DIN4 DIN5 SHDN MBAUD ROUT1B ROUT1 ROUT2 ROUT3 EN 24 5 23 6 22 7 19 10 17 12 DOUT1 DOUT2 DOUT3 DOUT4 DOUT5 14 15 16 21 8 20 9 18 11 RIN1 RIN2 RIN3 13 Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E 3 MAX3237E SLLS709B - MAY 2006 - REVISED JANUARY 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) -0.3 6 V V+ Positive-output supply voltage range (2) -0.3 7 V V- Negative-output supply voltage range (2) 0.3 -7 V 13 V V+ - V- Supply voltage difference VI Input voltage range VO Output voltage range (2) Package thermal impedance Tstg Storage temperature range (1) (2) (3) -0.3 6 Receiver -25 25 Driver Receiver Short-circuit duration qJA Driver (SHDN, MBAUD, EN) DOUT to GND -13.2 13.2 -0.3 VCC + 0.3 UNIT V V Unlimited (3) -65 62 C/W 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) See Figure 5 VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, SHDN, MBAUD, EN VIL Driver and control low-level input voltage DIN, SHDN, MBAUD, EN VI Receiver input voltage TA Operating free-air temperature (1) VCC = 3.3 V VCC = 5 V MAX3237EC MAX3237EI MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 2 5.5 2.4 5.5 UNIT V V 0 0.8 V -25 25 V 0 70 -40 85 C Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to 5 V. ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER II Input leakage current ICC Supply current (TA = 25C) TEST CONDITIONS DIN, SHDN, MBAUD, EN No load, SHDN = VCC (1) (2) 4 SHDN = GND Shutdown supply current SHDN = RIN = GND, DIN = GND or VCC MIN TYP (2) MAX 9 18 mA 0.5 2 mA 1 10 mA 10 300 nA UNIT Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E MAX3237E www.ti.com SLLS709B - MAY 2006 - REVISED JANUARY 2010 DRIVER SECTION ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER MIN TYP (2) TEST CONDITIONS VOH High-level output voltage DOUT at RL = 3 k to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 k to GND, DIN = VCC -5 -5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS Short-circuit output current (3) VCC = 3.6 V or 3.3 V, VO = 0 V ro Output resistance VCC, V+, and V- = 0 V, VO = 2 V (1) (2) (3) MAX V V 0.01 1 0.01 300 UNIT mA 1 mA 60 mA 50k Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. DRIVER SECTION SWITCHING CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN CL = 1000 pF, MBAUD = GND Maximum data rate CL = 1000 pF, VCC = 4.5 V to 5.5 V, MBAUD = VCC MAX UNIT 250 RL = 3 k, 1 DIN switching, See Figure 1 1000 CL = 250 pF, VCC = 3 V to 4.5 V, MBAUD = VCC kbit/s 1000 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 k to 7 k, MBAUD = VCC or GND, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 k to 7 k, TA = 25C (1) (2) (3) TYP (2) CL = 150 pF to 1000 pF CL = 150 pF to 2500 pF, 100 ns MBAUD = GND 6 30 MBAUD = VCC 24 150 MBAUD = GND 4 30 V/ms Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E 5 MAX3237E SLLS709B - MAY 2006 - REVISED JANUARY 2010 www.ti.com RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER VOH High-level output voltage IOH = -1 mA VOL Low-level output voltage IOL = 1 mA TYP (2) VCC - 0.6 VCC - 0.1 MAX VCC = 3.3 V Positive-going input threshold voltage VIT- Negative-going input threshold voltage Vhys Input hysteresis (VIT+ - VIT-) Ioz Output leakage current EN = VCC ri Input resistance VI = 3 V to 25 V 1.5 2.4 2 2.4 VCC = 5 V VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.8 1.5 UNIT V 0.4 VIT+ (1) (2) MIN TEST CONDITIONS V V V 0.5 V 0.05 10 mA 5 7 k 3 Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. RECEIVER SECTION SWITCHING CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns ten Output enable time CL = 150 pF, RL = 3 k, See Figure 4 2.6 ms tdis Output disable time CL = 150 pF, RL = 3 k, See Figure 4 2.4 ms tsk(p) Pulse skew (3) See Figure 3 50 ns TYP UNIT (1) (2) (3) ns Test conditions are C1-C4 = 0.1 mF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. ESD PROTECTION PIN TEST CONDITIONS HBM DOUT, RIN 6 15 IEC61000-4-2, Contact Discharge 8 IEC61000-4-2, Air-Gap Discharge 15 Submit Documentation Feedback kV Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E MAX3237E www.ti.com SLLS709B - MAY 2006 - REVISED JANUARY 2010 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 RL tTHL CL (see Note A) 3V SHDN = VCC TEST CIRCUIT 0V tTLH 3V 3V Output -3 V -3 V 6V SR(tr) + t THL or tTLH VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 RL Input 1.5 V 1.5 V 0V CL (see Note A) tPLH tPHL VOH 3V SHDN = VCC 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V EN = GND 3V Input 1.5 V 1.5 V -3 V Output Generator (see Note B) tPHL 50 3V EN = GND tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E 7 MAX3237E SLLS709B - MAY 2006 - REVISED JANUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V Input VCC 3 V or 0 V 1.5 V GND S1 -3 V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output CL (see Note A) EN Generator (see Note B) 50 0.3 V tPZL (S1 at VCC) tPLZ (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 8 Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E MAX3237E www.ti.com SLLS709B - MAY 2006 - REVISED JANUARY 2010 APPLICATION INFORMATION CBYPASS = 0.1 F + - 1 2 + C2 V+ 28 27 + GND C3 - - 3 4 - + C1+ C2+ C2- VCC V- C1- C4 DOUT1 DOUT2 DOUT3 RIN1 + - 26 C1 25 5 24 6 23 7 22 8 21 DIN1 DIN2 DIN3 ROUT1 5 k RS-232 Port RIN2 9 20 ROUT2 Logic I/Os 5 k DOUT4 RIN3 10 19 11 18 DIN4 ROUT3 5 k DOUT5 12 17 16 EN SHDN 13 14 15 DIN5 ROUT1B MBAUD C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC 3.3 V 0.15 V 3.3 V 0.3 V 5 V 0.5 V 3 V to 5.5 V C1 0.1 F 0.22 F 0.047 F 0.22 F C2, C3, and C4 0.1 F 0.22 F 0.33 F 1 F Figure 5. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback Copyright (c) 2006-2010, Texas Instruments Incorporated Product Folder Link(s): MAX3237E 9 PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3237ECDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3237EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX3237ECDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX3237ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX3237ECPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1 MAX3237EIDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX3237EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX3237EIPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3237ECDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3237ECDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX3237ECPWR TSSOP PW 28 2000 367.0 367.0 38.0 MAX3237EIDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3237EIDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX3237EIPWR TSSOP PW 28 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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