1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
C2+
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
EN
SHDN
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
MBAUD
DB, DW, OR PW PACKAGE
(TOP VIEW) QFN PACKAGE
(TOP VIEW)
C1–
DIN1
IN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
NC
V−
C2–
GND
C2+
C1+
V+
VCC
NC
DOUT5
EN
SHDN
MBAUD
NC
ROUT1B
DIN5
NC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
3132 30 29 28 27 26 25
109 11 12 13 14 15 16
MAX3237E
www.ti.com
SLLS709B –MAY 2006–REVISED JANUARY 2010
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
Check for Samples: MAX3237E
1FEATURES
• Meets or Exceeds the Requirements of • ESD Protection for RS-232 I/O Pins
TIA/EIA-232-F and ITU v.28 Standards – ±15 kV – Human-Body Model (HBM)
• Operates With 3-V to 5.5-V VCC Supply – ±8 kV – IEC61000-4-2, Contact Discharge
• Operates From 250 kbits/s to 1 Mbit/s – ±15 kV – IEC61000-4-2, Air-Gap Discharge
• Low Standby Current . . . 1 mA Typical APPLICATIONS
• External Capacitors . . . 4 × 0.1 mF• Battery-Powered, Hand-Held, and Portable
• Accepts 5-V Logic Input With 3.3-V Supply Equipment
• Designed to Be Interchangeable With Maxim • PDAs and Palmtop PCs
MAX3237E • Notebooks, Sub-Notebooks, and Laptops
• Latch-Up Performance Exceeds 100 mA Per • Digital Cameras
JESD 78, Class II • Mobile Phones and Wireless Devices
DESCRIPTION
The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode
(MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/ms.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3237E
SLLS709B –MAY 2006–REVISED JANUARY 2010
www.ti.com
The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device
is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 mA. Also, during shutdown, the
onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also
can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time,
regardless of the EN and SHDN condition.
The MAX3237EC is characterized for operation from 0°C to 70°C. The MAX3237EI is characterized for operation
from –40°C to 85°C.
AVAILABLE OPTIONS(1)
TAPACKAGED DEVICES(2)
MAX3237ECDBR
MAX3237ECPWR
0°C to 70°C MAX3237ECRHBR (QFN package)
MAX3237ECDWR
MAX3237EIDBR
MAX3237EIPWR
–40°C to 85°C MAX3237EIRHBR (QFN package)
MAX3237EIDWR
(1) For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
Table 1. FUNCTION TABLE
INPUTS OUTPUTS
SHDN EN DOUT ROUT ROUT1B
0 0 Z(1) Active Active
0 1 Z(1) Z(1) Active
1 0 Active Active Active
1 1 Active Z(1) Active
(1) Z = high impedance (off)
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Product Folder Link(s): MAX3237E
DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
RIN1
RIN2
RIN3
ROUT1
ROUT1B
ROUT2
ROUT3
24
23
22
21
16
20
18
5
6
7
8
9
11
DIN4 DOUT4
19 10
DIN5 DOUT5
17 12
13
EN
SHDN 14
MBAUD 15
MAX3237E
www.ti.com
SLLS709B –MAY 2006–REVISED JANUARY 2010
LOGIC DIAGRAM (POSITIVE LOGIC)
Copyright © 2006–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3237E
MAX3237E
SLLS709B –MAY 2006–REVISED JANUARY 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range(2) –0.3 6 V
V+ Positive-output supply voltage range(2) –0.3 7 V
V– Negative-output supply voltage range(2) 0.3 –7 V
V+ – V– Supply voltage difference(2) 13 V
Driver (SHDN, MBAUD, EN) –0.3 6
VIInput voltage range V
Receiver –25 25
Driver –13.2 13.2
VOOutput voltage range V
Receiver –0.3 VCC + 0.3
Short-circuit duration DOUT to GND Unlimited
qJA Package thermal impedance(3) 62 °C/W
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 5 MIN NOM MAX UNIT
VCC = 3.3 V 3 3.3 3.6
Supply voltage V
VCC = 5 V 4.5 5 5.5
VCC = 3.3 V 2 5.5
VIH Driver and control high-level input voltage DIN, SHDN, MBAUD, EN V
VCC = 5 V 2.4 5.5
VIL Driver and control low-level input voltage DIN, SHDN, MBAUD, EN 0 0.8 V
VIReceiver input voltage –25 25 V
MAX3237EC 0 70
TAOperating free-air temperature °C
MAX3237EI –40 85
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
IIInput leakage current DIN, SHDN, MBAUD, EN 9 18 mA
No load, SHDN = VCC 0.5 2 mA
Supply current SHDN = GND 1 10 mA
ICC (TA= 25°C) Shutdown supply current SHDN = RIN = GND, 10 300 nA
DIN = GND or VCC
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
4Submit Documentation Feedback Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): MAX3237E
MAX3237E
www.ti.com
SLLS709B –MAY 2006–REVISED JANUARY 2010
DRIVER SECTION ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage DOUT at RL= 3 kΩto GND, DIN = GND 5 5.4 V
VOL Low-level output voltage DOUT at RL= 3 kΩto GND, DIN = VCC –5 –5.4 V
IIH High-level input current VI= VCC ±0.01 ±1 mA
IIL Low-level input current VIat GND ±0.01 ±1 mA
IOS Short-circuit output current(3) VCC = 3.6 V or 3.3 V, VO= 0 V ±60 mA
roOutput resistance VCC, V+, and V– = 0 V, VO= ±2 V 300 50k Ω
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
DRIVER SECTION SWITCHING CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
CL= 1000 pF, 250
MBAUD = GND
CL= 1000 pF,
VCC = 4.5 V to 5.5 V, RL= 3 kΩ, 1 DIN switching, 1000
Maximum data rate kbit/s
MBAUD = VCC See Figure 1
CL= 250 pF,
VCC = 3 V to 4.5 V, 1000
MBAUD = VCC
CL= 150 pF to 2500 pF, RL= 3 kΩto 7 kΩ,
tsk(p) Pulse skew(3) 100 ns
MBAUD = VCC or GND, See Figure 2 MBAUD = GND 6 30
Slew rate, VCC = 3.3 V, CL= 150 pF to 1000 pF
SR(tr) transition region RL= 3 kΩto 7 kΩ, MBAUD = VCC 24 150 V/ms
(see Figure 1) TA= 25°C CL= 150 pF to 2500 pF, MBAUD = GND 4 30
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
Copyright © 2006–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3237E
MAX3237E
SLLS709B –MAY 2006–REVISED JANUARY 2010
www.ti.com
RECEIVER SECTION ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage IOH = –1 mA VCC – 0.6 VCC – 0.1 V
VOL Low-level output voltage IOL = 1 mA 0.4 V
VCC = 3.3 V 1.5 2.4
VIT+ Positive-going input threshold voltage V
VCC = 5 V 2 2.4
VCC = 3.3 V 0.6 1.1
VIT– Negative-going input threshold voltage V
VCC = 5 V 0.8 1.5
Vhys Input hysteresis (VIT+ – VIT–) 0.5 V
Ioz Output leakage current EN = VCC ±0.05 ±10 mA
riInput resistance VI= ±3 V to ±25 V 3 5 7 kΩ
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
RECEIVER SECTION SWITCHING CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP(2) UNIT
tPLH Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns
tPHL Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns
ten Output enable time CL= 150 pF, RL= 3 kΩ, See Figure 4 2.6 ms
tdis Output disable time CL= 150 pF, RL= 3 kΩ, See Figure 4 2.4 ms
tsk(p) Pulse skew(3) See Figure 3 50 ns
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD PROTECTION
PIN TEST CONDITIONS TYP UNIT
HBM ±15
DOUT, RIN IEC61000-4-2, Contact Discharge ±8 kV
IEC61000-4-2, Air-Gap Discharge ±15
6Submit Documentation Feedback Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): MAX3237E
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
3 V
SHDN = VCC
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50% 50%
1.5 V 1.5 V
3 V
SHDN = VCC
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
EN = GND
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
3 V
EN = GND
1.5 V 1.5 V
50% 50%
MAX3237E
www.ti.com
SLLS709B –MAY 2006–REVISED JANUARY 2010
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Slew Rate
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
Copyright © 2006–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): MAX3237E
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
Generator
(see Note B)
3 V or 0 V Output
VOL
VOH
tPZH
(S1 at GND)
3 V
−3 V
0.3 V
Output
Input
0.3 V
3 V or 0 V
EN
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.
1.5 V 1.5 V
50%
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
50%
tPZL
(S1 at VCC)
RL
S1
VCC GND
CL
(see Note A)
Output
MAX3237E
SLLS709B –MAY 2006–REVISED JANUARY 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 4. Receiver Enable and Disable Times
8Submit Documentation Feedback Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): MAX3237E
VCC C1 C2, C3, and C4
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.22 µF
0.047 µF
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
VCC vs CAPACITOR VALUES
+
−
+
−
+
−+
−
+
−
4
5
6
7
8
9
10
11
12
13
14
3
1
2
28
27
26
24
25
23
22
21
20
19
18
17
16
15
C2
CBYPASS = 0.1 µF
C1
C4
C2+
GND
C2−
V−
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
MBAUD
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
EN
SHDN
5 kΩ
5 kΩ
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
C3†
Logic I/Os
RS-232 Port 5 kΩ
MAX3237E
www.ti.com
SLLS709B –MAY 2006–REVISED JANUARY 2010
APPLICATION INFORMATION
Figure 5. Typical Operating Circuit and Capacitor Values
Copyright © 2006–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): MAX3237E
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3237ECDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3237EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3237ECDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3237ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3237ECPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
MAX3237EIDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3237EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3237EIPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3237ECDBR SSOP DB 28 2000 367.0 367.0 38.0
MAX3237ECDWR SOIC DW 28 1000 367.0 367.0 55.0
MAX3237ECPWR TSSOP PW 28 2000 367.0 367.0 38.0
MAX3237EIDBR SSOP DB 28 2000 367.0 367.0 38.0
MAX3237EIDWR SOIC DW 28 1000 367.0 367.0 55.0
MAX3237EIPWR TSSOP PW 28 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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